Wafer cassette transfer device for vertical high temperature furnace tube

Abstract

The utility model discloses a vertical high temperature furnace pipe's wafer box transmission device passes through the transport dolly subassembly and moves to the storage area along the closed circulation track system, and after the laser positioning, drops, and uses the first sucking disc device to catch the wafer box, and then rises and moves to the placement area, reaches, and the wafer box positioning subassembly is positioned to the wafer box accurately with the help of electromagnetic tracing trolley, displacement sensor, second laser reflector and CCD camera, and then wafer box placement subassembly cooperates and acts through second ball screw rod subassembly, second transverse electric push rod, third transverse electric push rod and second sucking disc device, places the wafer box accurately in the vertical high temperature furnace specified position, completes once transmission and placement, and each component circulates and executes above-mentioned operation under the coordination of central coordination control unit, solves the artificial handling efficiency lower, and it is easy to cause the operating error, secondly, long -term dependence artificial handling can increase the labor intensity of staff, and when large -scale production, it is easy to cause the production bottleneck.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a wafer cell transport device for a vertical high-temperature furnace tube. Background Technology

[0002] In semiconductor wafer manufacturing, wafer cassette handling is a critical step. Traditionally, wafer cassettes need to be moved from one location to another, especially from the wafer storage area to a vertical furnace for further processing. In actual production, vertical furnaces are typically used for high-temperature wafer processing and are designed with side openings for inserting or removing wafer cassettes. Traditional handling relies on manual operation, with workers moving the wafer cassettes from the storage area to the side opening of the vertical furnace. During this process, operators need to manually align the wafer cassette with the furnace opening and carefully place it into the furnace. While this method is simple, it has several problems. First, manual handling is inefficient and prone to errors. Second, long-term reliance on manual handling increases the workload of workers and can easily create production bottlenecks during large-scale production.

[0003] Therefore, there is an urgent need to design a wafer cell transport device for a vertical high-temperature furnace tube that can solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a wafer cell transfer device for a vertical high-temperature furnace tube, in order to solve the problems of low efficiency and easy operational errors caused by manual handling, as well as the fact that long-term reliance on manual handling increases the labor intensity of workers and can easily cause production bottlenecks during large-scale production.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A wafer cassette transport device for a vertical high-temperature furnace tube includes a storage area, a placement area, and a central coordination and control unit. The storage area and the placement area are equipped with a closed-loop track system at the top. The closed-loop track system is equipped with several transport trolley assemblies. The storage area also includes a wafer cassette transport assembly and several storage racks. The placement area also includes a wafer cassette positioning assembly, a wafer cassette placement assembly, and several vertical high-temperature furnaces.

[0007] Furthermore, the transport trolley assembly includes a first vertical electric push rod fixedly connected to a closed-loop track system. The output end of the first vertical electric push rod is provided with a trolley body. The bottom end of the trolley body is provided with a support plate. The bottom surface of the support plate is provided with a laser emitter. One side of the laser emitter is provided with a first laser rangefinder. The two sides of the trolley body are symmetrically provided with guardrails. The other side of the trolley body is provided with a first suction cup device. The first suction cup device is connected to a first horizontal electric push rod.

[0008] The above technical solution involves cyclically moving along a closed-loop track system to grab and transport wafer cassettes from the storage area to the placement area or other designated locations.

[0009] Furthermore, the wafer cassette conveying assembly includes a frame, a push plate is provided inside the frame, a second vertical electric push rod is provided at the bottom end of the push plate, and a first laser reflector is provided on one side of the outer side of the frame;

[0010] Using the above technical solution, wafer cassettes on the storage rack are manually moved onto the push plate, and then the transport trolley assembly and the wafer cassette conveying assembly work together to transfer the wafer cassettes, allowing for uninterrupted manual handling.

[0011] Furthermore, the wafer cassette positioning assembly includes an electromagnetic tracking trolley, with wires buried along a predetermined path within the placement area. A displacement sensor is provided on one side of the electromagnetic tracking trolley, a second laser reflector is provided on one side of the electromagnetic tracking trolley, a first lead screw box is provided at the top of the electromagnetic tracking trolley, a second lead screw box is provided on one side of the first lead screw box, and a first ball screw assembly is provided inside the second lead screw box. The first ball screw assembly is connected to a CCD camera.

[0012] The above technical solution is used to position the wafer cassettes transported to the placement area, ensuring that the wafer cassettes can accurately enter the designated position of the vertical high-temperature furnace.

[0013] Furthermore, the wafer box placement assembly includes a second ball screw assembly disposed inside the first ball screw box. The second ball screw assembly is connected to an L-shaped plate. A second laser rangefinder is provided at the bottom end of the shorter side of the L-shaped plate. A second transverse electric push rod is provided inside the L-shaped plate. The second transverse electric push rod is connected to a U-shaped frame. A plurality of rollers are provided at equal intervals on the inner side wall of the U-shaped frame through a rotating shaft. An inclined plate is provided at the end of the U-shaped frame away from the second transverse electric push rod. A third transverse electric push rod is provided on the shorter side of the L-shaped plate. The output shaft of the third transverse electric push rod is connected to a second suction cup device.

[0014] The above technical solution allows the pre-positioned wafer cassette to be accurately placed in the designated position of the vertical high-temperature furnace, completing the final placement operation of the wafer cassette.

[0015] Furthermore, the central coordination control unit includes a transport trolley control unit, a wafer cassette conveying control unit, a wafer cassette positioning control unit, and a wafer cassette placement control unit, and the central coordination control unit transmits data with the transport trolley control unit, the wafer cassette conveying control unit, the wafer cassette positioning control unit, and the wafer cassette placement control unit respectively via a wireless communication module;

[0016] The transport trolley control unit is electrically connected to the first vertical electric push rod, the first horizontal electric push rod, the laser emitter, and the closed-loop track system in the transport trolley assembly;

[0017] The wafer cassette transport control unit is electrically connected to the second vertical electric push rod in the wafer cassette transport assembly, and controls the transport action of the wafer cassette based on the information fed back by the first laser reflector.

[0018] The wafer box positioning control unit is electrically connected to the electromagnetic tracking trolley, displacement sensor, second laser reflector and first ball screw assembly in the wafer box positioning assembly.

[0019] The wafer cassette placement control unit is electrically connected to the second ball screw assembly, the second transverse electric push rod, the third transverse electric push rod, and the second laser rangefinder in the wafer cassette placement assembly.

[0020] The above technical solution coordinates the control between individual component units.

[0021] Compared with the prior art, the beneficial effects of this utility model are:

[0022] In this invention, a wafer cassette transport device for a vertical high-temperature furnace tube achieves the following effects: 1. Through the close cooperation between the closed-loop track system and the transport trolley assembly, the transport trolley assembly moves along the closed-loop track system to the storage area, descends after laser positioning, grabs the wafer cassette with the first suction cup device, then rises and moves to the placement area. Upon arrival, the wafer cassette positioning assembly uses an electromagnetic tracking trolley, displacement sensor, second laser reflector, and CCD camera to precisely position the wafer cassette. Then, the wafer cassette placement assembly uses a second ball screw assembly, a second lateral electric push rod, a third lateral electric push rod, and a second suction cup device. The coordinated operation accurately places the wafer cassettes at designated positions in the vertical high-temperature furnace. After one transfer and placement cycle, each component, under the coordination of the central control unit, cyclically performs the same operation, achieving continuous transfer and placement. This automates the transfer of wafer cassettes between the storage and placement areas, as well as their placement upon arrival at the placement area. Human intervention is no longer required for long-distance transport; assistance is only needed in the placement area. Secondly, the device automates most of the wafer cassette handling process. Except for the step of removing the wafer cassette from the storage rack and placing it on the pusher, the entire process from wafer cassette gripping and transport to placement requires no direct human intervention, significantly reducing the workload of workers. Simultaneously, the automated transfer device can continuously and stably complete the handling tasks, effectively avoiding production delays caused by insufficient manual handling capacity, ensuring production continuity and efficiency. In large-scale production scenarios, this improves overall production efficiency. Attached Figure Description

[0023] Figure 1This is a schematic diagram illustrating the overall operation of this utility model;

[0024] Figure 2 This is a schematic diagram showing the composition of the various components of this utility model;

[0025] Figure 3 This is a schematic diagram of the components of the transport trolley of this utility model;

[0026] Figure 4 This is a schematic diagram of the wafer box conveying assembly of this utility model;

[0027] Figure 5 This is a schematic diagram of the wafer box positioning component of this utility model;

[0028] Figure 6 This is a schematic diagram of the wafer box placement assembly of this utility model;

[0029] Figure 7 This is a schematic diagram of the central coordination and control unit component of this utility model.

[0030] In the diagram: 1. Storage area; 2. Placement area; 3. Closed-loop track system; 4. Transport trolley assembly; 401. First vertical electric push rod; 402. Trolley body; 403. Support plate; 404. Laser emitter; 405. First suction cup device; 406. First horizontal electric push rod; 5. Wafer box conveying assembly; 501. Frame; 502. Push plate; 503. Second vertical electric push rod; 504. First laser reflector; 6. Wafer box positioning assembly; 601. Electromagnetic tracking trolley; 602. Displacement sensor; 603. Second laser reflector; 604. Second lead screw box; 605. 7. First ball screw assembly; 8. CCD camera; 9. Wafer box placement assembly; 10. First screw box; 11. Second ball screw assembly; 12. L-shaped plate; 13. Second laser rangefinder; 14. Second transverse electric push rod; 15. U-shaped frame; 16. Roller; 17. Third transverse electric push rod; 18. Second suction cup device; 19. Vertical high-temperature furnace; 20. Central coordination control unit; 21. Transport trolley control unit; 22. Wafer box conveying control unit; 33. Wafer box positioning control unit; 44. Wafer box placement control unit; 55. Storage rack. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0032] To facilitate understanding of this utility model, a more comprehensive description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are provided. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0033] Please see Figure 1-7 This embodiment provides a wafer cell transport device for a vertical high-temperature furnace tube, comprising:

[0034] It includes a storage area 1, a placement area 2, and a central coordination and control unit 9. A closed-loop track system 3 is installed on top of the storage area 1 and the placement area 2. Several transport trolley assemblies 4 are mounted on the closed-loop track system 3. The storage area 1 also includes a wafer cassette conveying assembly 5 and several storage racks 10. The placement area 2 also includes a wafer cassette positioning assembly 6, a wafer cassette placement assembly 7, and several vertical high-temperature furnaces 8.

[0035] First, the wafer cassettes on the storage rack 10 are pre-placed onto the push plate 502 of the wafer cassette transport assembly 5. Then, the transport trolley assembly 4 moves along the closed-loop track system 3 to the storage area 1. After laser positioning, it descends and is picked up by the first suction cup device 405. It then rises and moves to the placement area 2. Upon arrival, the wafer cassette positioning assembly 6 uses the electromagnetic tracking trolley 601, displacement sensor 602, second laser reflector 603, and CCD camera 606 to accurately position the wafer cassette. Then, the wafer cassette placement assembly 7 coordinates the actions of the second ball screw assembly 702, the second lateral electric push rod 705, the third lateral electric push rod 708, and the second suction cup device 709 to accurately place the wafer cassette at the designated position in the vertical high-temperature furnace 8. After completing one transfer and placement cycle, each assembly performs the above operations cyclically under the coordination of the central coordination control unit 9 to achieve continuous transfer and placement.

[0036] like Figure 1 and Figure 2 and Figure 4 As shown, the transport trolley assembly 4 includes a first vertical electric push rod 401 fixedly connected to the closed-loop track system 3. The output end of the first vertical electric push rod 401 is provided with a trolley body 402. The bottom end of the trolley body 402 is provided with a support plate 403. A laser emitter 404 is provided on the bottom surface of the support plate 403. A first laser rangefinder is provided on one side of the laser emitter 404. Symmetrical side panels are provided on both sides of the trolley body 402. A first suction cup device 405 is provided on the other side of the trolley body 402. The first suction cup device 405 is connected to a first horizontal electric push rod 406.

[0037] The trolley body 402 moves cyclically along the closed-loop track system 3 until it reaches the storage area 1. At this point, the first laser reflector 504 and the laser emitter 404 are matched, and the trolley body 402 stops moving. The first vertical electric push rod 401 pushes the trolley body 402 down while the first laser rangefinder monitors the descent distance in real time until the support plate 403 and the top of the frame 501 are horizontal. At this point, the first suction cup device 405 approaches the wafer box under the push of the first horizontal electric push rod 406 and pushes the wafer box to the limit of the first horizontal electric push rod 406. Then, the first suction cup device 405 adsorbs the wafer box to prevent it from falling during transportation. Then, the first vertical electric push rod 401 resets, and the trolley body 402 moves towards the placement area 2 along the closed-loop track system 3.

[0038] like Figure 1 and Figure 2 and Figure 4 As shown, the wafer cassette transport assembly 5 includes a frame 501, a pusher plate 502 inside the frame 501, a second vertical electric push rod 503 at the bottom end of the pusher plate 502, and a first laser reflector plate 504 on one side of the outer side of the frame 501.

[0039] Before the main body 402 of the trolley reaches the storage area 1, the wafer cassette on the storage rack 10 is removed manually or by other tools and placed into the push plate 502 inside the frame 501. When the first laser reflector 504 matches the laser emitter 404, the second vertical electric push rod 503 will push the push plate 502 to the limit, at which point the wafer cassette is located at the top of the frame 501.

[0040] like Figure 1 and Figure 2 and Figure 5 As shown, the wafer cassette positioning assembly 6 includes an electromagnetic tracking trolley 601. Wires are embedded along a predetermined path within the placement area 2. A displacement sensor 602 is located on one side of the electromagnetic tracking trolley 601, a second laser reflector 603 is located on one side of the electromagnetic tracking trolley 601, a first lead screw box 701 is located at the top of the electromagnetic tracking trolley 601, a second lead screw box 604 is located on one side of the first lead screw box 701, and a first ball screw assembly 605 is located inside the second lead screw box 604. The first ball screw assembly 605 is connected to a CCD camera 606.

[0041] The electromagnetic tracking trolley 601 is located at the initial point. At this time, the CCD camera 606 captures the placement layer situation inside the vertical high-temperature furnace 8, determines the placement entrance position of each layer, and sends all the data to the central coordination and control unit 9. When the trolley body 402 reaches the placement area 2, the second laser reflector 603 matches with the laser emitter 404, and the trolley body 402 stops moving.

[0042] like Figure 1 and Figure 2 and Figure 6 As shown, the wafer cassette placement assembly 7 includes a second ball screw assembly 702 disposed inside a first ball screw box 701. The second ball screw assembly 702 is connected to an L-shaped plate 703. A second laser rangefinder 704 is disposed at the bottom end of the shorter side of the L-shaped plate 703. A second transverse electric push rod 705 is disposed inside the L-shaped plate 703. The second transverse electric push rod 705 is connected to a U-shaped frame 706. A plurality of rollers 707 are disposed at equal intervals on the inner side wall of the U-shaped frame 706 via a rotating shaft. An inclined plate is disposed at the end of the U-shaped frame 706 away from the second transverse electric push rod 705. A third transverse electric push rod 708 is disposed on the shorter side of the L-shaped plate 703. The output shaft of the third transverse electric push rod 708 is connected to a second suction cup device 709.

[0043] When the trolley body 402 stops moving, the first vertical electric push rod 401 pushes the trolley body 402 downward. Simultaneously, the first laser rangefinder and the second laser rangefinder 704 work together to monitor the descent distance in real time until the support plate 403 is horizontal with the U-shaped frame 706. At this point, the first horizontal electric push rod 406 resets and the first suction cup device 405 stops adsorbing. Then, the first vertical electric push rod 401 resets, causing the trolley body 402 to move upward. At this point, the trolley body 402 is completely detached from the wafer cassette. Simultaneously, the third horizontal electric push rod 708 drives the second... The suction cup device 709 adsorbs the wafer cassette. Then, with the numerical support of the central coordination control unit 9, it works with the second laser rangefinder 704 and displacement sensor 602 to vertically and horizontally move the wafer cassette. Subsequently, the second horizontal electric push rod 705 extends to its limit to drive the wafer cassette into the placement port of the vertical high-temperature furnace 8. Then, the second horizontal electric push rod 705 returns to its original position, and the second suction cup device 709 stops adsorbing. The third horizontal electric push rod 708 returns to its original position at a slower speed than the second horizontal electric push rod 705 to prevent the wafer cassette from detaching from the placement port.

[0044] like Figure 1 and Figure 2 and Figure 7As shown, the central coordination control unit 9 includes a transport trolley control unit 901, a wafer cassette conveying control unit 902, a wafer cassette positioning control unit 903, and a wafer cassette placement control unit 904. The central coordination control unit 9 transmits data to the transport trolley control unit 901, the wafer cassette conveying control unit 902, the wafer cassette positioning control unit 903, and the wafer cassette placement control unit 904 via wireless communication modules. The transport trolley control unit 901 is electrically connected to the first vertical electric push rod 401, the first horizontal electric push rod 406, the laser emitter 404, and the closed-loop track system 3 in the transport trolley assembly 4. The wafer cassette transport control unit 902 is electrically connected to the second vertical electric push rod 503 in the wafer cassette transport assembly 5, and controls the transport action of the wafer cassette according to the information fed back by the first laser reflector 504. The wafer cassette positioning control unit 903 is electrically connected to the electromagnetic tracking trolley 601, displacement sensor 602, second laser reflector 603 and first ball screw assembly 605 in the wafer cassette positioning assembly 6. The wafer cassette placement control unit 904 is electrically connected to the second ball screw assembly 702, second horizontal electric push rod 705, third horizontal electric push rod 708 and second laser rangefinder 704 in the wafer cassette placement assembly 7.

[0045] The working process of this utility model is as follows: When using this type of vertical high-temperature furnace tube wafer cassette transfer device, before the trolley body 402 begins its cyclic displacement along the closed-loop track system 3 and moves towards the storage area 1, the wafer cassettes on the storage rack 10 are manually removed or placed into the push plate 502 inside the frame 501 of the wafer cassette transport assembly 5.

[0046] The electromagnetic tracking trolley 601 is at its initial position. At this time, the first ball screw assembly 605 in the second lead screw box 604 at its top drives the connected CCD camera 606 to photograph the placement layers inside the vertical high-temperature furnace 8, determine the placement entrance position of each layer, and send all relevant data to the central coordination and control unit 9.

[0047] The main body of the vehicle 402 moves cyclically along the closed-loop track system 3 until it reaches the storage area 1. When the first laser reflector 504 aligns with the laser emitter 404 on the bottom surface of the support plate 403 at the bottom of the main body of the vehicle 402, the main body of the vehicle 402 stops moving.

[0048] Based on the information fed back from the first laser reflector 504, the wafer cassette transport control unit 902 controls the second vertical electric push rod 503 at the bottom of the push plate 502 to push the push plate 502 to its limit position. At this point, the wafer cassette is located at the top of the frame 501.

[0049] The first vertical electric push rod 401 pushes the trolley body 402 downwards, while the first laser rangefinder at the bottom of the trolley body 402 monitors the descent distance in real time until the support plate 403 is horizontal with the top of the frame 501. At this time, the first suction cup device 405 approaches the wafer cassette under the push of the first horizontal electric push rod 406 and pushes the wafer cassette to the limit position of the first horizontal electric push rod 406. Then, the first suction cup device 405 adsorbs the wafer cassette to prevent it from falling during transportation. After adsorption is completed, the first vertical electric push rod 401 resets, and the trolley body 402 moves towards the placement area 2 along with the closed-loop track system 3.

[0050] When the main body of the trolley 402 reaches the placement area 2, the second laser reflector 603 in the wafer box positioning assembly 6 matches with the laser emitter 404 on the bottom surface of the bottom support plate 403 of the main body of the trolley 402, and the main body of the trolley 402 stops moving.

[0051] Based on the data on the internal placement layers and entrance positions of the vertical high-temperature furnace 8 previously sent by the CCD camera 606, the central coordination and control unit 9 directs the wafer cell positioning control unit 903 to control the electromagnetic tracking trolley 601 to move along the wires buried along a predetermined path within the placement area 2. The displacement sensor 602 monitors the moving distance and position information of the electromagnetic tracking trolley 601 in real time, providing accurate positioning references for subsequent wafer cell placement.

[0052] When the trolley body 402 stops moving in the placement area 2, the first vertical electric push rod 401 pushes the trolley body 402 down. At the same time, the first laser rangefinder at the bottom of the trolley body 402 works in conjunction with the second laser rangefinder 704 at the bottom of the shorter side of the L-shaped plate 703 in the wafer box placement assembly 7 to monitor the descent distance in real time until the support plate 403 is horizontal with the U-shaped frame 706.

[0053] At this point, the first horizontal electric push rod 406 resets and the first suction cup device 405 stops adsorbing the wafer cassette. Subsequently, the first vertical electric push rod 401 resets, causing the trolley body 402 to move upward, and the trolley body 402 is completely separated from the wafer cassette. Simultaneously, the third horizontal electric push rod 708, located on the shorter side of the L-shaped plate 703, drives the second suction cup device 709 to adsorb the wafer cassette.

[0054] With the numerical support of the central coordination control unit 9, the wafer cassette placement control unit 904, in conjunction with the second laser rangefinder 704 and displacement sensor 602, controls the second ball screw assembly 702 to achieve vertical and horizontal displacement of the wafer cassette, adjusting the wafer cassette to a suitable position.

[0055] The second horizontal electric push rod 705 extends to its limit, driving the U-shaped frame 706 and its internal wafer cassette into the placement opening of the vertical high-temperature furnace 8. Subsequently, the second horizontal electric push rod 705 returns to its original position, and simultaneously, the second suction cup device 709 stops adsorbing the wafer cassette. The third horizontal electric push rod 708 then returns to its original position, but at a slower speed than the second horizontal electric push rod 705, to prevent the wafer cassette from detaching from the placement opening.

[0056] After completing the operation of transferring a wafer cassette from storage area 1 to placement area 2 and accurately placing it into the vertical high-temperature furnace 8, each component, under the coordination and command of the central coordination and control unit 9, resets the electromagnetic tracking trolley 601 to receive the next set of wafer cassettes and continues to cycle through the above operation process to achieve continuous transfer and placement of wafer cassettes to meet the production needs of the vertical high-temperature furnace 8.

[0057] All standard parts used in this application can be purchased from the market. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art. Among them, the ball screw, closed loop track system, electromagnetic tracking trolley, laser rangefinder and CCD camera are all existing mature technologies, so their principles will not be elaborated. The control method is through the central coordination control unit and the box control unit. The control circuit can be implemented by simple circuit connection by those skilled in the art. It is common knowledge in the field, so this application will not explain the control method and circuit connection in detail.

[0058] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer cell transport device for a vertical high-temperature furnace tube, characterized in that: It includes a storage area (1), a placement area (2), and a central coordination and control unit (9). The storage area (1) and the placement area (2) are equipped with a closed-loop track system (3) on top. The closed-loop track system (3) is equipped with several transport trolley components (4). The storage area (1) also includes a wafer box conveying component (5) and several storage racks (10). The placement area (2) also includes a wafer box positioning component (6), a wafer box placement component (7), and several vertical high-temperature furnaces (8).

2. The wafer cassette transport device for a vertical high-temperature furnace tube according to claim 1, characterized in that: The transport trolley assembly (4) includes a first vertical electric push rod (401) fixedly connected to the closed loop track system (3). The output end of the first vertical electric push rod (401) is provided with a trolley body (402). The bottom end of the trolley body (402) is provided with a support plate (403). The bottom surface of the support plate (403) is provided with a laser emitter (404). One side of the laser emitter (404) is provided with a first laser rangefinder. The two sides of the trolley body (402) are symmetrically provided with guardrails. The other side of the trolley body (402) is provided with a first suction cup device (405). The first suction cup device (405) is connected to a first horizontal electric push rod (406).

3. The wafer cassette transport device for a vertical high-temperature furnace tube according to claim 1, characterized in that: The wafer cassette conveying assembly (5) includes a frame (501), a push plate (502) is provided inside the frame (501), a second vertical electric push rod (503) is provided at the bottom end of the push plate (502), and a first laser reflector (504) is provided on the outer side of the frame (501).

4. The wafer cell transport device for a vertical high-temperature furnace tube according to claim 1, characterized in that: The wafer cassette positioning assembly (6) includes an electromagnetic tracking trolley (601), wires are buried along a predetermined path in the placement area (2), and a displacement sensor (602) is provided on one side of the electromagnetic tracking trolley (601). A second laser reflector (603) is provided on one side of the electromagnetic tracking trolley (601). A first lead screw box (701) is provided at the top of the electromagnetic tracking trolley (601). A second lead screw box (604) is provided on one side of the first lead screw box (701). A first ball screw assembly (605) is provided inside the second lead screw box (604). The first ball screw assembly (605) is connected to a CCD camera (606).

5. The wafer cell transport device for a vertical high-temperature furnace tube according to claim 4, characterized in that: The wafer box placement assembly (7) includes a second ball screw assembly (702) disposed inside a first screw box (701). The second ball screw assembly (702) is connected to an L-shaped plate (703). A second laser rangefinder (704) is provided at the bottom of the shorter side of the L-shaped plate (703). A second transverse electric push rod (705) is provided inside the L-shaped plate (703). The second transverse electric push rod (705) is connected to a U-shaped frame (706). A plurality of rollers (707) are provided at equal intervals on the inner side wall of the U-shaped frame (706) through a rotating shaft. An inclined plate is provided at the end of the U-shaped frame (706) away from the second transverse electric push rod (705). A third transverse electric push rod (708) is provided on the shorter side of the L-shaped plate (703). The output shaft of the third transverse electric push rod (708) is connected to a second suction cup device (709).

6. A wafer cell transport device for a vertical high-temperature furnace tube according to any one of claims 1-5, characterized in that: The central coordination control unit (9) includes a transport trolley control unit (901), a wafer cassette conveying control unit (902), a wafer cassette positioning control unit (903), and a wafer cassette placement control unit (904). The central coordination control unit (9) transmits data with the transport trolley control unit (901), the wafer cassette conveying control unit (902), the wafer cassette positioning control unit (903), and the wafer cassette placement control unit (904) respectively via a wireless communication module. The transport trolley control unit (901) is electrically connected to the first vertical electric push rod (401), the first horizontal electric push rod (406), the laser emitter (404), and the closed loop track system (3) in the transport trolley assembly (4); The wafer cassette transport control unit (902) is electrically connected to the second vertical electric push rod (503) in the wafer cassette transport assembly (5), and controls the transport action of the wafer cassette according to the information fed back by the first laser reflector (504); The wafer box positioning control unit (903) is electrically connected to the electromagnetic tracking trolley (601), displacement sensor (602), second laser reflector (603) and first ball screw assembly (605) in the wafer box positioning assembly (6); The wafer cassette placement control unit (904) is electrically connected to the second ball screw assembly (702), the second transverse electric push rod (705), the third transverse electric push rod (708), and the second laser rangefinder (704) in the wafer cassette placement assembly (7).

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