Wafer production feeding and discharging device

Abstract

The utility model relates to the technical field of semiconductor manufacturing equipment discloses a kind of feeding and discharging devices for wafer production, the novel device of the present application includes base;Rotary assembly, setting at the top of base, including rotary block, rotates at the top of base;Lifting assembly, setting in rotary block, including lifting block, sliding in rotary block upper end interior;Vacuum assembly, setting at the top of rotary block, including vacuum pump, setting at the top of rotary block;Edge clamping assembly, setting in both sides of rotary block interior, including bidirectional motor, setting in rotary block middle part;Transmission assembly, setting two groups, and located at the both sides of base, and two groups are L-shaped setting, by integrated rotation, lifting, vacuum adsorption and edge clamping multifunctional assembly, device can automatically, smoothly carry wafer between different processes, improve production efficiency and reduce human operation error.In addition, accurate control mechanism ensures the safety and integrity of wafer during handling, reduces the risk of wafer damage.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, specifically to a wafer production loading and unloading device. Background Technology

[0002] With the rapid development of the electronics industry, wafers, as the core material of semiconductor devices, are facing increasingly higher requirements for automation and precision in their production processes. The loading and unloading stages in wafer manufacturing are among the key steps affecting production efficiency and product quality. Traditional wafer handling methods rely heavily on manual operation, which is not only inefficient but also prone to wafer damage due to human error, impacting product yield. Furthermore, with the increase in wafer size and process precision, the requirements for handling equipment are also becoming more stringent, necessitating higher precision positioning and more stable handling mechanisms.

[0003] However, while existing wafer loading and unloading equipment has achieved a degree of automation, it still has some shortcomings. First, many devices lack sufficient precision and stability during handling, which can easily lead to wafer displacement or damage. Second, existing equipment is often single-function, making it difficult to adapt to different sizes and types of wafers, and lacking flexibility. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a wafer manufacturing loading and unloading device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a wafer production loading and unloading device, comprising a base; a rotating assembly disposed on the top of the base, comprising a rotating block rotating on the top of the base; a lifting assembly disposed inside the rotating block, comprising a lifting block sliding up and down inside the upper end of the rotating block; a vacuum assembly disposed on the top of the rotating block, comprising a vacuum pump disposed on the top of the rotating block; an edge clamping assembly disposed on both sides inside the lifting block, comprising a bidirectional motor disposed in the middle of the lifting block; and a transmission assembly comprising two sets, located on both sides of the base, and the two sets being arranged in an L-shape.

[0006] As a further description of the above technical solution: The rotating assembly includes: a DC motor, disposed on one side inside the base; a rotating gear, rotatably disposed inside the base near the DC motor and keyed to the output shaft of the DC motor; a large gear, rotatably disposed in the middle of the base and meshing with the rotating gear, and the bottom of the rotating block is welded to the top shaft.

[0007] As a further description of the above technical solution: The lifting assembly includes: a telescopic cylinder, which is disposed inside the rotating block and whose telescopic end is screwed to the bottom of the lifting block; and a sliding groove, which is formed inside the upper end of the rotating block and in which the lifting block slides up and down.

[0008] As a further description of the above technical solution: The vacuum assembly includes: two sets of solenoid valves, located on the top of the rotating block and on both sides of the vacuum pump, and connected to the suction sides of the vacuum pump via pipes; two sets of vacuum pipes, one end of which is connected to the solenoid valve pipe and the other end extends into both sides of the lifting block, extending to the bottom of both sides of the lifting block; and a vacuum suction cup, located at the bottom of the vacuum pipes near the lifting block.

[0009] As a further description of the above technical solution: The edge clamping assembly includes: two sets of rotating rods rotatably disposed inside the lifting block, with one end connected to the output ends of the bidirectional motor on both sides; two sets of first bevel gears rotatably disposed inside the lifting block on both sides, and keyed to the end of the rotating rods away from the bidirectional motor; two sets of second bevel gears rotatably disposed inside the lifting block on both sides, and meshing with the bottom of the first bevel gears; two sets of rotating shafts rotatably disposed inside the lifting block on both sides, with the upper end keyed to the second bevel gears; two sets of rotating gears rotatably disposed inside the lifting block on both sides, and keyed to the lower end of the rotating shafts; racks disposed on both sides of the rotating gears, meshing with the rotating gears, and sliding horizontally on both sides of the lifting block; and clamping blocks sliding horizontally on both sides of the bottom of the lifting block, with the top bolted to the bottom of one side of the rack.

[0010] As a further description of the above technical solution: The transmission component includes: four sets of support legs located on both sides of an L-shaped base, with rolling cylinders connected between two sets; a drive motor located on one side of the top of one set of support legs, with its output shaft keyed to the rolling cylinders between the support legs; and a conveyor belt sleeved on the outside of the rolling cylinders on both sides, which rolls and transmits the data on the support legs.

[0011] As a further description of the above technical solution: Heat dissipation holes are provided on the side of the base near the DC motor and on the side of the lifting block near the bidirectional motor.

[0012] This utility model has the following beneficial effects: 1. By driving the bevel gear to the rack and pinion linkage mechanism through a bidirectional motor, the clamping blocks at both ends move synchronously in opposite directions. Combined with the lifting component and vacuum adsorption coordinated control, the wafer is stably gripped and released, effectively avoiding slippage and damage during the handling process, and improving the accuracy and reliability of loading and unloading.

[0013] 2. By integrating rotation, lifting, vacuum and edge clamping functions into one unit, the rotating component realizes the automatic turning of the wafer between L-shaped transmission lines. The whole machine has a compact structure and efficient and coordinated operation, which meets the requirements of high cleanliness and high cycle time wafer production, and improves the level of automation and operation efficiency. Attached Figure Description

[0014] Figure 1 This is an overall schematic diagram of a wafer production loading and unloading device proposed in this utility model; Figure 2 This is a half-sectional view of the base and rotating block of a wafer production loading and unloading device proposed in this utility model; Figure 3 This is a half-sectional view of the lifting block of a wafer production loading and unloading device proposed in this utility model; Figure 4 This is a partially enlarged schematic diagram of the edge clamping component of a wafer production loading and unloading device proposed in this utility model.

[0015] Legend: 1. Base; 2. Rotating assembly; 21. DC motor; 22. Rotating gear; 23. Large gear; 24. Rotating block; 3. Lifting assembly; 31. Telescopic cylinder; 32. Lifting block; 33. Sliding groove; 4. Vacuum assembly; 41. Vacuum pump; 42. Solenoid valve; 43. Vacuum pipe; 44. Vacuum suction cup; 5. Edge clamping assembly; 51. Bidirectional motor; 52. Rotating rod; 53. First bevel gear; 54. Second bevel gear; 55. Rotating shaft; 56. Rotating gear; 57. Rack; 58. Clamping block; 6. Transmission assembly; 61. Support leg; 62. Drive motor; 63. Conveyor belt. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0018] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. Example

[0019] like Figures 1 to 4 As shown, this embodiment provides a wafer fabrication loading and unloading device, comprising: a base 1; a rotating assembly 2, disposed on the top of the base 1, including a rotating block 24 rotating on the top of the base 1; a lifting assembly 3, disposed inside the rotating block 24, including a lifting block 32 sliding up and down inside the upper end of the rotating block 24; a vacuum assembly 4, disposed on the top of the rotating block 24, including a vacuum pump 41 disposed on the top of the rotating block 24; an edge clamping assembly 5, disposed on both sides inside the lifting block 32, including a bidirectional motor 51 disposed in the middle of the lifting block 32; and two sets of transmission assemblies 6, located on both sides of the base 1, the two sets being arranged in an L-shape.

[0020] In this embodiment, the vacuum component 4 and the edge clamping component 5 constitute a wafer manufacturing loading and unloading device according to this application.

[0021] It should also be noted that the wafers used for loading and unloading in this application can be polished wafers, epitaxial wafers, bare wafers, etc. Figure 1 In this embodiment, the loading and unloading wafers are described using bare wafers as an example. Of course, other types of loading and unloading wafers can also adopt a similar structure, which will not be described in detail below.

[0022] It should also be understood that the DC motor 21, telescopic cylinder 31, vacuum pump 41, solenoid valve 42, bidirectional motor 51, drive motor 62, controller, position sensor and rotation sensor were all purchased from the market and are common knowledge in this field. They are only used and not modified, so the control method and circuit connection will not be described in detail.

[0023] Furthermore, in this embodiment, the base 1 is made of rectangular metal, possessing high strength and stability, suitable for industrial environments; the rotating component 2 includes a rotating block 24, made of cylindrical metal, possessing high strength and wear resistance; the lifting component 3 includes a lifting block 32, made of rectangular metal, possessing high strength and stability; the vacuum component 4 includes a vacuum pump 41, made of cylindrical metal; and the edge clamping component 5 includes a bidirectional motor 51, made of cylindrical metal. The rotating component 2 achieves wafer rotational positioning, the lifting component 3 achieves wafer vertical movement, the vacuum component 4 achieves wafer adsorption and release, the edge clamping component 5 achieves wafer edge clamping, and the transmission component 6 achieves wafer transmission. This improves the automation and efficiency of wafer production, reduces manual operation, and lowers production costs. Example

[0024] Based on Example 1, in order to further enable wafer loading and unloading, a rotating assembly 2 and a lifting assembly 3 are provided on the top of the base 1.

[0025] Specifically, the rotating assembly 2 includes: a DC motor 21, which is disposed inside the base 1 on one side; a rotating gear 22, which is rotatably disposed inside the base 1 near the DC motor 21 and is keyed to the output shaft of the DC motor 21; a large gear 23, which is rotatably disposed in the middle of the base 1 and meshes with the rotating gear 22, and the bottom of the rotating block 24 is welded to the top shaft.

[0026] In this embodiment, the DC motor 21 is made of cylindrical metal, the rotating gear 22 is made of cylindrical metal and has high precision and wear resistance, and the large gear 23 is made of cylindrical metal and has high precision and wear resistance. The DC motor 21 drives the rotating gear 22 to rotate, and the rotating gear 22 drives the large gear 23 to rotate through meshing. The large gear 23 drives the rotating block 24 to rotate on the top of the base 1. This achieves precise rotation and positioning of the wafer and ensures accurate transfer of the wafer between different workstations.

[0027] Specifically, the lifting assembly 3 includes: a telescopic cylinder 31, which is disposed inside the rotating block 24 and whose telescopic end is screwed to the bottom of the lifting block 32; and a sliding groove 33, which is opened inside the upper end of the rotating block 24 and the lifting block 32 slides up and down inside the sliding groove 33.

[0028] In a preferred embodiment, the telescopic cylinder 31 is made of cylindrical metal. The telescopic end of the cylinder 31 drives the lifting block 32 to slide up and down within the sliding groove 33, thereby achieving the vertical movement of the wafer. This enables precise vertical movement of the wafer and ensures accurate transfer of the wafer between different heights. Example

[0029] Based on Example 2, in order to prevent the wafer from falling during the loading and unloading of the wafer, a vacuum component 4 and an edge clamping component 5 are provided on the rotating block 24.

[0030] Specifically, the vacuum assembly 4 includes: two sets of solenoid valves 42, located on top of the rotating block 24 and on both sides of the vacuum pump 41, and connected to the suction sides of the vacuum pump 41 via pipes; two sets of vacuum pipes 43, one end of which is connected to the solenoid valve 42 pipe, and the other end extends into both sides of the lifting block 32, extending to the bottom of both sides of the lifting block 32; and a vacuum suction cup 44, located at the bottom of the vacuum pipe 43 near the lifting block 32.

[0031] In this embodiment, the solenoid valve 42 is made of cylindrical metal, the vacuum pipe 43 is made of cylindrical rubber, possessing good airtightness and flexibility, and the vacuum chuck 44 is made of circular rubber, also possessing good airtightness and flexibility. The vacuum pump 41 controls the vacuum level of the vacuum chuck 44 by opening and closing the vacuum pipes 43 on both sides and the two sets of solenoid valves 42, thereby achieving wafer adsorption and release. This enables stable wafer adsorption and rapid release, improving the reliability and efficiency of wafer transport.

[0032] Specifically, the edge clamping assembly 5 includes: two sets of rotating rods 52, rotatably disposed inside the lifting block 32, with one end connected to the output ends of the bidirectional motor 51 on both sides; two sets of first bevel gears 53, rotatably disposed inside the lifting block 32 on both sides, and keyed to the end of the rotating rods 52 away from the bidirectional motor 51; two sets of second bevel gears 54, rotatably disposed inside the lifting block 32 on both sides, and meshing with the bottom of the first bevel gears 53; two sets of rotating shafts 55, rotatably disposed inside the lifting block 32 on both sides, with the upper end keyed to the second bevel gears 54; two sets of rotating gears 56, rotatably disposed inside the lifting block 32 on both sides, and keyed to the lower end of the rotating shafts 55; racks 57, disposed on both sides of the rotating gears 56, meshing with the rotating gears 56, and sliding horizontally on both sides of the lifting block 32; and clamping blocks 58, sliding horizontally on both sides of the bottom of the lifting block 32, with the top bolted to the bottom of one side of the rack 57.

[0033] In this configuration, the rotating rod 52 is made of cylindrical metal, which has high precision and wear resistance; the first bevel gear 53 is made of cylindrical metal, which has high precision and wear resistance; the second bevel gear 54 is made of cylindrical metal, which has high precision and wear resistance; the rotating shaft 55 is made of cylindrical metal, which has high precision and wear resistance; the rotating gear 56 is made of cylindrical metal, which has high precision and wear resistance; the rack 57 is made of rectangular metal, which has high strength and stability; and the clamping block 58 is made of rectangular metal, which has high strength and stability. The clamping block 58 is equipped with rubber at the edge of the wafer, which has high elasticity, wear resistance and anti-slip properties. The bidirectional motor 51 drives the rotating rod 52 to rotate. The rotating rod 52 drives the rotating shaft 55 to rotate through the first bevel gear 53 and the second bevel gear 54. The rotating shaft 55 drives the rack 57 to slide horizontally through the rotating gear 56. The rack 57 drives the clamping block 58 to clamp the edge of the wafer. To achieve stable clamping of the wafer and protect its integrity during transport.

[0034] Specifically, the transmission component 6 includes: four sets of support legs 61, located on both sides of the base 1 in an L-shape, with rolling drums connected between the two sets; a drive motor 62, located on one side of the top of a set of support legs 61, with its output shaft keyed to the rolling drums between the support legs 61; and a conveyor belt 63 sleeved on the outside of the rolling drums on both sides, and rolling and transmitting on the support legs 61.

[0035] The support leg 61 is made of rectangular metal, providing high strength and stability. The drive motor 62 is made of cylindrical metal, and the conveyor belt 63 is made of rubber, offering good wear resistance and flexibility. The drive motor 62 drives the rotating drum, which in turn drives the conveyor belt 63 to achieve wafer transport. This ensures stable wafer transport and improves production efficiency.

[0036] In actual use, the user first connects two sets of drive motors 62 via the operation page controller (not shown in the figure) and starts the drive motors 62 to drive the top rollers of the support legs 61 to rotate. The two rollers on both sides of one set drive the conveyor belt 63 to move the upper-loaded wafer towards the base 1. When the position sensor (not shown in the figure) senses that the wafer has reached the target position, it sends a signal to the controller, which then controls the two sets of drive motors 62 to stop. Then, the user starts the telescopic cylinder 31 via the operation page controller circuit. The output end of the telescopic cylinder 31 drives the lifting block 32 to slide downwards inside the sliding groove 33. Then, when the vacuum suction cup 44 contacts the upper surface of the wafer, the controller stops the telescopic cylinder 31 from extending or retracting. At the same time, the user starts the vacuum pump 41 via the operation page controller circuit, and the controller circuit is connected to the vacuum pump. 41. Start the solenoid valve 42 near the wafer loading side to open the channel. Vacuum pump 41 draws vacuum to vacuum suction cup 44 through vacuum pipe 43 on the wafer loading side. Vacuum suction cup 44 picks up the wafer. The user starts telescopic cylinder 31 again in reverse through controller. Lifting block 32 drives the wafer to rise. Then, the user starts bidirectional motor 51 through the controller circuit on the operation page. Bidirectional motor 51 rotates rod 52 near the wafer loading side to drive first bevel gear 53 to rotate. First bevel gear 53 drives second bevel gear 54 to rotate. Second bevel gear 54 drives rotating gear 56 to rotate through rotating shaft 55. Rotating gear 56 meshes with racks 57 on both sides to slide towards the middle. At the same time, it drives clamping block 58 to clamp the edge of the wafer. Rubber is provided at the clamping point of clamping block 58 to protect the wafer.

[0037] Next, the DC motor 21 is started via the control panel's wiring. The DC motor 21 drives the rotating gear 22 to rotate, which in turn meshes with the large gear 23. The large gear 23 drives the rotating block 24 and the loading wafer to rotate on top of the base 1. When the rotation sensor (not shown in the figure) detects that the loading wafer has rotated onto another set of conveyor belts 63, it sends a command to the controller. The controller stops the DC motor 21 from rotating. Then, the telescopic cylinder 31 is started via the control panel's wiring. The telescopic end of the telescopic cylinder 31 drives the lifting block 32 downwards until the wafer reaches the other set of conveyor belts 63. The controller circuit connects to the vacuum pump 41 and starts, and the wafer solenoid valve 42 near the unloading side closes the channel. The vacuum pump 41 is then turned off via the controller circuit on the operation page, and the vacuum suction cup 44 stops adsorbing the wafer. Then, the user connects to the bidirectional motor 51 via the controller circuit on the operation page and starts the bidirectional motor 51. The rotating rod 52 near the unloading side rotates, passing through the first bevel gear 53, the second bevel gear 54, the rotating gear 56, and the rack 57 in sequence. Finally, the sliding clamping blocks 58 on both sides of the rack 57 release the clamping of the wafer edge. At this point, the clamping block 58 on the other side usually clamps another wafer through the above transmission.

[0038] The DC motor 21, telescopic cylinder 31, vacuum pump 41, solenoid valve 42, bidirectional motor 51, and drive motor 62 are all electrically connected to the PLC controller. The PLC controller is electrically connected to an external power supply. The PLC controller facilitates the power supply control of the electrical equipment, ensuring that the equipment can be powered on when needed, thus avoiding the situation where power cannot be supplied when power is required.

[0039] The outrigger 61 is equipped with a position sensor; the sensor is electrically connected to the controller, which is the central hub of the entire system. The controller is responsible for receiving instructions, monitoring the status, and controlling the actions of each actuator. Through preset programs or real-time parameter adjustments, the automatic control of the drive motor 62 can be realized. The position sensor monitors the wafer's moving position in real time and transmits the sensed signal to the controller, which then controls the drive motor 62 to run.

[0040] Rotating block 24 is equipped with a rotation sensor; the sensor is electrically connected to the controller, which is the central hub of the entire system. The controller is responsible for receiving instructions, monitoring the status, and controlling the actions of each actuator. Through preset programs or real-time parameter adjustments, the automatic control of DC motor 21 can be realized. The rotation sensor monitors the wafer rotation position in real time and transmits the sensed signal to the controller, which controls the operation of DC motor 21.

[0041] It should be noted that the controller can be a conventional known device that is controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific embodiments of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0042] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer fabrication loading and unloading device, characterized in that: Including the base (1); A rotating component (2) is disposed on top of the base (1) and includes a rotating block (24) that rotates on top of the base (1); The lifting assembly (3) is set inside the rotating block (24) and includes a lifting block (32) that slides up and down inside the upper end of the rotating block (24); A vacuum assembly (4) is disposed on top of the rotating block (24), including a vacuum pump (41) disposed on top of the rotating block (24); Edge clamping components (5) are provided on both sides inside the lifting block (32), including a bidirectional motor (51) provided in the middle of the lifting block (32); The transmission component (6) is set in two groups, located on both sides of the base (1), and the two groups are arranged in an L-shape.

2. The wafer fabrication loading and unloading device according to claim 1, characterized in that: The rotating assembly (2) includes: a DC motor (21) disposed on one side inside the base (1); A rotating gear (22) is rotatably mounted inside the base (1) on the side near the DC motor (21) and is keyed to the output shaft of the DC motor (21); The large gear (23) rotates in the middle of the base (1) and meshes with the rotating gear (22), and the bottom of the rotating block (24) is welded to the top shaft.

3. The wafer fabrication loading and unloading device according to claim 2, characterized in that: The lifting assembly (3) includes: a telescopic cylinder (31) which is disposed inside the rotating block (24) and whose telescopic end is screwed to the bottom of the lifting block (32); The sliding groove (33) is opened inside the upper end of the rotating block (24), and the lifting block (32) slides up and down inside the sliding groove (33).

4. The wafer fabrication loading and unloading device according to claim 3, characterized in that: The vacuum assembly (4) includes: two sets of solenoid valves (42), located on top of the rotating block (24) and on both sides of the vacuum pump (41), and connected to the suction sides of the vacuum pump (41) through pipes; Two sets of vacuum pipes (43) are provided, with one end connected to the solenoid valve (42) pipe and the other end extending into both sides of the lifting block (32) and extending to the bottom of both sides of the lifting block (32); The vacuum suction cup (44) is located at the bottom of the vacuum pipe (43) near the lifting block (32).

5. The wafer fabrication loading and unloading device according to claim 4, characterized in that: The edge clamping assembly (5) includes: a rotating rod (52), two sets of which are rotatably disposed inside the lifting block (32), and one end of which is connected to the output ends on both sides of the bidirectional motor (51); The first bevel gear (53) is provided in two sets and rotates inside both sides of the lifting block (32), and is keyed to the end of the rotating rod (52) away from the bidirectional motor (51); The second bevel gear (54) is provided in two sets and rotates inside both sides of the lifting block (32) and meshes with the bottom of the first bevel gear (53). Two sets of rotating shafts (55) are provided, and they rotate inside the lifting block (32) on both sides, and the upper end is keyed to the second bevel gear (54). Rotate the gear (56), set two sets, and rotate inside both sides of the lifting block (32), and connect to the key at the lower end of the rotating shaft (55); The rack (57) is set on both sides of the rotating gear (56), meshes with the rotating gear (56), and slides horizontally on both sides of the lifting block (32); The clamping block (58) slides horizontally on both sides of the bottom of the lifting block (32), and the top bolt is connected to the bottom of the rack (57) on one side.

6. The wafer fabrication loading and unloading device according to claim 5, characterized in that: The transmission component (6) includes: four sets of legs (61) located on both sides of the base (1) in an L-shape, with a rolling cylinder connected between the two sets; The drive motor (62) is located on one side of the top of a set of support legs (61), and the output shaft is keyed to the rolling cylinder between the support legs (61); The conveyor belt (63) is fitted outside the two side rollers and rolls on the support legs (61).

7. A wafer fabrication loading and unloading device according to claim 6, characterized in that: Heat dissipation holes are provided on the side of the base (1) near the DC motor (21) and on the side of the lifting block (32) near the bidirectional motor (51).

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