A three-dimensional layered high-density multi-channel signal generating device

Abstract

The utility model relates to high accuracy electronic test measurement technical field, concretely relates to a kind of three-dimensional layered high-density multi-channel signal generating device, including the multiple groups of channel function units of laminated arrangement, each group of channel function units includes two channel function units arranged in the same layer, and each channel function unit includes backplate, two multi-channel daughter boards and aluminum integrated heat dissipation shield cover. Multi-channel daughter board and heat dissipation shield cover are all installed on backplate, heat dissipation shield cover is correspondingly arranged with multi-channel daughter board, and a plurality of shielding cavities are sequentially arranged on heat dissipation shield cover, and shielding cavity and single channel on multi-channel daughter board one-to-one correspondence. Through the cooperation design of laminated channel function unit and aluminum heat dissipation shield cover, the heat dissipation path is optimized while realizing multi-channel independent shielding, has the advantages of suppressing crosstalk, improving heat dissipation efficiency and keeping compact structure, solves the technical problems that existing multi-channel signal generator has electromagnetic interference and insufficient heat dissipation performance.

Description

Technical Field

[0001] This utility model relates to the field of high-precision electronic testing and measurement technology, specifically to a three-dimensional layered high-density multi-channel signal generator. Background Technology

[0002] In high-end applications such as semiconductor testing, large-scale sensor array simulation, and phased array radar calibration, the demand for multi-channel signal generators is growing. These applications often require the simultaneous provision of hundreds of independent, precise electrical signals, with extremely high requirements for signal integrity and electromagnetic compatibility. With the dramatic increase in the number of channels, traditional signal generators face severe challenges: on the one hand, high-density integration compresses channel spacing, exacerbating electromagnetic crosstalk; on the other hand, increased system heat dissipation pressure affects equipment stability and lifespan.

[0003] In existing technologies, multi-channel signal sources mainly employ two architectural schemes: the first is to integrate multiple channels onto a single large PCB board. While this scheme is structurally simple, relying solely on physical spacing and ground isolation is insufficient to effectively suppress crosstalk between channels during high-frequency operation. The second is to stack multiple independent modules. Although this can improve electromagnetic interference issues, it results in a large system size, high cost, and complex coordination control between modules. Furthermore, both schemes have shortcomings in heat dissipation design, making it difficult to meet the requirements of high-power-density applications. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a three-dimensional layered high-density multi-channel signal generator, which solves the technical problems of electromagnetic interference and insufficient heat dissipation performance of existing multi-channel signal generators.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: This invention provides a three-dimensional, layered, high-density, multi-channel signal generator, comprising multiple sets of channel functional units arranged in a stacked manner. Each set of channel functional units includes two channel functional units disposed on the same layer. Each channel functional unit includes a backplate, two multi-channel sub-boards, and an integrated aluminum heat dissipation shield. The multi-channel sub-boards and the heat dissipation shield are both mounted on the backplate. The heat dissipation shield is correspondingly disposed to the multi-channel sub-boards, and multiple shielding cavities are sequentially disposed on the heat dissipation shield, each shielding cavity corresponding one-to-one with a single channel on the multi-channel sub-board.

[0006] In one possible implementation, the three-dimensional layered high-density multi-channel signal generator further includes a mounting frame, which comprises a base and studs connected to the base. The multiple sets of channel functional units are respectively connected to the studs, and the multiple channel functional units located in adjacent layers abut against each other.

[0007] In one possible implementation, the three-dimensional layered high-density multi-channel signal generator further includes a housing, which is mounted on the base. The housing and the base together form a mounting cavity, and the channel functional unit and the stud are both mounted in the mounting cavity.

[0008] In one possible implementation, the channel function unit further includes a central control unit electrically connected to the multi-channel sub-board, the central control unit being disposed on the backplane.

[0009] In one possible implementation, the base is equipped with multiple pulleys.

[0010] The beneficial effects of this utility model are that, compared with the prior art, this utility model, through the combined design of stacked channel functional units and aluminum heat dissipation shielding cover, optimizes the heat dissipation path while achieving independent shielding of multiple channels, effectively solving the problems of electromagnetic interference and thermal management under high-density integration. It has the advantages of suppressing crosstalk, improving heat dissipation efficiency and maintaining a compact structure, and solves the technical problems of electromagnetic interference and insufficient heat dissipation performance in existing multi-channel signal generators. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of a channel functional unit provided by this utility model.

[0012] Figure 2 This is a schematic diagram of the structure of a heat dissipation shield provided by this utility model.

[0013] Figure 3 A partial structural schematic diagram of a three-dimensional layered high-density multi-channel signal generator provided by this utility model.

[0014] Attached image labels: 1. Three-dimensional layered high-density multi-channel signal generator; 11. Channel functional unit; 111. Backplate; 112. Multi-channel sub-board; 113. Heat dissipation shield; 1131. Shielding cavity; 114. Central control unit; 12. Mounting frame; 121. Base; 122. Stud; 13. Housing; 131. Mounting cavity; 14. Pulley. Detailed Implementation

[0015] To solve the above-mentioned technical problems, this utility model provides a three-dimensional layered high-density multi-channel signal generator. The technical solution and embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0016] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0017] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation", "connection" and "joining" should be interpreted broadly, for example, they can refer to fixed connection, detachable connection, or integral connection; for those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0018] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0019] In traditional high-density multi-channel signal generators, electromagnetic crosstalk and heat accumulation between channels are significantly exacerbated at high frequencies. When the channel spacing is compressed to the millimeter level, parasitic capacitive coupling effects cause phase shifts and amplitude distortions in the signal waveforms of adjacent channels. At the same time, the obstruction of heat flow paths under high power density leads to local temperature rise, directly affecting the linearity of the digital-to-analog converter and the clock synchronization accuracy.

[0020] Faced with the aforementioned problems, this application first considers how to simultaneously solve electromagnetic crosstalk and heat conduction issues in a high-density channel layout. In traditional solutions, simply increasing physical spacing significantly increases equipment size, while using a split shielding structure leads to increased assembly complexity and cost. Therefore, this application attempts to integrate electromagnetic shielding and heat dissipation paths into a single design, with the selection of metal materials becoming a key breakthrough. By comparing the conductivity, processing cost, and weight parameters of copper alloys and aluminum alloys, it was found that aluminum alloys, while ensuring sufficient electromagnetic shielding effectiveness, also have a thermal conductivity that meets vertical heat dissipation requirements. Further research revealed that integrating the shielding structure and mechanical support frame into a single milled part can eliminate the risk of electromagnetic leakage caused by assembly gaps and establish a continuous heat conduction path.

[0021] like Figures 1 to 3 As shown, this utility model provides a three-dimensional layered high-density multi-channel signal generator 1, including multiple sets of channel functional units 11 arranged in a stacked manner. Each set of channel functional units 11 includes two channel functional units 11 arranged on the same layer. Each channel functional unit 11 includes a back plate 111, two multi-channel sub-boards 112, and an integrated aluminum heat dissipation shield 113. The multi-channel sub-boards 112 and the heat dissipation shield 113 are both mounted on the back plate 111. The heat dissipation shield 113 is arranged correspondingly to the multi-channel sub-boards 112. Multiple shielding cavities 1131 are sequentially arranged on the heat dissipation shield 113, and each shielding cavity 1131 corresponds one-to-one with a single channel on the multi-channel sub-board 112.

[0022] Among them, the stacked multi-channel functional unit 11 refers to the arrangement of multiple functional units stacked in the vertical direction. Specifically, it can be implemented by slot-type installation or rail-type installation. High-density integration is achieved through vertical stacking, which solves the problem of low space utilization in traditional planar layout.

[0023] The integrated aluminum heat dissipation shield 113 refers to an aluminum alloy component that is machined as a whole, specifically by CNC milling or die casting. This component has both electromagnetic shielding and heat dissipation functions, and suppresses interference between channels and conducts heat through the high electrical and thermal conductivity of the material.

[0024] The one-to-one correspondence between the shielded cavity 1131 and the single channel on the multi-channel sub-board 112 means that each cavity only accommodates the circuit part of one signal channel. Specifically, it can be achieved by precision machining to form an independent metal compartment, thereby blocking the high-frequency electromagnetic field coupling path through physical isolation and reducing the risk of crosstalk.

[0025] The core innovation of this application lies in the collaborative design of the stacked channel functional unit 11 and the aluminum integrated heat dissipation shield 113 to achieve high-density channel integration in a vertical stacking structure. At the same time, electromagnetic shielding and heat dissipation are completed simultaneously using a single metal component, breaking through the contradiction between spatial layout, signal isolation and thermal management in traditional solutions.

[0026] The above technical solution achieves high-density channel integration while effectively solving electromagnetic interference and heat dissipation problems. The integrated aluminum structure eliminates assembly gaps and provides continuous electromagnetic shielding and heat conduction paths. The stacked layout maximizes space utilization, allowing a large number of channels to be integrated within a limited space.

[0027] In a preferred embodiment, the three-dimensional layered high-density multi-channel signal generator 1 consists of 16 groups of channel functional units 11 arranged in 16 layers. Each group of channel functional units 11 includes two channel functional units 11, and each channel functional unit 11 includes a backplane 111, two 16-channel sub-boards, and an integrated aluminum heat dissipation shield 113. The backplane 111 is made of multilayer printed circuit boards and has power, control, and signal lines arranged on it. The two 16-channel sub-boards are connected to the backplane 111 via high-speed board-to-board connectors.

[0028] The integrated aluminum heat dissipation shield 113 is milled from a single piece of aluminum alloy. The heat dissipation shield 113 has 32 independent shielding cavities 1131, arranged in two rows of 16, corresponding one-to-one with the channels on the two 16-channel daughterboards. The size of each shielding cavity 1131 is slightly larger than the area of ​​a single channel circuit on the daughterboard. The heat dissipation shield 113 is fixed to the backplate 111 with screws, completely covering the two daughterboards.

[0029] During assembly, the 16-layer channel functional units 11 are stacked sequentially. The heat dissipation shields 113 and backplates 111 between adjacent layers are tightly fitted to form a continuous metal shielding layer. The entire stacked structure is fixed by four through-type long studs 122 to ensure good contact between the layers and provide a path for heat conduction.

[0030] See Figure 3 Furthermore, the three-dimensional layered high-density multi-channel signal generator 1 also includes a mounting frame 12, which includes a base 121 and studs 122 connected to the base 121. Multiple sets of channel functional units 11 are respectively connected to the studs 122, and the multiple sets of channel functional units 11 located in adjacent layers abut against each other.

[0031] The base 121 serves as the load-bearing foundation, forming a planar support surface through machining. The stud 122, made of high-strength metal, is vertically fixed to the surface of the base 121, with a threaded structure extending through the thickness of the base 121. Multiple channel functional units 11 have through holes at their corners, with the diameter of the through holes fitting the outer diameter of the stud 122 with a clearance fit. Axial fixation is achieved by locking with nuts. The contact surfaces of adjacent channel functional units 11 are precision ground, forming surface contact under the preload of the stud 122.

[0032] Specifically, the base 121 is fixed to the bottom of the chassis with bolts, and the studs 122 are welded or threaded to the corner areas of the base 121. During assembly, the channel functional units 11 are sequentially fitted onto the studs 122, and axial pressure is applied using a special clamp to cause elastic deformation of the aluminum heat dissipation shields 113 of adjacent units, eliminating assembly gaps. Finally, a double-nut locking structure is used to secure the units, ensuring uniform distribution of interlayer pressure. This structure ensures that the heat dissipation shields 113 are tightly fitted together, forming a continuous heat conduction path. Heat is transferred to the base 121 through the studs 122, and the copper heat pipes embedded inside the base 121 guide the heat to the heat dissipation fins on the side wall of the chassis. At the same time, the mutually abutting channel functional units 11 form a self-locking structure under vibration, preventing interlayer displacement caused by mechanical impact.

[0033] like Figure 3 As shown, the three-dimensional layered high-density multi-channel signal generator 1 further includes a housing 13, which is mounted on a base 121. The housing 13 and the base 121 surround a mounting cavity 131, and the channel functional unit 11 and the stud 122 are both installed in the mounting cavity 131.

[0034] Through the above technical solution, this application achieves a compact and modular structure for the three-dimensional layered high-density multi-channel signal generator 1. The mounting cavity 131 enclosed by the housing 13 and the base 121 provides protection for the internal components, preventing interference from the external environment on signal quality. The channel functional units 11 are installed within the enclosed mounting cavity 131, further improving the electromagnetic shielding effect. The design of studs 122 penetrating and fixing multiple channel functional units 11 makes the entire device structure stable and easy to disassemble and maintain. This modular design improves the flexibility of the device, allowing the number of channels to be increased or decreased as needed.

[0035] See Figure 1 Furthermore, the channel function unit 11 also includes a central control unit 114 electrically connected to the multi-channel sub-board 112, and the central control unit 114 is disposed on the back panel 111.

[0036] Through the above technical solution, this application achieves centralized control and collaborative processing of multi-channel signals. The central control unit 114 simplifies the system structure and improves the efficiency and accuracy of signal generation. Simultaneously, unified management of multiple channels through the central control unit 114 enhances the system's flexibility and scalability, facilitating the implementation of complex signal generation and processing functions.

[0037] like Figure 3 As shown, specifically, a plurality of pulleys 14 are mounted on the base 121.

[0038] The pulleys 14 are bolted to the bottom edge of the base 121. Each pulley 14 is a caster wheel with a locking mechanism. Four pulleys 14 are symmetrically distributed at the four corners of the base 121. The wheel bodies are made of polyurethane-coated metal hubs. The installation position of the pulleys 14 avoids the connection area between the base 121 and the housing 13, ensuring that the sealing surfaces of the base 121 and housing 13 maintain flat contact during assembly.

[0039] Specifically, the omnidirectional wheel structure allows the device to move in any direction, and the locking mechanism uses a foot-operated brake pad to self-lock the pulleys 14. The symmetrical distribution of the four pulleys 14 ensures balanced force distribution during movement, preventing tilting due to a shift in the center of gravity. The sealing surface at the connection area between the base 121 and the housing 13 remains free from interference from the pulleys 14, ensuring the electromagnetic shielding integrity of the mounting cavity 131 is unaffected. When the device needs to be moved, releasing the pulley 14 lock allows the entire device to be pushed; upon reaching the target position, pressing the brake pad locks the pulleys 14, preventing accidental displacement. The installation height of the pulleys 14 is calculated to maintain a preset distance between the base 121 and the ground when the device is fixed, ensuring unobstructed heat dissipation at the bottom.

[0040] Through the above technical solution, this application achieves flexible movement of the three-dimensional layered high-density multi-channel signal generator 1. This greatly improves the mobility and ease of operation of the equipment. Furthermore, the pulley 14 allows the equipment to be easily moved in laboratories or factory workshops, facilitating testing tasks in different locations. At the same time, the braking function of the pulley 14 ensures the stability of the equipment during operation.

[0041] The above description is merely a preferred embodiment of the present utility model, and the specific embodiments described above are not intended to limit the present utility model. Various modifications and variations can be made within the scope of the technical concept of the present utility model. All refinements, modifications, or equivalent substitutions made by those skilled in the art based on the above description are within the scope of protection of the present utility model.

Claims

1. A three-dimensional, layered, high-density, multi-channel signal generator, characterized in that, It includes multiple sets of channel functional units arranged in a stacked manner. Each set of channel functional units includes two channel functional units arranged on the same layer. Each channel functional unit includes a back plate, two multi-channel sub-boards and an integrated aluminum heat dissipation shield. Both the multi-channel sub-board and the heat dissipation shield are mounted on the back plate. The heat dissipation shield is correspondingly arranged with the multi-channel sub-board. Multiple shielding cavities are sequentially arranged on the heat dissipation shield, and each shielding cavity corresponds one-to-one with a single channel on the multi-channel sub-board.

2. The three-dimensional layered high-density multi-channel signal generator according to claim 1, characterized in that, The three-dimensional layered high-density multi-channel signal generator also includes a mounting frame, which includes a base and studs connected to the base. The multiple sets of channel functional units are respectively connected to the studs, and the multiple sets of channel functional units located on adjacent layers abut against each other.

3. The three-dimensional layered high-density multi-channel signal generator according to claim 2, characterized in that, The three-dimensional layered high-density multi-channel signal generator also includes a housing, which is mounted on the base. The housing and the base together form a mounting cavity, and the channel functional unit and the stud are both mounted in the mounting cavity.

4. The three-dimensional layered high-density multi-channel signal generator according to claim 1, characterized in that, The channel function unit also includes a central control unit electrically connected to the multi-channel sub-board, and the central control unit is disposed on the back panel.

5. The three-dimensional layered high-density multi-channel signal generator according to claim 2 or 3, characterized in that, The base is equipped with multiple pulleys.

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