A heat dissipation structure of a power amplifier tank body for a deep water transducer

Abstract

The utility model relates to power amplifier technical field, concretely relates to a power amplifier jar body heat dissipation structure for deep water transducer, the utility model provides a power amplifier jar body heat dissipation structure for deep water transducer, including sealed jar body, power amplifier radiator and multiple power amplification module. Power amplifier radiator is cubic structure, and power amplifier radiator sets up at the bottom of sealed jar body, and multiple power amplification module sets up at multiple side surfaces of power amplifier radiator far from the bottom of sealed jar body. Through the layout design of power amplifier radiator and power amplification module of cubic structure, in combination with passive heat conduction mode, heat is efficiently transmitted to jar body outer wall and is taken away by seawater, solve the problem that the temperature of equipment is too high because of the low efficiency of traditional heat dissipation mode, have the advantage that improve the heat dissipation efficiency, reduce the internal temperature of equipment, improve reliability and service life, solve the technical problem that the existing underwater power amplifier has insufficient heat dissipation performance.

Description

Technical Field

[0001] This utility model relates to the field of power amplifier technology, specifically to a heat dissipation structure for a power amplifier tank used in deep-sea transducers. Background Technology

[0002] In underwater exploration, communication, and other fields, high-power transducers are often required. The power amplifiers that drive these transducers typically need to be placed underwater to shorten transmission distances and reduce signal loss. However, placing high-power electronic equipment in deep-water environments (such as at depths of kilometers) presents significant challenges.

[0003] Because the power amplifier generates a lot of heat when it is working, and in the deep water and high pressure environment, the tank cannot use active heat dissipation methods such as fans, it can only rely on passive heat conduction to transfer the heat to the outer wall of the tank, and then the seawater will carry it away. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a heat dissipation structure for the power amplifier tank of a deep-sea transducer, thus solving the technical problem of insufficient heat dissipation performance in existing underwater power amplifiers.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: This invention provides a heat dissipation structure for a power amplifier tank in a deep-sea transducer, comprising a sealed tank, a power amplifier heat sink, and multiple power amplification modules. The power amplifier heat sink has a cubic structure and is located at the bottom of the sealed tank. The multiple power amplification modules are located on multiple sides of the power amplifier heat sink away from the bottom of the sealed tank.

[0006] In one possible implementation, the power amplifier tank heat dissipation structure further includes an impedance transformation module and a power supply module, with the power supply module mounted on top of the sealed tank. The power amplifier heat sink, the impedance transformation module, and the power supply module are stacked from bottom to top, and the power amplifier module, the impedance transformation module, and the power supply module are electrically connected.

[0007] In one possible implementation, the end of the sealed container opposite to the power amplifier heat sink is provided with a communication interface, which is used to receive remote control commands.

[0008] In one possible implementation, the end of the sealed container away from the power amplifier heat sink is also provided with a signal output interface and a signal input interface.

[0009] In one possible implementation, the end of the sealed container away from the power amplifier heat sink is also provided with a power supply interface, which is used to connect to an external power source.

[0010] The beneficial effects of this utility model are that, compared with the prior art, this utility model, through the layout design of the cubic structure power amplifier heat sink and power amplifier module, combined with the passive heat conduction method, efficiently transfers heat to the outer wall of the tank and carries it away by seawater, which solves the problem of low efficiency of traditional heat dissipation methods leading to excessively high equipment temperature. It has the advantages of improving heat dissipation efficiency, reducing the internal temperature of the equipment, and improving reliability and service life, and solves the technical problem of insufficient heat dissipation performance of existing underwater power amplifiers. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of a power amplifier tank heat dissipation structure provided by this utility model.

[0012] Figure 2 This is a schematic diagram of the internal structure of a power amplifier tank heat dissipation structure provided by this utility model.

[0013] Figure 3 This utility model provides a schematic diagram of the assembly structure of a power amplifier heat sink.

[0014] Attached image labels: 1. Power amplifier tank heat dissipation structure; 11. Sealed tank; 12. Power amplifier heat sink; 13. Power amplifier module; 14. Impedance conversion module; 15. Power supply module; 16. Communication interface; 17. Signal output interface; 18. Signal input interface; 19. Power supply interface. Detailed Implementation

[0015] To solve the above-mentioned technical problems, this utility model provides a heat dissipation structure for the power amplifier tank of a deep-water transducer. The technical solution and embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0016] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0017] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation", "connection" and "joining" should be interpreted broadly, for example, they can refer to fixed connection, detachable connection, or integral connection; for those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0018] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0019] In traditional deep-sea transducer power amplifier systems, a planar heat dissipation structure is used to attach the circuit board parallel to the inner wall of the sealed tank, resulting in a long and dispersed heat conduction path. Due to the high-pressure environment of deep water limiting active cooling, heat can only be passively conducted to the outer wall of the tank. However, the limited planar contact area and uneven heat flux distribution prevent the Joule heat generated by the power amplifier module from being quickly dissipated. Accumulated thermal resistance causes the module junction temperature to rise continuously, exceeding the safe operating temperature threshold of semiconductor devices, triggering frequent trips of the thermal protection circuit, severely restricting the continuous output power and operational stability of the equipment.

[0020] Faced with the aforementioned problems, this application first analyzes the root cause of the excessively long thermal resistance chain in traditional planar heat dissipation structures, finding that the dispersed heat conduction path and insufficient contact area are the core bottlenecks. To address this, this application explores several heat conduction path optimization schemes: the first scheme is to increase the thickness of the heat dissipation substrate to improve longitudinal heat conduction capacity, but this significantly increases the weight of the tank; the second scheme uses a ring-shaped heat sink arranged around the inner wall of the tank, which shortens the lateral heat conduction distance, but limits the module installation space; the third scheme designs a three-dimensional heat dissipation structure, reorganizing the heat source distribution through geometric configuration, allowing the heat from multiple heat sources to converge at a single conduction interface. Thermodynamic simulations verify that the three-dimensional structure can establish a more efficient heat flow channel, with the cubic configuration having the largest bottom surface contact area while ensuring module installation density; this scheme was ultimately selected as the optimal solution.

[0021] like Figures 1 to 3 As shown, this utility model provides a power amplifier tank heat dissipation structure 1 for a deep-sea transducer, including a sealed tank 11, a power amplifier heat sink 12, and multiple power amplification modules 13. The power amplifier heat sink 12 has a cubic structure and is located at the bottom of the sealed tank 11. The multiple power amplification modules 13 are located on multiple sides of the power amplifier heat sink 12 away from the bottom of the sealed tank 11.

[0022] Among them, the sealed tank 11 refers to a closed container made of pressure-resistant material, specifically titanium alloy or high-strength stainless steel material welded together, used to protect internal electronic components from water pressure damage in deep water and high-pressure environments.

[0023] The power amplifier heat sink 12 refers to the metal component used to conduct heat from the power amplifier module 13. Specifically, it can be made of aluminum alloy or copper into a cubic frame structure, and its bottom surface is connected to the bottom of the sealed tank 11 by welding or bolting to form a heat conduction path.

[0024] A cube structure refers to a three-dimensional geometric body enclosed by six rectangular planes. Specifically, it can adopt a hollow finned structure or a solid metal block structure, which improves heat exchange efficiency by increasing the heat dissipation surface area.

[0025] The power amplifier module 13 is located on the side of the power amplifier heat sink 12, which means that the power transistor and drive circuit are mounted vertically on the four sides of the heat sink. Specifically, thermally conductive adhesive or clamp pressing can be used to directly conduct the heat generated by the heat-generating element to the heat sink body.

[0026] The core innovation of this application lies in using a cubic power amplifier heatsink 12 as a heat concentration hub. By vertically arranging multiple power amplifier modules 13 on the side of the heatsink, the heat generated by each module is conducted to the bottom of the tank along the shortest path. Efficient heat dissipation is achieved by utilizing the direct contact between the outer wall of the tank bottom and seawater in the deep water environment. This structure breaks through the thermal resistance bottleneck of traditional planar heat dissipation layouts, forming a three-dimensional heat transfer channel within the sealed tank 11, significantly improving the heat dissipation capability of high-power devices in high-pressure, sealed environments.

[0027] The cubic structure of the power amplifier heat sink 12 provides multiple planes for mounting the power amplifier module 13, while the bottom surface is in close contact with the bottom of the sealed tank 11, forming an efficient heat conduction path. The heat generated by the power amplifier module 13 during operation is first conducted to the power amplifier heat sink 12, then concentrated through the bottom surface of the power amplifier heat sink 12 to the bottom of the sealed tank 11, and finally dissipated by the outer wall of the tank bottom in contact with seawater.

[0028] Through the above solution, this application solves the problem of heat dissipation difficulties for high-power equipment in deep-water environments. The cubic power amplifier heat sink 12 efficiently collects and conducts heat from multiple heat sources to the bottom of the tank, shortening the heat conduction path and improving heat dissipation efficiency. The operating temperature of the power amplifier module 13 is effectively controlled, extending the service life of the equipment and improving system reliability. At the same time, the compact three-dimensional structure enhances the overall vibration and shock resistance, adapting to harsh deep-water environments. In addition, the centralized heat dissipation design simplifies the system structure, facilitating maintenance and upgrades.

[0029] See Figure 2 Furthermore, the power amplifier tank heat dissipation structure 1 also includes an impedance transformation module 14 and a power supply module 15, with the power supply module 15 installed on the top of the sealed tank. The power amplifier heat sink 12, the impedance transformation module 14, and the power supply module 15 are stacked from bottom to top, and the power amplifier module 13, the impedance transformation module 14, and the power supply module 15 are electrically connected.

[0030] The power supply module 15 uses a combination of a switching power supply and an auxiliary power board. The switching power supply directly powers the power amplifier module 13, while the auxiliary power board provides low-voltage DC power to other modules. The impedance transformation module 14 includes a multi-stage switching transformer group, which changes the output voltage and impedance by connecting different transformers in series. The stacked arrangement distributes the modules along the longitudinal axis of the tank, with the power supply module 15 located on the top layer and directly connected to the power supply interface 19 at the top of the tank. The electrical connection uses pressure-resistant and waterproof connectors to ensure the reliability of signal transmission between modules.

[0031] Specifically, the stacked layout of the power module 15 shortens the distance between the wires and the external power supply interface 19, reducing line impedance loss. The high-power output of the switching power supply is directly delivered to the power amplifier module 13 via a short path, reducing energy loss. The impedance transformation module 14 is located between the power amplifier heatsink 12 and the power module 15. It receives the output signal from the power amplifier module 13 via electrical connection and matches the impedance requirements of different transducers after adjustment by the transformer group. The stacked structure forms a vertical heat conduction path. When heat is transferred upward from the bottom power amplifier heatsink 12, it is dispersed by the heat dissipation structure of the middle layer impedance transformation module 14 and the top power module 15, avoiding local overheating. The pressure-resistant connectors of the electrical connections use gold-plated contacts to maintain stable contact under kilometer-level water pressure, preventing signal interruption due to pressure deformation.

[0032] Through the above technical solution, this application achieves efficient utilization of the internal space of the power amplifier tank, with a reasonable layout of each functional module and compact circuit connections. The stacked structure facilitates heat dissipation, allowing heat to be conducted vertically to the bottom of the tank. The modular design improves assembly and maintenance efficiency. The power module 15 is located at the top, facilitating heat dissipation and keeping it away from the underwater transducer, thus reducing electromagnetic interference.

[0033] like Figure 1 As shown, a communication interface 16 is further provided at the end of the sealed tank 11 away from the power amplifier heat sink 12. The communication interface 16 is used to receive remote control commands.

[0034] The communication interface 16 adopts a waterproof structure design and is installed on the top end face of the sealed tank 11. The communication interface 16 is connected to the main control module through an internal cable. The main control module is configured to parse commands and control the working mode of the power amplifier module 13. The communication interface 16 supports standard communication protocols, such as RS-485 or RS232, to adapt to different transmission media requirements. The interface shell and the sealed tank 11 are pressed together with a metal sealing ring to ensure sealing in deep water environments.

[0035] Specifically, the communication interface 16 receives command signals sent by the watercraft and transmits them to the main control module through an internal cable. The main control module adjusts the gain, frequency, or signal source switching of the power amplifier module 13 according to the command content. At the same time, the main control module transmits the equipment's operating status data back to the watercraft through the communication interface 16, realizing two-way communication.

[0036] The communication interface 16 is installed on the top end face of the sealed tank 11, which avoids spatial interference with the power amplifier module 13 on the side of the radiator and facilitates connection with external cables. The waterproof design of the interface is achieved through a multi-layer sealing structure, including metal shell welding, rubber sealing ring compression and potting compound filling, to ensure no leakage under water pressure of 1,000 meters. An isolation circuit design is adopted between the main control module and the communication interface 16 to prevent signal interference from affecting control accuracy.

[0037] Through the above technical solution, this application achieves remote control and monitoring of the deep-water amplifier tank. The communication interface 16 allows operators to send control commands from the surface to the underwater equipment, adjusting amplifier parameters or switching operating modes without costly recovery operations. Simultaneously, this interface can also acquire the amplifier tank's operating status information, enabling timely detection of anomalies. This remote control capability significantly improves the reliability and maintainability of the deep-water amplifier system, and reduces operation and maintenance costs.

[0038] See Figure 1 Furthermore, the end of the sealed tank 11 away from the power amplifier heat sink 12 is also provided with a signal output interface 17 and a signal input interface 18.

[0039] The signal output interface 17 uses a waterproof connector, and its internal wires are connected to the output end of the power amplifier module 13 to transmit the amplified electrical signal to the transducer. The signal input interface 18 uses a coaxial waterproof socket, and its internal wiring is connected to the signal input end of the control circuit board to receive the original signal sent by the external device. The signal output interface 17 and the signal input interface 18 are distributed circumferentially along the end face of the sealed tank 11 to avoid electromagnetic interference between them.

[0040] Specifically, the signal input interface 18 is connected to the signal preprocessing unit of the control circuit board via a shielded cable. The analog signal sent by the external signal source is input through the interface, and then undergoes filtering and amplification before being transmitted to the power amplifier module 13. The signal output interface 17 is directly connected to the output terminal of the power amplifier module 13 via internal wires. The amplified high-voltage signal is output to the transducer through the interface, driving it to generate an acoustic signal.

[0041] Through the above technical solution, this application achieves signal connection between the deep-water power amplifier tank and external equipment. Signal output interface 17 enables the power amplifier output signal to be transmitted to the transducer, completing the signal transmission function. Signal input interface 18 enables external signal sources to input signals to the power amplifier, increasing the power amplifier's signal input methods. The use of waterproof connectors ensures the sealing and reliability of the interfaces in deep-water environments. The design of multiple signal inputs and single signal outputs meets the needs of different application scenarios. The reasonable layout of the interfaces avoids mutual interference between signals.

[0042] like Figure 1 As shown, the sealed container 11 is further provided with a power supply interface 19 at the end away from the power amplifier heat sink 12. The power supply interface 19 is used to connect an external power source.

[0043] The power supply interface 19 adopts a waterproof plug-in form, and its metal contacts are connected to the input terminal of the power module 15 through internal wires; the interface shell is fixed to the end of the sealed tank 11 by a flange structure, and the flange contact surface is filled with an annular sealing ring; the installation position of the power supply interface 19 is on the same end face as the communication interface 16 and the signal input / output interface, forming a centralized interface area; the rated voltage parameters of the power supply interface 19 match the input voltage range of the power module 15, and support DC or AC power input.

[0044] Specifically, the power supply interface 19 is located on the top end face of the sealed tank 11, forming the shortest electrical connection path with the input terminal of the internal power module 15, thus reducing line impedance. When the external power cable connects to the power supply interface 19 via the underwater connector, the current is filtered by the internal protection circuit of the interface and then directly delivered to the power module 15 at the top. The power module 15 converts external electrical energy into the operating voltage required by the power amplifier module 13, and simultaneously forms a vertical power supply link with the impedance transformation module 14 below through a stacked structure. The centralized layout of the interface area avoids cables from tangling on the tank surface, reducing installation space occupation. The combination structure of the flange and sealing ring ensures no leakage risk at the interface under kilometer-level water pressure. The overvoltage protection circuit adopts a transient voltage suppression diode and a self-resetting fuse series scheme, which automatically cuts off the power supply circuit when the output voltage of the power amplifier module 13 exceeds a preset threshold.

[0045] Through the above technical solution, this application achieves a reliable connection between the deep-water amplifier tank and the external power supply. This solves the problem of power supply for equipment in deep-water environments, ensuring the long-term stable operation of the amplifier system. Furthermore, the use of standardized waterproof connectors facilitates maintenance and replacement, improving the system's reliability and maintainability.

[0046] The above description is merely a preferred embodiment of the present utility model, and the specific embodiments described above are not intended to limit the present utility model. Various modifications and variations can be made within the scope of the technical concept of the present utility model. All refinements, modifications, or equivalent substitutions made by those skilled in the art based on the above description are within the scope of protection of the present utility model.

Claims

1. A heat dissipation structure for a power amplifier tank in a deep-water transducer, characterized in that, Includes a sealed tank, a power amplifier heat sink, and multiple power amplifier modules; The power amplifier heat sink has a cubic structure and is located at the bottom of the sealed container. The multiple power amplification modules are located on multiple sides of the power amplifier heat sink away from the bottom of the sealed container.

2. The power amplifier tank heat dissipation structure according to claim 1, characterized in that, The power amplifier tank heat dissipation structure also includes an impedance transformation module and a power supply module, with the power supply module installed on the top of the sealed tank. The power amplifier heat sink, the impedance transformation module, and the power supply module are stacked from bottom to top, and the power amplifier module, the impedance transformation module, and the power supply module are electrically connected.

3. The power amplifier tank heat dissipation structure according to claim 2, characterized in that, The sealed container is provided with a communication interface at the end opposite to the power amplifier heat sink, and the communication interface is used to receive remote control commands.

4. The power amplifier tank heat dissipation structure according to claim 3, characterized in that, The sealed container is also provided with a signal output interface and a signal input interface at the end opposite to the power amplifier heat sink.

5. The power amplifier tank heat dissipation structure according to claim 2, characterized in that, The sealed container is also provided with a power supply interface at the end opposite to the power amplifier heat sink, which is used to connect to an external power source.

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