Dual-arm cooperative die bonding device

Abstract

The utility model relates to the field of die bonding technology, and specifically discloses a two-arm cooperative die bonding equipment, which comprises a linear conveying device, the linear conveying device is used for conveying a tray loaded with a substrate along an X direction; a first die bonding module and a second die bonding module, the two die bonding modules are arranged on the two sides of the linear conveying device, and are used for cooperatively performing die bonding operations on different areas on the same tray; wherein, the maximum movement stroke of the first die bonding module in a Y direction perpendicular to the X direction is L1, the maximum movement stroke of the second die bonding module in the Y direction is L2, and the width dimension of the tray in the Y direction is W, L1, L2 and W satisfy the following relationship: (L1+L2) >= W. The two-arm cooperative die bonding equipment provided by the utility model can solve the problem of low travel efficiency of a die bonding mechanical arm when a substrate in a large-size tray is subjected to a die bonding operation by using an existing die bonding equipment.

Description

Technical Field

[0001] This utility model relates to the field of die bonding technology, and in particular to a dual-arm collaborative die bonding device. Background Technology

[0002] Die bonding is a crucial step in semiconductor packaging, primarily involving a robotic arm precisely picking up chips from the wafer frame and mounting them to designated positions on the substrate. Traditional die bonding equipment typically employs a single-arm configuration: substrates arrive in standardized trays and are transported to the die bonding station via a conveyor belt; the robotic arm completes the die bonding operation on all substrates on a single tray within a fixed station, after which the tray continues to the downstream process. This single-station model features a simple structure and clear control logic, and is widely used in packaging lines for small to medium-sized substrates.

[0003] However, as packaging technology advances towards higher integration and larger substrate sizes, the limitations of traditional single-arm robotic systems are becoming increasingly apparent. As the number or size of substrates a tray needs to support increases, the tray size also increases, significantly expanding the working area that the die-bonding robotic arm must cover. Because the movement stroke of the die-bonding robotic arm is constrained by its dynamic accuracy and acceleration performance, its movement speed often needs to be deliberately reduced to maintain positioning accuracy. This results in a significant increase in the time required for a single robotic arm to complete die bonding of all substrates in a large tray.

[0004] To address this issue, some equipment employs a dual-station layout, where two independent die-bonding robotic arms are positioned along the conveyor belt, handling different trays separately. While this approach can increase overall capacity, each die-bonding robotic arm is still independently responsible for bonding the entire tray, failing to resolve the problem of low travel efficiency of the die-bonding robotic arms due to the large size of individual trays.

[0005] Therefore, existing die bonding equipment needs to be improved to solve the problem of low stroke efficiency of the die bonding robot arm when performing die bonding operations on substrates in large-size trays.

[0006] The information disclosed in this background section is included only to enhance the understanding of the context of this disclosure, and therefore may contain information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0007] One objective of this invention is to provide a dual-arm collaborative die bonding device that can solve the problem of low stroke efficiency of the die bonding robotic arm when performing die bonding operations on substrates in large-size trays in existing die bonding equipment.

[0008] To achieve the above objectives, this utility model provides a dual-arm collaborative die bonding device, comprising:

[0009] A linear conveyor for conveying a tray loaded with substrates along the X direction;

[0010] The first die bonding module and the second die bonding module are arranged on both sides of the linear conveyor and are used to collaboratively perform die bonding operations on different areas of the same tray.

[0011] Wherein, the maximum travel distance of the first die bonding module in the Y direction perpendicular to the X direction is L1, the maximum travel distance of the second die bonding module in the Y direction is L2, and the width dimension of the material tray in the Y direction is W. L1, L2, and W satisfy the following relationship: (L1+L2)≥W.

[0012] Optionally, the two die-bonding modules are symmetrically arranged about the linear conveying device.

[0013] Optionally, the linear conveying device includes:

[0014] XY bidirectional adjustment platform, the XY bidirectional adjustment platform is used to place the material tray and drive the material tray to translate along the X direction and / or the Y direction;

[0015] The platform direct drive mechanism has its drive end connected to the XY bidirectional positioning platform, and is used to drive the XY bidirectional positioning platform to reciprocate along the Y direction.

[0016] Optionally, each of the die bonding modules includes a die ring hopper for storing die rings, a die ring rotation platform for fixing die rings, a die ring robot for transferring die rings between the die ring hopper and the die ring rotation platform, a push pin mechanism for lifting the chip on the die ring fixed by the die ring rotation platform upwards, and a die bonding robot arm for transferring the chip lifted by the push pin mechanism to the substrate in the tray.

[0017] Optionally, each of the die bonding modules is further provided with:

[0018] The module base plate, the crystal ring hopper, the crystal ring rotating platform, the crystal ring robot, the ejector pin mechanism, and the die bonding robot are all mounted and fixed on the corresponding module base plate;

[0019] The Y-direct drive mechanism has its drive end connected to the module base plate, and is used to drive the module base plate to shift relative to the material tray along the Y direction.

[0020] Optionally, when the Y-axis direct drive mechanism drives the corresponding module base plate to move away from the linear conveying device to its limit position, the corresponding die bonding robot arm completely withdraws from the space above the material tray.

[0021] When the Y-direct drive mechanism drives the corresponding module base plate to move towards the linear conveyor to its limit position, the die bonding robot arm moves from one side of the tray across the entire tray to the other side of the tray.

[0022] Optionally, the crystal ring hopper includes:

[0023] The main body of the silo is provided with several crystal ring storage slots arranged from top to bottom;

[0024] The Z-axis direct drive mechanism has its drive end connected to the main body of the hopper, driving the main body of the hopper to move up and down.

[0025] Optionally, the die-bonding robotic arm is an XYZ three-axis translational robotic arm or a rotary robotic arm.

[0026] The beneficial effects of this utility model are as follows: It provides a dual-arm collaborative die bonding device, wherein the linear conveying device conveys a tray loaded with substrates along the X direction; a first die bonding module and a second die bonding module are located on both sides of the tray, one responsible for the left half and the other for the right half, and the two move in coordination to cover the entire area of ​​the tray; the two die bonding modules simultaneously perform die bonding operations on different substrates on the same tray according to the pre-divided area, thereby completing the die bonding task of the entire tray in parallel;

[0027] Specifically, by limiting the first die-bonding module and the second die-bonding module to perform die-bonding operations on different areas of the same material tray based on the stroke relationship of (L1+L2)≥W, the task that was originally completed by a single die-bonding module is distributed to the two modules for parallel processing, which significantly shortens the overall operation time for large-size material trays and fundamentally solves the problem of decreased dynamic performance and low production efficiency caused by the increased stroke of the die-bonding robot arm. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the dual-arm collaborative die bonding device provided in the embodiment;

[0030] Figure 2 This is a schematic diagram of the die-bonding module provided in the embodiment.

[0031] In the picture:

[0032] 1. Linear conveyor device; 101. XY bidirectional adjustment platform; 102. Platform direct drive mechanism;

[0033] 2a. First die bonding module; 2b. Second die bonding module;

[0034] 201. Crystal ring hopper; 2011. Hopper body; 2012. Z-axis direct drive mechanism;

[0035] 202. Crystal ring rotation platform;

[0036] 203. Crystal Ring Robotic Arm;

[0037] 204. Ejector mechanism;

[0038] 205. Die-bonding robotic arm;

[0039] 206. Module base plate;

[0040] 207. Y-direct drive mechanism. Detailed Implementation

[0041] In this utility model, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this utility model, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0042] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit the invention.

[0043] In the description of this utility model, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " generally indicates that the preceding and following objects have an "or" logical relationship.

[0044] In this invention, terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy, or order between these entities or operations.

[0045] Without further limitations, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this invention is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a series of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0046] Similar to the understanding in the Examination Guidelines, in this utility model, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this utility model, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.

[0047] In the description of the embodiments of this utility model, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the convenience of describing the specific embodiments of this utility model or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0048] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this utility model, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this utility model pertains, the specific meaning of the above terms in the embodiments of this utility model can be understood according to the specific circumstances.

[0049] The direct drive mechanism in this invention can be a linear motor, a cylinder, a hydraulic cylinder, or a motor lead screw and slider assembly, etc.; the rotary drive mechanism can be a servo motor, a stepper motor, or a rotary cylinder, etc.

[0050] See Figure 1 This embodiment provides a dual-arm collaborative die bonding device, including:

[0051] A linear conveyor 1 is used to convey a tray loaded with substrates along the X direction;

[0052] The first die bonding module 2a and the second die bonding module 2b are arranged on both sides of the linear conveyor 1 to perform die bonding operations in different areas on the same tray.

[0053] Wherein, the maximum travel distance of the first die bonding module 2a in the Y direction perpendicular to the X direction is L1, the maximum travel distance of the second die bonding module 2b in the Y direction is L2, and the width dimension of the material tray in the Y direction is W. L1, L2, and W satisfy the following relationship: (L1+L2)≥W.

[0054] The dual-arm collaborative die bonding equipment provided in this embodiment includes a linear conveying device 1 that conveys a tray loaded with substrates along the X direction; a first die bonding module 2a and a second die bonding module 2b located on both sides of the tray, one responsible for the left half and the other for the right half, move in coordination to cover the entire area of ​​the tray; the two die bonding modules simultaneously perform die bonding operations on different substrates on the same tray according to the pre-divided area, thereby completing the die bonding task of the entire tray in parallel.

[0055] Specifically, by limiting the first die-bonding module 2a and the second die-bonding module 2b to perform die-bonding operations on different areas of the same material tray based on the stroke relationship of (L1+L2)≥W, the task originally completed by a single die-bonding module is distributed to the two modules for parallel processing, which significantly shortens the overall operation time for large-size material trays and fundamentally solves the problem of decreased dynamic performance and low production efficiency caused by the increased stroke of the die-bonding robot arm 205.

[0056] In this embodiment, the two die-bonding modules are symmetrically arranged about the linear conveyor 1. This symmetrical layout ensures that the two die-bonding modules have identical working areas and movement capabilities. This symmetry provides an ideal basis for workload distribution in the collaborative operation of the two modules, avoiding motion interference or control deviations that may result from structural asymmetry. Furthermore, it allows the control system to employ mirror or approximate path planning algorithms, greatly simplifying programming complexity and improving the stability and accuracy of the collaborative movement of the two arms.

[0057] In this embodiment, the linear conveying device 1 includes:

[0058] XY bidirectional adjustment platform 101, the XY bidirectional adjustment platform 101 is used to place the material tray and drive the material tray to translate along the X direction and / or the Y direction;

[0059] The platform direct drive mechanism 102 is connected to the XY bidirectional adjustment platform 101 at its drive end, and is used to drive the XY bidirectional adjustment platform 101 to reciprocate along the Y direction.

[0060] The linear conveyor 1 achieves precise positioning and initial position compensation of the tray in the X and Y directions, and works in conjunction with the movement of the die bonding module to expand the coverage capability of the tray across its full width.

[0061] Optional, see Figure 2 Each die-bonding module includes a die ring hopper 201 for storing die rings, a die ring rotation platform 202 for fixing die rings, a die ring robot 203 for transferring die rings between the die ring hopper 201 and the die ring rotation platform 202, a push-pin mechanism 204 for lifting the chip on the die ring fixed by the die ring rotation platform 202 upwards, and a die-bonding robot arm 205 for transferring the chip lifted by the push-pin mechanism 204 to the substrate in the tray. Optionally, the die-bonding robot arm 205 is an XYZ three-axis translation robot arm or a rotary robot arm, etc.

[0062] Furthermore, each of the aforementioned die-bonding modules is also provided with:

[0063] The module base plate 206, the crystal ring hopper 201, the crystal ring rotating platform 202, the crystal ring robot 203, the ejector pin mechanism 204, and the die bonding robot arm 205 are all installed and fixed on the corresponding module base plate 206.

[0064] Y-direct drive mechanism 207, the drive end of which is connected to the module base plate 206, is used to drive the module base plate 206 to shift relative to the material tray along the Y direction; wherein, L1 is the drive stroke of the Y-direct drive mechanism 207 of the first die bonding module 2a; L2 is the drive stroke of the Y-direct drive mechanism 207 of the second die bonding module 2b.

[0065] In this embodiment, when the Y-direct drive mechanism 207 drives the corresponding module base plate 206 to move to the limit position in a direction away from the linear conveying device 1, the corresponding die bonding robot arm 205 completely withdraws from the space above the material tray.

[0066] When the Y-direct drive mechanism 207 drives the corresponding module base plate 206 to move towards the linear conveyor 1 to its limit position, the die bonding robot arm 205 moves from one side of the tray across the entire tray to the other side of the tray.

[0067] When one die-bonding module is forced to stop working due to maintenance, malfunction, or process requirements, the other module can immediately switch to independent operation mode, using its full-coverage motion stroke to independently complete the die-bonding task for the entire tray. This design perfectly solves the drawback of traditional dual-station equipment where a single module failure leads to a complete production line shutdown, significantly improving equipment availability, reliability, and production scheduling flexibility.

[0068] In other words, each die-bonding module can not only perform die-bonding operations on half of the tray, but also, when necessary, one die-bonding module can move aside so that another can perform single-arm die-bonding operations. This design greatly enhances the flexibility and fault tolerance of the equipment's operating modes. On the one hand, it ensures that the die-bonding robotic arm 205 can completely retract from the space above the tray, providing an unobstructed passage for the safe flow of the tray; on the other hand, it gives a single die-bonding module the ability to operate across the entire tray.

[0069] In this embodiment, the crystal ring hopper 201 includes:

[0070] The silo body 2011 is provided with a plurality of crystal ring storage slots arranged sequentially from top to bottom;

[0071] Z-axis direct drive mechanism 2012, the drive end of which is connected to the hopper body 2011, drives the hopper body 2011 to move up and down.

[0072] The structure of the crystal ring hopper 201 enables batch storage and automatic loading and unloading of multiple crystal rings, so as to cooperate with the crystal ring robot 203 to accurately deliver the target crystal ring to the wafer changing station, which greatly reduces the equipment downtime for changing materials and improves the continuous operation capability and production efficiency of the equipment.

[0073] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A dual-arm collaborative die bonding device, characterized in that, include: A linear conveyor (1) is used to convey a tray of loaded substrates along the X direction; The first die bonding module (2a) and the second die bonding module (2b) are arranged on both sides of the linear conveyor (1) for coordinating die bonding operations on different areas of the same tray. Wherein, the maximum travel distance of the first die bonding module (2a) in the Y direction perpendicular to the X direction is L1, the maximum travel distance of the second die bonding module (2b) in the Y direction is L2, and the width dimension of the material tray in the Y direction is W. L1, L2, and W satisfy the following relationship: (L1+L2)≥W.

2. The dual-arm collaborative die bonding device according to claim 1, characterized in that, The two die-bonding modules are symmetrically arranged about the linear conveying device (1).

3. The dual-arm collaborative die bonding device according to claim 1, characterized in that, The linear conveying device (1) includes: XY bidirectional adjustment platform (101), the XY bidirectional adjustment platform (101) is used to place the material tray and drive the material tray to translate along the X direction and / or the Y direction; The platform direct drive mechanism (102) is connected to the XY bidirectional positioning platform (101) at its drive end, and is used to drive the XY bidirectional positioning platform (101) to reciprocate along the Y direction.

4. The dual-arm collaborative die bonding device according to claim 1, characterized in that, Each of the die bonding modules includes a die ring hopper (201) for storing die rings, a die ring rotating platform (202) for fixing die rings, a die ring robot (203) for transferring die rings between the die ring hopper (201) and the die ring rotating platform (202), a push pin mechanism (204) for lifting the chip on the die ring fixed by the die ring rotating platform (202) upwards, and a die bonding robot arm (205) for transferring the chip lifted by the push pin mechanism (204) to the substrate in the tray.

5. The dual-arm collaborative die bonding device according to claim 4, characterized in that, Each of the aforementioned die bonding modules is also provided with: The module base plate (206), the crystal ring hopper (201), the crystal ring rotating platform (202), the crystal ring robot (203), the ejector pin mechanism (204), and the die bonding robot arm (205) are all installed and fixed on the corresponding module base plate (206); Y-direct drive mechanism (207), the drive end of which is connected to the module base plate (206) and is used to drive the module base plate (206) to shift relative to the material tray along the Y direction.

6. The dual-arm collaborative die bonding device according to claim 5, characterized in that, When the Y-direct drive mechanism (207) drives the corresponding module base plate (206) to move away from the linear conveying device (1) to the limit position, the corresponding die bonding robot arm (205) completely withdraws from the space above the tray; When the Y-direct drive mechanism (207) drives the corresponding module base plate (206) to move towards the linear conveyor (1) to the limit position, the die bonding robot arm (205) moves from one side of the tray across the entire tray to the other side of the tray.

7. The dual-arm collaborative die bonding device according to claim 4, characterized in that, The crystal ring hopper (201) includes: The silo body (2011) is provided with a plurality of crystal ring storage tanks arranged from top to bottom; Z-direct drive mechanism (2012), the drive end of which is connected to the hopper body (2011) to drive the hopper body (2011) to move up and down.

8. The dual-arm collaborative die bonding device according to claim 4, characterized in that, The die-bonding robotic arm (205) is an XYZ three-axis translational robotic arm or a rotary robotic arm.

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