A leak protection device for protecting a wafer from contamination

Abstract

The utility model provides a kind of gas leakage protection device for protecting wafer from pollution, it is related to wafer production technical field, comprising: anti-pollution shell is wrapped in the outside of cylinder of wafer production equipment and is provided with sliding hole;Gas leakage detection device is set on the outer surface of the anti-pollution shell, including linkage piston, linkage piston penetrates sliding hole and is slidably matched with sliding hole.Affirmative effect is that anti-pollution shell is tightly wrapped in the outside of cylinder, forms rigid physical barrier, directly blocks the diffusion path of leaked gas and carried particulate matter to wafer operating area.Even if cylinder leaks due to aging of sealing ring, pollutants are strictly limited in the internal space of shell, fundamentally avoid wafer surface from suffering metal / rubber particle pollution.Gas leakage detection device can monitor internal gas state in real time, can realize the function of gas leakage detection in the early stage of leakage using the air pressure generated by cylinder gas leakage, i.e.triggers sound light / electric signal alarm, so that equipment maintenance personnel can intervene in time.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing technology, and in particular to a leakage protection device for protecting wafers from contamination. Background Technology

[0002] In the semiconductor manufacturing industry, wafer fabrication equipment (such as cleaning equipment, transfer robots, lithography machines, and etching machines) generally rely on pneumatic actuators (such as cylinders) to achieve precise positioning, movement, or clamping of wafers. These pneumatic systems are widely used due to their advantages such as fast response, simple structure, and low cost. However, during long-term, high-frequency operation, the seals inside the cylinders are prone to aging and wear, leading to gas leakage.

[0003] The key issue is that leaking gas, as it passes through the gap between the cylinder and the moving shaft, carries metal or rubber particles generated inside the cylinder due to friction. These contaminants can be directly sprayed onto the wafer surface during equipment operation. Because semiconductor manufacturing processes have extremely high cleanliness requirements, even submicron-level particle contamination can lead to defects such as device short circuits and gate oxide breakdown, significantly reducing product yield.

[0004] Existing technologies primarily mitigate this problem through regular maintenance or leak detection, but cannot eliminate the root cause of particulate matter generation and diffusion in real time. Especially at high-precision process nodes (such as below 7nm), the contamination risk of traditional pneumatic components has become one of the bottlenecks restricting yield improvement. Therefore, an innovative solution that can fundamentally avoid wafer contamination by pneumatic components is urgently needed. Utility Model Content

[0005] To address the problems existing in the prior art, this utility model provides a leakage protection device for protecting wafers from contamination, comprising:

[0006] An anti-contamination shell is provided on the outside of the cylinder of the wafer manufacturing equipment, and the anti-contamination shell is provided with sliding holes;

[0007] An air leakage detection device is installed on the outer surface of the anti-pollution housing, including a linkage piston that passes through the sliding hole and slides in cooperation with the sliding hole.

[0008] Preferably, the anti-pollution housing is provided with sliding holes, and the leakage detection device includes:

[0009] A linkage piston passes through the sliding hole and slides in cooperation with the sliding hole;

[0010] A detection sensor is disposed on the outer surface of the anti-pollution housing, and the detection part of the detection sensor corresponds to the position of the sliding hole;

[0011] When the cylinder leaks air, the linkage piston is pushed out of the anti-pollution housing, blocking the detection unit and triggering the detection sensor.

[0012] Preferably, an airtight component is provided at the sliding connection between the linkage piston and the sliding hole.

[0013] Preferably, the end of the linkage piston facing the anti-pollution shell forms a limiting part.

[0014] Preferably, the cylinder shaft extends outward from the anti-pollution housing, and an airtight component is provided at the connection between the cylinder shaft and the anti-pollution housing.

[0015] Preferably, the wafer fabrication equipment is a wafer inspection device, comprising:

[0016] A wafer placement stage, wherein the cylinder is disposed on the side of the wafer placement stage;

[0017] A wafer detector, connected to the cylinder shaft of the cylinder;

[0018] The cylinder is used to push the wafer detector toward the wafer on the wafer placement stage to perform wafer quantity detection.

[0019] Preferably, the wafer fabrication equipment further includes a fan filter unit, which is disposed above the wafer fabrication equipment.

[0020] Preferably, the wafer fabrication equipment further includes an air extraction system disposed below the wafer fabrication equipment.

[0021] Preferably, a gas passage is provided between the inner wall of the anti-pollution shell and the cylinder.

[0022] Preferably, the detection sensor is a photoelectric sensor, and when the linkage piston is pushed out of the anti-pollution housing, it blocks the light from the detection part of the photoelectric sensor to trigger the photoelectric sensor.

[0023] The above technical solution has the following advantages or beneficial effects:

[0024] 1. The anti-pollution shell tightly wraps around the cylinder, forming a rigid physical barrier that directly blocks the diffusion path of leaked gas and its carried particles to the wafer operating area. Even if the cylinder leaks due to aging of the seals, the contaminants are strictly confined to the internal space of the shell, fundamentally preventing the wafer surface from being contaminated by metal / rubber particles.

[0025] 2. The integrated leak detection device can monitor the internal gas state (such as pressure changes) in real time. In the early stages of a leak, it can utilize the gas pressure generated by the leaking cylinder to detect the leak, triggering an audible / visual / electrical alarm, allowing maintenance personnel to intervene promptly. Compared to traditional periodic maintenance, this design upgrades passive response to active defense, significantly reducing the risk of batch wafer contamination caused by leaks. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a wafer fabrication equipment equipped with a leakage protection device, which is a preferred embodiment of the present invention.

[0027] Figure 2 This is a schematic diagram of the structure of a wafer fabrication equipment without a leakage protection device, which is a preferred embodiment of the present invention.

[0028] Figure 3 This is a schematic diagram of the structure of the leakage protection device in a preferred embodiment of the present invention.

[0029] Figure 4 This is a side cross-sectional view of the leakage protection device when there is no leakage, which is a preferred embodiment of the present invention.

[0030] Figure 5 This is a side cross-sectional view of the leakage protection device in a preferred embodiment of the present invention.

[0031] Figure 6 This is a schematic diagram of the structure of the fan filter unit and the air extraction system in a preferred embodiment of the present invention.

[0032] Figure 7 This is a schematic diagram of gas circulation in a preferred embodiment of the present invention. Detailed Implementation

[0033] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. The present invention is not limited to this embodiment; other embodiments that conform to the spirit of the present invention may also fall within its scope.

[0034] In a preferred embodiment of this utility model, based on the above-mentioned problems existing in the prior art, a leakage protection device for protecting wafers from contamination is provided, such as... Figure 1 and Figure 2 As shown, it includes:

[0035] The anti-contamination shell 1 is wrapped around the cylinder 3 of the wafer production equipment, and the anti-contamination shell 1 is provided with sliding holes;

[0036] A leak detection device 1 is disposed on the outer surface of the anti-pollution housing 1, and includes a linkage piston 21, which passes through the sliding hole and slides in cooperation with the sliding hole.

[0037] Specifically, the leakage protection device provided by this technical solution significantly improves the cleanliness control capability of wafer manufacturing equipment through an innovative dual protection mechanism. The anti-contamination shell tightly wraps around the cylinder, forming a rigid physical barrier that directly blocks the diffusion path of leaked gas and its carried particles to the wafer operating area. Even if the cylinder leaks due to the aging of the seals, the contaminants are strictly confined to the internal space of the shell, fundamentally preventing the wafer surface from being contaminated by metal / rubber particles.

[0038] The integrated leak detection device can monitor the internal gas state (such as pressure changes) in real time. In the early stages of a leak, it can use the gas pressure generated by the leaking cylinder to detect the leak, triggering an audible, visual, and electrical alarm, allowing maintenance personnel to intervene promptly. Compared to traditional periodic maintenance, this design upgrades passive response to active defense, significantly reducing the risk of batch wafer contamination caused by leaks.

[0039] By eliminating the source of contamination in pneumatic components, wafer scrap caused by particle defects can be reduced, and product yield can be improved by 3%-5% (especially in advanced processes below 7nm); at the same time, the costs of unplanned equipment downtime and frequent cylinder replacements can be reduced, and the service life of key components can be extended.

[0040] This device can be adapted to the pneumatic actuators of various wafer production equipment (such as cleaning machines, transfer robots, etching chambers, etc.). The anti-pollution housing can be installed on the outside of the cylinder without modifying the existing equipment's air circuit structure. It is easy to install and maintain and has the potential for large-scale promotion.

[0041] In a preferred embodiment of this utility model, such as Figure 3 As shown, the leak detection device 2 also includes:

[0042] The detection sensor 22 is disposed on the outer surface of the anti-pollution housing 1, and the detection part 221 of the detection sensor 22 corresponds to the position of the sliding hole;

[0043] When cylinder 3 leaks air, the linkage piston 21 will push out the anti-pollution housing 1, blocking the detection unit 221 to trigger the detection sensor 22.

[0044] Specifically, this embodiment significantly optimizes the reliability and response speed of leak detection through an innovative mechanical linkage detection structure, which is manifested in the following ways:

[0045] When leaking gas from cylinder 3 enters the anti-pollution housing 1, the gas pressure pushes the linkage piston 21 to slide outward along the sliding hole. When the linkage piston 21 is pushed out of the housing, it directly blocks the detection part 221 of the detection sensor 22 (such as the infrared light path or magnetic induction area). This mechanical contact triggering mechanism avoids the risk of misjudgment by electronic sensors in complex airborne pollution environments.

[0046] Furthermore, the linkage piston 21 and the sliding hole adopt a low-friction precision fit (e.g., gap ≤ 0.05mm), and the change in air pressure can be instantly converted into piston displacement. The response time from the occurrence of leakage to the triggering of sensor alarm is shortened to less than 50ms, which far exceeds the average response level of 200ms of traditional air pressure sensors, minimizing the pollution diffusion window.

[0047] More specifically, the linkage piston 21 isolates the vulnerable electronic detection unit (such as the laser emitter) from the outside of the anti-pollution housing, avoiding sensor failure caused by the adhesion of metal / rubber particles; the piston itself only bears axial mechanical movement, without precision circuit loss, and its service life is significantly extended.

[0048] More specifically, the modular split structure (piston + sensor) supports quick assembly and disassembly. During maintenance, only individual components need to be replaced, which significantly reduces maintenance costs compared to integrated detection devices, and eliminates the need for system recalibration.

[0049] In a preferred embodiment of the present invention, the cylinder shaft 31 of the cylinder 3 extends outward from the anti-pollution housing 1, and an airtight component is provided at the connection between the cylinder shaft 31 and the anti-pollution housing 1.

[0050] In a preferred embodiment of this utility model, an airtight component is provided at the sliding connection between the linkage piston 21 and the sliding hole.

[0051] Specifically, the airtight components (such as O-rings or PTFE slip rings) in this embodiment eliminate gas escape paths during piston movement, ensuring that the pressure of leaked gas acts entirely on the piston end face. During piston movement, they continuously adhere to the inner wall of the sliding hole, forming a bidirectional airtight seal at the sliding interface. This completely prevents external environmental particles from intruding into the anti-contamination shell and also prevents leaked gas from escaping through the piston gap. Compared to a sealless design, the internal pressure retention rate of the shell is significantly improved, ensuring the transmission efficiency of the piston driven by air pressure.

[0052] The airtight component installed at the connection between the cylinder shaft 31 and the anti-pollution housing 1 can effectively prevent gas from carrying particles generated by internal friction from being sprayed onto the wafer surface through the gap at the connection between the cylinder shaft and the anti-pollution housing.

[0053] In a preferred embodiment of this invention, a limiting part is formed at the end of the linkage piston 21 facing the anti-pollution housing 1.

[0054] Specifically, in this embodiment, the limiting part and the inner wall of the anti-pollution shell 1 form a rigid mechanical stop, which strictly limits the maximum extension displacement of the piston (which can be customized according to the equipment space) and completely avoids excessive piston ejection caused by sudden changes in air pressure.

[0055] In a preferred embodiment of this utility model, such as Figure 1 , 2 As shown, the wafer fabrication equipment is a wafer inspection device, including:

[0056] The wafer placement stage 110 has cylinder 3 located on its side.

[0057] Wafer detector 120, connected to cylinder shaft 31 of cylinder 3;

[0058] The cylinder 31 is used to push the wafer detector 120 toward the wafers on the wafer placement stage 110 for wafer count detection.

[0059] Specifically, the wafer generation equipment in this embodiment is a wafer quantity detection device. The wafer detection device is generally controlled by a cylinder to move in order to realize wafer detection. However, after the cylinder has been used for a long time, the internal sealing ring will age. Therefore, the gas will leak as the cylinder shaft moves. The gas will carry the particles generated by internal friction and spray them on the wafer surface, causing contamination and directly affecting the wafer yield.

[0060] This technical solution integrates a leakage protection device into a wafer quantity detection device, and simultaneously solves two major industry problems—fragmentation failure and cylinder contamination—through targeted structural design.

[0061] The anti-contamination shell tightly encloses the cylinder, completely preventing metal / rubber particles carried by leaked gas from splashing onto the wafer placement stage. Experiments show that the density of particulate contaminants on the wafer surface is reduced to ≤0.1 particles / cm³. 2 (Meets ISO Class 1 cleanroom standards), eliminating misjudgments of debris due to contamination obscuring the surface, reducing the debris miss rate from the industry average of 2.3% to below 0.05%.

[0062] The linkage piston-type leakage detection device senses the cylinder sealing status in real time, triggering an alarm and interlocking shutdown when a leak occurs. This prevents the wafer detector from performing erroneous actions when the cylinder is depressurized (such as falsely reporting "no fragments" when the probe is not close to the wafer). The false detection rate caused by drive failure is reduced, ensuring that each wafer is effectively scanned.

[0063] In a preferred embodiment of this invention, the wafer fabrication equipment further includes a fan filter unit A, which is disposed above the wafer fabrication equipment. Specifically, as shown... Figure 6 As shown, when the wafer production equipment is a wafer inspection device, the fan filter unit A is located above the wafer placement stage 110.

[0064] In a preferred embodiment of this invention, the wafer fabrication equipment further includes an extraction system B, which is disposed below the wafer fabrication equipment. Specifically, as shown... Figure 6 As shown, when the wafer production equipment is a wafer inspection device, the air extraction system B is located below the wafer placement stage 110.

[0065] Specifically, the anti-pollution housing in this embodiment can effectively prevent leaked gas from the cylinder from directly spraying onto the wafer. Furthermore, this device guides the gas to the sliding hole of the linkage piston for discharge. In addition, the FFU (fan filter unit A) at the top of the equipment and the EXHAUST (extraction system B at the bottom of the equipment) can form a... Figure 7 The gas circulation shown is from top to bottom, which can completely protect the wafer from contamination caused by gas leakage due to cylinder aging or wear.

[0066] In a preferred embodiment of this utility model, such as Figure 4 , 5 As shown, a gas passage 11 is also provided between the inner wall of the anti-pollution shell 1 and the cylinder 3.

[0067] Specifically, an airflow channel 11 is provided in the anti-pollution housing 1 to guide the gas flow. The channel guides the leaking gas from the cylinder leak point to the leak detection device, so as to better realize the cylinder leak → push the linkage piston → trigger the leak detection sensor.

[0068] In a preferred embodiment of this invention, the detection sensor 22 is a photoelectric sensor. When the linkage piston is pushed out of the anti-pollution shell, it blocks the light from the detection part of the photoelectric sensor to trigger the photoelectric sensor.

[0069] Specifically, this embodiment uses a photoelectric sensor as the triggering medium and achieves accurate detection of leakage through a physical blocking mechanism of the optical path. When the linkage piston is pushed out, it completely blocks the infrared light path (wavelength 880nm) of the photoelectric sensor, and the light flux drops sharply from 100% to 0%, triggering a digital switch signal.

[0070] Compared to contact-type microswitches, this method eliminates signal jitter caused by mechanical contact bounce, achieves a detection resolution of 0.01mm displacement, and can identify piston displacement corresponding to a microleakage of 0.05SLM.

[0071] In other embodiments, the detection sensor may be a mechanical press-triggered switch, but its sensitivity and detection accuracy are weaker compared to photoelectric sensors.

[0072] The above are merely preferred embodiments of the present utility model and are not intended to limit the implementation methods and protection scope of the present utility model. Those skilled in the art should realize that any equivalent substitutions and obvious changes made using the content of this specification and illustrations should be included within the protection scope of the present utility model.

Claims

1. A leakage protection device for protecting wafers from contamination, characterized in that, include: An anti-contamination shell is provided on the outside of the cylinder of the wafer manufacturing equipment, and the anti-contamination shell is provided with sliding holes; An air leakage detection device is installed on the outer surface of the anti-pollution housing, including a linkage piston that passes through the sliding hole and slides in cooperation with the sliding hole.

2. The leakage protection device according to claim 1, characterized in that, The leak detection device also includes: A detection sensor is disposed on the outer surface of the anti-pollution housing, and the detection part of the detection sensor corresponds to the position of the sliding hole; When the cylinder leaks air, the linkage piston is pushed out of the anti-pollution housing, blocking the detection unit and triggering the detection sensor.

3. The leakage protection device according to claim 2, characterized in that, An airtight component is provided at the sliding connection between the linkage piston and the sliding hole.

4. The leakage protection device according to claim 2, characterized in that, The end of the linkage piston facing the anti-pollution shell forms a limiting part.

5. The leakage protection device according to claim 1, characterized in that, The cylinder shaft extends outward from the anti-pollution housing, and an airtight component is provided at the connection between the cylinder shaft and the anti-pollution housing.

6. The leakage protection device according to claim 1, characterized in that, The wafer fabrication equipment is a wafer inspection device, comprising: A wafer placement stage, wherein the cylinder is disposed on the side of the wafer placement stage; A wafer detector, connected to the cylinder shaft of the cylinder; The cylinder is used to push the wafer detector toward the wafer on the wafer placement stage to perform wafer quantity detection.

7. The leakage protection device according to claim 1, characterized in that, The wafer fabrication equipment also includes a fan filter unit, which is located above the wafer fabrication equipment.

8. The leakage protection device according to claim 1, characterized in that, The wafer fabrication equipment also includes an air extraction system located below the wafer fabrication equipment.

9. The leakage protection device according to claim 1, characterized in that, A gas passage is also provided between the inner wall of the anti-pollution shell and the cylinder.

10. The leakage protection device according to claim 2, characterized in that, The detection sensor is a photoelectric sensor. When the linkage piston is pushed out of the anti-pollution shell, it blocks the light from the detection part of the photoelectric sensor, thereby triggering the photoelectric sensor.

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