Wafer insertion machine

Abstract

The utility model discloses a wafer insert piece machine, including: wafer box elevating and turnover mechanism, including having box placement part, and the box placement part is configured to place wafer box, and wafer box elevating and turnover mechanism is configured to drive wafer box elevating and turnover, empty wafer box handling mechanism is configured to empty wafer box handling to the box placement part, cleaning frame buffer mechanism, including having first placement site and second placement site, still including having cleaning frame drive mechanism, and cleaning frame drive mechanism is configured to empty full cleaning frame on the first placement site handling to the second placement site, full wafer box handling mechanism is configured to full wafer box on the box placement part handling to the first placement site in the cleaning frame, empty cleaning frame handling mechanism is configured to empty cleaning frame handling to the first placement site, and the scheme can realize the automatic insert piece of wafer piece and handling flow and change, improve production efficiency, avoid the wafer piece loss caused by artificial misoperation.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip technology, and in particular to a wafer insertion machine. Background Technology

[0002] In the semiconductor wafer production process, silicon rods are first cut into wafers using a wire cutter. The wafers are then attached to the wafer holder using a resin plate. The wafer holder and the cut wafers are then placed together into a material frame, which transports them to the debonding station. A debonding machine separates the wafers from the wafers, and the wafers are then sequentially conveyed to subsequent stages such as insertion, cleaning, and drying.

[0003] Currently, wafer insertion for semiconductor wafers is primarily done manually, which is inefficient and prone to causing wafers to bump and knock, resulting in defects such as microcracks, edge chipping, and fragmentation. After each wafer cassette is filled, it is manually moved to the cleaning frame. Empty and full wafer cassettes and cleaning frames all require manual handling and circulation, which is labor-intensive, has a low degree of automation, and even slight carelessness by humans can cause the wafer cassettes to bump, shake, or even fall, causing incalculable losses to wafer manufacturers.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Summary of the Invention

[0005] In response to the problems mentioned in the background art, this invention proposes a wafer insertion machine that realizes automatic wafer insertion and handling, improves production efficiency, and avoids wafer loss caused by human error.

[0006] To achieve the above-mentioned objectives, the present invention employs the following technical solution: In some embodiments of this application, a wafer insertion machine is provided, comprising: A wafer cassette lifting and flipping mechanism includes a cassette placement section configured to place a wafer cassette, and the wafer cassette lifting and flipping mechanism configured to drive the wafer cassette to lift and flip. An empty wafer cassette transport mechanism is configured to transport an empty wafer cassette onto the cassette placement section; The cleaning box buffer mechanism includes a first placement position and a second placement position, and also includes a cleaning box driving mechanism, which is configured to transport a full cleaning box placed on the first placement position to the second placement position. A full wafer cassette transport mechanism is configured to transport a full wafer cassette on the cassette placement section to a cleaning frame on the first placement position; An empty cleaning box transport mechanism is configured to transport the empty cleaning box to the first placement position.

[0007] In some embodiments of this application, the wafer cassette lifting and flipping mechanism includes a lifting part, a flipping part is provided on the lifting part, and the cassette placement part is provided on the flipping part. The lifting part is configured to drive the flipping part to lift and lower, and the flipping part is configured to drive the cassette placement part to flip so that the wafer cassette flips from a vertical position to a horizontal position.

[0008] In some embodiments of this application, the cassette placement portion is provided with a clamping portion, which is configured to clamp the wafer cassette placed on the cassette placement portion.

[0009] In some embodiments of this application, the cassette placement portion includes a base plate and side plates disposed on the base plate, the base plate and the side plates forming a cassette placement space for placing a wafer cassette, and the clamping portion is disposed on one of the side plates.

[0010] In some embodiments of this application, the box placement space includes a first opening and a second opening; wherein, when the box placement part is in a first posture, the first opening faces upward and the second opening faces the wafer loading conveyor line; when the box placement part is in a second posture, the second opening faces upward.

[0011] In some embodiments of this application, the empty wafer cassette transport mechanism, the full wafer cassette transport mechanism, and the empty cleaning frame transport mechanism are mounted on a crossbeam, and the empty wafer cassette transport mechanism, the full wafer cassette transport mechanism, and the empty cleaning frame transport mechanism reciprocate along the crossbeam.

[0012] In some embodiments of this application, the cleaning frame buffer mechanism further includes a first support platform, on which a first placement position and a second placement position are provided; the cleaning frame driving mechanism includes a linear driving part, on which a lifting driving part is provided, and on which a second support platform is provided, the linear driving part drives the lifting driving part to reciprocate between the first placement position and the second placement position, and the lifting driving part drives the second support platform to rise and fall; the first support platform is provided with an opening, and the second support platform protrudes from the opening to support the cleaning frame.

[0013] In some embodiments of this application, the first placement position, the second placement position, and the second support platform are provided with limiting parts for limiting the cleaning frame.

[0014] Compared with the prior art, the advantages and positive effects of this utility model are: The wafer insertion machine disclosed in this application, during wafer insertion, involves an empty wafer cassette transport mechanism picking up an empty wafer cassette from the empty wafer cassette conveyor line and placing it on the cassette placement section; an empty cleaning frame transport mechanism picks up the empty cleaning frame and places it on the first placement position; a wafer, transported from the wafer conveyor line, is inserted into the empty wafer cassette; after the wafer cassette is filled, the full wafer cassette transport mechanism picks up the full wafer cassette and places it into the empty cleaning frame on the first placement position; after the cleaning frame on the first placement position is filled with wafer cassettes, the cleaning frame drive mechanism moves the full cleaning frame to the second placement position; the empty cleaning frame transport mechanism then picks up another new empty cleaning frame and places it on the first placement position; the full cleaning frame on the second placement position is then transported to the subsequent cleaning station by a robotic arm or manually. The entire wafer insertion process requires no manual intervention, achieving automatic wafer insertion and transport, improving production efficiency, and avoiding wafer loss due to human error.

[0015] During the wafer insertion process, the wafer cassette lifting and flipping mechanism drives the vertically positioned wafer cassette to move upward by one wafer interval distance for each inserted wafer. This interval distance is precisely matched with the wafer thickness, ensuring that each wafer is accurately aligned with the slot when inserted, avoiding friction and collision caused by manual alignment deviation. At the same time, the wafer cassette adopts a vertical, open-top design facing the conveyor line, allowing the wafers to smoothly enter the slot along the conveyor line without manual pushing, further reducing contact damage.

[0016] After the wafer cassette is filled with wafers, the wafer cassette lifting and flipping mechanism drives the wafer cassette to rotate smoothly 90° to a horizontal position, avoiding the wafers from slipping or colliding inside the cassette due to sudden stops and turns during manual flipping; the horizontal wafer cassette has its opening facing upwards, which is suitable for the clamping requirements of the subsequent full wafer cassette handling mechanism, and the wafers are stacked vertically inside the cassette, eliminating the risk of gravity compression.

[0017] The cleaning frame buffer mechanism is set with a first placement position and a second placement position. When the cleaning frame in the first placement position is full of wafer cells, the cleaning frame drive mechanism transfers it to the second placement position for buffering. At the same time, the empty cleaning frame transport mechanism immediately replenishes the first placement position with a new empty cleaning frame, realizing the parallel transfer of full frames and the replenishment of new frames, thereby improving production efficiency.

[0018] Other features and advantages of this utility model will become clearer after reading the detailed embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a structural diagram of a wafer insertion and feeding conveyor according to some embodiments; Figure 2 This is a structural diagram of a vertical conveying unit and a side spraying unit according to some embodiments; Figure 3 This is a structural diagram of a flipping conveyor according to some embodiments; Figure 4 This is a structural diagram of a vertical conveyor, a tilting conveyor, and a horizontal conveyor belt according to some embodiments; Figure 5 This is a structural diagram of a defective piece discharge section according to some embodiments; Figure 6 This is a structural diagram of a water tank according to some embodiments; Figure 7 This is a structural diagram of a wafer insertion machine according to some embodiments; Figure 8 This is a partial structural diagram of a wafer insertion machine according to some embodiments; Figure 9 This is a structural diagram of a wafer cassette lifting and flipping mechanism according to some embodiments; Figure 10 This is a structural diagram of a cleaning box buffer mechanism according to some embodiments; Figure 11 This is a structural diagram of an empty wafer cassette transport mechanism, a full wafer cassette transport mechanism, and an empty cleaning frame transport mechanism according to some embodiments.

[0021] Figure label: 1. Wafer insertion and feeding conveyor; 2. Wafer box conveyor; 3. Wafer box; 4. Cleaning frame; 5. Material frame; 6. Wafer; 10. Material frame conveyor; 11. Water tank; 12. Guide rail; 13. Slider; 14. Bearing plate; 15. First detection sensor; 16. Second detection sensor; 20. Vertical conveyor section; 21. First adsorption plate; 22. First conveyor belt; 30. Tilting conveyor section; 31. Second adsorption plate; 32. Second conveyor belt; 33. Upper rotating shaft; 40. Side spray section; 50. Wafer conveyor line; 51. First horizontal conveyor belt; 60. Defective Parts Inspection Department; 70. Defective piece discharge unit; 71. Tilting frame; 72. Second horizontal conveyor belt; 73. Tilting drive unit; 74. Defective piece collection box; 80. Water collection tray; 90. Anti-tipping rollers; 001. Wafer box lifting and flipping mechanism; 011. Box placement part; 012. Lifting part; 013. Flipping part; 014. Clamping part; 015. Base plate; 016. Side plate; 017. First opening; 018. Second opening; 002. Empty wafer box handling mechanism; 021. First lifting part; 022. First lateral moving part; 023. First clamping part; 003, Cleaning frame buffer mechanism; 031, First placement position; 032, Second placement position; 033, Cleaning frame drive mechanism; 034, First support platform; 035, Linear drive unit; 036, Lifting drive unit; 037, Slide rail; 038, Slide plate; 039, Second support platform; 004. Full wafer cassette handling mechanism; 041. Second lifting unit; 042. Second lateral movement unit; 043. Second clamping unit; 005. Empty cleaning frame transport mechanism; 051. Third lifting unit; 052. Third lateral movement unit; 053. Third clamping unit; 006. Empty wafer box conveyor line; 007. Crossbeam. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0024] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0027] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0028] In some embodiments of this application, a wafer insertion machine is provided. Figure 7 This is a structural diagram of a wafer insertion machine. The wafer insertion machine includes a wafer insertion feeding and conveying device 1. Figure 1 This is a structural diagram of a wafer insertion and feeding conveyor device 1. The wafer insertion machine includes a wafer cassette conveyor device 2. Figure 7 This is a structural diagram of a wafer box transport device 2.

[0029] The material frame 5 holds the wafers 6 and supplies them to the wafer insertion and feeding conveyor 1. The wafer insertion and feeding conveyor 1 supplies the wafers 6 to the wafer box 3. The wafers 6 transported by the wafer insertion and feeding conveyor 1 are inserted into the empty wafer box 3. After being filled with wafers, the full wafer box 3 is transferred to the subsequent cleaning, drying and other processes through the cleaning frame 4.

[0030] In some embodiments of this application, reference is made to Figure 1 The wafer insertion feeding and conveying device 1 includes a material frame conveying section 10, which is configured to convey material frames 5.

[0031] The wafer insertion feeding and conveying device 1 includes a vertical conveying section 20, which is located at the end of the material frame conveying section 10. The vertical conveying section 20 is configured to convey the wafer 6 conveyed by the material frame 5 upward in a vertical posture. Figure 2 This is a structural diagram of the vertical conveyor unit 20.

[0032] The wafer insertion feeding and conveying device 1 includes a flipping conveyor 30, which is disposed above the vertical conveyor 20. The flipping conveyor 30 is configured to flip the wafer 6 conveyed by the vertical conveyor 20 to a horizontal position. Figure 3 This is a structural diagram of the flipping conveyor unit 30.

[0033] The wafer insertion and feeding conveyor 1 includes a wafer conveyor line 50, as shown in the reference. Figure 4 The wafer conveyor line 50 is located adjacent to the vertical conveyor section 20, and the wafer conveyor line 50 is configured to receive and convey the wafers 6 conveyed by the flip conveyor section 30.

[0034] The wafer insertion and conveying device 1 includes a defective wafer detection unit 60, as shown in the reference. Figure 1 A defective wafer detection unit 60 is disposed on the wafer transport line 50, and the defective wafer detection unit 60 is configured to detect the quality of the wafers 6 on the wafer transport line 50. The defective wafer detection unit 60 may employ camera detection or other sensors for detection.

[0035] A frame 5 containing wafers 6 is placed on a frame conveyor 10. The frame conveyor 10 drives the frame 5 towards the vertical conveyor 20. The vertical conveyor 20 conveys the wafers 6 in the frame 5 upwards in a vertical position. The wafers 6 move upwards to a flipping conveyor 30, which continues to convey the wafers 6 upwards in a vertical position for a certain distance. Then, the wafers 6 tilt and flip to a horizontal position. The wafer conveyor line 50 receives and conveys the horizontally positioned wafers 6. During the conveying of the wafers 6 along the wafer conveyor line 50, a defective wafer detection unit 60 performs quality inspection on the wafers 6. Defective wafers 6 are discharged, while qualified wafers 6 continue to be conveyed downstream to the wafer cassette 3 for insertion.

[0036] The wafer insertion machine provided in this application achieves automated continuous wafer insertion through the coordinated operation of various devices. Specifically, the material frame conveying unit 10 can stably convey the material frame 5 containing wafers 6, accurately conveying the material frame 5 to the vertical conveying unit 20; the vertical conveying unit 20 can convey the wafers 6 in the material frame 5 upward in a vertical position, realizing the efficient transfer of wafers 6 from the material frame 5 to the subsequent conveying stage; the flipping conveying unit 30 can flip the vertical wafers 6 to a horizontal position, preparing the wafers 6 for entering the wafer conveying line 50; the wafer conveying line 50 can receive and convey the horizontally positioned wafers 6, continuously conveying qualified wafers 6 to the wafer cassette 3 for insertion. The entire process requires no manual intervention, the various devices are smoothly connected, and uninterrupted wafer conveying and insertion operations can be achieved, shortening the wafer insertion time for a single batch, improving the production efficiency of the wafer insertion stage, and thus accelerating the progress of the entire semiconductor wafer production process.

[0037] The defect detection unit 60 installed on the wafer transport line 50 can use camera detection or other sensor detection methods to detect the quality of wafers 6 in real time during the transport process, promptly detect defective wafers 6 and remove them, preventing defective wafers 6 from entering subsequent insertion and processing stages, further ensuring the quality of wafers 6 entering the wafer cassette 3, providing high-quality wafer raw materials for subsequent wafer cleaning, drying and other processing steps, and helping to improve the quality of the final semiconductor product.

[0038] In some embodiments of this application, reference is made to Figure 2 The vertical conveying unit 20 includes a first adsorption plate 21 and a first conveyor belt 22. The first adsorption plate 21 is configured to adsorb the wafer 6 toward the direction of the first conveyor belt 22 so that the wafer 6 is attached to the first conveyor belt 22. The first conveyor belt 22 is configured to drive the wafer 6 to move upward in a vertical posture.

[0039] The first adsorption plate 21 is provided with a plurality of spaced water suction holes (not shown), which are connected to water suction pipes (not shown). When the wafer 6 moves along the vertical conveyor section 20, the liquid on the wafer 6 is drawn into the water suction pipe through the water suction holes under the suction force of the water suction pipe, so that the wafer 6 is adsorbed onto the surface of the first conveyor belt 22.

[0040] Once the wafer 6 is attached to the first conveyor belt 22 by the adsorption of the first adsorption plate 21, the first conveyor belt 22 starts, driving the attached wafer 6 to move upward in the vertical direction. During this process, the adsorption effect of the first adsorption plate 21 continues: on the one hand, the continuous suction force of the water absorption holes counteracts the gravitational component of the wafer 6, preventing the wafer 6 from sliding down due to gravity during upward transport; on the other hand, the adsorption force can limit the lateral displacement (such as left and right offset) of the wafer 6 on the surface of the conveyor belt, so that the wafer 6 always moves along the central axis of the conveyor belt, ensuring the consistency of the transport path of each wafer 6.

[0041] The water absorption holes of the first adsorption plate 21 also serve as liquid removal functions. Residual liquid adhering to the surface of the wafer 6 is drawn into the water absorption pipe through the water absorption holes under the negative pressure of the water absorption pipe.

[0042] In some embodiments of this application, reference is made to Figure 2 The wafer insertion feeding and conveying device 1 also includes a side spray section 40, which is located on the side of the vertical conveying section 20. The side spray section 40 is configured to spray water onto the wafers 6 in the material frame 5 in wafer groups to separate multiple wafers in the wafer group. The vertical conveying section 20 then conveys the wafers 6 after separation upwards in a vertical posture.

[0043] The vertical conveyor section 20 is equipped with side spray sections 40 on both sides, which spray water from both sides of the wafer 6 simultaneously to improve the reliability of wafer 6 slicing.

[0044] In some embodiments of this application, reference is made to Figure 3 The flipping conveyor section 30 includes a second adsorption plate 31 and a second conveyor belt 32. The second adsorption plate 31 is configured to adsorb the wafer 6 toward the direction close to the second conveyor belt 32, so that the wafer 6 is attached to the second conveyor belt 32. The upper end of the second conveyor belt 32 is wrapped around the upper rotating shaft 33. The wafer conveyor line 50 includes a horizontal conveyor belt, referred to as the first horizontal conveyor belt 51, which is adjacent to the flipping conveyor section 30 and is wrapped around the upper rotating shaft 33.

[0045] For example, the second adsorption plate 31 is provided with multiple spaced-apart suction cups (not shown), which adsorb the wafer 6 to make the wafer 6 adhere to the surface of the second conveyor belt 32. The suction cups can be vacuum suction cups or Bernoulli suction cups. The second adsorption plate 31 can also adopt water absorption or other air-exhausting adsorption methods.

[0046] In some embodiments of this application, reference is made to Figure 3 and Figure 4The wafer insertion feeding and conveying device 1 also includes an anti-tipping roller 90, which is located at the intersection of the vertical conveying section 20 and the flipping conveying section 30. For example, the anti-tipping roller 90 is a sponge roller.

[0047] There is a gap between the anti-tipping roller 90 and the first conveyor belt 22 and the second conveyor belt 32. The wafer 6 conveyed by the vertical conveyor section 20 passes through the gap to prevent the vertical wafer 6 from tipping over.

[0048] In some embodiments of this application, reference is made to Figure 1 and Figure 5 The wafer insertion feeding and conveying device 1 also includes a defective wafer discharge section 70, which is configured to remove defective wafers 6 from the wafer conveying line 50.

[0049] In some embodiments of this application, reference is made to Figure 5 The defect discharge section includes a conveying section and a flipping drive section 73. The conveying section is integrated on the wafer conveying line 50, and the flipping drive section 73 is configured to drive the conveying section to flip downward. A defect collection box 74 is provided below the conveying section.

[0050] The conveying unit includes a tilting frame 71, on which a second horizontal conveyor belt 72 is mounted. The tilting drive unit 73 is configured to drive the tilting frame 71 to tilt downwards.

[0051] When the flipping frame 71 is in a horizontal position, the second horizontal conveyor belt 72 and the first horizontal conveyor belt 51 are on the same plane, and together they transport the wafer 6. When a defective wafer 6 is detected in the defective part of the wafer 6, the flipping frame 71 flips downward, and a gap appears between the first conveyor belt 22 and the second conveyor belt 32. The defective wafer 6 falls through this gap into the defective wafer collection box 74 below.

[0052] In some embodiments of this application, the material frame conveying unit 10 includes a water tank 11, which has an inlet and an outlet. A level sensor and a temperature control sensor are also provided on the water tank 11. The water tank 11 also serves as a mounting carrier for other components.

[0053] The material frame 5 is placed in the water tank 11, and a guide rail 12 is provided in the water tank 11. The material frame 5 is configured to move along the guide rail 12 towards the vertical conveyor section 20. Specifically, a slider 13 is provided on the guide rail 12, and a support plate 14 is provided on the slider 13. The slider 13 reciprocates along the guide rail 12 under the drive of the drive mechanism. The material frame 5 is transported onto the support plate 14 by a robot or manually. The support plate 14 is provided with positioning posts (not shown) for positioning the material frame 5.

[0054] In some embodiments of this application, a first detection sensor 15 and a second detection sensor 16 are provided on the water tank 11. The first detection sensor 15 is configured to detect the tail position of the wafer rod in the material frame 5, and the second detection sensor 16 is configured to detect the head position of the wafer rod in the material frame 5.

[0055] The first detection sensor 15 and the second detection sensor 16 can detect the length of the wafer rod in the material frame 5. The system calculates the number of wafers 6 in the current material frame 5 based on the length of the wafer rod, so as to realize the automatic control of the start and stop of the wafer insertion operation of the system.

[0056] In some embodiments of this application, a water receiving tray 80 is provided below the wafer transport line 50 to collect water dripping from the wafer 6.

[0057] In some embodiments of this application, reference is made to Figure 7 and Figure 8 The wafer insertion machine includes a wafer cassette lifting and flipping mechanism 001. (Refer to...) Figure 9 The wafer cassette lifting and flipping mechanism 001 includes a cassette placement part 011, which is configured to place the wafer cassette 3, and the wafer cassette lifting and flipping mechanism 001 is configured to drive the wafer cassette 3 to lift and flip.

[0058] Wafer box 3 is a box structure with an open side. When wafer box 3 is in a vertical orientation, refer to... Figure 9 The opening of wafer cassette 3 faces the wafer transport line 50. Wafers 6, transported from the wafer transport line 50, are inserted into wafer cassette 3 through this opening. When wafer cassette 3 is in a horizontal position, the opening of wafer cassette 3 faces upwards.

[0059] Reference Figure 9 When the wafer cassette 3 is placed on the cassette placement section 011 for wafer insertion, the wafer cassette 3 is in a vertical position. Each time a wafer 6 is inserted, the wafer cassette lifting and flipping mechanism 001 moves the wafer cassette 3 upwards by the distance of one wafer 6. After the wafer cassette 3 is filled with wafers, the wafer cassette lifting and flipping mechanism 001 flips the wafer cassette 3 90° to a horizontal position.

[0060] The wafer insertion machine also includes an empty wafer cassette transport mechanism 002, see reference. Figure 8 and Figure 11 The empty wafer box handling mechanism 002 is configured to handle the empty wafer box 3 onto the box placement section 011.

[0061] The wafer insertion machine also includes a cleaning frame buffer mechanism 003, see reference. Figure 8 and Figure 10The cleaning box buffer mechanism 003 includes a first placement position 031 and a second placement position 032. The cleaning box buffer mechanism 003 also includes a cleaning box driving mechanism 033, which is configured to transport the full cleaning box 4 placed on the first placement position 031 to the second placement position 032.

[0062] The wafer insertion machine also includes a full wafer cassette transport mechanism 004, see reference. Figure 8 and Figure 11 The full wafer cassette transport mechanism 004 is configured to transport the full wafer cassette 3 on the cassette placement section 011 to the cleaning frame 4 on the first placement position 031.

[0063] The wafer insertion machine also includes an empty cleaning frame transport mechanism 005, see reference. Figure 8 and Figure 11 The empty cleaning box transport mechanism 005 is configured to transport the empty cleaning box 4 to the first placement position 031.

[0064] The wafer insertion machine also includes an empty wafer cassette conveyor line 006, see reference. Figure 8 The empty wafer box conveyor line 006 is configured to convey empty wafer boxes 3 to the empty wafer box handling mechanism 002.

[0065] During wafer insertion, the empty wafer cassette transport mechanism 002 picks up an empty wafer cassette 3 from the empty wafer cassette conveyor line 006 and places it on the cassette placement section 011; the empty cleaning frame transport mechanism 005 picks up an empty cleaning frame 4 and places it on the first placement position 031; the wafer 6 conveyed by the wafer conveyor line 50 is inserted into the empty wafer cassette 3; after the wafer cassette 3 is filled with wafers, the full wafer cassette transport mechanism 004 picks up the full wafer cassette 3 and places it into the empty cleaning frame 4 on the first placement position 031; after the cleaning frame 4 on the first placement position 031 is filled with wafer cassette 3, the cleaning frame drive mechanism 033 moves the full cleaning frame 4 to the second placement position 032; the empty cleaning frame transport mechanism 005 picks up another new empty cleaning frame 4 and places it on the first placement position 031; the full cleaning frame 4 on the second placement position 032 is transported to the subsequent cleaning station by a robot or manually.

[0066] During the insertion process, the wafer box lifting and flipping mechanism 001 can drive the vertical wafer box 3 to move upward by a wafer 6 interval distance for each inserted wafer 6. This interval distance is precisely matched with the thickness of the wafer 6, ensuring that each wafer 6 can be accurately aligned with the slot when inserted, avoiding friction and collision caused by manual alignment deviation. At the same time, the wafer box 3 adopts a vertical open-face orientation towards the conveyor line, allowing the wafer 6 to smoothly enter the slot along the conveyor line without manual pushing, further reducing contact damage.

[0067] After the wafer cassette is filled, the wafer cassette lifting and flipping mechanism 001 drives the wafer cassette 3 to rotate smoothly 90° to a horizontal position, avoiding sudden stops and turns during manual flipping that could cause the wafers 6 to slip or collide inside the cassette. The horizontal wafer cassette 3 has its opening facing upwards, which is suitable for the clamping requirements of the subsequent full wafer cassette handling mechanism 004. Furthermore, the wafers 6 are stacked vertically inside the cassette, eliminating the risk of gravity compression.

[0068] The cleaning frame buffer mechanism 003 is set with a first placement position 031 and a second placement position 032. When the cleaning frame 4 in the first placement position 031 is full of wafer cassette 3, the cleaning frame drive mechanism 033 transfers it to the second placement position 032 for buffering. At the same time, the empty cleaning frame transport mechanism 005 immediately replenishes the first placement position 031 with a new empty cleaning frame 4, so as to realize the parallel transfer of full frames and the replenishment of new frames, thereby improving production efficiency.

[0069] In some embodiments of this application, reference is made to Figure 9 The wafer cassette lifting and flipping mechanism 001 includes a lifting part 012, a flipping part 013 on the lifting part 012, and a cassette placement part 011 on the flipping part 013. The lifting part 012 is configured to drive the flipping part 013 to lift and lower, and the flipping part 013 is configured to drive the cassette placement part 011 to flip so that the wafer cassette 3 flips from a vertical position to a horizontal position.

[0070] For example, the lifting part 012 is a lifting cylinder, and the power end of the lifting cylinder is provided with a tilting part 013, which is a tilting cylinder, and the power end of the tilting cylinder is provided with a box placement part 011.

[0071] In some embodiments of this application, a clamping part 014 is provided on the cassette placement part 011. The clamping part 014 is configured to clamp the wafer cassette 3 placed on the cassette placement part 011, thereby improving the stability of the wafer cassette 3 within the cassette placement part 011 and preventing it from falling off. For example, the clamping part 014 is a cylinder.

[0072] In some embodiments of this application, the wafer cassette placement portion 011 includes a base plate 015 and three side plates 016 disposed on the base plate 015. The base plate 015 and the side plates 016 form a wafer cassette placement space for placing the wafer cassette 3. A clamping portion 014 is disposed on one of the side plates 016. The clamping portion 014 applies a force to the wafer cassette 3, clamping and limiting the wafer cassette 3 between the clamping portion 014 and the side plate 016 opposite to the clamping portion 014.

[0073] In some embodiments of this application, the box placement space includes a first opening 017 and a second opening 018.

[0074] When the cassette placement section 011 is in the first position, the first opening 017 faces upwards, and the second opening 018 faces the wafer 6 feeding conveyor line, that is, the second opening 018 faces the wafer conveyor line 50. During wafer insertion, the cassette placement section 011 is in the first position, the empty wafer cassette 3 enters the cassette placement section 011 through the first opening 017, and the wafer 6 is inserted into the wafer cassette 3 through the second opening 018.

[0075] When the cassette placement section 011 is in the second position, the second opening 018 faces upward. After the wafer cassette 3 is filled with wafers, the cassette placement section 011 rotates 90° to the second position. At this time, the opening of the full wafer cassette 3 faces upward, and the full wafer cassette 3 is taken out through the second opening 018.

[0076] In some embodiments of this application, reference is made to Figure 8 Empty wafer box transport mechanism 002, full wafer box transport mechanism 004 and empty cleaning frame transport mechanism 005 are mounted on crossbeam 007 and reciprocate along crossbeam 007.

[0077] The empty wafer cassette transport mechanism 002, the wafer cassette lifting and flipping mechanism 001, the full wafer cassette transport mechanism 004, and the empty cleaning frame transport mechanism 005 are arranged on the same straight line.

[0078] The empty wafer cassette transport mechanism 002 includes a first lifting section 021 and a first lateral section 022. The power end of the first lifting section 021 is equipped with a first clamping section 023, which is driven by the first lifting section 021 to move up and down. The first clamping section 023 is used to clamp the empty wafer cassette 3. The first lateral section 022 moves along the crossbeam 007, driving the entire empty wafer cassette transport mechanism 002 to move laterally. For example, the first lifting section 021 can be a lifting module or a lead screw. For example, the first lateral section 022 can be a motor-driven gear or a lead screw.

[0079] The full wafer cassette transport mechanism 004 is similar to the empty wafer cassette transport mechanism 002. The full wafer cassette transport mechanism 004 includes a second lifting section 041 and a second lateral transport section 042. The power end of the second lifting section 041 is equipped with a second clamping section 043, which drives the second clamping section 043 to move up and down. The second clamping section 043 is used to clamp the full wafer cassette 3. The second lateral transport section 042 moves along the crossbeam 007, driving the entire full wafer cassette transport mechanism 004 to move laterally. For example, the second lifting section 041 can be a lifting module or a lead screw. For example, the second lateral transport section 042 can be a motor-driven gear or a lead screw.

[0080] The empty cleaning box transport mechanism 005 includes a third lifting part 051 and a third lateral moving part 052. The power end of the third lifting part 051 is equipped with a third clamping part 053, which is driven by the third lifting part 051 to move up and down. The third clamping part 053 is used to clamp the empty cleaning box 4. The third lateral moving part 052 moves along the crossbeam 007, driving the entire empty cleaning box transport mechanism 005 to move laterally. For example, the third lifting part 051 can be a lifting module or a lead screw, etc. For example, the third lateral moving part 052 can be a motor-driven gear or a lead screw, etc.

[0081] In some embodiments of this application, reference is made to Figure 10 The cleaning frame buffer mechanism 003 also includes a first support platform 034, on which a first placement position 031 and a second placement position 032 are provided.

[0082] The cleaning frame drive mechanism 033 includes a linear drive unit 035, on which a lifting drive unit 036 is mounted. For example, the linear drive unit 035 includes a slide rail 037, on which a slide plate 038 is mounted, and the slide plate 038 is driven by a cylinder. The lifting drive unit 036 is a cylinder, which is mounted on the slide plate 038.

[0083] A second support platform 039 is provided on the lifting drive unit 036. The linear drive unit 035 drives the lifting drive unit 036 to reciprocate between the first placement position 031 and the second placement position 032, and the lifting drive unit 036 drives the second support platform 039 to rise and fall. An opening is provided on the first support platform 034, and the second support platform 039 protrudes from the opening to support the cleaning frame 4.

[0084] Initially, the second support platform 039 is located at the first placement position 031. The second support platform 039 is not lifted and is lower than the first support platform 034. When the empty cleaning frame 4 is placed on the first placement position 031, the empty cleaning frame 4 contacts the first support platform 034. After the cleaning frame 4 is filled with the wafer cassette 3, the lifting drive unit 036 drives the second support platform 039 to rise. The second support platform 039 carries the full cleaning frame 4 and rises synchronously. At this time, the full cleaning frame 4 is lifted away from the first support platform 034. Then, the linear drive unit 035 drives the second support platform 039 to move to the second placement position 032. After reaching the position, the lifting drive unit 036 drives the second support platform 039 to fall down, and the full cleaning frame 4 falls back onto the first support platform 034. Then, the linear drive unit 035 drives the second support platform 039 back to the first placement position 031 to wait. This process is repeated in sequence.

[0085] In some embodiments of this application, limiting parts (not shown) are provided on the first placement position 031, the second placement position 032, and the second support platform 039 to limit the cleaning frame 4. For example, the limiting part is a limiting block, which stops and limits different sides of the cleaning frame 4.

[0086] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0087] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A wafer insertion machine, characterized in that, Including: A wafer cassette lifting and flipping mechanism includes a cassette placement section configured to place a wafer cassette, and the wafer cassette lifting and flipping mechanism configured to drive the wafer cassette to lift and flip. An empty wafer cassette transport mechanism is configured to transport an empty wafer cassette onto the cassette placement section; The cleaning box buffer mechanism includes a first placement position and a second placement position, and also includes a cleaning box driving mechanism, which is configured to transport a full cleaning box placed on the first placement position to the second placement position. A full wafer cassette transport mechanism is configured to transport a full wafer cassette on the cassette placement section to a cleaning frame on the first placement position; An empty cleaning box transport mechanism is configured to transport the empty cleaning box to the first placement position.

2. The wafer insertion machine according to claim 1, characterized in that, The wafer cassette lifting and flipping mechanism includes a lifting part, a flipping part, and a cassette placement part. The lifting part is configured to drive the flipping part to lift and lower, and the flipping part is configured to drive the cassette placement part to flip so that the wafer cassette flips from a vertical position to a horizontal position.

3. The wafer insertion machine according to claim 2, characterized in that, The cassette placement section is provided with a clamping part, which is configured to clamp the wafer cassette placed on the cassette placement section.

4. The wafer insertion machine according to claim 3, characterized in that, The casing placement section includes a base plate and side plates disposed on the base plate. The base plate and the side plates form a casing placement space for placing wafer casings. The clamping part is disposed on one of the side plates.

5. The wafer insertion machine according to claim 4, characterized in that, The box placement space includes a first opening and a second opening; When the box placement part is in the first posture, the first opening faces upward and the second opening faces the wafer loading and conveying line; when the box placement part is in the second posture, the second opening faces upward.

6. The wafer insertion machine according to any one of claims 1 to 5, characterized in that, The empty wafer cassette transport mechanism, the full wafer cassette transport mechanism, and the empty cleaning frame transport mechanism are mounted on a crossbeam, and the empty wafer cassette transport mechanism, the full wafer cassette transport mechanism, and the empty cleaning frame transport mechanism reciprocate along the crossbeam.

7. The wafer insertion machine according to any one of claims 1 to 5, characterized in that, The cleaning frame buffer mechanism further includes a first support platform, on which the first support platform is provided with the first placement position and the second placement position; The cleaning frame drive mechanism includes a linear drive unit, a lifting drive unit is provided on the linear drive unit, and a second support platform is provided on the lifting drive unit. The linear drive unit drives the lifting drive unit to reciprocate between the first placement position and the second placement position, and the lifting drive unit drives the second support platform to rise and fall. The first support platform has an opening, and the second support platform protrudes from the opening to support the cleaning frame.

8. The wafer insertion machine according to claim 7, characterized in that, The first placement position, the second placement position, and the second support platform are provided with limiting parts to limit the movement of the cleaning frame.

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