Water-cooled heat dissipation controller and vehicle

Abstract

The utility model provides a kind of water-cooling heat dissipation controller and vehicle, belong to the technical field of automobile parts, including controller shell, capacitor module and IGBT module, controller shell is provided with water inlet channel and water outlet channel;Capacitor module is installed in capacitor installation area;Capacitor module is integrated with capacitor cooling channel.IGBT module is installed in IGBT module installation area, and is sealed with IGBT module installation area and constitutes IGBT module cooling channel;Capacitor cooling channel and IGBT module cooling channel are connected between water inlet channel and water outlet channel.This application is arranged horizontally by capacitor module and IGBT module, and is connected between water inlet channel and water outlet channel, solves the problem that upper and lower stacked arrangement IGBT module and capacitor share cooling water channel, height cannot be reduced and is difficult to arrange in limited space, also solves the problem that horizontally arranged IGBT module and capacitor have poor heat dissipation effect.

Description

Technical Field

[0001] This utility model belongs to the field of automotive parts technology, and more specifically, it relates to a water-cooled heat dissipation controller and a vehicle. Background Technology

[0002] With the rapid development of the automotive industry, new energy vehicles have become the mainstream in the automotive market. To meet the diversified needs of the market, the design criteria for motor controllers are becoming increasingly stringent. As one of the main components of the motor controller, ensuring that the capacitor can operate within its normal operating temperature range within a limited space has become a significant challenge in controller structural design. In existing controller structures, the capacitor is electrically connected to the IGBT module, making it difficult to design a separate water-cooling structure for the capacitor.

[0003] As an essential component in motor controllers, capacitors currently employ two main heat dissipation methods, and these methods present the following problems: The first type involves stacking the IGBT module and capacitor in a vertical layer, with the capacitor and IGBT sharing a cooling channel for heat dissipation. This limits the height of the controller and makes the layout design difficult within a limited space. The second type involves horizontally arranging the capacitor and IGBT module, with heat dissipation between the capacitor and the casing via thermally conductive materials. This results in poor heat dissipation, and when the capacitor's temperature rise fails to meet design requirements, continuous optimization of the capacitor's copper busbar or core structure is necessary to ensure capacitor performance. This not only wastes time but also increases the final cost of the capacitor. Utility Model Content

[0004] The purpose of this utility model is to provide a water-cooled heat dissipation controller and vehicle, which can solve the problem that the height of the stacked IGBT modules and capacitors sharing the same cooling water channel cannot be reduced and it is difficult to arrange them in a limited space, and can also solve the problem of poor heat dissipation of horizontally arranged IGBT modules and capacitors.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: to provide a water-cooled heat dissipation controller, comprising: The controller housing has a capacitor mounting area and an IGBT module mounting area, as well as a water inlet channel and a water outlet channel; the water inlet channel has a capacitor cooling water inlet and an IGBT module cooling water inlet that are respectively connected to the capacitor mounting area and the IGBT module mounting area, and the water outlet channel has a capacitor cooling water outlet and an IGBT module cooling water outlet that are respectively connected to the capacitor mounting area and the IGBT module mounting area; A capacitor module is installed in the capacitor mounting area; the capacitor module integrates a capacitor cooling channel, which has an inner capacitor cooling inlet connected to the capacitor cooling water inlet and an inner capacitor cooling outlet connected to the capacitor cooling water outlet; and An IGBT module is installed in the IGBT module mounting area and is sealed with the IGBT module mounting area to form an IGBT module cooling channel; The capacitor cooling channel and the IGBT module cooling channel are connected in parallel between the water inlet channel and the water outlet channel.

[0006] The beneficial effects of the water-cooled heat dissipation controller provided by this utility model are as follows: Compared with the prior art, the water-cooled heat dissipation controller of this utility model has a capacitor mounting area and an IGBT module mounting area on the controller housing, which is equivalent to the capacitor module and IGBT module being arranged horizontally. The controller as a whole is flat and low in height, making it easy to arrange in a limited space. Cooling channels are set for the capacitor module and the IGBT module respectively. The cooling channels of the two are connected in parallel between the inlet channel and the outlet channel. Cooling water enters the inlet channel on the controller housing from the outside and splits into two paths from the capacitor cooling inlet and the IGBT module cooling inlet into the capacitor cooling channel and the IGBT module cooling channel respectively, cooling the capacitor module and the IGBT module respectively. This cooling method can improve the heat dissipation effect compared with the series cooling channels.

[0007] Therefore, this application solves the problem that the height of stacked IGBT modules and capacitors sharing the same cooling water channel cannot be reduced and it is difficult to arrange them in a limited space by horizontally arranging the capacitor module and IGBT module and connecting the cooling channels in parallel. It also solves the problem of poor heat dissipation of horizontally arranged IGBT modules and capacitors.

[0008] The reason why series cooling is less effective than parallel cooling is analyzed as follows: In series cooling, the cooling water passes through the capacitor module and the IGBT module in sequence (or first through the IGBT module and then through the capacitor module). After passing through the capacitor module, the temperature rises after absorbing heat. When it flows through the IGBT module, the temperature of the cooling water has already absorbed heat and risen, and the temperature difference between the cooling water and the IGBT module becomes smaller. The reduced temperature difference will directly reduce the heat dissipation efficiency, resulting in insufficient heat dissipation of the latter module.

[0009] Accumulated flow resistance leads to a decrease in flow rate: The pipes in series flow channels are longer and have more bends, resulting in greater overall flow resistance. Under the same inlet water pressure, the cooling water flow rate will be smaller, and the heat carried away per unit time will also be reduced.

[0010] When connected in parallel, each module can obtain low-temperature cooling water. The cooling water is directly diverted from the inlet channel to the cooling channels of the two modules. The temperature difference between the cooling water and each module is always kept at its maximum, and the heat dissipation power is in the optimal state. There will be no situation where the downstream module is cooled by hot water.

[0011] When connected in parallel, the flow rate can be allocated in a targeted manner: different cross-sectional area water inlets can be designed according to the heat generation power of capacitors and IGBTs, so that modules with high heat generation (such as IGBTs) can obtain more cooling water flow and accurately match heat dissipation requirements.

[0012] When connected in parallel, the flow resistance is lower and the flow rate is more stable: the overall flow resistance of parallel flow channels is lower than that of series flow channels. Under the same inlet water pressure, the total flow rate is larger, and the flow rate of a single branch is not affected by the other branch, resulting in higher heat dissipation stability.

[0013] In conjunction with the first aspect, in one possible implementation, the capacitor module includes: A water-cooled radiator includes a water-receiving shell and a sealing cover plate covering the water-receiving shell; the capacitor cooling inlet and the capacitor cooling outlet are disposed on the sealing cover plate; the cavity inside the water-receiving shell constitutes the capacitor cooling flow channel; and The capacitor body is mounted on the outer bottom surface of the water-retaining shell, away from the sealing cover.

[0014] In conjunction with the first aspect, in one possible implementation, a heat dissipation structure is provided on the inner bottom surface of the water-containing shell.

[0015] In conjunction with the first aspect, in one possible implementation, the heat dissipation structure includes heat dissipation columns arrayed on the bottom surface inside the water-containing shell; the capacitor cooling inlet and the capacitor cooling outlet are respectively located on opposite sides of the sealing cover.

[0016] In conjunction with the first aspect, in one possible implementation, an insulating paper is provided between the outer bottom surface of the water-containing shell and the capacitor body.

[0017] In conjunction with the first aspect, in one possible implementation, a recessed first support step is provided at the opening of the water-containing shell, and the sealing cover plate is fitted onto the first support step, with the outer surface of the sealing cover plate flush with the end face of the water-containing shell.

[0018] In conjunction with the first aspect, in one possible implementation, the capacitor module further includes a capacitor housing, the capacitor body is installed inside the capacitor housing, and the water-cooled radiator covers the opening of the capacitor housing and is flush with the end face of the capacitor housing.

[0019] In conjunction with the first aspect, in one possible implementation, the inner inlet of the capacitor cooling system is connected to the capacitor cooling outlet and sealed by a surrounding first sealing ring; the inner outlet of the capacitor cooling system is connected to the capacitor cooling outlet and sealed by a surrounding second sealing ring.

[0020] In conjunction with the first aspect, in one possible implementation, the IGBT module mounting area forms a second support step, the IGBT module is supported on the second support step to form a cooling channel for the IGBT module, and a third sealing ring is provided on the second support step.

[0021] Secondly, this utility model embodiment also provides a vehicle, including the aforementioned water-cooled heat dissipation controller.

[0022] The vehicle provided in this embodiment of the utility model adopts a water-cooled heat dissipation structure with capacitor modules and IGBT modules arranged horizontally. This not only has a good heat dissipation effect, but also reduces the height of the controller, meets the spatial arrangement requirements of the controller, facilitates the miniaturization design of the controller, and enables platform-based applications. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A three-dimensional structural diagram of the water-cooled heat dissipation controller provided in an embodiment of this utility model; Figure 2 An exploded view of the water-cooled heat dissipation controller provided in an embodiment of this utility model; Figure 3 A schematic diagram of the external front view structure of the controller housing provided in an embodiment of this utility model; Figure 4 for Figure 3 A three-dimensional structural diagram of the controller housing is shown; Figure 5 for Figure 3 The diagram shows the internal front view of the controller housing. Figure 6 for Figure 3 The diagram shows the internal three-dimensional structure of the controller housing; Figure 7 A three-dimensional structural schematic diagram of the capacitor module provided in an embodiment of this utility model; Figure 8An exploded view of the capacitor module provided in an embodiment of this utility model; Figure 9 A three-dimensional structural diagram of the water-cooled radiator provided in the embodiment of this utility model; Figure 10 A three-dimensional structural diagram illustrating the arrangement of the capacitor body within the capacitor housing of the capacitor module provided in this embodiment of the utility model; Figure 11 This is a three-dimensional structural diagram showing the installation position of the capacitor body and the water-cooled radiator of the capacitor module provided in the embodiment of this utility model.

[0025] In the diagram: 1. Controller housing; 11. Capacitor mounting area; 12. Capacitor cooling inlet; 13. Capacitor cooling outlet; 14. IGBT module mounting area; 15. IGBT module cooling inlet; 16. Second support step; 17. IGBT module cooling outlet; 18. Outlet channel; 19. Inlet channel; 2. Capacitor module; 21. Water-cooled radiator; 211. Capacitor cooling inner inlet; 212. Capacitor cooling inner outlet; 213. Sealing cover; 214. Heat dissipation structure; 215. Water tank; 216. First support step; 22. Capacitor housing; 23. Input copper busbar; 24. Output copper busbar; 25. Capacitor body; 26. Insulating paper; 3. IGBT module; 4. Inlet connector; 5. Outlet connector; 6. First sealing ring; 7. Second sealing ring; 8. Third sealing ring. Detailed Implementation

[0026] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0027] It should be noted that when an element is referred to as being "set on" another element, it can be directly on or indirectly on that other element. It should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0028] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a number" means two or more, unless otherwise explicitly specified.

[0029] It should be noted that the directions or positional relationships indicated by "front", "rear", "inner", "outer", "up", and "down" in this embodiment are based on the vehicle's own orientation. The front of the vehicle represents "front", the rear of the vehicle represents "rear", the top of the vehicle represents "up", the bottom of the vehicle represents "down", the "inner" side refers to the side facing the driver's cab, and the "outer" side refers to the side facing the driver's cab.

[0030] In addition, the front-rear direction of the vehicle body defined in the embodiments of this utility model refers to the front-rear direction of the vehicle's forward direction during driving; the left-right direction of the vehicle body defined refers to the left-right direction of the vehicle's forward direction during driving; and the up-down direction of the vehicle body defined refers to the up-down direction of the vehicle's forward direction during driving.

[0031] Please refer to the following: Figures 1 to 11 The water-cooled heat dissipation controller provided by this utility model will now be described. The water-cooled heat dissipation controller includes a controller housing 1, a capacitor module 2, and an IGBT module 3. The controller housing 1 is provided with a capacitor mounting area 11 and an IGBT module mounting area 14, and is also provided with a water inlet channel 19 and a water outlet channel 18. The water inlet channel 19 is provided with a capacitor cooling water inlet 12 and an IGBT module cooling water inlet 15, which are respectively connected to the capacitor mounting area 11 and the IGBT module mounting area 14. The water outlet channel 18 is provided with a capacitor cooling water outlet 13 and an IGBT module cooling water outlet 17, which are respectively connected to the capacitor mounting area 11 and the IGBT module mounting area 14.

[0032] The capacitor module 2 is installed in the capacitor mounting area 11; the capacitor module 2 is integrated with a capacitor cooling channel, which is provided with a capacitor cooling inner inlet 211 that connects to the capacitor cooling water inlet 12, and a capacitor cooling inner outlet 212 that connects to the capacitor cooling water outlet 13.

[0033] IGBT module 3 is installed in IGBT module mounting area 14 and is sealed with IGBT module mounting area 14 to form IGBT module cooling channel; capacitor cooling channel and IGBT module cooling channel are connected in parallel between water inlet channel 19 and water outlet channel 18.

[0034] Compared with the prior art, the water-cooled heat dissipation controller of this utility model has a capacitor mounting area 11 and an IGBT module mounting area 14 on the controller housing 1, which is equivalent to the capacitor module 2 and IGBT module 3 being arranged horizontally. The controller is flat and low in height, making it easy to arrange in a limited space. Cooling channels are provided for the capacitor module 2 and IGBT module 3 respectively. The cooling channels are connected in parallel between the inlet channel 19 and the outlet channel 18. Cooling water enters the inlet channel 19 on the controller housing 1 from the outside and splits into two paths, entering the capacitor cooling channel 12 and the IGBT module cooling channel 15 respectively, cooling the capacitor module 2 and IGBT module 3 respectively. This cooling method can improve the heat dissipation effect compared with the series cooling channels.

[0035] Therefore, this application solves the problem that the height of the stacked IGBT module 3 and the capacitor cannot be reduced and it is difficult to arrange them in a limited space by horizontally arranging the capacitor module 2 and the IGBT module 3 and connecting the cooling channels in parallel. It also solves the problem of poor heat dissipation of the horizontally arranged IGBT module 3 and the capacitor.

[0036] In this application, an inlet connector 4 directly connected to the inlet channel 19 and an outlet connector 5 directly connected to the outlet channel 18 are installed on the controller housing 1. Figure 3 As shown by the middle arrow, the heat dissipation path of the controller is as follows: Cooling water entering from the inlet connector 4 first enters the inlet channel 19, and then enters the capacitor cooling channel and the IGBT module cooling channel respectively from the capacitor cooling inlet 12 and the IGBT module cooling inlet 15 set in the inlet channel 19. The return water that has absorbed heat flows from the capacitor cooling outlet 13 and the IGBT module cooling outlet 17 to the outlet channel 18, and is discharged from the outlet connector 5.

[0037] In one embodiment of the water inlet channel 19 and water outlet channel 18, the water inlet channel 19 and water outlet channel 18 are located on opposite sides of the controller housing 1, and are located on opposite sides of the controller housing 1, separate from the capacitor module 2 and IGBT module 3. That is, the water inlet channel 19 and water outlet channel 18 are located on the side opposite to the capacitor mounting area 11. Figures 1 to 6 The diagram shows this type of layout.

[0038] In another embodiment of the water inlet channel 19 and water outlet channel 18, the water inlet channel 19 and water outlet channel 18 are located on opposite sides of the controller housing 1, and are on the same side of the controller housing 1 as the capacitor module 2 and IGBT module 3. In this case, a partition wall is set between the water inlet channel 19 and water outlet channel 18 and the capacitor module 2 and IGBT module 3, and the water inlet and outlet are set on the partition wall directly opposite each module. The reason why series cooling is worse than parallel cooling is analyzed as follows: In series cooling, the cooling water passes through the capacitor module 2 and IGBT module 3 in sequence (or first through the IGBT module 3 and then through the capacitor module 2; after passing through the capacitor module 2, the temperature rises after absorbing heat; when it flows through the IGBT module 3, the temperature of the cooling water has already absorbed heat and risen, and the temperature difference with the IGBT module 3 becomes smaller. The reduced temperature difference will directly reduce the heat dissipation efficiency, resulting in insufficient heat dissipation of the latter module.

[0039] Accumulated flow resistance leads to a decrease in flow rate: The pipes in series flow channels are longer and have more bends, resulting in greater overall flow resistance. Under the same inlet water pressure, the cooling water flow rate will be smaller, and the heat carried away per unit time will also be reduced.

[0040] When connected in parallel, each module can obtain low-temperature cooling water. The cooling water is directly diverted from the inlet channel 19 to the cooling channels of the two modules. The temperature difference between the cooling water and each module is always kept at its maximum, and the heat dissipation power is in the optimal state. There will be no situation where the downstream module is cooled by hot water.

[0041] When connected in parallel, the flow rate can be allocated in a targeted manner: different cross-sectional area water inlets can be designed according to the heat generation power of capacitors and IGBTs, so that modules with high heat generation (such as IGBTs) can obtain more cooling water flow and accurately match heat dissipation requirements.

[0042] For example, combining Figures 2 to 6 As shown, the dimensions of each water inlet can be designed in this application. The capacitor cooling water inlet 12 and the IGBT module cooling water inlet 15 are both elongated holes, and the capacitor cooling water outlet 13 and the IGBT module cooling water outlet 17 are also elongated holes. The size of the water flow distributed to each module is realized by the length and width dimensions of the elongated holes.

[0043] When connected in parallel, the flow resistance is lower and the flow rate is more stable: the overall flow resistance of parallel flow channels is lower than that of series flow channels. Under the same inlet water pressure, the total flow rate is larger, and the flow rate of a single branch is not affected by the other branch, resulting in higher heat dissipation stability.

[0044] Among them, capacitor module 2 and IGBT module 3 are respectively fixed to controller housing 1 by bolts, and the electrical connection between capacitor module 2 and IGBT module 3 is made by bolts or laser welding. In some embodiments, see Figures 7 to 11The capacitor module 2 includes a water-cooled heat sink 21 and a capacitor body 25. The water-cooled heat sink 21 includes a water-filled shell 215 and a sealing cover 213 covering the water-filled shell 215. The capacitor cooling inlet 211 and the capacitor cooling outlet 212 are disposed on the sealing cover 213. The cavity inside the water-filled shell 215 forms a capacitor cooling flow channel. The capacitor body 25 is installed on the outer bottom surface of the water-filled shell 215 away from the sealing cover 213.

[0045] In this embodiment, the capacitor body 25 is directly integrated on the water-cooled heat sink 21. The cooling water diverted through the capacitor cooling inlet 12 directly enters the water tank 215, which can directly absorb the heat generated by the capacitor body 25, reduce the temperature of the capacitor body 25, and achieve good heat dissipation of the capacitor body 25.

[0046] Since the capacitor body 25 includes a capacitor core, an input copper busbar 23, and an output copper busbar 24, and the capacitor core is connected to the input copper busbar 23 and the output copper busbar 24, the cooling water in the capacitor cooling channel can directly dissipate heat and cool the input copper busbar 23 and the output copper busbar 24, improving the heat dissipation effect of the capacitor module 2 and ensuring that the capacitor body 25 can maintain normal operation for a long time. At the same time, since the capacitor module 2 integrates the cooling channel, the capacitor shell 22 has a simple structure, requiring less modification to existing projects. Furthermore, the capacitor and IGBT module 3 are arranged horizontally, reducing the overall height of the controller and facilitating the layout requirements of the electric drive assembly.

[0047] In some embodiments, see Figure 8 As shown, a heat dissipation structure 214 is provided on the inner bottom surface of the water-containing shell 215. The heat dissipation structure 214 can improve the heat dissipation effect of the capacitor module 2.

[0048] In some embodiments, see Figure 8 As shown, the heat dissipation structure 214 includes heat dissipation columns arrayed on the bottom surface inside the water-containing shell 215; the capacitor cooling inner water inlet 211 and the capacitor cooling inner water outlet 212 are respectively located on opposite sides of the sealing cover plate 213.

[0049] The capacitor cooling inlet 211 and the capacitor cooling outlet 212 are located on opposite sides of the sealing cover 213. After the cooling water enters the water tank 215 through the inlet, if the bottom surface is flat, the water flow tends to be parallel and laminar, resulting in low heat exchange efficiency. The heat dissipation columns of the array act as flow disruptors. When the cooling water flows through the heat dissipation columns, it is blocked, diverted, and bypassed by the columns, disrupting the original laminar flow. Therefore, it can significantly increase the speed of heat transfer from the heat dissipation columns to the cooling water.

[0050] Optionally, the heat dissipation structure 214 provided on the bottom surface inside the water-containing shell 215 can also be staggered baffles. Through the baffles, curved cooling channels are formed, extending the time for cooling water to pass through and improving the heat dissipation effect (this solution is not shown in the figure).

[0051] Optionally, the heat dissipation structure 214 provided on the bottom surface inside the water-containing shell 215 can also be an S-shaped meandering groove, which can also improve the heat dissipation effect by extending the passage time of cooling water (not shown).

[0052] The heat dissipation structure 214 is integrally formed within the water-containing shell 215.

[0053] In some embodiments, see Figure 11 As shown, an insulating paper 26 is provided between the outer bottom surface of the water-retaining shell 215 and the capacitor body 25. By insulating the capacitor body 25 and the water-cooled radiator 21 with the insulating paper 26, the electrical reliability of the controller is ensured.

[0054] In some embodiments, see Figure 8 As shown, a recessed first support step 216 is provided at the opening of the water-containing shell 215, and a sealing cover 213 is fitted onto the first support step 216, with the outer surface of the sealing cover 213 flush with the end face of the water-containing shell 215. Through structural design, the height of the water-cooled radiator 21 is reduced, thereby reducing the overall height of the controller, which facilitates the arrangement of the controller in the limited space inside the vehicle.

[0055] In some embodiments, see Figures 7 to 10 As shown, the capacitor module 2 also includes a capacitor housing 22, with the capacitor body 25 installed inside the capacitor housing 22. A water-cooled radiator 21 covers the opening of the capacitor housing 22 and is flush with the end face of the capacitor housing 22. Similarly, this structural design reduces the overall height of the controller, facilitating its placement within the limited space of the vehicle.

[0056] In some embodiments, see Figure 2 As shown, the capacitor cooling inner inlet 211 is connected to the capacitor cooling inlet 12 and sealed by the surrounding first sealing ring 6; the capacitor cooling inner outlet 212 is connected to the capacitor cooling outlet 13 and sealed by the surrounding second sealing ring 7. These sealing rings prevent cooling water leakage and ensure the electrical safety and reliability of the controller.

[0057] In some embodiments, see Figure 2As shown, the IGBT module mounting area 14 forms a second support step 16, and the IGBT module 3 is supported on the second support step 16 so that an IGBT module cooling channel is formed between the IGBT module 3 and the controller housing 1. The second support step 16 is provided with an annular sealing groove, and the third sealing ring 8 is installed in the annular sealing groove to prevent cooling water leakage and ensure the electrical safety and reliability of the controller.

[0058] Based on the same inventive concept, this application also provides a vehicle including the aforementioned water-cooled heat dissipation controller.

[0059] The vehicle provided in this embodiment of the utility model adopts a water-cooled heat dissipation structure with capacitor modules and IGBT modules arranged horizontally. This not only has a good heat dissipation effect, but also reduces the height of the controller, meets the spatial arrangement requirements of the controller, facilitates the miniaturization design of the controller, and enables platform-based applications.

[0060] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A water-cooled heat dissipation controller, characterized in that, include: The controller housing (1) is provided with a capacitor mounting area (11) and an IGBT module mounting area (14), and is also provided with a water inlet channel (19) and a water outlet channel (18); the water inlet channel (19) is provided with a capacitor cooling water inlet (12) and an IGBT module cooling water inlet (15) respectively connecting the capacitor mounting area (11) and the IGBT module mounting area (14); the water outlet channel (18) is provided with a capacitor cooling water outlet (13) and an IGBT module cooling water outlet (17) respectively connecting the capacitor mounting area (11) and the IGBT module mounting area (14); A capacitor module (2) is installed in the capacitor mounting area (11); the capacitor module (2) integrates a capacitor cooling channel, the capacitor cooling channel is provided with a capacitor cooling inner inlet (211) communicating with the capacitor cooling inlet (12), and a capacitor cooling inner outlet (212) communicating with the capacitor cooling outlet (13); and The IGBT module (3) is installed in the IGBT module mounting area (14) and is sealed with the IGBT module mounting area (14) to form an IGBT module cooling channel; The capacitor cooling channel and the IGBT module cooling channel are connected in parallel between the water inlet channel (19) and the water outlet channel (18).

2. The water-cooled heat dissipation controller as described in claim 1, characterized in that, The capacitor module (2) includes: A water-cooled radiator (21) includes a water-receiving shell (215) and a sealing cover (213) covering the water-receiving shell (215). The capacitor cooling inlet (211) and the capacitor cooling outlet (212) are disposed on the sealing cover (213). The cavity inside the water-receiving shell (215) constitutes the capacitor cooling flow channel. The capacitor body (25) is mounted on the outer bottom surface of the water-holding shell (215) away from the sealing cover plate (213).

3. The water-cooled heat dissipation controller as described in claim 2, characterized in that, A heat dissipation structure (214) is provided on the inner bottom surface of the water-containing shell (215).

4. The water-cooled heat dissipation controller as described in claim 3, characterized in that, The heat dissipation structure (214) includes heat dissipation columns arranged in an array on the bottom surface inside the water-containing shell (215); the capacitor cooling inner water inlet (211) and the capacitor cooling inner water outlet (212) are respectively located on opposite sides of the sealing cover plate (213).

5. The water-cooled heat dissipation controller as described in claim 2, characterized in that, An insulating paper (26) is provided between the outer bottom surface of the water-containing shell (215) and the capacitor body (25).

6. The water-cooled heat dissipation controller as described in claim 2, characterized in that, The opening of the water-containing shell (215) is provided with a recessed first support step (216), and the sealing cover (213) covers the first support step (216). The outer surface of the sealing cover (213) is flush with the end face of the water-containing shell (215).

7. The water-cooled heat dissipation controller as described in claim 2, characterized in that, The capacitor module (2) also includes a capacitor housing (22), the capacitor body (25) is installed inside the capacitor housing (22), and the water-cooled radiator (21) covers the opening of the capacitor housing (22) and is flush with the end face of the capacitor housing (22).

8. The water-cooled heat dissipation controller as described in claim 1, characterized in that, The capacitor cooling inner inlet (211) is connected to the capacitor cooling inlet (12) and sealed by the surrounding first sealing ring (6); the capacitor cooling inner outlet (212) is connected to the capacitor cooling outlet (13) and sealed by the surrounding second sealing ring (7).

9. The water-cooled heat dissipation controller as described in claim 1, characterized in that, The IGBT module mounting area (14) forms a second support step (16), the IGBT module (3) is supported on the second support step (16) to form the IGBT module cooling channel, and a third sealing ring (8) is provided on the second support step (16).

10. A vehicle, characterized in that, Includes the water-cooled heat dissipation controller as described in any one of claims 1-9.

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