Batch positioning measurement system for placing wafers into cassettes or jigs

Abstract

A batch positioning measurement system for placing wafers into a wafer box or jig includes a machine table, a controller, a horizontal moving structure, a wafer placing structure, a wafer box, an L-shaped fixing structure, a vertical moving structure, a plurality of contact digital sensors, and a plurality of wafers. The controller controls the horizontal moving structure to drive the plurality of wafers on the wafer placing structure to move in batches, and the contact digital sensors measure the front edge positions of the wafers in real time. The controller drives the horizontal moving distance in cooperation with the contact digital sensors. After the wafers are pushed to the rear for positioning, the controller and the contact digital sensors can immediately obtain the front edge positions of the wafers. After the positioning measurement is completed, the wafer placing structure automatically returns. The number of contact digital sensors can be flexibly configured according to the odd or even number of wafers. Through the controller controlling the horizontal moving structure and the vertical moving structure, and in cooperation with the use of the contact digital sensors, the plurality of wafers can be quickly and accurately positioned and measured in batches, greatly improving the efficiency of wafer box measurement regulation.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically relating to wafer handling and precise positioning measurement technology, especially for a batch positioning measurement system for efficiently and accurately placing multiple wafers into a wafer cassette, covering a multidisciplinary application including mechanical structure design, automatic control, and high-precision contact digital sensors. Background Technology

[0002] In semiconductor manufacturing, wafer handling and positioning are extremely important processes. As semiconductor technology advances to 7 nanometers, 5 nanometers, and even more advanced processes, wafer sizes have increased from 6 inches and 8 inches to 12 inches. The requirements for wafer positioning accuracy have reached the submicron or even nanometer level. At the same time, the competitive trend of high capacity and low cost in the semiconductor industry has also posed higher challenges to wafer positioning efficiency. Utility Model Content

[0003] The main purpose of this invention is to provide a batch positioning and measurement system for efficiently and accurately placing multiple wafers into a wafer box or fixture.

[0004] To achieve the above objectives, this utility model provides a batch positioning and measurement system for placing wafers into wafer cassettes or fixtures. The system includes a machine base, a controller, a horizontal moving structure, a wafer placement structure, multiple wafers, a wafer cassette, an L-shaped fixing structure, a vertical moving structure, and multiple contact digital sensors. The horizontal moving structure is mounted on the machine base and connected to the controller. The wafer placement structure is mounted on the horizontal moving structure and connected to the controller to control the forward movement of the wafer placement structure. Multiple wafers are placed sequentially from top to bottom on the wafer placement structure. The wafer cassette is mounted on the machine base and located at one end of the horizontal moving structure, with a vertical positioning section at its rear. The L-shaped fixing structure is mounted on the horizontal moving structure and located on the opposite side of the wafer cassette. A vertical moving structure, mounted on the L-shaped fixed structure and connected to the controller, controls the vertical movement of the vertical moving structure within the L-shaped fixed structure. Multiple contact digital sensors, mounted on the vertical moving structure and connected to the controller, measure the movement distance of each wafer in real time. Thus, during operation, when the controller commands the wafer placement structure to move forward, the wafer placement structure advances all wafers in batches towards the wafer cassette. During this advancement, the multiple contact digital sensors work in conjunction with the controller, performing real-time measurements until the rear circumference of each wafer reaches the vertical positioning section, completing the positioning measurement process.

[0005] In one embodiment of the present invention, after the plurality of wafers are placed in the wafer cassette and the positioning measurement is completed simultaneously, the wafer placement structure can move backward to return to the initial position after the positioning measurement is completed.

[0006] In one embodiment of this utility model, the positioning measurement is completed by moving each wafer to the rear circumference of each wafer to abut the vertical positioning section.

[0007] In one embodiment of this invention, the number of the plurality of contact digital sensors is equal to the number of the plurality of wafers.

[0008] In one embodiment of this invention, if the number of wafers is even, the number of the plurality of contact digital sensors is half the number of the plurality of wafers.

[0009] In one embodiment of this utility model, if the number of wafers is odd, the number of the plurality of contact digital sensors is half the number of the plurality of wafers plus one.

[0010] In summary, the batch positioning and measurement system for placing wafers into wafer cassettes or fixtures provided by this utility model can bring the following benefits:

[0011] 1. This utility model can control the horizontal and vertical moving structures through the controller. With the use of contact digital sensors, it can quickly and accurately perform batch positioning and measurement of multiple wafers in a wafer box, which greatly improves the efficiency of wafer placement and positioning measurement in the wafer box. Compared with positioning and measuring a single wafer one by one or multiple wafers one by one, it saves a lot of time.

[0012] 2. By employing contact digital sensors for distance measurement and a controller for precise control, the efficiency of wafer placement and positioning measurements within the wafer cassette is greatly improved.

[0013] 3. After completing the positioning measurement, the system can automatically control the wafer placement structure to return to the initial position, which facilitates the operation of the next batch of wafer positioning measurement and further improves the overall work efficiency.

[0014] The following detailed description through specific embodiments will make it easier to understand the purpose, technical content, features and effects achieved by this utility model. Attached Figure Description

[0015] Figure 1 This is an overall schematic diagram of the batch positioning and measurement system of this utility model for placing wafers into wafer boxes or fixtures.

[0016] Figure 2 This is a partial schematic diagram of the batch positioning and measurement system for placing wafers into wafer boxes or fixtures according to this utility model.

[0017] Figure 3 This is a side view of the batch positioning and measurement system of the present invention for placing wafers into wafer boxes or fixtures.

[0018] Figure 4 This is a schematic diagram of the first action of the batch positioning and measurement system of this utility model for placing wafers into wafer boxes or fixtures.

[0019] Figure 5 This is a schematic diagram of the second action of the batch positioning and measurement system of this utility model for placing wafers into wafer boxes or fixtures.

[0020] Figure 6 This is a schematic diagram of the third action of the batch positioning and measurement system of this utility model for placing wafers into wafer boxes or fixtures.

[0021] Figure 7 This is a schematic diagram of the first action of another embodiment of the batch positioning and measurement system for placing wafers into wafer boxes or fixtures according to the present invention.

[0022] Figure 8 This is a schematic diagram of the second action of another embodiment of the batch positioning and measurement system for placing wafers into wafer boxes or fixtures according to the present invention.

[0023] Figure 9 This is a schematic diagram of the third action of another embodiment of the batch positioning and measurement system for placing wafers into wafer boxes or fixtures according to the present invention.

[0024] Explanation of reference numerals in the attached figures: 100 - Batch positioning and measurement system for placing wafers into wafer cassettes or fixtures; 110 - Machine tool; 120 - Controller; 130 - Horizontal moving structure; 140 - Wafer placement structure; 150 - Wafer; 160 - Wafer cassette; 162 - Vertical positioning section; 170 - L-shaped fixing structure; 180 - Vertical moving structure; 190 - Contact digital sensor. Detailed Implementation

[0025] After years of research and development, the inventor of this utility model has improved upon the shortcomings of existing products. The following will detail how this utility model achieves the most efficient functional requirements by using a batch positioning and measurement system for placing wafers into wafer boxes or fixtures.

[0026] This invention aims to design an innovative batch positioning and measurement system 100 for placing wafers into wafer cassettes or fixtures. By integrating automated control, precision mechanical transmission, and contact digital sensors, it effectively solves the problems of low efficiency, poor accuracy, high cost, and susceptibility to contamination inherent in existing wafer cassette positioning and measurement technologies. Please refer to... Figures 1 to 6 , Figure 1This is an overall schematic diagram of the batch positioning and measurement system of this utility model for placing wafers into wafer boxes or fixtures. Figure 2 This is a partial schematic diagram of the batch positioning and measurement system for placing wafers into wafer boxes or fixtures according to this utility model. Figure 3 This is a side view of the batch positioning and measurement system of the present invention for placing wafers into wafer boxes or fixtures. Figure 4 This is a schematic diagram of the first action of the batch positioning and measurement system of this utility model for placing wafers into wafer boxes or fixtures. Figure 5 This is a schematic diagram of the second action of the batch positioning and measurement system of this utility model for placing wafers into wafer boxes or fixtures. Figure 6 This is a schematic diagram of the third action of the batch positioning and measurement system for placing wafers into wafer cassettes or fixtures according to this utility model. As shown in the figure, the batch positioning and measurement system 100 for placing wafers into wafer cassettes or fixtures includes a machine base 110, a controller 120, a horizontal moving structure 130, a wafer placement structure 140, multiple wafers 150, a wafer cassette 160, an L-shaped fixing structure 170, a vertical moving structure 180, and multiple contact digital sensors 190. The horizontal moving structure 130 is mounted on the machine base 110 and connected to the controller 120. The wafer placement structure 140 is mounted on the horizontal moving structure 130 and connected to the controller 120. Multiple wafers 150 are placed sequentially from top to bottom on the wafer placement structure 140, wherein the size of the wafers 150 can be 6 inches / 8 inches / 12 inches. A wafer cassette 160 is mounted on the machine base 110 and located at one end of the horizontal moving structure 130. The wafer cassette 160 has a vertical positioning section 162 (or vertical positioning arc surface) at its rear. The wafer cassette 160 can also be replaced by a fixture. An L-shaped fixing structure 170 is mounted on the horizontal moving structure 130 and located on the opposite side of the wafer cassette 160. A vertical moving structure 180 is mounted on the L-shaped fixing structure 170 and connected to the controller 120. The vertical moving structure 180 can move up and down on the L-shaped fixing structure 170 according to the instructions of the controller 120, but is not limited to this. A plurality of contact digital sensors 190 are mounted on the vertical moving structure 180 and connected to the controller 120.

[0027] The aforementioned wafer 160 product can also be a panel (310*310mm or 510*515mm or other sizes), and the dimensions of the wafer box 160 or fixture will correspond to the product dimensions of the wafer or panel.

[0028] As the supporting foundation of the entire system, high-strength stainless steel is used in one embodiment. Four sets of pneumatic vibration damping feet can be installed at the bottom of the machine base 110 to effectively isolate external vibration interference, thereby ensuring the stability of the system during operation. Simultaneously, the machine base 110 has pre-reserved wiring channels for electrical wires and air pipes, facilitating the wiring connection and maintenance of various system components. The core control module can be an industrial-grade PLC controller, or customized control software based on a computer (PC) to provide powerful data processing and logic operation capabilities, but is not limited thereto. In one embodiment, the controller 120 communicates in real-time with various execution components within the system (such as the horizontal movement structure 130, vertical movement structure 180, etc.) via an EtherCAT industrial bus, with a communication rate of up to 1Gbps, ensuring the real-time performance and accuracy of command transmission, or via RS-232 or Gig-E for real-time communication. Furthermore, the controller 120 can also incorporate a self-developed wafer positioning and measurement algorithm or any existing positioning and measurement algorithm, which can quickly generate the optimal positioning and measurement strategy based on the number and size of wafers and preset standard values, but is not limited thereto. Positioned above the machine tool 110, the transmission system employs a combination of high-precision linear guides, servo motors, and optical scales. This ensures high precision and stability during the horizontal movement of the wafer placement structure 140. In one embodiment, the servo motor is equipped with a 23-bit absolute controller and an optical scale, achieving a positional repeatability of ±0.5μm, enabling precise control of the movement distance and speed. In one embodiment, the maximum movement speed of the horizontal moving structure 130 can reach 500mm / s, with an acceleration of 2m / s². 2 The system can quickly move wafers from their initial position to the wafer cassette 160. Multiple contact digital sensors 190 are mounted on the vertical moving structure 180 and connected to the controller 120 via a high-speed parallel bus. The contact digital sensors 190 can measure the moving distance of each wafer 150 in real time with precision. When the system is running, the controller 120 first generates an alignment control program based on pre-set wafer quantity, size, and positioning standard values. Then, the controller 120 issues control commands to control the horizontal moving structure 130 to move the wafer placement structure 140 forward, causing multiple wafers 150 on the wafer placement structure 140 to advance towards the wafer cassette 160 in batches. During the movement, the contact digital sensors 190 on the vertical moving structure 180 work synchronously, with each sensor continuously contacting and measuring the circumferential cross-section of the corresponding wafer 150 and transmitting the measured distance data to the controller 120 in real time. The controller 120 can calculate the positioning distance deviation of each wafer 150 in real time based on the received data and the predetermined positioning allowable error, using built-in algorithms, until all wafers 150 have completed the positioning measurement.

[0029] In simple terms, when the controller 120 controls the wafer placement structure 140 to move forward, the wafer placement structure 140 moves all of the multiple wafers 150 in batches towards the wafer cassette 160. During the movement, the multiple contact digital sensors 190 work in coordination with the controller 120 to measure and calculate the moving distance of each wafer 150 in real time until the rear circumference of each wafer 150 reaches the vertical positioning section, thus completing the positioning measurement process in one go. In other words, the operation of this invention does not require repeated wafer placement and re-measurement.

[0030] Furthermore, after completing the positioning measurement and placing the plurality of wafers 150 into the wafer cassette 160, the controller 120 controls the wafer placement structure 140 to move backward to return to its initial position. It should be noted that the positioning measurement is completed by moving each wafer 150 until its rear circumference is against the vertical positioning section. Figures 4 to 6 In this embodiment, the number of the plurality of contact digital sensors 190 is equal to the number of the plurality of wafers 150, so the operation of moving and positioning all wafers 150 can be completed in one batch.

[0031] Next, please refer to Figures 7 to 9 , Figure 7 This is a schematic diagram of the first action of another embodiment of the batch positioning and measurement system for placing wafers into wafer boxes or fixtures according to the present invention. Figure 8 This is a schematic diagram of the second action of another embodiment of the batch positioning and measurement system for placing wafers into wafer boxes or fixtures according to the present invention. Figure 9 This is a schematic diagram of the third operation of another embodiment of the batch positioning and measurement system for placing wafers into a wafer cassette or fixture according to this utility model. In this other embodiment, if the number of wafers 150 is even, the number of the plurality of contact digital sensors 190 is half the number of wafers 150. If the number of wafers 150 is odd, the number of the plurality of contact digital sensors 190 is half the number of wafers 150 plus one. Therefore, the process of completing the movement and positioning measurement of all wafers 150 is required twice.

[0032] Suppose that in a semiconductor manufacturing plant, a batch of wafers needs to be placed into a wafer cassette. First, multiple wafers 150 are placed in an orderly manner from top to bottom on the wafer placement structure 140. At this time, the controller 120 controls the horizontal moving structure 130 to start working according to a preset instruction. The horizontal moving structure 130 drives the wafer placement structure 140 and the wafers 150 on it to move towards one end of the wafer cassette 160.

[0033] As wafer 150 moves forward, contact digital sensors 190 on the vertical movement structure 180 begin to operate. Each contact digital sensor 190 performs contact measurements, correspondingly measuring the movement distance of each wafer 150. The contact digital sensors 190 transmit the measured distance data to the controller 120. Based on this data and a preset positioning standard value, the controller 120 determines the deviation between the actual positioning distance of each wafer 150 and the positioning standard value.

[0034] Once all wafers 150 have been placed in the wafer cassette 160 and the positioning measurement has been completed simultaneously, the controller 120 can issue a command to control the horizontal moving structure 130 to reverse its rotation, causing the wafer placement structure 140 to move backward and return to its initial position, waiting for the next batch positioning measurement operation of the wafer cassette or fixture.

[0035] In practical applications, if the number of wafers 150 is even, for example, 10 wafers, then the number of contact digital sensors 190 is set to 5. These 5 contact digital sensors 190 can be evenly distributed on the vertical moving structure 180, corresponding to measuring the positioning distance of the 1st, 3rd, 5th, 7th, and 9th wafers, respectively. As the vertical moving structure 180 moves, it then measures the 2nd, 4th, 6th, 8th, and 10th wafers.

[0036] If the number of wafers 150 is odd, for example, 9 wafers, then the number of contact digital sensors 190 is set to (9 + 1) ÷ 2 = 5. Similarly, these 5 contact digital sensors 190 are reasonably distributed on the vertical moving structure 180 to measure the distance of some wafers. As the vertical moving structure 180 moves, it measures the 2nd, 4th, 6th, and 8th wafers respectively.

[0037] In summary, the batch positioning and measurement system for placing wafers into wafer cassettes or fixtures provided by this utility model can bring the following benefits:

[0038] 1. This utility model can control the horizontal and vertical moving structures through the controller. With the use of contact digital sensors, it can quickly and accurately perform batch positioning and measurement of multiple wafers, which greatly improves the efficiency of wafer placement and positioning measurement in wafer boxes. Compared with positioning and measuring a single wafer one by one or multiple wafers one by one, it saves a lot of time.

[0039] 2. By using contact digital sensors for distance measurement and controllers for precise control, the accuracy of wafer positioning measurement is greatly improved, reducing the risk of wafer damage or manufacturing defects caused by inaccurate positioning measurement.

[0040] 3. After completing batch positioning measurements, the system can automatically control the wafer placement structure to return to its initial position, facilitating the batch positioning measurement operation of the next wafer box or fixture, and further improving the overall work efficiency.

[0041] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model. Therefore, all equivalent variations or modifications made in accordance with the features and spirit described in the claims of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A batch positioning and measurement system for placing wafers into wafer cassettes or fixtures, characterized in that, include: One machine; One controller; A horizontally moving structure is mounted on the machine base and connected to the controller; A wafer placement structure is disposed on the horizontal moving structure and connected to the controller for controlling the wafer placement structure to move forward; Multiple wafers are arranged in an orderly manner from top to bottom on the wafer placement structure; A wafer cassette is disposed on the machine base and is located at one end of the horizontally moving structure, wherein the wafer cassette has a vertical positioning section at its rear. An L-shaped fixing structure is disposed on the horizontally moving structure and located on the opposite side of the wafer cassette; A vertical moving structure is disposed on the L-shaped fixed structure and connected to the controller for controlling the vertical moving structure to move up and down on the L-shaped fixed structure. as well as Multiple contact digital sensors, mounted on the vertical moving structure and connected to the controller, are used to measure the moving distance of each wafer in real time.

2. The batch positioning and measurement system for placing wafers into wafer cassettes or fixtures as described in claim 1, characterized in that, The positioning measurement is completed by moving each wafer to the rear circumference of each wafer to the vertical positioning section.

3. The batch positioning and measurement system for placing wafers into wafer cassettes or fixtures as described in claim 2, characterized in that, The wafer placement structure can move backward to return to its initial position after the positioning measurement is completed.

4. The batch positioning and measurement system for placing wafers into wafer cassettes or fixtures as described in claim 1, characterized in that, The number of these multiple contact digital sensors is equal to the number of these multiple wafers.

5. The batch positioning and measurement system for placing wafers into wafer cassettes or fixtures as described in claim 1, characterized in that, The number of wafers is even, and the number of multiple contact digital sensors is half the number of wafers.

6. The batch positioning and measurement system for placing wafers into a wafer cassette or fixture as described in claim 1, characterized in that, The number of wafers is odd, and the number of multiple contact digital sensors is half the number of wafers plus one.

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