Substrate processing apparatus and etch cleaning apparatus

Abstract

The utility model discloses a kind of substrate processing device and etching cleaning device.The substrate processing device includes spraying part, conveying assembly and reflux component, the spraying part is suitable for spraying liquid to substrate, conveying assembly is located below the spraying part, the spraying part is suitable for spraying liquid to substrate;Reflux component includes liquid receiving groove and reflux pipe, the liquid receiving groove is located below the spraying part, one end of the reflux pipe is communicated with the liquid receiving groove.Conveying assembly can convey substrate to spraying part, spraying part can spray liquid to the surface of substrate, excess liquid will flow to liquid receiving groove, liquid receiving groove is communicated with reflux pipe, liquid in liquid receiving groove is refluxed by reflux pipe, so as to realize the recycling of liquid, to save resources, reduce cost.

Description

Technical Field

[0001] This utility model relates to the field of etching and cleaning equipment technology, and more specifically, to a substrate processing device and an etching and cleaning device. Background Technology

[0002] Among related technologies, TOPCon (Tunnel Oxide Passivated Contact) is a passivation contact technology. In the fabrication process of TOPCon cells, in order to protect the front side of the cell from damage in subsequent processes, a relatively thick BSG (BoroSilicate Glass) layer is usually formed on the silicon wafer surface.

[0003] Since BSG layers exist on both sides of the silicon wafer, and only the back side needs to be removed, a water film is used to protect the front side of the wafer. The BSG layer on the back side is typically removed using a high-concentration hydrogen fluoride (HF) solution. However, current water film spraying equipment wastes a large amount of pure water when spraying it onto the front side of the silicon wafer, resulting in higher production costs.

[0004] Therefore, a new technical solution is needed to solve the above-mentioned technical problems. Utility Model Content

[0005] One objective of this invention is to provide a new technical solution for a substrate processing device.

[0006] According to a first aspect of the present invention, a substrate processing apparatus is provided. The substrate processing apparatus includes: A spraying element, the spraying element being adapted to spray liquid onto a substrate; A conveying assembly is located below the spray element, and the conveying assembly is capable of conveying the substrate through the spray element; The return assembly includes a liquid receiving tank and a return pipe. The liquid receiving tank is located below the spray element, and one end of the return pipe is connected to the liquid receiving tank.

[0007] Optionally, the reflux assembly further includes a filter adapted to filter liquid flowing into the reflux pipe.

[0008] Optionally, the reflux assembly further includes a pump body connected to the reflux pipe.

[0009] Optionally, the substrate processing device further includes an overflow pipe, the inlet of which protrudes from the bottom wall of the receiving tank.

[0010] Optionally, the reflux assembly further includes a first connecting pipe, which is connected to the liquid receiving tank, the overflow pipe and the reflux pipe respectively, and a first valve body is provided between the first connecting pipe and the overflow pipe.

[0011] Optionally, the reflux assembly further includes a mesh cover, and the liquid receiving tank is provided with a liquid outlet communicating with the reflux pipe, and the mesh cover is provided on the liquid outlet.

[0012] Optionally, the inner diameter of the liquid outlet gradually decreases along the reflux direction of the liquid.

[0013] Optionally, the substrate processing device includes a scraper, which is located above the conveying assembly and on one side of the spraying assembly along the horizontal direction. The conveying assembly is capable of conveying the substrate first through the spraying assembly and then through the scraper.

[0014] Optionally, the substrate processing apparatus further includes a mounting base, on which the scraping element is movably mounted.

[0015] Optionally, the distance between the scraper and the conveying assembly is 1.5mm-3mm.

[0016] Optionally, the length of the substrate is L, and the distance between the spray element and the scraper element is greater than or equal to L.

[0017] Optionally, the substrate has a length of L, the conveying assembly is adapted to convey the substrate to the processing step, the scraper is located between the spraying component and the processing step, and the distance between the scraper and the processing step is greater than or equal to L.

[0018] Optionally, the substrate processing device further includes a liquid storage tank, which is connected to the spraying component, and the liquid receiving tank is connected to the liquid storage tank through the return pipe.

[0019] Optionally, the end of the return pipe away from the liquid receiving tank is connected to the spray element.

[0020] According to a second aspect of the present invention, an etching and cleaning apparatus is provided. This etching and cleaning apparatus includes the substrate processing apparatus described in the above embodiments.

[0021] One technical advantage of this application is that the conveying component can convey the substrate to the spraying component, which can spray liquid onto the surface of the substrate. Excess liquid will flow to the liquid receiving tank, which is connected to a return pipe. The liquid in the liquid receiving tank will flow back through the return pipe, thereby realizing the recycling and reuse of liquid, saving resources and reducing costs.

[0022] Other features and advantages of the present invention will become clear from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of the present invention and, together with their description, serve to explain the principles of the present invention.

[0024] Figure 1 This is a schematic diagram of the structure of a substrate processing apparatus according to an embodiment of this application.

[0025] Figure 2 This is a schematic diagram of the structure of a spray component according to an embodiment of this application.

[0026] Figure 3 This is a partial structural schematic diagram of an etching and cleaning apparatus according to an embodiment of this application.

[0027] Figure 4 This is a partial structural schematic diagram of a substrate processing apparatus according to an embodiment of this application.

[0028] Figure 5 This is a schematic diagram of the substrate processing apparatus according to another embodiment of this application.

[0029] Figure label: 1. Spraying component; 11. First outlet pipe; 12. Outlet plate; 13. Nozzle; 14. Second valve body; 2. Scraper; 3. Conveying assembly; 31. First roller; 4. Storage tank; 41. Inlet pipe; 42. Second outlet pipe; 43. Second connecting pipe; 44. Level gauge; 5. Receiving trough; 51. Outlet section; 52. Drainage trough; 6. Return pipe; 61. Pump body; 7. First connecting pipe; 8. Filter; 9. Overflow pipe; 10. First valve body; 20. Substrate; 30. Protective membrane; 60. Frame; 70. Acid tank; 80. Sensor; 90. Mesh cover; 100. Third connecting pipe. Detailed Implementation

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present invention.

[0031] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0032] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0033] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0034] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0035] According to one embodiment of this application, a substrate processing apparatus is provided. For example... Figures 1 to 5 As shown, the substrate processing device includes a spraying component 1, which is adapted to spray liquid onto a substrate 20; a conveying component 3, located below the spraying component 1, which is capable of conveying the substrate 20 through the spraying component 1; and a return component, including a liquid receiving tank 5 and a return pipe 6, wherein the liquid receiving tank 5 is located below the spraying component 1, and one end of the return pipe 6 is connected to the liquid receiving tank 5.

[0036] In this example, the conveying component 3 can convey the substrate 20 to the spraying component 1, which can spray liquid onto the surface of the substrate 20. Excess liquid will flow to the liquid receiving tank 5, which is connected to the return pipe 6. The liquid can be returned through the return pipe 6, thereby realizing the recycling and reuse of liquid, saving resources and reducing costs.

[0037] In this example, the substrate 20 can be fed to the conveying assembly 3 by an operator, or it can be directly conveyed to the conveying assembly 3 from the previous process. The conveying assembly 3 can move the substrate 20 towards the spraying component 1. When the substrate 20 is located below the spray nozzle of the spraying component 1, the water sprayed by the spraying component 1 can form a protective film 30 on the front side of the substrate 20. Excess liquid will flow to the liquid receiving tank 5 and then return through the return pipe 6. For example, the end of the return pipe 6 away from the liquid receiving tank 5 can be connected to other tank structures for liquid reuse; or, the end of the return pipe 6 away from the liquid receiving tank 5 can also return to the spraying component 1 through the return assembly, so that the liquid can be reused through the spraying component 1. In this embodiment, the end of the return pipe 6 away from the liquid receiving tank 5 returns to the spraying component 1 through the return assembly.

[0038] It should be noted that the liquid sprayed by the sprayer 1 onto the substrate 20 can be a protective liquid. This liquid forms a protective film 30 on the surface of the substrate 20, preventing contamination. The substrate 20 can be a silicon wafer, and the liquid can be pure water or phosphoric acid. For example, spraying pure water onto the surface of a silicon wafer by the sprayer 1 can form a water film on the wafer surface, which serves as the protective film 30. Of course, the specific types of the substrate 20 and the liquid can be determined by those skilled in the art based on the actual situation, and are not specifically limited here.

[0039] like Figure 3 As shown, in this example, Figure 3 The middle arrow indicates the conveying direction of the substrate 20. The conveying assembly 3 includes multiple first rollers 31, which are spaced apart. The substrate 20 is placed on the first rollers 31, and the multiple first rollers 31 can rotate to move the substrate 20. The multiple first rollers 31 can be arranged in parallel to avoid the substrate 20 shifting during conveying.

[0040] In this example, the multiple first rollers 31 can be connected by a drive mechanism, and a single drive unit can drive the multiple first rollers 31 to rotate synchronously. Alternatively, the conveying assembly 3 includes a conveying section and a coating section, wherein the coating section is the part of the conveying assembly 3 corresponding to the spraying component 1 and the scraping component 2. The conveying section and the coating section can be driven by different drive units. The conveying speed of the conveying section is greater than that of the coating section, which can improve the conveying efficiency and also ensure the coating effect on the surface of the substrate 20. The drive unit can be a rotary motor or other drive equipment, which can be determined by those skilled in the art according to the actual situation, and is not specifically limited here.

[0041] In this example, the conveying component 3 can also be a conveying structure such as a conveyor belt. Those skilled in the art can determine the specific type of conveying component based on the actual situation, and no specific limitation is made here.

[0042] In this example, the end of the return pipe 6 away from the liquid receiving tank 5 is connected to the spraying component 1. That is, the liquid in the liquid receiving tank 5 can flow back from the return pipe 6 to the spraying component 1 to spray the substrate 20, thereby enabling the recycling of the liquid.

[0043] like Figure 2 and Figure 3 As shown, in this example, the substrate processing apparatus also includes a sensor 80, which can be used to detect the substrates 20 conveyed by the conveying assembly 3 and count the number of substrates 20. For example, the sensor 80 can be mounted on the frame 60. Furthermore, the sensor 80 is located above the conveying assembly 3 and on one side of the spray member 1 in the horizontal direction.

[0044] In this example, multiple liquid receiving tanks 5 can be arranged at intervals, and the return pipes 6 corresponding to the multiple liquid receiving tanks 5 can be connected through a third connecting pipe 100. Alternatively, each liquid receiving tank 5 can be provided with an independent return pipe. Those skilled in the art can decide according to the actual situation, and no specific limitation is made here.

[0045] In this example, the liquid receiving tank 5 can be assembled by sequentially connecting multiple side walls and bottom walls, or it can be integrally formed. Those skilled in the art can decide according to the actual situation, and no specific limitations are made here.

[0046] like Figure 1 As shown, in one example, the reflux assembly further includes a filter 8 adapted to filter liquid flowing into the reflux pipe 6. For example, the inlet of the filter 8 is connected to the receiving tank 5, and the outlet of the filter 8 is connected to the reflux pipe 6.

[0047] In this example, the receiving tank 5 is provided with a liquid outlet 51, for example, the liquid outlet 51 can be provided on the bottom wall of the receiving tank. The inlet end of the filter 8 is connected to the liquid outlet 51. The liquid in the receiving tank 5 flows into the return pipe 6 after passing through the filter 8, thereby filtering the liquid in the receiving tank 5.

[0048] In this example, the filter 8 may include a filter screen and a filter element, which are sequentially arranged within the first connecting pipe 7.

[0049] like Figure 1 As shown, in one example, the inner diameter of the liquid outlet 51 gradually decreases along the direction of liquid recirculation.

[0050] In this example, the direction of liquid return is the same as the direction of liquid flow. For instance, if the liquid in the receiving tank 5 flows from top to bottom into the return pipe 6, then the inner diameter of the outlet 51 gradually decreases from its upper end to its lower end. That is, the outlet 51 can be a funnel-shaped structure or a trumpet-shaped structure with a larger opening at the upper end. The filter 8 can be inserted into the outlet 51 from its lower end. The liquid in the receiving tank 5 can first flow into the outlet 51, then seep into the filter 8, and then flow into the return pipe 6. The larger opening at the upper end of the outlet 51 allows for the pre-storage of a larger amount of liquid, while the smaller lower end helps to avoid obstructing other installation components.

[0051] It should be noted that the liquid outlet 51 can be integrally formed with the bottom wall of the liquid receiving tank 5. That is, the bottom wall of the liquid receiving tank 5 has an opening that extends downward to form a funnel-shaped liquid outlet 51. A mesh cover 90 is provided at the upper end of the liquid outlet 51 to provide a filtering effect.

[0052] Alternatively, the larger opening end of the liquid outlet 51 can be connected to the liquid receiving tank 5 by welding or other means. The bottom wall of the liquid receiving tank 5 has an opening that communicates with the liquid outlet 51. A mesh cover 90 can be installed over the opening in the bottom wall of the liquid receiving tank 5.

[0053] like Figure 5As shown, in this example, the bottom wall of the liquid receiving tank 5 is also provided with a diversion channel 52, one end of which extends to and communicates with the liquid outlet 51. Multiple liquid receiving tanks 5 are provided, and adjacent liquid receiving tanks 5 are interconnected. For example, the diversion channels 51 of two adjacent liquid receiving tanks 5 are interconnected. If one liquid receiving tank 5 becomes blocked, the liquid in the liquid receiving tank 5 can be diverted to another liquid receiving tank 5 through the diversion channel 52 for discharge.

[0054] like Figure 1 As shown, in one example, the reflux assembly further includes a pump body 61 connected to the reflux pipe 6.

[0055] In this example, the return pipe 6 is connected to a pump body 61, which draws the liquid in the receiving tank 5 through the return pipe 6 to the spray element 1, ensuring a stable and continuous water spray from the spray element 1. Alternatively, the pump body 61 can also draw the liquid into the storage tank 4. By setting up the pump body 61, continuous and stable liquid return and reuse can be achieved.

[0056] like Figure 1 As shown, in one example, the substrate processing apparatus further includes an overflow pipe 9, the inlet of which protrudes from the bottom wall of the liquid receiving tank 5.

[0057] In this example, the inlet of the overflow pipe 9 protrudes beyond the bottom wall of the receiving tank 5. When the liquid in the receiving tank 5 exceeds the inlet of the overflow pipe 9, the liquid can be discharged from the overflow pipe 9 in a timely manner to prevent the liquid in the receiving tank 5 from overflowing. The length by which the inlet of the overflow pipe 9 protrudes beyond the bottom wall of the receiving tank 5 can be determined by those skilled in the art based on actual conditions, and is not specifically limited here.

[0058] like Figure 1 As shown, in one example, the reflux assembly further includes a first connecting pipe 7, which is connected to the liquid receiving tank 5, the overflow pipe 9, and the reflux pipe 6, respectively. A first valve body 10 is provided between the first connecting pipe 7 and the overflow pipe 9. For example, one end of the first connecting pipe 7 is connected to the liquid receiving tank 5, and the overflow pipe 9 and the reflux pipe 6 are respectively connected to the first connecting pipe 7.

[0059] like Figure 1As shown, in this example, the filter 8 can be installed inside the first connecting pipe 7. One end of the return pipe 6 is connected to the first connecting pipe 7. The first connecting pipe 7 is connected to the overflow pipe 9, allowing liquid in the receiving tank 5 to flow from the first connecting pipe 7 into the overflow pipe 9. A first valve body 10 is provided between the first connecting pipe 7 and the overflow pipe 9. When the first valve body 10 is open, liquid in the receiving tank 5 can flow from the first connecting pipe 7 into the overflow pipe 9. For example, the bottom wall of the receiving tank 5 is provided with an outlet 51 connected to the first connecting pipe 7. The inner diameter of the first connecting pipe 7 is larger than the inner diameter of the return pipe 6, allowing water in the receiving tank 5 to flow substantially through the first connecting pipe 7 to the overflow pipe 9. When liquid in the receiving tank 5 needs to flow back, the first valve body 10 can be closed, allowing the liquid to flow smoothly into the return pipe.

[0060] like Figure 1 As shown, in this example, multiple liquid receiving tanks 5 are spaced apart, and each liquid receiving tank 5 is provided with a corresponding first connecting pipe 7. There is one return pipe 6, and the multiple first connecting pipes 7 are connected by a third connecting pipe 100. One of the first connecting pipes 7 is connected to the overflow pipe 9 and the return pipe 6.

[0061] like Figures 1 to 3 As shown, in one example, the substrate processing device includes a scraper 2 located above the conveying assembly 3 and on one side of the spraying assembly 1 in the horizontal direction. The conveying assembly 3 is capable of conveying the substrate 20 first through the spraying assembly 1 and then through the scraper 2.

[0062] In this example, the conveying assembly 3 moves the substrate 20 to the position of the spraying member 1, where the spraying member 1 sprays liquid onto the upper surface of the substrate 20 to form a protective film 30 on the surface of the substrate 20. The conveying assembly 3 continues to move the substrate 20 toward the scraping member 2. There is a gap between the scraping member 2 and the conveying assembly 3. As the conveying assembly 3 moves the substrate 20 through the gap, the scraping member 2 removes excess liquid from the surface of the substrate 20. The scraped-off protective film 30 flows in liquid form to the liquid receiving tank 5 of the return assembly. Furthermore, the scraping member 2 also makes the protective film 30 on the surface of the substrate 20 more uniform. Then, the conveying assembly 3 conveys the substrate 20 to the acid tank 70, where an HF solution is used to etch away the BSG layer on the reverse side of the substrate 20. The protective film 30 can protect the BSG layer on the front side. The front and back sides of the substrate 20 are two opposite sides of the substrate 20 along the thickness direction. When the substrate 20 is on the conveying assembly 3, the upper surface of the substrate 20 is the front side and the lower surface is the back side.

[0063] The wiper component 2 can be a scraper or a roller structure. For example, the wiper component 2 can be a roller. The material of the wiper component 2 is PP (Polypropylene). The length of the wiper component 2 can be 1525mm, and the diameter of the wiper component 2 can be 40mm. Of course, the specific material and size of the wiper component 2 can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.

[0064] like Figure 1 As shown, in this example, the substrate processing apparatus also includes a frame 60, which has a liquid receiving tank 5. The conveying assembly 3, the spraying component 1, and the scraping component 2 are respectively mounted on the frame 60.

[0065] In one example, the substrate processing apparatus further includes a mounting base on which the scraper 2 is movably mounted.

[0066] In this example, the mounting base is mounted on the frame 60, and the scraper 2 is movably mounted on the mounting base. For example, the scraper 2 can move away from or closer to the conveying assembly 3, thereby adjusting the distance between the scraper 2 and the conveying assembly 3 so that the scraper 2 can scrape off an appropriate amount of the protective film 30.

[0067] In this example, the scraper 2 can be moved away from or closer to the conveying assembly 3 by a drive mechanism such as a linear motor or cylinder. Those skilled in the art can determine the appropriate method based on the specific circumstances, and no specific limitations are made here.

[0068] In one example, the distance between the scraper 2 and the delivery assembly 3 is 1.5mm-3mm.

[0069] In this example, the scraper 2 is positioned above the conveying assembly 3, with a gap of 1.5mm-3mm between the scraper 2 and the conveying assembly 3. The substrate 20, with a protective film 30 covering its surface, can pass through this gap. As the substrate 20 passes through the gap, the scraper 2, positioned above it, scrapes off excess protective film 30 from the surface of the substrate 20. This prevents excess protective film 30 from being carried into the acid tank 70 to dilute the HF solution, thereby reducing acid consumption. Furthermore, the scraper 2 ensures a more uniform coverage of the protective film 30 on the surface of the substrate 20, preventing any gaps or areas where the protective film 30 is not covered.

[0070] If the distance between the wiper 2 and the conveying assembly 3 is less than 1.5 mm, the protective film 30 covering the surface of the substrate 20 will be insufficient, failing to provide effective protection. Conversely, if the distance is greater than 3 mm, excess protective film 30 cannot be effectively removed, resulting in an excessive amount of protective film 30 on the surface of the substrate 20. Therefore, setting the distance between the wiper 2 and the conveying assembly 3 to 1.5 mm-3 mm effectively removes excess protective film 30 from the surface of the substrate 20 while ensuring that the protective film 30 covering the surface of the substrate 20 provides sufficient protection for the BSG layer on the substrate 20 surface.

[0071] For example, the distance between the scraper 2 and the conveying assembly 3 can be set to 1.5mm, 2.0mm, 2.5mm or 3mm, etc., which can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.

[0072] In one example, the substrate 20 has a length of L, and the distance between the spray element 1 and the scraper element 2 is greater than or equal to L.

[0073] In this example, the length of the substrate 20 is L in the conveying direction of the conveying assembly 3. The spraying element 1 and the scraping element 2 are spaced apart, and the distance between them is greater than or equal to L. That is, the distance between the spraying element 1 and the scraping element 2 is sufficient to accommodate at least one substrate 20. This allows the spraying element 1 to spray liquid onto the surface of the substrate 2 before moving to the position of the scraping element 2 to scrape off excess liquid. This avoids the scraping element 2 affecting the surface of the substrate 20 when the spraying element 1 sprays liquid onto the substrate 20, preventing insufficient liquid on the substrate 20 surface.

[0074] For example, the distance between the spray element 1 and the scraper element 2 can be L, 1.1L, 1.2L or 1.3L, etc., which can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.

[0075] like Figure 3 and Figure 4 As shown, in this example, the conveying assembly 3 may include a plurality of spaced first rollers 31. Five or six first rollers 31 may be spaced between the spray element 1 and the scraper element 2.

[0076] In one example, the substrate 20 has a length of L, the conveying assembly 3 is adapted to convey the substrate 20 to the processing step, the scraper 2 is located between the spraying assembly 1 and the processing step, and the distance between the scraper 2 and the processing step is greater than or equal to L.

[0077] In this example, the length of the substrate 20 is L in the conveying direction of the conveying assembly 3. After the sprayer 1 sprays liquid onto the substrate 20, the excess liquid is scraped off by the scraper 2, and then the substrate is conveyed to the processing step by the conveying assembly 3 for further processing. The distance between the scraper 2 and the processing step is greater than or equal to L, that is, the distance between the scraper 2 and the processing step is at least enough to accommodate one substrate 20, or in other words, the distance between the scraper 2 and the processing step is at least enough to accommodate one substrate 20. This allows the scraper 2 to scrape off excess liquid from the surface of the substrate 2 before moving to the processing step. This prevents the substrate 20 from moving to the processing step while the scraper 2 is scraping off excess liquid, thus avoiding excess liquid leaking into the processing step. The processing step can be an acid tank 70.

[0078] For example, the distance between the scraper 2 and the processing step can be L, 1.1L, 1.2L or 1.3L, etc., which can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.

[0079] like Figure 1 As shown, in one example, the substrate processing apparatus further includes a liquid storage tank 4, which is connected to the spray element 1, and the liquid receiving tank 5 is connected to the liquid storage tank 4 through the return pipe 6.

[0080] like Figure 1 As shown, in this example, the liquid storage tank 4 can be installed on the frame 60. The liquid storage tank 4 contains liquid, and the spray element 1 is connected to the liquid storage tank 4. The liquid in the liquid storage tank 4 can be transported to the spray element 1, and sprayed onto the surface of the substrate 20 by the spray element 1 to form a protective film 30 on the surface of the substrate 20. The liquid receiving tank 5 is located below the spray element 1. Part of the liquid sprayed by the spray element 1 covers the surface of the substrate 20, and the other part flows into the liquid receiving tank 5. The liquid receiving tank 5 and the liquid storage tank 4 are connected by a return pipe 6, which can return the liquid in the liquid receiving tank 5 to the liquid storage tank 4, thereby enabling the liquid to be recycled and reused, which is beneficial for saving resources and reducing costs.

[0081] like Figure 1 As shown, in this example, the storage tank 4 can be positioned above the spray element 1. The liquid can flow towards the spray element 1 under gravity and be continuously and stably sprayed out from the spray element 1, thus eliminating the need for an additional pneumatic valve to continuously adjust the flow rate and reducing costs. The return pipe 6 is connected to a pump body 61, which can pump the liquid in the receiving tank 5 into the storage tank 4 through the return pipe 6.

[0082] like Figure 1As shown, in this example, the liquid storage tank 4 is connected to an inlet pipe 41, allowing liquid to flow from the outside into the liquid storage tank 4 through the inlet pipe 41 to replenish the liquid in the tank 4. The substrate processing apparatus also includes a second outlet pipe 42 and a second connecting pipe 43. The liquid storage tank 4 is connected to the second connecting pipe 43 via the second outlet pipe 42. The second connecting pipe 43 can be mounted on the frame 60. The second connecting pipe 43 can be arranged along the width direction of the conveying assembly 3. Multiple spray elements 1 are spaced apart and connected to the second connecting pipe 43, and the multiple spray elements 1 are evenly connected to the second connecting pipe 43. By spaced apart and connecting the multiple spray elements 1 to the second connecting pipe 43, it is not necessary to set up an additional mounting structure for the spray elements 1, which helps to improve the compactness of the structure.

[0083] like Figure 1 As shown, in this example, a liquid level gauge 44 is also installed on the liquid storage tank 4 to monitor the liquid level in the liquid storage tank 4 in real time, so that liquid can be replenished in time when the liquid in the liquid storage tank 4 is insufficient.

[0084] like Figure 2 As shown, in one example, the spray element 1 includes a first outlet pipe 11 and an outlet plate 12, with the first outlet pipe 11 connected to a second connecting pipe 43. A second valve body 14 is connected to the first outlet pipe 11 and is used to regulate the flow rate. The end of the first outlet pipe 11 away from the first connecting pipe 7 is connected to the outlet plate 12, and a plurality of nozzles 13 are spaced apart on the outlet plate 12. Liquid can be sprayed from the plurality of nozzles 13 respectively.

[0085] like Figure 1 As shown, in one example, there are multiple spray elements 1, and the multiple spray elements 1 are spaced apart along the width direction of the conveying assembly 3.

[0086] In this example, the conveying direction of the conveying component 3 is the length direction, and the width direction is perpendicular to the length direction. By setting multiple spray elements 1, it is beneficial to fully cover the front side of the substrate 20 with the protective film 30. For example, two, three, four, five, or six spray elements 1 can be set, etc., which can be determined by those skilled in the art according to the actual situation, and no specific limitation is made here.

[0087] like Figure 1 and Figure 2 As shown, in this example, each spray element 1 is provided with a second valve body 14, which can adjust the spray volume of each spray element 1. Furthermore, the number of spray elements 1 can be opened according to the width of the substrate 20. The second valve body 14 can be a manual valve or similar type of valve; those skilled in the art can determine its type based on the actual situation, and no specific limitation is made here.

[0088] According to another embodiment of this application, an etching and cleaning apparatus is provided, which includes the substrate processing apparatus of the above embodiment. The substrate processing apparatus includes a spray element 1; a conveying assembly 3 located below the spray element 1, the conveying assembly 3 capable of conveying a substrate 20 through the spray element 1, the spray element 1 being adapted to spray liquid onto the substrate 20; and a return assembly including a liquid receiving tank 5 and a return pipe 6, the liquid receiving tank 5 located below the spray element 1, one end of the return pipe 6 connected to the liquid receiving tank 5, and the other end connected to the spray element 1. The conveying assembly 3 can convey the substrate 20 to the spray element 1, the spray element 1 can spray liquid onto the surface of the substrate 20 to form a protective film 30 on the surface of the substrate 20, and excess liquid flows to the liquid receiving tank 5 and then returns to the spray element 1 through the return pipe 6, thereby achieving liquid recycling and reuse, saving resources and reducing costs.

[0089] like Figure 3 As shown, in this example, the etching and cleaning apparatus also includes an acid tank 70, which can be housed within the frame 60. The acid tank 70 is separated from the receiving tank 5 by a partition. After the front side of the substrate 20 is covered with a protective film 30, it is transported to the acid tank 70, where the BSG layer on the substrate 20 is etched using a high-concentration HF solution.

[0090] In this example, the etching and cleaning apparatus can be used to etch and clean the BSG layer on the substrate 20, or it can also be used to etch and clean the PSG layer on the substrate 20. Those skilled in the art can choose according to the actual situation, and no specific limitation is made here.

[0091] Comparative Example 1: In Comparative Example 1, the substrate processing apparatus did not include a scraping device or a reflux assembly. The substrate processing apparatus was equipped with a control module. When the silicon wafer was conveyed to the control module via the conveying assembly, the sensor in the control module detected the wafer and then activated the spray system to cover the wafer surface with pure water, forming a water film. The wafer continued to be conveyed into the acid bath. The conveying speed of the conveying assembly was 4.0 m / min, the replenishment rate of HF solution was 1 L / 1000 wafers, and the water film volume was 33 mL. The mass of the silicon wafer and the water film were measured together; the total mass minus the silicon wafer mass equals the water film mass, and the water film volume was calculated based on this mass.

[0092] Example 1: In Example 1, the substrate processing device is equipped with a scraping component and a return assembly. When the silicon wafer is conveyed to the control module via the conveying assembly, the sensor in the control module detects the silicon wafer and then opens the spraying component to cover the surface of the silicon wafer with pure water, forming a water film. The thickness of the water film on the silicon wafer is 2.5mm-3mm. The distance between the scraping component and the conveying assembly below is 2mm-2.5mm, and the water film thickness is greater than the distance. After passing through the scraping component, the water film coverage on the surface of the silicon wafer is uniform, and the amount of water film is reduced. The water sprayed outside the silicon wafer flows into the receiving tank and is pumped back into the storage tank by the pump body. After passing through the scraping component, the silicon wafer enters the acid tank. The conveying speed of the conveying assembly is 4.0m / min, the replenishment volume of HF solution is 0.9L / 1000 wafers, and the water film volume is 30mL. The mass of the silicon wafer and the water film are tested together. The total mass minus the mass of the silicon wafer is the mass of the water film, and the volume of the water film is calculated based on the mass of the water film.

[0093] Comparing Example 1 and Comparative Example 1, it can be seen that when the excess water film on the silicon wafer surface is not removed by a scraper, the amount of water film on the silicon wafer surface is 33 mL, and the replenishment volume of HF solution is 1 L / 1000 wafers. However, after the excess water film on the silicon wafer surface is removed by a scraper, the amount of water film on the silicon wafer surface is 30 mL, and the replenishment volume of HF solution is 0.9 L / 1000 wafers.

[0094] Therefore, by installing a scraper to remove excess water film, both pure water can be saved and the loss of HF solution can be reduced.

[0095] Example 2 In Example 2, the substrate processing device is equipped with a scraper and a reflux assembly. A manual valve controls the sprayer to continuously and stably spray pure water. After the silicon wafer is conveyed to the sprayer, the sprayer covers the surface of the wafer with pure water, forming a water film with a thickness of 2.5mm-3mm. The distance between the scraper and the conveying assembly below is 2mm-2.5mm, and the water film thickness is greater than the distance. After passing the scraper, the water film on the wafer surface is uniformly covered, the amount of water film decreases, and the water sprayed outside the wafer flows into the receiving tank and is pumped back into the storage tank. After passing the scraper, the wafer enters the acid tank. The conveying speed of the conveying assembly is 4.0m / min, the replenishment volume of HF solution is 0.9L / 1000 wafers, and the water film volume is 30mL. The mass of the silicon wafer and the water film are tested together; the total mass minus the silicon wafer mass equals the water film mass, and the water film volume is calculated based on this mass.

[0096] As can be seen from Example 2 compared to Example 1, the consumption of pure water and HF solution is the same for both the control module detecting the silicon wafer and then controlling the sprayer to spray pure water, and the sprayer continuously and stably spraying pure water.

[0097] Therefore, the water film substrate processing device of this application can allow pure water to flow back by setting a return pipe, so that the spraying component can continuously and stably spray pure water, which will not cause waste of pure water and will not require an additional control module, thus helping to reduce costs.

[0098] Example 3 In Example 3, the substrate processing device is equipped with a scraper and a reflux assembly. A manual valve controls the sprayer to continuously and stably spray pure water. After the silicon wafer is conveyed to the sprayer, the sprayer covers the surface of the wafer with pure water, forming a water film with a thickness of 2.5mm-3mm. The distance between the scraper and the conveying assembly below is 1.5mm-2mm, and the water film thickness is greater than the distance. After passing the scraper, the water film on the wafer surface is uniformly covered, the amount of water film decreases, and the water sprayed outside the wafer flows into the receiving tank and is pumped back into the storage tank. After passing the scraper, the wafer enters the acid tank. The conveying speed of the conveying assembly is 4.0m / min, the replenishment volume of HF solution is 0.8L / 1000 wafers (the amount of HF solution needed to replenish every 1000 wafers etched), and the water film volume is 28.5mL. The mass of the silicon wafer and the water film are tested together; the total mass minus the silicon wafer mass is the water film mass, and the water film volume is calculated based on this mass.

[0099] Comparing Example 3 and Example 2, it can be seen that when the distance between the scraper and the lower conveying assembly is 2mm-2.5mm, the water film volume on the silicon wafer surface is 30mL, and the replenishment volume of HF solution is 0.9L / thousand wafers. When the distance between the scraper and the lower conveying assembly is 1.5mm-2mm, the water film volume on the silicon wafer surface is 28.5mL, and the replenishment volume of HF solution is 0.8L / thousand wafers (the amount of HF solution needed to replenish every thousand wafers etched).

[0100] Therefore, by appropriately reducing the distance between the scraper and the conveying assembly, the amount of pure water required and the loss of HF solution can be further reduced.

[0101] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0102] Although specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A substrate processing apparatus, characterized in that, include: Sprayer (1), the sprayer (1) being adapted to spray liquid onto substrate (20); The conveying assembly (3) is located below the spraying component (1) and is capable of conveying the substrate (20) through the spraying component (1). The return assembly includes a liquid receiving tank (5) and a return pipe (6), wherein the liquid receiving tank (5) is located below the spray element (1), and one end of the return pipe (6) is connected to the liquid receiving tank (5).

2. The substrate processing apparatus according to claim 1, characterized in that, The reflux assembly also includes a filter (8) adapted to filter liquid flowing into the reflux pipe (6).

3. The substrate processing apparatus according to claim 1, characterized in that, The reflux assembly also includes a pump body (61) connected to the reflux pipe (6).

4. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing device also includes an overflow pipe (9), the inlet of which protrudes from the bottom wall of the receiving tank (5).

5. The substrate processing apparatus according to claim 4, characterized in that, The reflux assembly further includes a first connecting pipe (7), which is connected to the liquid receiving tank (5), the overflow pipe (9) and the reflux pipe (6) respectively. A first valve body (10) is provided between the first connecting pipe (7) and the overflow pipe (9).

6. The substrate processing apparatus according to claim 1, characterized in that, The reflux assembly also includes a mesh cover (90), and the liquid receiving tank (5) is provided with a liquid outlet (51) that communicates with the reflux pipe (6), and the mesh cover (90) covers the liquid outlet (51).

7. The substrate processing apparatus according to claim 6, characterized in that, Along the direction of liquid reflux, the inner diameter of the liquid outlet (51) gradually decreases.

8. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing device includes a scraper (2), which is located above the conveying assembly (3) and on one side of the spraying assembly (1) in the horizontal direction. The conveying assembly (3) can convey the substrate (20) first through the spraying assembly (1) and then through the scraper (2).

9. The substrate processing apparatus according to claim 8, characterized in that, The substrate processing device also includes a mounting base, and the scraping component (2) is movably mounted on the mounting base.

10. The substrate processing apparatus according to claim 8, characterized in that, The distance between the scraper (2) and the conveying assembly (3) is 1.5mm-3mm.

11. The substrate processing apparatus according to claim 8, characterized in that, The substrate (20) has a length of L, and the distance between the spraying element (1) and the scraping element (2) is greater than or equal to L.

12. The substrate processing apparatus according to claim 8, characterized in that, The substrate (20) has a length of L, the conveying assembly (3) is adapted to convey the substrate (20) to the processing step, the scraper (2) is located between the sprayer (1) and the processing step, and the distance between the scraper (2) and the processing step is greater than or equal to L.

13. The substrate processing apparatus according to claim 1, characterized in that, The substrate processing device further includes a liquid storage tank (4), which is connected to the spray element (1), and the liquid receiving tank (5) is connected to the liquid storage tank (4) through the return pipe (6).

14. The substrate processing apparatus according to claim 1, characterized in that, The end of the return pipe (6) away from the liquid receiving tank (5) is connected to the spray element (1).

15. An etching and cleaning apparatus, characterized in that, Includes the substrate processing apparatus as described in any one of claims 1 to 14.

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