A heat dissipation structure and a power supply assembly comprising the same

Abstract

The utility model provides a kind of heat dissipation structure and the power supply assembly containing the heat dissipation structure, it includes, shell, having the air inlet and air outlet of intercommunication thereon, the heat generating module and circuit board are installed in the shell inside along first direction layering, the heat generating module is tightly through high heat-conducting medium between the shell;Heat dissipation flow channel, including the heat dissipation flow channel one being set between circuit board and the shell, the heat dissipation flow channel two through the heat generating module inside and outside, the heat dissipation flow channel three being set between the heat generating module and the circuit board, the heat dissipation flow channel one, heat dissipation flow channel two, heat dissipation flow channel three are connected with the air inlet, air outlet.The utility model utilizes multiple-path collaborative air duct heat dissipation, reduces the failure risk and intensity of single heat dissipation path, reliability has been greatly improved, and under the premise of ensuring excellent heat dissipation performance, heat dissipation flow channel optimization design is carried out.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, specifically to a heat dissipation structure and a power supply assembly including the heat dissipation structure. Background Technology

[0002] In existing blood purification equipment, the patient's blood flows out of the body, passes through tubing and purification devices, and then returns to the body, forming an extracorporeal circulation system. The main function of the power supply assembly is to isolate the mains power and convert it into multiple voltages to supply the blood purification equipment. During treatment, it provides the entire machine with safe, stable, pure, and uninterrupted power, and ensures a seamless switching between the AC main power supply and the DC backup power supply, thereby ensuring the patient's treatment safety.

[0003] The power supply assembly can automatically manage the charging of lead-acid batteries and has an automatic backup power switching function. When the mains voltage is lower than the input voltage during the operation of the whole machine, it will automatically switch to the backup power supply and automatically switch back to the mains power supply when the mains power is restored.

[0004] As electronic devices evolve towards higher power density and miniaturization, their internal space decreases, leading to increased heat loss per unit volume. This results in a dramatic increase in heat generation in power supply modules, particularly at high power densities, where heat dissipation has become a critical bottleneck restricting their performance, reliability, and lifespan. If heat cannot be dissipated in time, it will cause the junction temperature of internal components to rise, leading to performance degradation, reduced efficiency, decreased reliability, and even thermal breakdown and damage.

[0005] The main heat dissipation technologies of existing power supply assembly equipment include: (1) traditional passive heat dissipation, which mainly relies on large-area aluminum or copper heat sinks to dissipate heat through natural convection or forced air; (2) liquid cooling heat dissipation, which removes heat through liquid circulation; and (3) heat pipe heat dissipation, which uses the phase change of the working fluid for heat transfer. All of the above heat dissipation technologies have disadvantages. For example, traditional passive heat dissipation usually only dissipates heat from a single or part of the heat-generating components, with a single heat conduction path. Heat accumulates inside the module, forming local hot spots, resulting in unbalanced heat management. At the same time, heat dissipation efficiency is contradictory to volume. To cope with peak power, the heat sink needs to be designed to be very large, increasing the product volume, weight and cost. If the size of the heat sink is reduced to save space, there will be an overheating risk under heavy load. Liquid cooling heat dissipation has a complex structure system, high cost and leakage risk, and is difficult to maintain. In heat pipe heat dissipation, the layout of the heat pipe and the way it is combined with the heat source are relatively complex, and the cost is high when dealing with large-area heat sources.

[0006] Therefore, it is necessary to adjust the heat dissipation structure of the power supply assembly to overcome the shortcomings of the poor heat dissipation performance of the existing power supply assembly. Summary of the Invention

[0007] In order to overcome the defects existing in the prior art, the purpose of this utility model is to provide a heat dissipation structure and a power supply assembly containing the heat dissipation structure. The structure is compact, the heat dissipation path and internal structure are optimized, and efficient and fast multi-heat source coordinated heat dissipation is achieved, so as to achieve the maximum heat dissipation capacity in a limited space.

[0008] To achieve the above-mentioned objectives of this utility model, this utility model provides a heat dissipation structure, which includes a housing having a communicating air inlet and an air outlet. A heating module and a circuit board are stacked and installed inside the housing along a first direction, and the heating module is in close contact with the housing through a high thermal conductivity medium. The heat dissipation channels include a first heat dissipation channel disposed between the circuit board and the housing, a second heat dissipation channel penetrating the inside and outside of the heat-generating module, and a third heat dissipation channel disposed between the heat-generating module and the circuit board. The first, second, and third heat dissipation channels are all connected to the air inlet and the air outlet.

[0009] Optionally, the air inlet and air outlet are located on opposite sides of the housing and their central axes coincide, and the central axis is perpendicular to the first direction. The second heat dissipation channel includes a heat dissipation inner channel disposed on the heat generation module. The central axis of the heat dissipation inner channel is perpendicular to the central axis of the air inlet and air outlet, and the central axis of the heat dissipation inner channel is also perpendicular to the first direction.

[0010] Optionally, the number of internal heat dissipation channels is at least two, which are horizontally and parallelly distributed on the heat dissipation module.

[0011] Optionally, the second heat dissipation channel includes: a first flow channel branch formed between the side of the heating module and the inner wall of the housing; a second flow channel branch formed between the end of the heating module and the inner wall of the housing; a third flow channel branch formed between the other end of the heating module and the inner wall of the housing; and a fourth flow channel branch formed between the other side of the heating module and the inner wall of the housing. The airflow enters through the air inlet, passes sequentially through the first flow channel branch, the second flow channel branch, the heat dissipation inner channel, the third flow channel branch, and the fourth flow channel branch, and is then discharged through the air outlet.

[0012] Optionally, the width of the first flow channel branch (221) is K1, the width of the second flow channel branch (222) is L1, the width of the third flow channel branch (223) is L2, and the width of the fourth flow channel branch (224) is K2, wherein 1≤L1 / K1≤3.8 and K1≥10mm, 1≤L2 / K2≤5.3 and K2≥10mm.

[0013] Optionally, the heating module and the circuit board are projected vertically toward the air inlet, and the projected surfaces intersect with the area of ​​the air inlet, or the projected surfaces are all within the area of ​​the air inlet.

[0014] Optionally, the distance H1 between the heating module and the circuit board along the first direction is ≥12mm.

[0015] Optionally, the housing includes two U-shaped plates, outer shell one and outer shell two, which are locked together by interlocking.

[0016] Optionally, the air inlet and air outlet are located on the second outer casing, a fan is provided inside the air outlet, and a dust cover is provided on the air inlet.

[0017] This utility model also discloses a power supply assembly, which includes a housing and contains the aforementioned heat dissipation structure.

[0018] The beneficial effects of this utility model are as follows: by utilizing multi-path collaborative airflow for heat dissipation, the failure risk and strength of a single heat dissipation path are reduced, and the reliability is greatly improved. Furthermore, under the premise of ensuring excellent heat dissipation performance, the heat dissipation flow channel is optimized, which improves the overall structural compactness and achieves the maximum heat dissipation capacity in a limited space, thereby realizing the compactness and lightweight of the heat dissipation structure.

[0019] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 yes Figure 1 Decomposition structure diagram; Figure 3 yes Figure 2 Assembly structure diagram of the inner components of the outer shell; Figure 4 yes Figure 1 A view of the air duct structure of the second heat dissipation channel; Figure 5 yes Figure 1 A view of the air duct structure of the third heat dissipation channel; Figure 6 This is an end view of the air duct structure of heat dissipation channel three; Figure 7 This is a cross-sectional view of the air duct structure of heat dissipation channel three; Figure 8 yes Figure 6 Rear view; Figure 9 It is a cloud map showing the velocity and temperature field distribution of the power supply assembly; Figure 10 It is a cloud map of streamline distribution within the flow field of the power assembly.

[0021] In the attached diagram, 1-Outer shell one, 2-Outer shell two, 3-Circuit board, 4-Heating module, 21-Heat dissipation channel one, 211-Exhaust vent, 212-Fan, 213-Air inlet, 214-Dust cover, 215-Mounting post, 22-Heat dissipation channel two, 221-First channel branch, 222-Second channel branch, 223-Third channel branch, 224-Fourth channel branch, 23-Heat dissipation channel three, 31-Heat element one, 32-Heat element two, 33-Screw, 41-Heat conducting medium, 401-Inner heat dissipation channel. Detailed Implementation

[0022] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0023] In the description of this invention, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0024] like Figures 1 to 10 As shown, this utility model provides a heat dissipation structure, which includes... The housing has an air inlet 213 and an air outlet 211 that are connected to each other. Inside the housing, a heating module 4 and a circuit board 3 are stacked and installed along the first direction. The heating module 4 is tightly attached to the housing through a high thermal conductivity medium 41. The heat dissipation channels include a first heat dissipation channel 21 disposed between the circuit board 3 and the housing, a second heat dissipation channel 22 penetrating the inside and outside of the heat-generating module 4, and a third heat dissipation channel 23 disposed between the heat-generating module 4 and the circuit board 3. The first heat dissipation channel 21, the second heat dissipation channel 22, and the third heat dissipation channel 23 are all connected to the air inlet 213 and the air outlet 211.

[0025] The heat dissipation structure in this invention can be applied to most heat-generating devices that require heat dissipation to ensure the performance and lifespan of the device, such as power supply assemblies.

[0026] This embodiment uses a power supply assembly device as an example to illustrate the concept in detail.

[0027] like Figure 1 As shown, the casing is made of a high thermal conductivity material such as aluminum alloy or copper, specifically aluminum alloy 6061, 5A02 or 6063. In this embodiment, aluminum alloy 6063 is used to quickly absorb heat and release it to the external environment.

[0028] Figure 1 , Figure 2 The housing comprises two U-shaped plates, outer shell 1 and outer shell 2, which are locked together vertically to form a closed structure. Specifically, both outer shell 1 and outer shell 2 are made of aluminum alloy plates bent into a U-shape, staggered and aligned vertically, and then assembled using locking screws or bolts.

[0029] A heating module 4 and a circuit board 3 with the main heating element are installed inside the housing. Scientific heat dissipation is achieved by using the heat dissipation channel design of this case.

[0030] The heating module 4 can be located at either the bottom or top of the housing. This example uses the bottom of the housing as an example, meaning the heating module 4 is located inside the inner bottom of the outer shell 2. The heating module 4 has two operating modes: steady-state heating under normal conditions and instantaneous heat generation under special operating conditions. Instantaneous heating can generate a large amount of heat energy in a short time, therefore timely heat dissipation is necessary. In this example, the heating module 4 is tightly positioned inside the inner bottom of the outer shell 2 using a high thermal conductivity heat transfer medium 41. The heat transfer medium 41 can have a thermal conductivity ≥2 W / (m²). 2 The circuit board 3 is secured to the mounting posts 215 of the outer casing 2 by screws 33. During installation, there is a gap between the circuit board 3 and the heating module 4, and heat dissipation gaps are also provided between the circuit board 3, the heating module 4, and the outer casing. When the load on the power assembly increases, the junction temperature of the heating module 4 fluctuates drastically due to the sudden change in load, causing a momentary temperature rise. Heat is conducted through the thermal medium 41 to the outer casing 2, and then rapidly conducted to the external environment for cooling, ensuring the normal and safe operation of the heating module 4.

[0031] The first direction involved in this case refers to the stacking direction of the heating module 4 and circuit board 3 within the housing, and serves as a reference basis for the arrangement of components within the entire power supply assembly. It is not limited to various placement configurations of the entire power supply assembly. For example... Figure 2 , 3As shown, the air inlet 213 and the air outlet 211 are located on opposite sides of the housing and their central axes coincide, and the central axis is perpendicular to the first direction; the heat dissipation inner channel 401 of the heat dissipation module 4 is horizontally arranged, and the central axis of the heat dissipation inner channel 401 is on the same horizontal plane as the central axis of the air inlet 213 and the air outlet 211 and is perpendicular to each other. At the same time, the central axis of the heat dissipation inner channel 401 is also perpendicular to the first direction.

[0032] An air inlet 213 and an exhaust vent 211 are located on the outer casing 2, and a fan 212 is installed on the overall airflow channel where the air inlet 213 and exhaust vent 211 are located to ensure timely airflow for heat dissipation inside the entire power assembly. A dust cover 214 is also installed at the air inlet 213 to prevent dust from the outside air from entering the power assembly. In this embodiment, the fan 212 is fixedly installed inside the casing where the exhaust vent 211 is located, and the dust cover 214 is fixedly installed outside the casing where the air inlet 213 is located. When the heat-generating elements or heat-generating module 4 of the power assembly overheats, the fan speed 212 can be increased to improve heat dissipation and ensure the power assembly operates at a stable dynamic load temperature.

[0033] The central axis of the heat dissipation inner channel 401 of the heat dissipation module 4 is perpendicular to the central axis of the air inlet 213 and the air outlet 211, so as to prevent dust that may enter the power assembly through the air inlet 213 from directly entering the heat dissipation module 4, thereby reducing the risk of failure.

[0034] This solution enhances the reliability of heat dissipation within the power supply assembly through multi-path heat dissipation, reducing the risk of failure of any heat dissipation path. Even if forced air cooling fails, the system can still operate safely for a period of time thanks to the efficient heat conduction of the casing and the natural convection of the optimized internal structure, demonstrating high reliability.

[0035] For multi-path heat dissipation: All heat dissipation air ducts enter through the air inlet 213 and then follow at least three paths. The first path passes over the top of the circuit board 3 and exits through the exhaust port 211, which is heat dissipation channel one 21, mainly targeting the main heat-generating components on the circuit board 3. The second path is heat dissipation channel two 22, which runs through the inside and outside of the heat-generating module 4. This heat dissipation channel two 22 flows from the air inlet 213, through the heat dissipation inner channel 401 inside the heat-generating module 4, and then exits through the exhaust port 211, mainly targeting the heat dissipation of the heat-generating module 4. The third path passes through the gap between the circuit board 3 and the heat-generating module 4 and exits through the exhaust port 211, which is heat dissipation channel three 23, mainly targeting the heat dissipation shell of the heat-generating module 4 and the bottom surface of the circuit board 3 for heat dissipation.

[0036] Figure 2 , 3In the middle, the heating module 4 and the circuit board 3 are vertically projected towards the air inlet 213, and the projected surfaces intersect with the area of ​​the air inlet 213 at the same time, or the projected surfaces are all within the area of ​​the air inlet 213.

[0037] Specifically, the air inlet 213 should partially overlap or cover the heating module 4 and the circuit board 3 in the vertical direction to ensure that the air coming in through the air inlet 213 can directly act on the heating module 4 and the circuit board 3; that is, the lower edge of the air inlet 213 should be at least lower than the upper edge of the heating module 4, and the upper edge of the air inlet 213 should be at least higher than the lower edge of the circuit board 3. Furthermore, in actual settings, the lower edge of the air inlet 213 is almost flush with the lower edge of the heating module 4, and the upper edge of the air inlet 213 is higher than the upper edge of the circuit board 3.

[0038] The heat dissipation channels 401 inside the heat dissipation module 4 are at least two, which are horizontally and parallelly distributed on the side of the heat dissipation module 4 and penetrate through the heat dissipation module 4 to improve the heat dissipation capacity inside the heat dissipation module 4.

[0039] In the case of multiple circuit boards 3, a gap is set between each circuit board 3. This increases the number of heat dissipation paths, that is, the gap between the circuit boards serves as a heat dissipation path, so as to ensure that each circuit board 3 has corresponding heat dissipation.

[0040] As shown in Figures 4 and 5, the synergistic airflow design allows for forced air cooling, with a dust cover 214 installed on the exterior of the casing. Figure 9 The airflow is guided to flow through the areas corresponding to multiple heating elements and heating modules 4 and then to the exhaust port 211, forming a parallel and coordinated air duct.

[0041] To prevent instantaneous breakdown of components on circuit board 3, ensure basic safety, and achieve good heat dissipation, the electrical clearance distance H1 between the bottom surface of circuit board 3 and the upper surface of heat-generating module 4 in heat dissipation channel 3 23 must be ≥12mm. In the design, excessively large or small changes in cross-section should be avoided; a gradual transition should be used. If the cross-section of the heat dissipation channel suddenly shrinks, it will lead to a decrease in the total system airflow, uneven flow field, and large pressure loss; if the cross-section of the heat dissipation channel suddenly expands, it will cause vortices, a decrease in air velocity, and the greatest pressure loss. This will reduce the total effective airflow of the system and deteriorate the flow field, thus being very detrimental to heat dissipation overall.

[0042] In this embodiment, there is a relatively large heating module 4 and a relatively large circuit board 3 with heat dissipation elements. The heating module 4 and the circuit board 3 are located in a compact housing. The air inlet 213 and the air outlet 211 are located on both sides of the heating module 4. To solve the problem of poor heat dissipation effect of the air inlet 213 and the air outlet 211 being located on both sides of the heating module 4, the simulation calculation results are as follows: In the second heat dissipation channel 22: the second heat dissipation channel 22 includes: a first flow channel branch 221 formed between the side of the heating module 4 and the inner wall of the housing; a second flow channel branch 222 formed between the end of the heating module 4 and the inner wall of the housing; a third flow channel branch 223 formed between the other end of the heating module 4 and the inner wall of the housing; and a fourth flow channel branch 224 formed between the other side of the heating module 4 and the inner wall of the housing. The airflow enters from the air inlet 213, passes through the first flow channel branch 221, the second flow channel branch 222, the heat dissipation inner channel 401, the third flow channel branch 223, and the fourth flow channel branch 224 in sequence, and is discharged from the air outlet 211.

[0043] With the width of the first flow channel branch 221 as K1, the width of the second flow channel branch 222 as L1, the width of the third flow channel branch 223 as L2, and the width of the fourth flow channel branch 224 as K2, and the height of each of the first to fourth flow channel branches as H2, the cross-sectional area ratio of the second flow channel branch to the first flow channel branch is L1*H2 / (K1*H2) = L1 / K1, and the cross-sectional area ratio of the third flow channel branch to the fourth flow channel branch is L2*H2 / (K2*H2) = L2 / K2, where 1≤L1 / K1≤3.8 and K1≥10mm, and 1≤L2 / K2≤5.3 and K2≥10mm. This heat dissipation efficiency can meet the steady-state overheating requirements of multiple heat-generating components or heat-generating modules 4 in the power supply assembly. Within this area ratio range, the efficiency of forced air cooling is also improved, reducing the surface temperature of the heat-generating components or heat-generating modules 4 and ensuring the operating temperature of the power supply assembly under stable dynamic loads.

[0044] By designing the heat dissipation channel of the structure through thermal simulation and verifying the test results, the structural compactness is improved while ensuring excellent heat dissipation performance, so as to achieve the maximum heat dissipation capacity in a limited space and realize the compactness and lightweight of the heat dissipation structure.

[0045] like Figure 10 As shown in the streamline distribution cloud diagram within the power supply assembly flow field, although the structure in this embodiment is extremely compact, the parallel and coordinated airflow design of the integrated heat dissipation structure allows the cold air to enter in an orderly and rapid manner and carry away the heat, avoiding the formation of eddies and stagnation of airflow in a narrow space. The heat dissipation efficiency does not decrease but increases, effectively reducing the temperature of the heat-generating components or modules and ensuring the stable and safe operation of the power supply assembly.

[0046] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0047] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat dissipation structure, characterized in that: Includes a housing having a connected air inlet (213) and an air outlet (211), wherein a heating module (4) and a circuit board (3) are stacked and installed inside the housing along a first direction, and the heating module (4) is tightly attached to the housing through a high thermal conductivity medium (41); The heat dissipation channels include a first heat dissipation channel (21) disposed between the circuit board (3) and the housing, a second heat dissipation channel (22) penetrating inside and outside the heat-generating module (4), and a third heat dissipation channel (23) disposed between the heat-generating module (4) and the circuit board (3). The first heat dissipation channel (21), the second heat dissipation channel (22), and the third heat dissipation channel (23) are all connected to the air inlet (213) and the air outlet (211).

2. The heat dissipation structure according to claim 1, characterized in that: The air inlet (213) and air outlet (211) are located on opposite sides of the housing and their central axes coincide, and the central axis is perpendicular to the first direction. The second heat dissipation channel (22) includes a heat dissipation inner channel (401) provided on the heat-generating module (4). The central axis of the heat dissipation inner channel (401) is perpendicular to the central axis of the air inlet (213) and air outlet (211), and the central axis of the heat dissipation inner channel (401) is also perpendicular to the first direction.

3. The heat dissipation structure according to claim 2, characterized in that: The number of heat dissipation internal channels (401) is at least two, which are horizontally and parallelly distributed on the heat-generating module (4).

4. A heat dissipation structure according to claim 2 or 3, characterized in that: The second heat dissipation channel (22) includes: a first flow channel branch (221) formed between the side of the heating module (4) and the inner wall of the housing; a second flow channel branch (222) formed between the end of the heating module (4) and the inner wall of the housing; a third flow channel branch (223) formed between the other end of the heating module (4) and the inner wall of the housing; and a fourth flow channel branch (224) formed between the other side of the heating module (4) and the inner wall of the housing. The airflow enters through the air inlet (213), passes through the first flow channel branch (221), the second flow channel branch (222), the heat dissipation inner channel (401), the third flow channel branch (223), and the fourth flow channel branch (224) in sequence, and is discharged through the exhaust port (211).

5. A heat dissipation structure according to claim 4, characterized in that: The width of the first flow channel branch (221) is K1, the width of the second flow channel branch (222) is L1, the width of the third flow channel branch (223) is L2, and the width of the fourth flow channel branch (224) is K2, wherein 1≤L1 / K1≤3.8 and K1≥10mm, 1≤L2 / K2≤5.3 and K2≥10mm.

6. A heat dissipation structure according to any one of claims 1, 2, 3 or 5, characterized in that: The heating module (4) and the circuit board (3) are projected vertically toward the air inlet (213), and the projected surfaces intersect with the area of ​​the air inlet (213), or the projected surfaces are all within the area of ​​the air inlet (213).

7. A heat dissipation structure according to any one of claims 1, 2, 3 or 5, characterized in that: The distance H1 between the heating module (4) and the circuit board (3) along the first direction is ≥12mm.

8. A heat dissipation structure according to any one of claims 1, 2, 3 or 5, characterized in that: The housing includes two U-shaped plates, outer shell one (1) and outer shell two (2), which are locked together by interlocking.

9. A heat dissipation structure according to claim 8, characterized in that: The air inlet (213) and air outlet (211) are located on the outer shell (2). A fan (212) is provided inside the air outlet (211), and a dust cover (214) is provided on the air inlet (213).

10. A power supply assembly, characterized in that: It includes a housing, the housing containing a heat dissipation structure as described in any one of claims 1-9.

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