A precision automatic adjusting liquid spraying structure suitable for a 12-inch large silicon wafer final single piece cleaning machine

Abstract

The utility model discloses a kind of precision automatic adjustment liquid spraying structures suitable for 12 inch large silicon wafer final single piece cleaning machine, belong to single piece cleaning machine technical field.The liquid spraying structure includes mesa, cleaning jar, liquid spraying pipeline, wherein, cleaning jar is fixedly connected on mesa, and liquid level sensor is fixedly connected on the outer wall of cleaning jar;Fixedly connected with telescopic column on mesa, the upper end of telescopic column movably connects with rotary cylinder, and the upper end of rotary cylinder is fixedly connected with multiple groups of liquid spraying pipeline;The outer surface of one side of rotary cylinder is fixedly connected with connecting block, the upper end of connecting block is fixedly connected with support frame, and the upper end of support frame is fixedly connected with electromagnetic proportional valve and controller;Liquid film thickness on the surface of silicon wafer in cleaning jar is detected in real time by liquid level sensor and fed back to controller, and the spray pressure and flow of corresponding liquid spraying pipeline are adjusted by controller control electromagnetic proportional valve;With the telescopic action of telescopic column and the rotary action of rotary cylinder, the spray height and angle of liquid spraying pipeline are adjusted.

Description

Technical Field

[0001] This utility model relates to a precise automatic adjustment spray structure suitable for a final single-wafer cleaning machine for 12-inch large silicon wafers, belonging to the technical field of single-wafer cleaning machines. Background Technology

[0002] The precise, automatically adjustable spray structure of the 12-inch silicon wafer final single-wafer cleaning machine is a key component in the final single-wafer cleaning process for 12-inch silicon wafers. Its core function is to achieve precise control of spray parameters through a specific structural design to adapt to the cleaning requirements of 12-inch silicon wafers. This structure is mainly used in the final single-wafer cleaning scenario of 12-inch silicon wafer production. Specifically, in the semiconductor chip manufacturing field, it provides stable and precise spray support for the cleaning process of 12-inch silicon wafers, ensuring the orderly conduct of the silicon wafer cleaning process and facilitating the smooth progress of the semiconductor chip manufacturing process.

[0003] However, it still has some drawbacks. For example, the current precision automatic liquid spraying structure for the final single-wafer cleaning machine for 12-inch large silicon wafers lacks a component that can detect the thickness of the liquid film on the surface of the silicon wafer in real time during use. It cannot monitor the liquid film thickness from multiple positions, and is prone to errors due to single monitoring or no monitoring, resulting in incomplete and unreliable detection data. This can easily lead to problems such as incomplete cleaning or silicon wafer damage caused by improper liquid film thickness. Utility Model Content

[0004] The purpose of this invention is to provide a precise automatic liquid spraying structure suitable for a final single-wafer cleaning machine for 12-inch large silicon wafers, so as to solve the problem of not being able to monitor the liquid film thickness in real time as mentioned in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: A precision-controlled automatic spray structure for a final single-wafer cleaning machine for 12-inch silicon wafers includes a table, a cleaning tank, and spray pipes. The cleaning tank is fixedly connected to the tabletop, and a liquid level sensor is fixedly connected to the outer wall of the cleaning tank. A telescopic column is fixedly connected to the platform, and a rotating cylinder is movably connected to the upper end of the telescopic column. Multiple sets of spray pipes are fixedly connected to the upper end of the rotating cylinder. A connecting block is fixedly connected to one side of the outer surface of the rotating cylinder, a support frame is fixedly connected to the upper end of the connecting block, and an electromagnetic proportional valve and a controller are fixedly connected to the upper end of the support frame. The liquid level sensor detects the thickness of the liquid film on the surface of the silicon wafer in the cleaning tank in real time and feeds it back to the controller. The controller controls the electromagnetic proportional valve to adjust the spray pressure and flow rate of the corresponding spray pipe. In conjunction with the telescopic column's extension and retraction and the rotating cylinder's rotation, the spray height and angle of the spray pipe are adjusted.

[0006] Furthermore, a second connecting column and a third connecting column are fixedly connected to the lower end of the support frame. A first servo motor is fixedly connected to the lower end of the second connecting column, and a second servo motor is fixedly connected to the lower end of the third connecting column. A first connecting post is movably connected to one side of the outer surface of the first servo motor, and a fourth connecting post is movably connected to one side of the outer surface of the second servo motor; multiple sets of liquid spraying pipes are respectively connected to the first connecting post and the fourth connecting post; The controller controls the first servo motor and the second servo motor. The first servo motor drives the first connecting column, and the second servo motor drives the fourth connecting column to adjust the spray angle of the spray pipe.

[0007] Furthermore, multiple liquid level sensors are fixedly connected to the outer wall of the cleaning tank.

[0008] Furthermore, there are four sets of liquid level sensors, symmetrically arranged on the outer wall of the cleaning tank.

[0009] Furthermore, the liquid level sensor is an optical sensor or an ultrasonic sensor.

[0010] Furthermore, the liquid level sensor includes a circular head and a rectangular strip, with the lower end of the circular head fixedly connected to the rectangular strip.

[0011] Compared with the prior art, the beneficial effects of this utility model are: This invention utilizes a liquid level sensor to facilitate real-time monitoring of the liquid film thickness on the silicon wafer surface within the cleaning tank. Multiple liquid level sensors monitor the liquid film thickness from different locations, avoiding errors from a single monitoring point and ensuring comprehensive and reliable data. Based on the real-time monitoring of the liquid film thickness, the system can automatically adjust the spray height, angle, flow rate, and pressure, effectively preventing incomplete cleaning or silicon wafer damage caused by improper liquid film thickness. This improves the quality and efficiency of the final single-wafer cleaning of 12-inch silicon wafers, ensures the stability and consistency of the cleaning process, and meets the high-precision cleaning requirements of large-size silicon wafers. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of a precision automatic liquid spraying structure suitable for a final single-wafer cleaning machine for 12-inch large silicon wafers according to the present invention.

[0013] Figure 2 This is a schematic diagram of the cleaning cylinder in a precision automatic liquid spraying structure suitable for a final single-wafer cleaning machine for 12-inch large silicon wafers according to the present invention.

[0014] Figure 3This is a schematic diagram of the liquid level sensor in a precision automatic liquid adjustment spray structure suitable for a final single-wafer cleaning machine for 12-inch large silicon wafers according to this utility model.

[0015] Figure Labels 1. Countertop; 2. Cleaning tank; 3. Liquid level sensor; 4. Circular head; 5. Rectangular strip; 6. Telescopic column; 7. Rotating cylinder; 8. Spray pipe; 9. Electromagnetic proportional valve; 10. Controller; 11. Support frame; 12. First connecting column; 13. Second connecting column; 14. Third connecting column; 15. Fourth connecting column; 16. First servo motor; 17. Second servo motor; 18. Connecting block. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0017] Please refer to Figures 1 to 3 This invention discloses a precise automatic liquid spraying structure suitable for a final single-wafer cleaning machine for 12-inch silicon wafers. It includes a table 1, with a cleaning cylinder 2 fixedly connected to the upper outer surface of the table 1. Four sets of liquid level sensors 3 are fixedly connected to the outer wall of the cleaning cylinder 2, symmetrically arranged on the outer wall. These liquid level sensors 3 facilitate real-time detection of the liquid film thickness on the silicon wafer surface within the cleaning cylinder 2. The four sets of liquid level sensors 3 monitor the liquid film thickness from different locations, avoiding errors from a single monitoring point and ensuring comprehensive and reliable detection data. Based on the real-time monitoring of the liquid film thickness, the system can automatically adjust the spraying height, angle, flow rate, and pressure.

[0018] like Figure 1As shown, in this embodiment, a telescopic column 6 is fixedly connected to the upper outer surface of the platform 1. A rotating cylinder 7 is movably connected to the upper end of the telescopic column 6. A spray pipe 8 is fixedly connected to the upper end of the rotating cylinder 7. The number of spray pipes 8 can be multiple sets, which can be determined according to actual needs, for example, two or more sets. A connecting block 18 is fixedly connected to one side of the outer surface of the rotating cylinder 7. A support frame 11 is fixedly connected to the upper end of the connecting block 18. An electromagnetic proportional valve 9 and a controller 10 are fixedly connected to the upper end of the support frame 11. The pressure and flow rate of the sprayed liquid in each spray pipe 8 are controlled by the electromagnetic proportional valve 9. A second connecting column 13 and a third connecting column 14 are fixedly connected to the lower end of the support frame 11. A first servo motor 16 is fixedly connected to the lower end of the second connecting column 13, and a second servo motor 17 is fixedly connected to the lower end of the third connecting column 14. A first connecting post 12 is movably connected to one side of the outer surface of the first servo motor 16, and a fourth connecting post 15 is movably connected to one side of the outer surface of the second servo motor 17. The corresponding spray pipes 8 are respectively connected to the first connecting post 12 and the fourth connecting post 15. The controller 10 controls the first servo motor 16 and the second servo motor 17. The first servo motor 16 drives the first connecting post 12 to move, and the second servo motor 17 drives the fourth connecting post 15 to move, thereby adjusting the spray angle of the spray pipes 8 connected to the first connecting post 12 and the fourth connecting post 15.

[0019] When the liquid film in the central area of ​​the silicon wafer is detected to be too thin or too thick, the controller 10 controls the electromagnetic proportional valve 9 to adjust the pressure of the corresponding spray pipe 8, and simultaneously achieves self-fine adjustment of the orifice diameter of the spray pipe 8. When the flow rate at the edge of the silicon wafer is detected to be insufficient, the controller 10 controls the first servo motor 16 and the second servo motor 17. The first servo motor 16 drives the first connecting column 12, and the second servo motor 17 drives the fourth connecting column 15. The corresponding spray pipe 8 moves with the first connecting column 12 and the fourth connecting column 15, respectively. In conjunction with the telescopic action of the telescopic column 6 and the rotation action of the rotating cylinder 7, the spray height and angle of the spray pipe 8 are adjusted to enhance the coverage of the spray on the silicon wafer, thereby completing the self-adjustment of the spray height, angle, flow rate, and pressure.

[0020] The liquid level sensor used in this invention measures the thickness of the liquid film on the silicon wafer surface in a non-contact manner. It can be an optical sensor, such as a laser displacement sensor, or an ultrasonic sensor, such as an ultrasonic pulse-echo sensor. Figure 2 , Figure 3As shown, in this embodiment, the liquid level sensor 3 includes a circular head 4 and a rectangular strip 5, with the rectangular strip 5 fixedly connected to the lower end of the circular head 4. The circular head design allows the sensor to emit and receive detection signals (such as optical or ultrasonic signals) in a uniform radial pattern, thereby enabling non-contact measurement of the liquid film thickness on the silicon wafer surface. The circular shape helps reduce signal dead zones, ensuring wider detection area coverage and improving the accuracy of single-point measurements. When the cleaning fluid forms a liquid film on the silicon wafer surface, the circular head continuously emits signals and receives feedback, converting the liquid film thickness data into an electrical signal and transmitting it to the controller 10. The rectangular strip serves as a connecting and supporting component, used to fix the liquid level sensor to the outer wall of the cleaning tank 2. Its rectangular design provides a large contact area, ensuring the sensor is securely installed and preventing displacement due to vibration or water flow impact during cleaning, thus ensuring the stability of the monitoring point.

[0021] When using the precise automatic adjustment spray structure of this final single-wafer cleaning machine for 12-inch silicon wafers, a fixed program is first set through the controller 10. The self-adjustment function is then enabled based on actual needs. If enabled, four sets of liquid level sensors 3 fixedly connected to the outer wall of the cleaning tank 2 will detect the thickness and uniformity of the liquid film on the silicon wafer surface in the cleaning tank 2 in real time at millisecond speeds, and feed the detection data back to the controller 10 in real time. When the liquid film in the central area of ​​the silicon wafer is detected to be too thin or too thick, the controller 10 controls the electromagnetic proportional valve 9 to adjust the pressure of the corresponding spray pipe 8, while simultaneously fine-tuning the orifice diameter of the spray pipe 8. When insufficient flow is detected at the edge of the silicon wafer, the controller 10 controls the first servo motor 16 and the second servo motor 17. The first servo motor 16 drives the first connecting column 12; the second servo motor 17 drives the fourth connecting column 15, and in conjunction with the telescopic column 6's telescopic movement and the rotating cylinder 7's rotation, the spray height and angle of the spray pipe 8 are adjusted, thereby completing the self-adjustment of spray height, angle, flow rate, and pressure. If the self-adjustment function is not enabled, the entire spray structure will operate according to the original program. During the entire cleaning process, the spray structure can swing by means of the rotation of the rotating cylinder 7 and the extension of the telescopic column 6. After the cleaning process is completed, the swing function can help the spray-related devices return to their original positions for subsequent silicon wafer removal operations.

[0022] Based on the above embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

Claims

1. A precision automatic adjustment spray structure suitable for a final single-wafer cleaning machine for 12-inch large silicon wafers, comprising a table (1), a cleaning tank (2), and a spray pipe (8), characterized in that: The cleaning tank (2) is fixedly connected to the table (1), and a liquid level sensor (3) is fixedly connected to the outer wall of the cleaning tank (2). A telescopic column (6) is fixedly connected to the platform (1), and a rotating cylinder (7) is movably connected to the upper end of the telescopic column (6). Multiple sets of spray pipes (8) are fixedly connected to the upper end of the rotating cylinder (7). A connecting block (18) is fixedly connected to one side of the outer surface of the rotating cylinder (7), and a support frame (11) is fixedly connected to the upper end of the connecting block (18). An electromagnetic proportional valve (9) and a controller (10) are fixedly connected to the upper end of the support frame (11). The liquid level sensor (3) detects the thickness of the liquid film on the surface of the silicon wafer in the cleaning tank (2) in real time and feeds it back to the controller (10). The controller (10) controls the electromagnetic proportional valve (9) to adjust the spray pressure and flow rate of the corresponding spray pipe (8). In conjunction with the telescopic column (6) extension and retraction action and the rotating cylinder (7) rotation action, the spray height and angle of the spray pipe (8) are adjusted.

2. The precise automatic adjustment spray structure for a final single-wafer cleaning machine for 12-inch large silicon wafers according to claim 1, characterized in that: The lower end of the support frame (11) is fixedly connected to a second connecting column (13) and a third connecting column (14). The lower end of the second connecting column (13) is fixedly connected to a first servo motor (16), and the lower end of the third connecting column (14) is fixedly connected to a second servo motor (17). The first servo motor (16) has a first connecting post (12) movably connected to one side of its outer surface, and the second servo motor (17) has a fourth connecting post (15) movably connected to one side of its outer surface. Multiple sets of spray pipes (8) are respectively connected to the first connecting column (12) and the fourth connecting column (15); The controller (10) controls the first servo motor (16) and the second servo motor (17). The first servo motor (16) drives the first connecting column (12), and the second servo motor (17) drives the fourth connecting column (15) to adjust the spray angle of the spray pipe (8).

3. The precise automatic adjustment spray structure for a final single-wafer cleaning machine for 12-inch large silicon wafers according to claim 1 or 2, characterized in that: Multiple liquid level sensors (3) are fixedly connected to the outer wall of the cleaning tank (2).

4. The precise automatic spray structure for a final single-wafer cleaning machine for 12-inch large silicon wafers according to claim 3, characterized in that: The liquid level sensors are in four sets, symmetrically arranged on the outer wall of the cleaning tank (2).

5. The precise automatic adjustment spray structure for a final single-wafer cleaning machine for 12-inch large silicon wafers according to claim 1 or 2, characterized in that: The liquid level sensor (3) is an optical sensor or an ultrasonic sensor.

6. The precise automatic spraying structure for a final single-wafer cleaning machine for 12-inch large silicon wafers according to claim 5, characterized in that: The liquid level sensor (3) includes a circular head (4) and a rectangular bar (5), with the lower end of the circular head (4) fixedly connected to the rectangular bar (5).

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