Heat dissipation module and electronic product

Abstract

The application discloses a heat dissipation module and an electronic product. The heat dissipation module comprises a bottom plate, a cover and a liquid absorbing element. The bottom plate is used to form a shell of a mobile phone, and one side of the bottom plate is provided with a containing space. The cover is connected with the bottom plate and covers the containing space. The liquid absorbing element absorbs cooling medium in the containing space, and comprises a heat absorbing area and a heat dissipating area. The cooling medium is driven to flow directionally by capillary force of the liquid absorbing element: the heat absorbing area absorbs heat of the mobile phone to make the cooling medium vaporize, the vaporized medium flows to the heat dissipating area to dissipate heat and liquefy, and the liquefied medium returns to the heat absorbing area to circulate by capillary force. The design integrates the heat dissipation module and the shell of the mobile phone, reduces internal space occupation, guarantees stability of phase change circulation in the closed space, efficiently transfers heat by continuous phase change (vaporization-liquefaction) driven by capillary force, and significantly improves heat dissipation performance of the mobile phone.

Description

Technical Field

[0001] This application relates to the field of electronic product technology, and in particular to a heat dissipation module and electronic product. Background Technology

[0002] Some mobile phones and other electronic products are equipped with heat dissipation devices, some of which require a gas-liquid two-phase exchange method for heat dissipation. However, existing heat dissipation devices need to be separately installed inside the phone, resulting in the heat dissipation device occupying too much space inside the phone and other electronic products. Utility Model Content

[0003] In view of this, this application provides a heat dissipation module to solve the problem of occupying too much space in mobile phones and other electronic products.

[0004] One embodiment of this application provides a heat dissipation module, including a base plate, a cover, and a liquid-absorbing component. The base plate forms the housing of a mobile phone, and a receiving space is provided on one side of the base plate for containing a cooling medium. The cover is connected to the base plate and is used to cover the receiving space. The liquid-absorbing component is disposed within the receiving space and is used to absorb the cooling medium within the receiving space. The liquid-absorbing component includes a heat-absorbing region and a heat-dissipating region, with the heat-dissipating region located on at least one side of the heat-absorbing region. The heat-absorbing region is used for the cooling medium to absorb heat from the mobile phone and form a vaporized state, while the heat-dissipating region is used for the vaporized cooling medium to dissipate heat and form a liquefied state. The liquid-absorbing component is also used to apply capillary force to the cooling medium, causing the liquefied cooling medium outside the heat-absorbing region to flow towards the heat-absorbing region.

[0005] In the above embodiments, by directly integrating the base plate as a component of the electronic product's casing and providing a receiving space on one side, the heat dissipation module is integrated with the electronic product's casing, eliminating the need for a separate heat dissipation device and effectively reducing the space occupied by the heat dissipation module within the electronic product's interior. Simultaneously, the cover and base plate cooperate to form a closed receiving space, providing a stable working environment for the phase change cycle of the cooling medium. Driven by the capillary force of the liquid-absorbing component, the cooling medium flows directionally between the heat absorption area (absorbing heat from the electronic product and vaporizing) and the heat dissipation area (vaporizing and then liquefying), accelerating the efficiency of heat transfer from the inside of the electronic product to the external environment. Furthermore, the cyclic phase change of the cooling medium continuously removes heat, thereby significantly improving the overall heat dissipation performance of the electronic product.

[0006] In some embodiments, the cover member has a plurality of support posts on the side facing the base plate. These support posts contact the base plate and define the relative position of the cover member and the base plate. The suction member includes a plurality of through holes, each for accommodating one support post. The support posts define the position of the cover member and the base plate to maintain a constant volume of the accommodating space, thereby reducing the risk of the suction member being compressed and its capillary force decreasing.

[0007] In some embodiments, the diameter of the support column located in the heat absorption region is smaller than the diameter of the support column located in the heat dissipation region. By reducing the diameter of the support column in the heat absorption region, the area of ​​the support column in the heat absorption region is reduced, thereby reducing the risk of liquefaction of the vaporized cooling medium upon contact with the support column.

[0008] In some embodiments, the diameters of the multiple support columns increase sequentially from the heat absorption region to the heat dissipation region. This gradual increase in the diameter of the support columns along the heat absorption region helps to gradually increase their surface area, allowing the cooling medium to smoothly transition between vapor and liquid states. This improves the efficiency of the vaporized cooling medium in dissipating heat and forming a liquefied state.

[0009] In some embodiments, the support pillars on the cover are spaced apart, wherein the spacing between the multiple support pillars located in the heat absorption region is greater than the spacing between the multiple support pillars located in the heat dissipation region. By increasing the spacing between the multiple support pillars located in the heat absorption region, the density of the support pillars is reduced, thereby reducing the risk of liquefaction of the vaporized cooling medium upon contact with the support pillars.

[0010] In some embodiments, the liquid-absorbing element includes capillaries, wherein the pore size of the capillaries located in the heat-absorbing region is smaller than that of the capillaries located in the heat-dissipating region. By making the pore size of the capillaries in the heat-absorbing region smaller than that in the heat-dissipating region, the capillary force in the heat-absorbing region is increased, thereby promoting the flow of the liquefied cooling medium from the heat-dissipating region to the heat-absorbing region.

[0011] In some embodiments, the pore size of the multiple capillaries decreases sequentially from the heat dissipation region to the heat absorption region. This sequential decrease in pore size relative to the pore size abruptness reduces the stress distribution of the liquid-absorbing component, thereby improving its strength and allowing the cooling medium to smoothly transition between vapor and liquid states.

[0012] In some embodiments, the pore size of the capillaries located on the side of the heat dissipation region away from the heat absorption region is 150%-250% of the pore size of the capillaries located on the side of the heat absorption region away from the heat dissipation region. Providing capillaries with larger pore sizes in the heat dissipation region helps to increase the flow rate of the cooling medium within that region. Simultaneously, providing capillaries with smaller pore sizes in the heat absorption region facilitates the flow of the liquefied cooling medium towards the heat absorption region.

[0013] In some embodiments, the edge of the cover is provided with a connecting portion for connecting to the base plate and sealing the receiving space. By connecting to the bottom through the connecting portion, the receiving space is sealed from the outside, which helps to reduce the risk of the cover occupying the receiving space compared to sealing the receiving space from the inside.

[0014] This application also provides an electronic product, including a motherboard module and a heat dissipation module as described above, wherein the motherboard module is connected to a base plate. The heat dissipation component dissipates heat from the motherboard module to improve the performance of the electronic product.

[0015] In some embodiments, the electronic product further includes a middle plate connected to a base plate. Along the direction in which the cover and base plate are positioned opposite each other, the motherboard module, the cover, and the liquid-absorbing component are sequentially distributed. The motherboard module, the cover, and the liquid-absorbing component are positioned between the middle plate and the base plate to protect the motherboard module and the liquid-absorbing component. Simultaneously, the proximity of the receiving space to the motherboard module allows the cooling medium to quickly dissipate heat from the motherboard module.

[0016] In some embodiments, the base plate includes opposing inner and outer sides, with the motherboard module located on the inner side of the base plate and the cover and liquid absorber located on the outer side of the base plate. The electronic product also includes a rear cover, with the cover integrally formed with it. By integrating the cover with the rear cover, heat from the cooling medium is transferred outwards through the rear cover, and the cover is positioned within the base plate relative to the base plate, thereby improving space utilization within the electronic product. Attached Figure Description

[0017] Figure 1 This is an exploded view of a heat dissipation module according to an embodiment of this application.

[0018] Figure 2 for Figure 1 A schematic diagram of the working state of the liquid suction component.

[0019] Figure 3 for Figure 1 A schematic diagram of the working status of the heat dissipation module.

[0020] Figure 4 for Figure 1 A schematic diagram of the cover assembly from another perspective.

[0021] Figure 5 for Figure 1 A schematic diagram of the working state of another liquid suction component.

[0022] Figure 6 for Figure 1 A schematic diagram of the liquid suction component.

[0023] Figure 7 This is a schematic diagram of the working state of an electronic product according to an embodiment of this application.

[0024] Figure 8 This is a schematic diagram of the working state of an electronic product according to another embodiment of this application.

[0025] Explanation of main component symbols 10. Heat dissipation module; 11. Base plate; 111. Accommodation space; 112. Groove; 113. Inner side; 114. Outer side; 12. Cover assembly; 121. Connecting part; 122. Support column; 13. Liquid suction component; 131. Heat absorption area; 132. Heat dissipation area; 133. Through hole; 20. Electronic product; 21. Motherboard module; 22. Middle plate; 23. Rear cover. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0027] The terms “first”, “second”, etc., are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implying the quantity, specific order, or primary and secondary relationship of the indicated technical features.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0029] Some electronic products (such as mobile phones) are equipped with heat dissipation devices. To improve heat dissipation, some of these devices use a gas-liquid two-phase exchange method. However, existing heat dissipation devices need to be placed separately inside the phone, resulting in them taking up too much space within the phone.

[0030] To reduce the space occupied by the heat dissipation device, some mobile phones have a mounting slot on the mid-plate for installing the heat dissipation device. However, this method of installing the heat dissipation device is limited by the shape of the mounting slot on the mid-plate, which reduces the flexibility of installation. At the same time, this method of installing the heat dissipation device is also limited by the thickness of the mid-plate, resulting in an excessively thick mid-plate that takes up internal space in the mobile phone.

[0031] Therefore, one embodiment of this application provides a heat dissipation module, including a base plate, a cover, and a liquid-absorbing component. The base plate is used to form the housing of an electronic product, and a receiving space is provided on one side of the base plate for containing a cooling medium. The cover is connected to the base plate and is used to cover the receiving space. The liquid-absorbing component is disposed within the receiving space and is used to absorb the cooling medium within the receiving space. The liquid-absorbing component includes a heat-absorbing region and a heat-dissipating region, with the heat-dissipating region located on at least one side of the heat-absorbing region. The heat-absorbing region is used for the cooling medium to absorb heat from the electronic product and form a vaporized state, while the heat-dissipating region is used for the vaporized cooling medium to dissipate heat and form a liquefied state. The liquid-absorbing component is also used to apply capillary force to the cooling medium, causing the cooling medium, which has changed from a vaporized state to a liquefied state, to flow from the heat-dissipating region to the heat-absorbing region.

[0032] In the above embodiments, by directly integrating the base plate as a component of the electronic product's casing and providing a receiving space on one side, the heat dissipation module is integrated with the electronic product's casing, eliminating the need for a separate heat dissipation device and effectively reducing the space occupied by the heat dissipation module within the electronic product's interior. Simultaneously, the cover and base plate cooperate to form a closed receiving space, providing a stable working environment for the phase change cycle of the cooling medium. Driven by the capillary force of the liquid-absorbing component, the cooling medium flows directionally between the heat absorption area (absorbing heat from the electronic product and vaporizing) and the heat dissipation area (vaporizing and then liquefying), accelerating the efficiency of heat transfer from the inside of the electronic product to the external environment. Furthermore, the cyclic phase change of the cooling medium continuously removes heat, thereby significantly improving the overall heat dissipation performance of the electronic product.

[0033] Some embodiments of this application will now be described with reference to the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0034] Please see Figure 1 and Figure 2 A heat dissipation module 10, applied in electronic products, includes a base plate 11, a cover 12, and a liquid-absorbing component 13. A receiving space 111 is provided on one side of the base plate 11, which contains a cooling medium (not shown). The cover 12 is connected to the base plate 11 and covers the receiving space 111. The liquid-absorbing component 13 is disposed within the receiving space 111 and absorbs the cooling medium. The liquid-absorbing component 13 includes a heat-absorbing region 131 and a heat-dissipating region 132, with the heat-dissipating region 132 located on at least one side of the heat-absorbing region 131. During operation, the cooling medium absorbs heat in the heat absorption area 131 and forms a vaporized state. The vaporized cooling medium flows from the heat absorption area 131 to the heat dissipation area 132. The vaporized cooling medium dissipates heat outward in the heat dissipation area 132 and forms a liquefied state. Finally, driven by the capillary force of the liquid suction component 13, the liquefied cooling medium outside the heat absorption area 131 (i.e. inside the heat dissipation area 132 or between the heat dissipation area 132 and the heat absorption area 131) flows directionally towards the heat absorption area 131, so that the liquefied cooling medium can continuously replenish the heat absorption area 131 for heat absorption. This method not only accelerates the heat transfer efficiency from the heat source to the external environment, but also continuously removes heat through the cyclic phase change of the cooling medium, thereby significantly improving the overall heat dissipation performance of the electronic product.

[0035] In some embodiments, please refer to Figures 1 to 3Taking the application of the heat dissipation module 10 in a mobile phone as an example, the base plate 11 can form the casing of the mobile phone. By directly using the base plate 11 as a component of the mobile phone casing and setting an accommodating space 111 on one side, the heat dissipation module 10 is integrated with the mobile phone casing. There is no need to configure an additional independent heat dissipation module 10, which effectively reduces the space occupied by the heat dissipation module 10 inside the mobile phone. At the same time, by directly using the base plate 11 as a component of the mobile phone casing and sealing the accommodating space 111 together with the cover 12, compared with setting a separate heat dissipation module 10, it helps to shorten the path of heat transfer from inside the mobile phone to the outside, which helps to improve the heat dissipation effect of the mobile phone.

[0036] It is understandable that when the heat dissipation module 10 is applied to different mobile phones or electronic products other than mobile phones, when the position of the motherboard, chip or other components with high heat generation in different mobile phones or electronic products other than mobile phones changes, the relative position between the heat absorption area 131 and the heat dissipation area 132 is adaptively adjusted to ensure that the heat absorption area 131 corresponds to the motherboard or chip or other components with high heat generation in the mobile phone.

[0037] In some embodiments, please refer to Figure 1 and Figure 3 The base plate 11 includes an inner side 113 and an outer side 114. When the electronic product is a mobile phone, other components of the mobile phone (such as a battery or circuit board) are located on the inner side 113 of the base plate 11. The direction in which the base plate 11 and the cover 12 are positioned relative to each other is defined as the Z-axis direction, and the direction from the inner side 113 to the outer side 114 is defined as the negative direction of the Z-axis. In the figure, the Z-axis, Y-axis, and X-axis directions are perpendicular to each other.

[0038] In some embodiments, the receiving space 111 is located inside the bottom plate 11 11 113, and both the cover 12 and the liquid-absorbing member 13 are located inside the bottom plate 11 113. When the mobile phone is working, the heat of the mobile phone is transferred outward through the cover 12, the receiving space 111 and the bottom plate 11 in sequence. Furthermore, when the receiving space 111 is located inside the bottom plate 11 113, the cover 12 is in contact with the heat source to improve the efficiency of heat transfer.

[0039] In other embodiments, the receiving space 111 is located on the outer side 114 of the base plate 11, and the cover 12 and the liquid absorber 13 are also located on the outer side 114 of the base plate 11. When the phone is working, the heat of the phone is transferred outward sequentially through the base plate 11, the receiving space 111, and the cover 12. Compared to the receiving space 111 being located on the inner side 113 of the base plate 11, this helps to reduce the space occupied inside the phone by the cover 12 and the liquid absorber 13 being located on the inner side 113 of the base plate 11. Furthermore, when the receiving space 111 is located on the outer side 114 of the base plate 11, the cover 12 is integrally formed with the back cover 23 of the phone, that is, the back cover 23 of the phone is connected to the base plate 11, and the receiving space 111 is located between the back cover 23 and the base plate 11. Compared to the additional configuration of a separate heat dissipation module 10, this achieves the effect of shortening the path of heat transfer from inside the phone to the outside.

[0040] Furthermore, when the accommodating space 111 is located on the outer side 114 of the base plate 11, the inner sidewall of the base plate 11 is in contact with the heat source to improve the efficiency of heat transfer.

[0041] In other embodiments, the accommodating space 111 is located on one side of the base plate 11 along the X-axis or Y-axis direction, and the cover member 12 and the liquid suction member 13 are respectively located on one side of the base plate 11 along the X-axis or Y-axis direction. It can be understood that the accommodating space 111 can be located inside the base plate 11 or outside the base plate 11.

[0042] In some embodiments, please refer to Figure 1 and Figure 4 The edge of the cover 12 is provided with a connecting part 121, which is used to connect with the side of the base plate 11 and seal the receiving space 111.

[0043] In some embodiments, please refer to Figure 1 and Figure 4 The connecting portion 121 extends outward from the edge of the cover 12, thereby sealing the receiving space 111 from the outside. Compared to sealing the receiving space 111 by connecting the connecting portion 121 to the base plate 11 inside the receiving space 111, this helps reduce the risk of the cover 12 occupying the receiving space 111. Furthermore, by extending the connecting portion 121 outward from the edge of the cover 12, the contact area between the connecting portion 121 and the bottom is increased when the cover 12 and the base plate 11 are connected and installed, thus increasing the width of the sealing area and improving the sealing effect.

[0044] In some embodiments, please refer to Figure 1 and Figure 4The connecting portion 121 is flat relative to the cover 12, which helps to reduce the thickness of the connecting portion 121, thereby reducing the risk of the connecting portion 121 extending from the edge of the cover 12 outward and causing the cover 12 to occupy too much space, and helps to reduce the overall volume of the heat dissipation module 10.

[0045] In some embodiments, the connecting part 121 is connected to the base plate 11 by means of welding or bonding.

[0046] In some embodiments, please refer to Figure 1 and Figure 3 The base plate 11 has a groove 112 on its side facing the cover 12, and the receiving space 111 is located in the groove 112. It can be understood that when the receiving space 111 is located on the outer side 114 of the base plate 11, the outer surface of the base plate 11 has the groove 112; when the receiving space 111 is located on the inner side 113 of the base plate 11, the inner surface of the base plate 11 has the groove 112.

[0047] In other embodiments, a portion of the cover 12 is recessed (not shown) on the side facing the base plate 11, and the receiving space 111 is located within the recess of the cover 12.

[0048] In some embodiments, please refer to Figure 2 The heat dissipation area 132 is located on one side of the heat absorption area 131. When the motherboard or chip and other components that generate a lot of heat are concentrated at one end of the phone, the heat dissipation area 132 and the heat absorption area 131 are respectively set at the two ends of the phone, and the heat absorption area 131 is closer to the motherboard or chip and other components that generate a lot of heat than the heat dissipation area 132.

[0049] In other embodiments, please refer to Figure 5 The heat dissipation area 132 is arranged around the heat absorption area 131. When the motherboard or chip and other components with large heat generation are concentrated in the middle of the mobile phone, the heat absorption area 131 is arranged in the middle of the mobile phone, and the heat dissipation area 132 is arranged around the heat absorption area 131 and is closer to the edge of the mobile phone relative to the heat absorption area 131. When the distance between the heat dissipation area 132 and the heat absorption area 131 is close, the area of ​​the cooling medium for external heat dissipation is increased, thereby improving the efficiency of the cooling medium in the vaporized state to dissipate heat to the outside and form a liquefied state.

[0050] In some embodiments, the liquid suction member 13 includes capillary pores (not shown). Specifically, the liquid suction member 13 is generally a porous structure, so that multiple capillary pores can be distributed throughout the liquid suction member 13 and interconnected, so as to enable the liquid suction member 13 to absorb the cooling medium and apply capillary force to the cooling medium.

[0051] In some embodiments, the liquid-absorbing component 13 is made of metals such as copper and stainless steel and is formed by processes such as sintering, welding or etching.

[0052] In other embodiments, the liquid-absorbing component 13 is made of carbon-based, polymer or other composite materials and is formed by 3D printing.

[0053] In some embodiments, the pore size of the capillaries in the heat absorption region 131 is smaller than that of the capillaries in the heat dissipation region 132. By reducing the pore size of the capillaries in the heat absorption region 131, the capillary force in the heat absorption region 131 is increased, thereby promoting the flow of the liquefied cooling medium from the heat dissipation region 132 to the heat absorption region 131, thereby improving the efficiency of the cooling medium's circulating phase change.

[0054] In some embodiments, the pore size of the plurality of capillaries decreases sequentially from the heat dissipation region 132 to the heat absorption region 131. The sequential decrease in pore size relative to the pore size abruptness of the capillaries reduces the stress distribution of the liquid-absorbing member 13, thereby improving its strength and allowing the cooling medium to smoothly transition between vapor and liquid states. For example, the pore size of the capillaries decreases by 10% every unit distance from the heat dissipation region 132 to the heat absorption region 131.

[0055] In some embodiments, the pore size of the capillaries located on the side of the heat dissipation region 132 away from the heat absorption region 131 is 150%-250% of the pore size of the capillaries located on the side of the heat absorption region 131 away from the heat dissipation region 132. That is, along the X-axis direction, the ratio of the pore sizes of the two farthest capillaries is 1:1.5 to 1:2.5. By providing capillaries with larger pore sizes in the heat dissipation region 132, it is helpful to increase the flow rate of the cooling medium in the heat dissipation region 132. Furthermore, the larger pore size of the capillaries can improve the efficiency of the liquid suction member 13 in absorbing the cooling medium in the heat dissipation region 132, so that the cooling medium can be evenly distributed, thereby reducing the efficiency of the cooling medium in the vaporized state to liquefy state due to the accumulation of cooling medium and the resulting increase in local pressure in the heat dissipation region 132. At the same time, the smaller pore size of the capillaries in the heat absorption region 131 increases the capillary force in the heat absorption region 131. For example, the pore size of the capillaries located on the side of the heat dissipation area 132 away from the heat absorption area 131 is 150%, 155%, 160%, 165%, 170%, 175%, 170%, 185%, 190%, 195%, 200%, 205%, 210%, 215%, 220%, 225%, 230%, 235%, 240%, 245%, or 250% of the pore size of the capillaries located on the side of the heat absorption area 131 away from the heat dissipation area 132.

[0056] In some embodiments, the cooling medium includes easily vaporizable working fluids such as pure water, acetone, or nano-mercury.

[0057] Because the accommodating space 111 needs to be evacuated before the cooling medium is injected during processing, in some embodiments, the cover 12 is provided with multiple support columns 122 on the side facing the base plate 11 (see [link]). Figure 4 The liquid suction element 13 includes multiple through holes 133 (see [reference]). Figure 6 Each through-hole 133 is used to accommodate a support post 122. The support post 122 contacts the base plate 11 and defines the relative position of the cover 12 and the base plate 11 to keep the volume of the accommodating space 111 constant. This reduces the risk that the cover 12 or the base plate 11 will deform under pressure and squeeze the liquid suction member 13 when the accommodating space 111 is evacuated, thus reducing the risk of the capillary force of the liquid suction member 13 being reduced.

[0058] Understandably, the support column 122 can also support the relative position between the cover 12 and the base plate 11 when the heat dissipation component is impacted.

[0059] In some embodiments, the diameter of the support column 122 located in the heat absorption region 131 (hereinafter referred to as the first support column 122) is smaller than the diameter of the support column 122 located in the heat dissipation region 132 (hereinafter referred to as the second support column 122). By reducing the diameter of the first support column 122 relative to the second support column 122, the area of ​​the first support column 122 within the heat absorption region 131 is reduced, thereby reducing the risk of the vaporized cooling medium coming into contact with the first support column 122 and liquefying.

[0060] In some embodiments, the diameters of the plurality of support pillars 122 increase sequentially from the heat absorption region 131 to the heat dissipation region 132. The gradual increase in the diameter of the support pillars 122 along the direction from the heat absorption region 131 to the heat dissipation region 132 helps to gradually increase the surface area of ​​the support pillars 122, allowing the cooling medium to smoothly transition between vapor and liquid states, thereby improving the efficiency of the vaporized cooling medium in dissipating heat and forming a liquefied state. In some embodiments, the support pillars 122 on the cover member 12 are spaced apart, wherein the spacing between the plurality of support pillars 122 located in the heat absorption region 131 (hereinafter referred to as the first support pillars 122) is greater than the spacing between the plurality of support pillars 122 located in the heat dissipation region 132 (hereinafter referred to as the second support pillars 122). By increasing the spacing of the plurality of first support pillars 122 relative to the second support pillars 122, the distribution density of the first support pillars 122 is reduced, thereby reducing the risk of the vaporized cooling medium coming into contact with the first support pillars 122 and liquefying.

[0061] In other embodiments, the liquid-absorbing component 13 is a member with an internally formed diamond cubic structure or honeycomb structure, which provides reinforcement. This results in capillary pores distributed throughout the inner and outer surfaces of the liquid-absorbing component 13. The reinforced structure design helps increase the mechanical strength of the liquid-absorbing component 13, preventing it from deforming under pressure. Furthermore, when the support column 122 is not required to define the relative position between the cover component 12 and the base plate 11, the risk of the cooling medium contacting the support component can be avoided. It is understood that the diamond cubic structure or honeycomb structure only constitutes the sidewall structure of the capillary pores and does not occupy the space where the capillary pores are distributed.

[0062] In other embodiments, the support column 122 and the liquid-absorbing member 13 with a reinforced structure jointly support the relative position of the cover 12 and the base plate 11 to reduce the risk of deformation of the cover 12 and the base plate 11 under pressure, which helps to maintain a constant volume of the accommodating space 111.

[0063] One embodiment also provides an electronic product 20, please refer to [link / reference]. Figure 7 The electronic product 20 includes a motherboard module 21 and a heat dissipation module 10 as described in any of the above embodiments. The motherboard module 21 is connected to the base plate 11 to form the main body of the electronic product 20. The heat dissipation assembly dissipates heat from the motherboard module 21 to improve the performance of the electronic product 20.

[0064] In some embodiments, the electronic product 20 includes thin electronic devices such as mobile phones and tablets. It is understood that when the electronic product 20 is a different electronic device, the base plate 11 serves as the housing for that specific electronic device.

[0065] In some embodiments, please refer to Figure 7 When the cover 12 and the liquid absorber 13 are located inside the base plate 113, the electronic product 20 also includes a middle plate 22, which is connected to the base plate 11. The mainboard module 21, the cover 12, and the liquid absorber 13 are sequentially distributed along the direction in which the cover 12 and the base plate 11 are positioned opposite each other. The mainboard module 21, the cover 12, and the liquid absorber 13 are positioned between the middle plate 22 and the base plate 11 to protect them. Simultaneously, the accommodating space 111 is close to the mainboard module 21, allowing the cooling medium to quickly dissipate heat from the mainboard module 21.

[0066] In other embodiments, please refer to Figure 8When the cover assembly 12 and the liquid absorber 13 are located on the outer side 114 of the base plate 11, the motherboard module 21 is located on the inner side 113 of the base plate 11. The electronic product 20 also includes a back cover 23, with the cover assembly 12 and the back cover 23 being integrally formed. During operation, the heat of the cooling medium is transferred outward through the back cover 23. Since the back cover 23 is located within the base plate 11 relative to the cover assembly 12, it improves the space utilization within the electronic product 20. Furthermore, by integrating the cover assembly 12 with the back cover 23, compared to a separate cover assembly 12, the number of components is reduced, effectively reducing the space occupied by the heat dissipation module 10 within the phone's internal space.

[0067] In some embodiments, please refer to Figure 8 The electronic product 20 includes both a middle plate 22 and a back cover 23.

[0068] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the substantive scope of this application fall within the scope of this application.

Claims

1. A heat dissipation module for heat dissipation in electronic products, characterized in that, include: A base plate, which is used to assemble the housing of an electronic product, has a receiving space on one side for receiving a cooling medium; A cover assembly, which is connected to the base plate, is used to cover the receiving space; A liquid-absorbing component is disposed within the receiving space. The liquid-absorbing component is used to absorb the cooling medium within the receiving space. The liquid-absorbing component includes a heat-absorbing area and a heat-dissipating area. The heat-dissipating area is located on at least one side of the heat-absorbing area. The heat-absorbing area is used for the cooling medium to absorb the heat of the electronic product and form a vaporized state. The heat-dissipating area is used for the vaporized cooling medium to dissipate heat and form a liquefied state. The liquid-absorbing element is also used to apply capillary force to the cooling medium so that the liquefied cooling medium outside the heat-absorbing region flows towards the heat-absorbing region.

2. The heat dissipation module according to claim 1, characterized in that, The cover is provided with a plurality of support columns on the side facing the base plate. The support columns are used to contact the base plate and define the relative position of the cover and the base plate. The liquid suction element includes multiple through holes, each of which is used to accommodate one of the support columns.

3. The heat dissipation module according to claim 2, characterized in that, The diameter of the support column located in the heat absorption area is smaller than the diameter of the support column located in the heat dissipation area.

4. The heat dissipation module according to claim 3, characterized in that, The diameters of the plurality of support columns increase sequentially from the heat absorption area to the heat dissipation area.

5. The heat dissipation module according to claim 2, characterized in that, The support columns on the cover are spaced apart, wherein the spacing between the plurality of support columns located in the heat absorption area is greater than the spacing between the plurality of support columns located in the heat dissipation area.

6. The heat dissipation module according to claim 1, characterized in that, The liquid-absorbing element includes capillary pores, wherein the pore diameter of the capillary pores located in the heat-absorbing region is smaller than the pore diameter of the capillary pores located in the heat-dissipating region.

7. The heat dissipation module according to claim 6, characterized in that, The diameters of the multiple capillaries decrease sequentially from the heat dissipation area to the heat absorption area.

8. The heat dissipation module according to claim 7, characterized in that, The pore size of the capillary located on the side of the heat dissipation area away from the heat absorption area is 150%-250% of the pore size of the capillary located on the side of the heat absorption area away from the heat dissipation area.

9. The heat dissipation module according to claim 1, characterized in that, The edge of the cover is provided with a connecting part, which is used to connect with the base plate and seal the receiving space.

10. An electronic product, characterized in that, It includes a motherboard module and a heat dissipation module as described in any one of claims 1 to 9, wherein the motherboard module is connected to the base plate.

11. The electronic product according to claim 10, characterized in that, The electronic product also includes a middle plate, which is connected to the base plate. Along the direction in which the cover is disposed opposite to the base plate, the motherboard module, the cover, and the liquid suction component are distributed in sequence.

12. The electronic product according to claim 10, characterized in that, The base plate includes opposing inner and outer sides, the main board module is located on the inner side of the base plate, and the cover and the liquid suction component are located on the outer side of the base plate; The electronic product also includes a back cover, and the cover assembly is integrally formed with the back cover.

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