Silicon wafer transfer device

Abstract

The application relates to a silicon wafer conveying device. The silicon wafer conveying device comprises a conveying mechanism, a carrier and a correcting mechanism. The carrier is connected with the conveying mechanism and can move synchronously with the conveying mechanism, the carrier is used for carrying a silicon wafer, and a clamping mechanism for clamping and fixing or releasing the silicon wafer is arranged on the carrier; the correcting mechanism is arranged on a moving path of the carrier, and the correcting mechanism is used for correcting the silicon wafer in the carrier when the carrier moves to the correcting mechanism. The above silicon wafer conveying device can ensure that the silicon wafer is not damaged in the conveying process and ensure the positioning accuracy of the silicon wafer.

Description

Technical Field

[0001] This application relates to the field of solar cell production equipment technology, and in particular to a silicon wafer conveying device. Background Technology

[0002] In solar cell production, silicon wafers are typically transported using belt conveyors. However, when the belt speed is too high, the wafers can easily slip, leading to inaccurate wafer positioning. To prevent slippage between the wafers and the belt, the surface friction coefficient of the belt needs to be increased. This results in a rougher belt surface, making the wafers more prone to scratches. Furthermore, small foreign objects are more likely to adhere to the belt, further increasing the likelihood of scratches and even fragmentation of the wafers. In addition, belt conveyors are prone to causing wafer blockages and stacking issues, generating a large number of defective products and disrupting normal machine operations. Utility Model Content

[0003] Therefore, it is necessary to provide a silicon wafer conveying device to solve the problems of silicon wafer damage, inaccurate positioning, wafer blockage, and wafer stacking caused by traditional belt conveying of silicon wafers.

[0004] This application provides a silicon wafer conveying device, comprising:

[0005] Transmission mechanism;

[0006] A material carrier is connected to the transmission mechanism and can move synchronously with the transmission mechanism. The material carrier is used to carry silicon wafers and is provided with a clamping mechanism for clamping, fixing or releasing the silicon wafers.

[0007] A correction mechanism is arranged on the moving path of the material carrier, and the correction mechanism is used to correct the silicon wafer in the material carrier when the material carrier moves to a predetermined position.

[0008] The technical solution will be further explained below:

[0009] In one embodiment, the clamping mechanism includes:

[0010] Two positioning blocks are disposed opposite each other on the material carrier along a first direction, and an accommodating space for accommodating the silicon wafer is formed between the two positioning blocks; each positioning block is provided with an elastic airbag on the side facing the accommodating space.

[0011] An air passage assembly is connected to the elastic airbag. The air passage assembly is used to pressurize the elastic airbag, causing the elastic airbag to expand and clamp the silicon wafer. The air passage assembly is also used to depressurize the elastic airbag, causing the elastic airbag to contract and release the silicon wafer.

[0012] In one embodiment, the air circuit assembly includes an air source, an air inlet pipe, an air outlet pipe, and an air cylinder. The air cylinder is disposed on the material carrier. The air cylinder is connected to the air source through the air inlet pipe and to the elastic airbag through the air outlet pipe. A valve is provided on the air inlet pipe and / or the air outlet pipe.

[0013] In one embodiment, the two positioning blocks are movably disposed along the first direction, and the positioning blocks have an initial position for placing the silicon wafer into the accommodating space, and a correction position for abutting against the silicon wafer to correct the silicon wafer in the first direction;

[0014] The clamping mechanism further includes two elastic elements, which are connected to two positioning blocks in a one-to-one correspondence; the elastic elements are used to drive the positioning blocks into or maintain them in the initial position;

[0015] The correction mechanism can drive the two positioning blocks closer together so that the positioning blocks enter the correction position.

[0016] In one embodiment, the clamping mechanism further includes two piston pushers, which are retractably connected to both ends of the air cylinder, and the piston pushers can extend and retract along the first direction under the drive of the air pressure inside the air cylinder. The two piston pushers are also connected to two positioning blocks in a corresponding manner.

[0017] The elastic element is sleeved on the piston pusher, with one end of the elastic element abutting against the positioning block and the other end of the elastic element abutting against the air cylinder.

[0018] In one embodiment, the alignment mechanism includes two first push blocks arranged opposite each other along the first direction. When the loading component moves between the two first push blocks, the two first push blocks can approach each other along the first direction and abut against the two positioning blocks one by one, thereby driving the two positioning blocks into the alignment position.

[0019] In one embodiment, the material carrier is further provided with a stop on one side along the second direction, the stop being used to limit the silicon wafer in the second direction, wherein the second direction intersects with the first direction.

[0020] In one embodiment, the alignment mechanism further includes a second pusher block, which is vertically movable and has an inclined surface. When the material carrier moves between the two first pushers, the second pusher block can be raised until the inclined surface abuts against one end of the silicon wafer in the second direction, and drive the other end of the silicon wafer in the second direction to abut against the stop block, so as to align the silicon wafer in the second direction.

[0021] In one embodiment, the transmission mechanism includes an annular conveyor belt;

[0022] The number of the material carriers is multiple, and the multiple material carriers are arranged sequentially along the annular conveyor belt. Each material carrier is provided with the positioning block and the air cylinder.

[0023] In one embodiment, the air path assembly further includes an air path adapter, which is rotatably disposed at the rotation center of the annular conveyor belt. The rotation center of the air path adapter is provided with a rotating shaft communicating with the air source. The air path adapter is provided with a plurality of air outlets spaced apart along the circumferential direction. Each air outlet is connected to an air cylinder on the material carrier through an air pipe.

[0024] In the aforementioned silicon wafer conveying device, silicon wafers are carried by a carrier component, and the carrier component moves synchronously with the conveying mechanism to achieve wafer conveying. Furthermore, by providing a clamping mechanism on the carrier component to hold and fix the silicon wafers, the silicon wafers remain relatively stationary with respect to the carrier component during conveying. This prevents slippage of the silicon wafers relative to the carrier component even at high speeds, thus avoiding scratches caused by slippage. Simultaneously, the carrier mechanism avoids wafer blockages and stacking issues caused by belt conveyors. In addition, by incorporating a alignment mechanism along the carrier component's movement path, the alignment mechanism can correct the silicon wafers when they reach a predetermined position, ensuring that the wafers are accurately picked up by external wafer-retrieving mechanisms such as suction cups at the designated location. This prevents wafer-retrieving failures or even wafer damage due to misalignment during the wafer-retrieving process. Attached Figure Description

[0025] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the various components are shown as examples only and not necessarily to scale. In the accompanying drawings:

[0028] Figure 1 This is a schematic diagram of the structure of a silicon wafer conveying device according to one embodiment.

[0029] Figure 2 This is a top view of the loading component of a silicon wafer conveying device according to an embodiment.

[0030] Figure 3 This is a top view of the loading component and the alignment mechanism of a silicon wafer conveying device according to an embodiment.

[0031] Figure 4 This is a side view of the loading component and the alignment mechanism of a silicon wafer conveying device according to an embodiment.

[0032] Figure 5 This is a schematic diagram of the structure of the air circuit adapter of a silicon wafer conveying device according to an embodiment.

[0033] Explanation of reference numerals in the attached figures:

[0034] 10. Conveying mechanism; 30. Loading component; 31. Positioning block; 311. Accommodating space; 32. Elastic airbag; 33. Air circuit assembly; 331. Air cylinder; 332. Air outlet pipe; 333. Air inlet pipe; 334. Elastic component; 335. Piston pusher; 34. Air circuit adapter; 341. Rotating shaft; 35. Stop block; 36. Valve; 50. Correction mechanism; 51. First push block; 52. Second push block; 521. Inclined surface; 60. Silicon wafer. Detailed Implementation

[0035] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0036] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0037] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0038] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0040] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0041] See Figure 1 as well as Figure 2 One embodiment of the silicon wafer conveying device includes a conveying mechanism 10, a material carrier 30, and a straightening mechanism 50. Wherein:

[0042] The material carrier 30 is connected to the transmission mechanism 10 and can move synchronously with the transmission mechanism 10. The material carrier 30 is used to carry the silicon wafer 60. The material carrier 30 is provided with a clamping mechanism for clamping and fixing or releasing the silicon wafer 60 to prevent the silicon wafer 60 from falling off during the movement.

[0043] The alignment mechanism 50 is arranged on the moving path of the material carrier 30. The alignment mechanism 50 is used to align the silicon wafer 60 in the material carrier 30 when the material carrier 30 moves to a predetermined position, so that the silicon wafer 60 can be accurately picked up by the wafer picking mechanism at the predetermined position.

[0044] In the aforementioned silicon wafer conveying device, the silicon wafer 60 is carried by the material carrier 30, and the silicon wafer 60 can be conveyed by making the material carrier 30 move synchronously with the conveying mechanism 10. Furthermore, by providing a clamping mechanism on the carrier 30 to hold and fix the silicon wafer 60, the silicon wafer 60 is ensured to remain relatively stationary with the carrier 30 during the conveying process. This prevents slippage of the silicon wafer 60 relative to the carrier 30 even at high speeds, thus avoiding scratches caused by slippage. Simultaneously, transporting the silicon wafer 60 via the carrier mechanism also avoids abnormalities such as wafer blockage and stacking caused by belt conveyors. In addition, by providing a correction mechanism 50 along the movement path of the carrier 30, the correction mechanism 50 can correct the silicon wafer 60 when it is conveyed to the predetermined position, ensuring that the silicon wafer 60 can be accurately picked up by external wafer-picking mechanisms such as suction cups at the predetermined position. This avoids wafer-picking failures or even damage to the silicon wafer 60 due to misalignment during the wafer-picking process.

[0045] See Figure 2 In one embodiment, the clamping mechanism includes two positioning blocks 31 and an air passage assembly 33, wherein:

[0046] Two positioning blocks 31 are disposed opposite each other on the material carrier 30 along a first direction. For example, the first direction can be a direction perpendicular to the movement of the material carrier 30. An accommodating space 311 for accommodating the silicon wafer 60 is formed between the two positioning blocks 31. Each positioning block 31 is provided with an elastic airbag 32 on the side facing the accommodating space 311.

[0047] The gas path assembly 33 is connected to the elastic air bag 32. The gas path assembly 33 is used to pressurize the elastic air bag 32, for example, by filling the elastic air bag 32 with air or liquid, so that the elastic air bag 32 expands to clamp and fix the silicon wafer 60. The gas path assembly 33 can also be used to depressurize the elastic air bag 32, for example, by discharging the gas or liquid in the elastic air bag 32, so that the elastic air bag 32 contracts to release the silicon wafer 60.

[0048] Specifically, after the silicon wafer 60 is placed into the accommodating space 311 between the two positioning blocks 31, the elastic airbag 32 is pressurized through the air passage assembly 33, causing the elastic airbag 32 to expand. This allows the elastic airbags 32 on the two positioning blocks 31 to clamp the silicon wafer 60 from opposite sides in the first direction, preventing the silicon wafer 60 from falling or slipping during the movement of the carrier 30. When the carrier 30 moves to the predetermined position, the pressure in the elastic airbag 32 is released through the air passage assembly 33, causing the elastic airbag 32 to contract and release the silicon wafer 60. This allows the alignment mechanism 50 to align the silicon wafer 60 and facilitates the removal mechanism from the carrier 30. Furthermore, because the elastic airbag 32 and the silicon wafer 60 are in flexible contact, damage to the silicon wafer 60 can be avoided during clamping.

[0049] For example, each positioning block 31 is provided with multiple elastic airbags 32, such as two, three, four or more. The elastic airbags 32 located on the same positioning block 31 can be independent or connected, which is not limited here. When clamping and fixing the silicon wafer 60, the simultaneous contact of multiple elastic airbags 32 with the silicon wafer 60 can ensure the force balance of the silicon wafer 60 and further avoid damage to the silicon wafer 60.

[0050] See Figure 2 The air circuit assembly 33 includes an air source (not shown), an inlet pipe 333, an outlet pipe 332, and an air cylinder 331. The air source can be a gas tank storing high-pressure gas or a gas generating device. The air cylinder 331 is disposed on the material carrier 30. The air cylinder 331 is connected to the air source through the inlet pipe 333 and to the elastic airbag 32 through the outlet pipe 332. For example, the air cylinder 331 is connected to multiple outlet pipes 332, and each outlet pipe 332 is connected to a corresponding elastic airbag 32.

[0051] See Figure 5 Furthermore, the air intake pipe 333 is equipped with a valve 36, so that by opening the valve 36, air can be supplied to the elastic airbag 32 through the air source. Closing the valve 36 will stop the air source from supplying air to the elastic airbag 32, thereby depressurizing the elastic airbag 32. Optionally, the valve 36 can be a solenoid valve, so that the valve 36 can be automatically controlled to open or close using an electrical signal.

[0052] Understandably, in another embodiment, a valve 36 may also be provided on the air outlet pipe 332. In this way, the elastic airbag 32 can be inflated or depressurized by opening or closing the valve 36, and there is no limitation on this.

[0053] See Figure 2In one embodiment, for example, two positioning blocks 31 are movably disposed along a first direction. Each positioning block 31 has an initial position for inserting a silicon wafer 60 into a receiving space 311, and a correction position for abutting against the silicon wafer 60 to correct its orientation in the first direction. Specifically, in the initial position, the two positioning blocks 31 are spaced apart to allow the silicon wafer 60 to be smoothly inserted into the receiving space 311. In the correction position, the two positioning blocks 31 are close together to limit the silicon wafer 60 in the first direction, thereby achieving correction of the silicon wafer 60 in the first direction.

[0054] See also Figure 2 Specifically, the clamping mechanism also includes two elastic elements 334, which are connected to two positioning blocks 31 in a one-to-one correspondence; the elastic elements 334 are used to drive the positioning blocks 31 into or maintain them in the initial position. Specifically, during the process of the loading component 30 receiving the silicon wafer 60 and during the transportation of the silicon wafer 60, the positioning blocks 31 are always in the initial position, and the silicon wafer 60 is fixed by the inflated elastic air bladder 32.

[0055] Furthermore, the alignment mechanism 50 can drive the two positioning blocks 31 closer together, so that the positioning blocks 31 enter the alignment position. Specifically, when the loading component 30 conveys the silicon wafer 60 to the alignment mechanism 50, the pneumatic assembly 33 depressurizes the elastic airbag 32, and at the same time, the alignment mechanism 50 drives the two positioning blocks 31 closer together, so that the positioning blocks 31 resist the elastic force of the elastic element 334 and enter the alignment position, thereby causing the positioning blocks 31 to abut against both sides of the silicon wafer 60 in the first direction, thereby achieving alignment of the silicon wafer 60 in the first direction. After alignment is completed, the alignment mechanism 50 releases the two positioning blocks 31, and the two positioning blocks 31 can then return to their initial positions under the elastic force of the elastic element 334.

[0056] See also Figure 2 In some embodiments, the clamping mechanism further includes two piston pushers 335, which are telescopically connected to both ends of the air cylinder 331, and the piston pushers 335 can extend and retract in a first direction under the drive of the air pressure inside the air cylinder 331. The two piston pushers 335 are also connected to two positioning blocks 31 in a corresponding manner. An elastic member 334 is sleeved on the piston pushers 335, one end of the elastic member 334 abuts against the positioning block 31, and the other end of the elastic member 334 abuts against the air cylinder 331.

[0057] Specifically, during the process of the carrier 30 conveying the silicon wafer 60, the air source inflates the air cylinder 331, causing the piston pusher 335 to extend and lock the positioning block 31 in its initial position. This prevents the positioning block 31 from colliding with the silicon wafer 60 during the movement of the carrier 30, thus protecting the silicon wafer 60 from damage. Furthermore, when the carrier 30 moves to the alignment mechanism 50, the air cylinder 331 is depressurized, causing the piston pusher 335 to retract and release the lock on the positioning block 31. At this time, the positioning block 31 can then enter the alignment position under the drive of the alignment mechanism 50.

[0058] See Figure 3 as well as Figure 4 For example, in some embodiments, the alignment mechanism 50 includes two first push blocks 51, which are arranged opposite each other along a first direction. When the loading member 30 moves between the two first push blocks 51, the two first push blocks 51 can approach each other along the first direction and abut against the two positioning blocks 31 one by one, so as to drive the two positioning blocks 31 into the alignment position. Specifically, the two first push blocks 51 can be driven by a driving member such as an electric push rod or a cylinder, which is not limited here.

[0059] See also Figure 3 as well as Figure 4 In some embodiments, the carrier 30 is further provided with a stop 35 on one side along the second direction. The stop 35 is used to limit the silicon wafer 60 in the second direction, wherein the second direction intersects with the first direction. Exemplarily, the second direction can be the moving direction of the carrier 30. By providing a stop 35 on one side of the carrier 30 along the second direction, the silicon wafer 60 can be prevented from slipping out of the carrier 30 during transport.

[0060] See Figure 4 In one embodiment, the alignment mechanism 50 further includes a second pusher 52, which is vertically oriented and has an inclined surface 521. When the loading member 30 moves between the two first pushers 51, the second pusher 52 can be raised until the inclined surface 521 abuts against one end of the silicon wafer 60 in the second direction, and drives the other end of the silicon wafer 60 in the second direction to abut against the stop block 35, thereby achieving alignment of the silicon wafer 60 in the second direction. Exemplarily, the second pusher 52 can also be driven to rise and fall by a driving member such as an electric push rod or a cylinder, which is not limited here.

[0061] See Figure 1 In some embodiments, the conveying mechanism 10 includes an annular conveyor belt. Thus, the material carrier 30 is circulated and reused through the cyclical movement of the annular conveyor belt.

[0062] Furthermore, there are multiple material carriers 30, which are arranged sequentially along the circular conveyor belt. Each material carrier 30 is equipped with a positioning block 31 and an air cylinder 331. This enables continuous conveying of the silicon wafer 60, further improving conveying efficiency.

[0063] Combination Figure 1 as well as Figure 5 In one embodiment, for example, the gas path assembly 33 further includes a gas path adapter 34, which is rotatably disposed at the rotation center of the annular conveyor belt. The rotation center of the gas path adapter 34 is provided with a rotating shaft 341 communicating with a gas source. The gas path adapter 34 is provided with multiple air outlets spaced apart along the circumferential direction. Each of the multiple air outlets is connected to an air cylinder 331 on each material carrier 30 through an air inlet pipe 333. In this way, the air cylinders 331 on all material carriers 30 can be pressurized or depressurized simultaneously through a single gas source. Furthermore, since the rotating shaft 341 of the gas path adapter 34 rotates synchronously with the annular conveyor belt, the air inlet pipe 333 can be prevented from becoming entangled or pulled, ensuring the stable operation of the silicon wafer conveying device.

[0064] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A silicon wafer conveying device, characterized in that, include: Transmission mechanism (10); The material carrier (30) is connected to the transmission mechanism (10) and can move synchronously with the transmission mechanism (10). The material carrier (30) is used to carry the silicon wafer (60). The material carrier (30) is provided with a clamping mechanism for clamping, fixing or releasing the silicon wafer (60). A correction mechanism (50) is arranged on the moving path of the carrier (30) and is used to correct the silicon wafer (60) in the carrier (30) when the carrier (30) moves to a predetermined position.

2. The silicon wafer conveying device according to claim 1, characterized in that, The clamping mechanism includes: Two positioning blocks (31) are disposed opposite each other on the material carrier (30) along a first direction, and a receiving space (311) for accommodating the silicon wafer (60) is formed between the two positioning blocks (31); each positioning block (31) is provided with an elastic airbag (32) on the side facing the receiving space (311). An air passage assembly (33) is connected to the elastic airbag (32). The air passage assembly (33) is used to pressurize the elastic airbag (32) so that the elastic airbag (32) expands to clamp and fix the silicon wafer (60). The air passage assembly (33) is also used to depressurize the elastic airbag (32) so that the elastic airbag (32) contracts to release the silicon wafer (60).

3. The silicon wafer conveying device according to claim 2, characterized in that, The air circuit assembly (33) includes an air source, an air inlet pipe (333), an air outlet pipe (332), and an air cylinder (331). The air cylinder (331) is disposed on the material carrier (30). The air cylinder (331) is connected to the air source through the air inlet pipe (333) and to the elastic airbag (32) through the air outlet pipe (332). A valve (36) is provided on the air inlet pipe (333) and / or the air outlet pipe (332).

4. The silicon wafer conveying device according to claim 3, characterized in that, The two positioning blocks (31) are movably disposed along the first direction. The positioning blocks (31) have an initial position for placing the silicon wafer (60) into the accommodating space (311) and a correction position for abutting against the silicon wafer (60) to correct the silicon wafer (60) in the first direction. The clamping mechanism further includes two elastic elements (334), which are connected to two positioning blocks (31) in a one-to-one correspondence; the elastic elements (334) are used to drive the positioning blocks (31) into or maintain them in the initial position; The correction mechanism (50) can drive the two positioning blocks (31) to move closer to each other so that the positioning blocks (31) enter the correction position.

5. The silicon wafer conveying device according to claim 4, characterized in that, The clamping mechanism also includes two piston pushers (335), which are telescopically connected to both ends of the air cylinder (331), and the piston pushers (335) can extend and retract along the first direction under the drive of the air pressure in the air cylinder (331). The two piston pushers (335) are also connected to two positioning blocks (31) in a corresponding manner. The elastic element (334) is sleeved on the piston pusher (335), one end of the elastic element (334) abuts against the positioning block (31), and the other end of the elastic element (334) abuts against the air cylinder (331).

6. The silicon wafer conveying device according to claim 4, characterized in that, The correction mechanism (50) includes two first push blocks (51), which are arranged opposite each other along the first direction. When the loading component (30) moves between the two first push blocks (51), the two first push blocks (51) can approach each other along the first direction and abut against the two positioning blocks (31) one by one, and drive the two positioning blocks (31) into the correction position.

7. The silicon wafer conveying device according to claim 6, characterized in that, The material carrier (30) is further provided with a stop (35) on one side along the second direction, the stop (35) being used to limit the silicon wafer (60) in the second direction, wherein the second direction is intersecting the first direction.

8. The silicon wafer conveying device according to claim 7, characterized in that, The correction mechanism (50) further includes a second push block (52), which is vertically adjustable. The second push block (52) is provided with an inclined surface (521). When the material carrier (30) moves between the two first push blocks (51), the second push block (52) can be raised until the inclined surface (521) abuts against one end of the silicon wafer (60) in the second direction, and drives the other end of the silicon wafer (60) in the second direction to abut against the stop block (35) to correct the silicon wafer (60) in the second direction.

9. The silicon wafer conveying device according to claim 3, characterized in that: The transmission mechanism (10) includes an annular conveyor belt; The number of the material carriers (30) is multiple, and the multiple material carriers (30) are arranged sequentially along the annular conveyor belt. Each material carrier (30) is provided with the positioning block (31) and the air cylinder (331).

10. The silicon wafer conveying device according to claim 9, characterized in that, The air circuit assembly (33) also includes an air circuit adapter (34), which is rotatably disposed at the rotation center of the annular conveyor belt. The rotation center of the air circuit adapter (34) is provided with a rotating shaft (341) connected to the air source. The air circuit adapter (34) is provided with multiple air outlets at intervals along the circumferential direction. Each air outlet is connected to an air cylinder (331) on the material carrier (30) through an air pipe.

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