A stand-alone power supply structure

Abstract

The application relates to the technical field of power supply structures, and provides an independent power supply structure, which comprises a power supply box, a bottom plate, a gland, a pressing plate, a packaging baffle and a wire pressing assembly; the power supply box is internally provided with a clamping groove type track, the bottom plate is mounted in the track and carries electrical elements; the gland is hingedly connected to the power supply box, and the pressing plate is detachably connected to the power supply box; the packaging baffle is detachably connected to the pressing plate, which not only encloses a heat dissipation glue filling cavity together with the power supply box and the bottom plate, but also encloses a wire pressing space together with the gland and the pressing plate; the wire pressing assembly is arranged in the wire pressing space and comprises a multi-tooth mechanism adjusting baffle, a wire pressing block fixing base and a wire pressing block; a multi-tooth adjusting mechanism is arranged between the multi-tooth mechanism adjusting baffle and the wire pressing block, and the wire pressing block is detachable from the base; the height of the wire pressing block is stepwisely adjusted through the multi-tooth adjusting mechanism, and the glue liquid is constrained in the heat dissipation glue filling cavity, so that the problems that the existing independent power supply structure is difficult to adapt to power supply wires with different thicknesses and the heat dissipation efficiency is low due to the easy flow and dispersion of the heat dissipation glue are effectively solved.

Description

Technical Field

[0001] This application relates to the field of power supply structure technology, and more specifically, to an independent power supply structure. Background Technology

[0002] Traditional independent power supply structures have significant shortcomings in terms of installation and maintenance, wire clamping compatibility, and heat dissipation efficiency: First, wire clamping assemblies mostly use fixed-specification clamping designs, which cannot adjust the clamping height according to the thickness of the power cord, easily leading to problems such as thin wires not being clamped securely and thick wires being excessively squeezed and damaging the insulation layer; Second, there is no dedicated space for the pouring of thermal adhesive, which makes the adhesive easy to flow and disperse, resulting in poor adhesion to the ends of high-heat electrical components, uneven heat dissipation, and easy overflow of adhesive during the pouring process, which contaminates surrounding components and seriously affects the overall reliability and service life of the power supply. Utility Model Content

[0003] In view of this, this application provides an independent power supply structure to solve the technical problems of existing independent power supply structures being difficult to adapt to power cables of different thicknesses and having low heat dissipation efficiency due to the easy flow and dispersion of thermal adhesive.

[0004] This application provides a stand-alone power supply structure, wherein the stand-alone power supply structure includes: Power supply box, with built-in slot-type rails; The base plate is installed in a slotted track, and electrical components are mounted on the base plate. The pressure cover is hinged to the power supply box, and the pressure plate is connected to the power supply box. The encapsulation baffle is detachably connected to the pressure plate. The encapsulation baffle is located at the end of the power supply box. The encapsulation baffle, the power supply box and the base plate enclose the heat dissipation adhesive filling cavity. The encapsulation baffle, the pressure cover and the pressure plate enclose the wire pressing space. When the encapsulation baffle is removed, the end of the electrical component can be exposed. Heat dissipation adhesive can be directly poured into the heat dissipation adhesive filling cavity. When the encapsulation baffle is closed, the heat dissipation adhesive can be concentrated and constrained in the heat dissipation adhesive filling cavity. The wire pressing assembly is set in the wire pressing space and includes a multi-tooth mechanism adjustment baffle, a wire pressing block fixing base, and a wire pressing block. A multi-tooth adjustment mechanism is provided between the multi-tooth mechanism adjustment baffle and the wire pressing block. The multi-tooth adjustment mechanism can change the height of the wire pressing block relative to the pressure plate to adapt to power cables of different thicknesses, and the wire pressing block and the wire pressing block fixing base are detachably connected.

[0005] Furthermore, the sidewall of the pressure plate is provided with multiple linearly distributed holes, and the number of multiple holes is at least two.

[0006] Furthermore, the multi-tooth mechanism adjustment baffle is provided with multiple sets of positioning teeth, and the wire pressing block is provided with an elastic buckle corresponding to the multi-tooth mechanism adjustment baffle. The elastic buckle engages with the positioning teeth, the wire pressing block is provided with a first pressing tooth, and the pressure plate is provided with a second pressing tooth. By changing the engagement position of the elastic buckle and the positioning teeth, the height of the wire pressing block can be adjusted in a step-like manner, so that the power cord can be pressed by the first pressing tooth and the second pressing tooth after adjustment.

[0007] Furthermore, the detachable connection between the pressure block and the pressure block fixing base is a snap-fit ​​connection, and the two side walls of the pressure block fixing base are provided with snap-fit ​​grooves that are adapted to the elastic snap-fit.

[0008] Furthermore, the pressure plate and the power box are connected by a snap-fit ​​structure. The pressure plate has a snap protrusion facing the power box, and the power box has a snap groove on its inner wall. The snap protrusion and the snap groove engage to make the pressure plate and the power box detachably fixed.

[0009] Furthermore, a heat-conducting plate is fixedly installed at the end of the electrical component, which is located within the cavity filled with thermal adhesive, and the area of ​​the heat-conducting plate matches the end of the electrical component.

[0010] Furthermore, the surface of the heat-conducting plate away from the electrical components has several radially distributed heat dissipation grooves.

[0011] Furthermore, the side of the encapsulation baffle facing the cavity filled with thermal adhesive has an integrally formed guide groove to guide the flow of thermal adhesive, and the top of the encapsulation baffle has an injection port, one end of the guide groove extends to the injection port, and the other end is aligned with the center of the thermal conductive sheet.

[0012] Furthermore, an overflow prevention dike is set on the base plate, which wraps around the electrical components and fits in place with the encapsulation baffle.

[0013] The beneficial effects of the independent power supply structure provided by this utility model are as follows: This utility model, through the wire pressing assembly (including a multi-tooth mechanism adjustment baffle, a wire pressing block, and a multi-tooth adjustment mechanism between the two) set in the wire pressing space, and in conjunction with the detachable connection between the wire pressing block and the wire pressing block fixing base, allows the multi-tooth adjustment mechanism to flexibly change the height of the wire pressing block relative to the pressure plate, and can stably adapt to power lines of different thicknesses. This effectively solves the technical problems of existing wire pressing assemblies using a fixed specification clamping design, which cannot adapt to power lines of different diameters, resulting in thin wires not being clamped firmly and thick wires being easily squeezed and damaged in insulation.

[0014] By encapsulating a baffle and forming a dedicated cavity for thermal adhesive filling with the power supply box and base plate, and by allowing the baffle to be closed, the flow of thermal adhesive can be constrained through the cavity during the pouring of thermal adhesive, preventing adhesive dispersion or overflow from contaminating surrounding components. It also ensures that the thermal adhesive is tightly attached to the ends of electrical components, improving the uniformity and efficiency of heat dissipation. This solves the technical problems of existing thermal adhesives having no dedicated constraint space, uneven heat dissipation, and overflow affecting the reliability and lifespan of the power supply. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a perspective view of an embodiment of the independent power supply structure of this application; Figure 2 This is a schematic diagram of the structure of some components in an independent power supply structure according to an embodiment of this application; Figure 3 This is a schematic diagram of the structure of some components in an independent power supply structure according to an embodiment of this application; Figure 4 This is a schematic diagram of the cover structure in an independent power supply structure according to an embodiment of this application; Figure 5 This is a schematic diagram of the structure of some components in an independent power supply structure according to an embodiment of this application; Figure 6 This is a schematic diagram of the power supply box in an independent power supply structure according to an embodiment of this application; Figure 7 This is a schematic diagram of the structure of some components in an independent power supply structure according to an embodiment of this application; Figure 8 This is a schematic diagram of the heat-conducting sheet in an independent power supply structure according to an embodiment of this application; Figure 9 This is a schematic diagram of the voltage block in an independent power supply structure according to an embodiment of this application; Figure 10 This is a schematic diagram of the voltage block in an independent power supply structure according to an embodiment of this application from different perspectives; Figure 11 This is a schematic diagram of the encapsulation baffle in an independent power supply structure according to an embodiment of this application; Figure 12 For along Figure 11 A sectional view of section AA.

[0017] Explanation of reference numerals in the attached figures: 1-Power supply box; 2-Slotted rail; 3-Base plate; 4-Clip cover; 5-Pressure plate; 6-Encapsulation baffle; 7-Heat-filling cavity; 8-Multi-wire hole; 21-Multi-tooth mechanism adjustment baffle; 22-Wire pressing block fixing base; 23-Wire pressing block; 25-Positioning tooth; 26-Snap; 27-Snap slot; 28-First pressing tooth; 29-Second pressing tooth; 31-Snap protrusion; 32-Slot; 41-Heat-conducting sheet; 42-Heat dissipation groove; 43-Flow guide groove; 44-Injection port; 45-Overflow prevention dike. Detailed Implementation

[0018] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. One or more embodiments of this application are exemplarily shown in the drawings to provide a more accurate and thorough understanding of the technical solutions disclosed herein. However, it should be understood that this application can be implemented in many different forms and is not limited to the embodiments described below.

[0019] In the accompanying drawings of this application, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0020] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0021] See Figures 1 to 12 The independent power supply structure includes: Power supply box 1, with built-in slot-type rail 2; base plate 3, installed in the slot-type rail 2, with electrical components mounted on the base plate 3; pressure cover 4 and pressure plate 5, the pressure cover 4 is hinged to the power supply box 1, and the pressure plate 5 is connected to the power supply box 1; encapsulation baffle 6, detachably connected to the pressure plate 5, the encapsulation baffle 6 is located at the end of the power supply box 1, the encapsulation baffle 6, the power supply box 1, and the base plate 3 enclose a heat-dissipating adhesive-filled cavity 7, and the encapsulation baffle 6, the pressure cover 4, and the pressure plate 5 enclose a wire pressing space, and the electrical components can be exposed when the encapsulation baffle 6 is removed. The end of the heat sink is used to directly pour heat sink into the heat sink filling cavity 7. Covering the end with the encapsulation baffle 6 can concentrate and constrain the heat sink within the heat sink filling cavity 7. The wire pressing assembly is set in the wire pressing space and includes a multi-tooth mechanism adjustment baffle 21, a wire pressing block fixing base 22, and a wire pressing block 23. A multi-tooth adjustment mechanism is provided between the wire pressing block 23 and the multi-tooth mechanism adjustment baffle 21. The multi-tooth adjustment mechanism can change the height of the wire pressing block 23 relative to the pressure plate 5 to adapt to power cables of different thicknesses. The wire pressing block 23 and the wire pressing block fixing base 22 are detachably connected.

[0022] According to a specific embodiment of this application, the slotted track 2 is typically disposed along the length of the power box 1 on its inner wall, forming a long, narrow groove structure. This provides a stable installation guide for the base plate 3, facilitating quick insertion or removal of the base plate 3. Simultaneously, it restricts the lateral displacement of the base plate 3 within the power box 1, ensuring structural stability after installation. The pressure cover 4 is connected to the power box 1 via a hinge, allowing for flexible opening and closing around the hinge point. When it is necessary to thread power cables or adjust the wire pressing assembly, opening the pressure cover 4 exposes the wire pressing space, making operation convenient and without damaging the original structure. The pressure plate 5, as the mounting carrier of the wire pressing assembly and a component of the wire pressing space, provides support for the wire pressing assembly through its stable connection to the power box 1, while also... The cover 4 and the encapsulation baffle 6 work together to form a closed wire pressing space, preventing the power cord from being interfered with by the outside world or accidentally falling off. The detachable design of the encapsulation baffle 6 combines ease of operation with functional partitioning. When removed, the end of the electrical component can be directly exposed, and the thermal adhesive can be poured without disassembling other parts, solving the problem that the power box 1 needs to be disassembled for traditional thermal adhesive pouring. The thermal adhesive filling cavity 7 enclosed by the encapsulation baffle 6, the power box 1, and the base plate 3 can precisely constrain the flow of adhesive, preventing the adhesive from spreading and causing poor adhesion to the end of the component, while also preventing adhesive overflow from contaminating surrounding components. In addition, the wire pressing space enclosed by the encapsulation baffle 6, the cover 4, and the pressure plate 5 can limit the position of the power cord and the wire pressing assembly, ensuring stable and reliable wire pressing operation.

[0023] According to a specific embodiment of this application, the side wall of the pressure plate 5 is provided with linearly distributed multi-wire holes 8. The number of multi-wire holes 8 is at least two. The linearly distributed multi-wire holes 8 can realize the orderly installation of multiple power lines, avoid the circuit chaos caused by the cross-entanglement of different power lines. The design of at least two holes can meet the needs of multi-line power supply or signal transmission and improve the practicality of the power supply structure.

[0024] According to a specific embodiment of this application, the multi-tooth mechanism adjustment baffle is provided with multiple sets of positioning teeth 25, and the wire pressing block 23 is provided with an elastic buckle 26 corresponding to the multi-tooth mechanism adjustment baffle. The elastic buckle 26 engages with the positioning teeth 25. The wire pressing block 23 is provided with a first pressing tooth 28, and a second pressing tooth 29 is provided on the pressing plate. By changing the engagement position of the elastic buckle 26 and the positioning teeth 25, the height of the wire pressing block 23 can be adjusted in a stepped manner, so that the adjusted first pressing tooth 28 and second pressing tooth 29 cooperate to press the power cord. The positioning teeth 25 are distributed sequentially along the height direction of the multi-tooth mechanism adjustment baffle, forming a fixed height difference between adjacent teeth; the elastic buckle 26 has a certain elastic deformation capability, and can be disengaged from the current positioning tooth 25 when pressed, and can be re-engaged after being released after moving to the target tooth position, realizing step-like height adjustment; the first pressing tooth 28 and the second pressing tooth 29 are usually arranged in a sawtooth or concave-convex structure facing each other. After adjustment, the two bite each other, which can increase the contact friction with the power cord and ensure that the power cord is firmly pressed and does not loosen.

[0025] According to a specific embodiment of this application, the detachable connection between the wire clamping block 23 and the wire clamping block fixing base 22 is a snap-fit ​​connection. Elastic snaps 26 are provided on both sides of the wire clamping block 23, and snap grooves 27 adapted to the elastic snaps 26 are provided on both side walls of the wire clamping block fixing base 22. The engagement between the elastic snaps 26 and the snap grooves 27 is a tool-free disassembly and assembly structure. Operators do not need to use tools such as screwdrivers; they can simply press the elastic snaps 26 to assemble and disassemble the wire clamping block 23, greatly improving operational efficiency. Simultaneously, the elastic deformation of the elastic snaps 26 ensures a tight fit with the snap grooves 27 after connection. When the wire clamping block 23 is needed, it can be directly removed from the wire clamping block fixing base 22; when the wire clamping block 23 is not needed, it is locked onto the wire clamping block fixing base 22.

[0026] According to a specific embodiment of this application, the pressure plate 5 and the power box 1 are connected by a snap-fit ​​structure. The pressure plate 5 has a snap-fit ​​protrusion 31 facing the power box 1, and the power box 1 has a snap-fit ​​groove 32 on its inner wall. The snap-fit ​​protrusion 31 and the snap-fit ​​groove 32 engage to detachably fix the pressure plate 5 and the power box 1. Compared with the traditional screw connection, the snap-fit ​​connection eliminates the need to repeatedly tighten the screws and allows for quick assembly and disassembly of the pressure plate 5. When it is necessary to inspect the wire pressing assembly or clean the wire pressing space, the pressure plate 5 can be removed simply by separating the snap-fit ​​protrusion 31 and the snap-fit ​​groove 32. The operation is convenient and does not damage the inner wall of the power box 1. The precise fit of the snap-fit ​​protrusion 31 and the snap-fit ​​groove 32 also ensures that the pressure plate 5 is fixed in position after installation, avoiding the impact of the pressure plate 5 shifting on the normal operation of the wire pressing assembly.

[0027] According to a specific embodiment of this application, a heat-conducting sheet 41 is fixedly provided at the end of the electrical component disposed in the heat-dissipating adhesive filling cavity 7. The area of ​​the heat-conducting sheet 41 matches the end of the electrical component. The core function of the heat-conducting sheet 41 is to increase the heat dissipation area at the end of the electrical component. The heat generated when the electrical component is working can be quickly transferred to the heat-dissipating adhesive through the heat-conducting sheet 41. Compared with the heat being directly transferred from the end of the component to the heat-dissipating adhesive, the heat-conducting sheet 41 can reduce thermal resistance and improve heat transfer efficiency. The design of matching the area with the end of the component can ensure that the heat-conducting sheet 41 is tightly attached to the end of the component, avoiding local overheating problems caused by insufficient attachment.

[0028] According to a specific embodiment of this application, a plurality of radially distributed heat dissipation grooves 42 are provided on the surface of the heat-conducting sheet 41 away from the electrical components. The radial heat dissipation grooves 42 can further increase the contact area with the heat dissipation adhesive on the basis of the original area of ​​the heat-conducting sheet 41, so that the heat transferred by the heat-conducting sheet 41 can be diffused into the heat dissipation adhesive more evenly and quickly, avoiding local accumulation of heat on the surface of the heat-conducting sheet 41. At the same time, the radial structure also facilitates the heat dissipation adhesive to better fill the grooves during casting, further improving the overall heat dissipation efficiency.

[0029] According to a specific embodiment of this application, the side of the encapsulation baffle 6 facing the heat dissipation adhesive filling cavity 7 is integrally formed with a flow guide groove 43 to guide the flow of heat dissipation adhesive. The top of the encapsulation baffle 6 is provided with an injection port 44. One end of the flow guide groove 43 extends to the injection port 44, and the other end is aligned with the center of the heat conduction sheet 41. The injection port 44 provides a precise entrance for the heat dissipation adhesive pouring, avoiding the adhesive from flowing in from other gaps and causing waste. The flow guide groove 43 can guide the adhesive from the injection port 44 directly to the center of the heat conduction sheet 41, ensuring that the adhesive preferentially fills the key area between the heat conduction sheet 41 and the encapsulation baffle 6, avoiding the adhesive from flowing randomly due to gravity and causing insufficient adhesive around the heat conduction sheet 41. The integrally formed design can also ensure the structural stability of the flow guide groove 43, without producing gaps, and improving the reliability of adhesive guidance.

[0030] According to a specific embodiment of this application, an anti-overflow dike 45 is provided on the base plate 3. The anti-overflow dike 45 wraps around the electrical component and is attached to the encapsulation baffle 6. The anti-overflow dike 45 is a raised structure on the base plate 3 surrounding the electrical component. Its height is slightly higher than the surface of the base plate 3, and its edge is tightly attached to the inner side of the encapsulation baffle 6 to form a closed barrier. When thermal adhesive is poured into the thermal adhesive filling cavity, the anti-overflow dike 45 can prevent the adhesive from overflowing into non-target areas around the electrical component, ensuring that the adhesive is confined to the cavity and preventing the adhesive from contaminating other components on the base plate 3.

[0031] It should be noted that the above embodiments only illustrate preferred embodiments of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting this application. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of this application, such as combining different features in various embodiments, and these should all fall within the protection scope of this application.

Claims

1. An independent power supply structure, characterized in that, The independent power supply structure includes: Power supply box, wherein the power supply box has a built-in slot-type track; A base plate, which is installed in the slotted track, and electrical components are mounted on the base plate; A pressure cover and a pressure plate, wherein the pressure cover is hinged to the power supply box and the pressure plate is connected to the power supply box; An encapsulation baffle is detachably connected to the pressure plate. The encapsulation baffle is located at the end of the power supply box. The encapsulation baffle, the power supply box, and the base plate enclose a heat-dissipating adhesive filling cavity. The encapsulation baffle, the pressure cover, and the pressure plate enclose a wire pressing space. When the encapsulation baffle is removed, the end of the electrical component can be exposed, and heat-dissipating adhesive can be directly poured into the heat-dissipating adhesive filling cavity. When the encapsulation baffle is closed, the heat-dissipating adhesive can be concentrated and constrained within the heat-dissipating adhesive filling cavity. A wire pressing assembly is disposed within the wire pressing space and includes a multi-tooth mechanism adjusting baffle, a wire pressing block fixing base, and a wire pressing block. A multi-tooth adjusting mechanism is provided between the multi-tooth mechanism adjusting baffle and the wire pressing block. The multi-tooth adjusting mechanism can change the height of the wire pressing block relative to the pressing plate to adapt to power cables of different thicknesses, and the wire pressing block and the wire pressing block fixing base are detachably connected.

2. The independent power supply structure according to claim 1, characterized in that, The sidewall of the pressure plate is provided with multiple linearly distributed holes, and the number of the multiple holes is at least two.

3. The independent power supply structure according to claim 1, characterized in that, The multi-tooth mechanism adjustment baffle is provided with multiple sets of positioning teeth. The wire pressing block is provided with an elastic buckle corresponding to the multi-tooth mechanism adjustment baffle. The elastic buckle engages with the positioning teeth. The wire pressing block is provided with a first pressing tooth, and the pressure plate is provided with a second pressing tooth. By changing the engagement position of the elastic buckle and the positioning tooth, the height of the wire pressing block can be adjusted in a step manner, so that the first pressing tooth and the second pressing tooth cooperate to press the power cord.

4. The independent power supply structure according to claim 3, characterized in that, The detachable connection between the pressure block and the pressure block fixing base is a snap-fit ​​connection, and the two side walls of the pressure block fixing base are provided with snap-fit ​​grooves that are adapted to the elastic snap-fit.

5. The independent power supply structure according to claim 1, characterized in that, The pressure plate and the power box are connected by a snap-fit ​​structure. The pressure plate has a snap-fit ​​protrusion at one end facing the power box, and the power box has a snap-fit ​​groove on its inner wall. The snap-fit ​​protrusion and the snap-fit ​​groove engage to make the pressure plate and the power box detachably fixed.

6. The independent power supply structure according to claim 1, characterized in that, A heat-conducting plate is fixedly installed at the end of the electrical component, which is located within the cavity filled with thermal adhesive, and the area of ​​the heat-conducting plate matches the end of the electrical component.

7. The independent power supply structure according to claim 6, characterized in that, The heat-conducting sheet has several radially distributed heat dissipation grooves on the surface away from the electrical component.

8. The independent power supply structure according to claim 7, characterized in that, The encapsulation baffle has an integrally formed flow channel on the side facing the cavity filled with thermal adhesive, which guides the flow of thermal adhesive. The top of the encapsulation baffle has an injection port. One end of the flow channel extends to the injection port, and the other end is aligned with the center of the thermal conductive sheet.

9. The independent power supply structure according to claim 8, characterized in that, An overflow prevention dike is provided on the base plate, which encloses the electrical components and is attached to the encapsulation baffle.

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