Wafer surface defect scanning positioning table

Abstract

The utility model relates to wafer technical field discloses a kind of wafer surface defect scanning positioning table, including device main body, the outer wall of device main body is fixedly connected with placing table, and wafer main body is placed in the top of placing table.The utility model has the following advantages and effects: by setting second detector and piston rod, when detecting wafer surface by positioning table, to improve the effect of detecting wafer surface defect all-round, open second motor by the rotation of first gear, drive second gear rotation, and drive second detector to fixedly placed wafer bottom surface annular detection, the second detector setting under the device top, wafer top surface is synchronously annular detected, and after wafer surface detection, by the centring sliding of piston rod and sliding rod, wafer bottom and both sides are synchronously loosened and disassembled movement, reach the efficiency of improving wafer replenishment detection.

Description

Technical Field

[0001] This utility model relates to the field of wafer technology, and in particular to a wafer surface defect scanning and positioning stage. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seed crystals. Then it is slowly pulled out to form a cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, which is a wafer. During wafer production and processing, a positioning stage is needed to assist in the defect detection operation on the wafer surface.

[0003] According to prior art, CN222855330U discloses a disc granulator, which includes a fixed disc frame, a rotating disc body, an electric telescopic cylinder mechanism, and an automatic dustproof disc cover. The rotating disc body is rotatably mounted inside the fixed disc frame. An automatic dustproof disc cover adapted to the rotating disc body is movably mounted on the front side of the fixed disc frame through a series of electric telescopic cylinder mechanisms arranged in a ring. A dust suction pipe is installed through the end face of the automatic dustproof disc cover away from the rotating disc body near the top. A water tank with a pump is fixedly installed at the center of the end face of the automatic dustproof disc cover away from the rotating disc body. A scraper spraying mechanism is arranged inside the side of the automatic dustproof disc cover near the rotating disc body. Through the fixed disc frame, the electric telescopic cylinder mechanism, and the automatic dustproof disc cover, the rotating disc body can be automatically closed to prevent dust from scattering during the operation of the disc granulator and avoid harm to the operator's eyes, respiratory tract, etc.

[0004] However, while existing defect detection positioning stages can effectively detect defects on the wafer surface, they often rely on an inspection instrument mounted on top to inspect the wafer surface. This method is not very effective for simultaneous circular inspection of the top and bottom sides of the wafer after it has been fixed in place, reducing the effectiveness of comprehensive inspection of the wafer surface. Furthermore, the linkage between wafer fixing and loosening during inspection is not high, which reduces the efficiency of wafer replenishment on the positioning stage. Utility Model Content

[0005] The purpose of this invention is to provide a wafer surface defect scanning and positioning stage that can solve the problems mentioned in the background art, such as the low effect of synchronous ring detection on the upper and lower sides of the wafer, the reduced effect of all-round detection of the wafer surface, and the low linkage between wafer fixing and loosening during wafer detection, which reduces the efficiency of wafer feeding on the positioning stage.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a wafer surface defect scanning and positioning stage, comprising a device body, a placement stage fixedly connected to the outer wall of the device body, a wafer body placed on the top of the placement stage, a first detector located above the wafer body on the top of the device body, a piston rod slidably connected to the inner wall of the placement stage, a negative pressure hole opened on the top of the placement stage, a second motor provided on the outer wall of the device body, a first gear fixedly connected to the output end of the second motor, a second gear sleeved on the outer wall of the first gear meshing with the outer wall of the first gear, and a second detector located below the wafer body on the outer wall of the second gear.

[0007] By adopting the above technical solution, in order to improve the effect of all-round detection of wafer surface defects when inspecting the wafer surface through the positioning stage, the second motor is turned on, and the rotation of the first gear drives the second gear to rotate, which in turn drives the second inspection instrument to perform a ring inspection on the bottom surface of the fixed wafer. At the same time, under the setting of the second inspection instrument set at the top of the device, a synchronous ring inspection is performed on the top surface of the wafer. After the wafer surface is inspected, the bottom and sides of the wafer are simultaneously loosened and disassembled by the centering sliding of the piston rod and the sliding rod, thereby improving the efficiency of wafer replenishment inspection.

[0008] Preferably, the bottom of the main body of the device is fixedly connected to a first electric push rod that is fixedly connected to the outer wall of the piston rod.

[0009] Preferably, a pull rod is rotatably connected to the outer wall of the piston rod, and one end of the pull rod is rotatably connected to a sliding rod that is slidably connected to the outer wall of the device body.

[0010] Preferably, the outer wall of the sliding rod is slidably connected to a limiting rod that is fixedly connected to the outer wall of the device body.

[0011] Preferably, there are two sets of sliding rods and pulling rods, and the positions of the two sets of sliding rods and pulling rods are symmetrical about the central axis of the piston rod.

[0012] Preferably, a pressure relief valve is provided on the outer wall of the placement platform.

[0013] Preferably, the outer wall of the sliding rod is provided with a second electric push rod, one end of which is fixedly connected to a lifting rod that is slidably connected to the inner wall of the sliding rod, and the outer wall of the lifting rod is provided with a first motor, the output end of which is fixedly connected to a rotating block.

[0014] Preferably, the outer wall of the rotating block is provided with a third electric push rod, and one end of the third electric push rod is fixedly connected to a limiting block located on one side of the wafer body.

[0015] Preferably, a second gear and a second detector are also provided on the top of the main body of the device.

[0016] Preferably, a soft silicone pad is provided at the contact point between the inner sidewall of the limiting block and the sidewall of the wafer body.

[0017] The beneficial effects of this utility model are:

[0018] This invention, by setting up a second detector and a piston rod, improves the effectiveness of all-round detection of wafer surface defects when inspecting the wafer surface through the positioning stage. A second motor is activated, and through the rotation of the first gear, the second gear rotates, which in turn drives the second detector to perform a circular inspection of the fixed bottom surface of the wafer. With the second detector located at the top of the device, a synchronous circular inspection of the top surface of the wafer is performed. After inspecting the wafer surface, the piston rod and sliding rod slide together to simultaneously loosen and disassemble the bottom and sides of the wafer, thereby improving the efficiency of wafer replenishment inspection. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the overall structure of this utility model from another direction;

[0022] Figure 3 This is a schematic diagram of the piston rod position distribution structure of this utility model;

[0023] Figure 4 This is a schematic diagram of the connection structure between the first gear and the second gear of this utility model.

[0024] In the diagram, 1. Main body of the device; 2. Placement stage; 3. First detector; 4. Wafer body; 5. First electric push rod; 6. Piston rod; 7. Negative pressure hole; 8. Pull rod; 9. Sliding rod; 10. Limiting rod; 11. Second electric push rod; 12. Lifting rod; 13. First motor; 14. Rotating block; 15. Third electric push rod; 16. Limiting block; 17. Second motor; 18. First gear; 19. Second gear; 20. Second detector. Detailed Implementation

[0025] The technical solution of this utility model will now be clearly and completely described with reference to specific embodiments. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0026] Reference Figure 1-4 A wafer surface defect scanning and positioning stage includes a device body 1, a placement stage 2 fixedly connected to the outer wall of the device body 1, a wafer body 4 to be inspected placed on the top of the placement stage 2, a first detector 3 located on the top of the device body 1 for detecting defects above the wafer body 4, a negative pressure hole 7 opened on the top of the placement stage 2, a piston rod 6 slidably connected to the inner wall of the placement stage 2 for generating negative pressure air pressure in the negative pressure hole 7, a second motor 17 disposed on the outer wall of the device body 1, a second gear 19 sleeved on the outer wall of the placement stage 2, a first gear 18 fixedly connected to the output end of the second motor 17 for driving the second gear 19 to rotate, and a second detector 20 disposed on the outer wall of the second gear 19 for detecting defects below the wafer body 4.

[0027] The device body 1 is fixedly connected to a first electric push rod 5, which is fixedly connected to the outer wall of the piston rod 6. The piston rod 6 forms a lifting structure with the placement stage 2 through the first electric push rod 5, which is conducive to driving the first electric push rod 5 and driving the piston rod 6 to move along the inner wall of the placement stage 2 to achieve the effect of negative pressure adsorption and fixation of the bottom of the wafer body 4.

[0028] Among them, the outer wall of the piston rod 6 is rotatably connected to the pull rod 8, and one end of the pull rod 8 is rotatably connected to the sliding rod 9 which is slidably connected to the outer wall of the main body 1 of the device. The sliding rod 9 forms a sliding structure with the limiting rod 10 through the piston rod 6 and the pull rod 8, which is conducive to the movement of the piston rod 6. Through the connection of the pull rod 8, the sliding rod 9 is driven to slide along the outer wall of the limiting rod 10, so as to achieve the effect of convenient adjustment of the distance between the two sides of the limiting block 16.

[0029] The outer wall of the sliding rod 9 is slidably connected to a limiting rod 10 which is fixedly connected to the outer wall of the main body 1 of the device. This helps to achieve the effect of limiting the sliding of the sliding rod 9 by setting the limiting rod 10.

[0030] The sliding rod 9 and the pulling rod 8 are each provided in two sets. The positions of the two sets of sliding rods 9 and pulling rods 8 are symmetrical about the central axis of the piston rod 6. This is beneficial to achieving the effect of relative sliding of the two sets of sliding rods 9 by setting two sets of sliding rods 9 and pulling rods 8 with their positions symmetrical about the central axis of the piston rod 6.

[0031] The outer wall of the placement platform 2 is equipped with a pressure relief valve, which facilitates the convenient release of air pressure inside the placement platform 2.

[0032] The outer wall of the sliding rod 9 is provided with a second electric push rod 11. One end of the second electric push rod 11 is fixedly connected to a lifting rod 12 that is slidably connected to the inner wall of the sliding rod 9. The outer wall of the lifting rod 12 is provided with a first motor 13. The output end of the first motor 13 is fixedly connected to a rotating block 14. The lifting rod 12 forms a lifting structure with the sliding rod 9 through the second electric push rod 11, which is beneficial to the driving of the second electric push rod 11, which drives the lifting rod 12 to slide along the inner wall of the sliding rod 9, so as to achieve the effect of convenient height adjustment when the wafer is clamped and flipped.

[0033] The outer wall of the rotating block 14 is provided with a third electric push rod 15. One end of the third electric push rod 15 is fixedly connected to a limiting block 16 located on one side of the wafer body 4, which is beneficial to achieve the effect of effectively clamping and fixing both sides of the wafer through the setting of the limiting block 16.

[0034] The device body 1 is also equipped with a second gear 19 and a second detector 20 on its top, which facilitates the simultaneous detection of the upper and lower sides of the wafer.

[0035] The inner sidewall of the limiting block 16 is provided with a soft silicone pad at the contact point with the sidewall of the wafer body 4. This helps to reduce the damage to both sides of the wafer caused by the limiting block 16.

[0036] In this invention, when scanning and detecting defects on the wafer surface, the wafer is first placed on the top of the placement stage 2, adhering to the surface of the negative pressure hole 7. The first electric push rod 5 is then activated, causing the piston rod 6 to slide along the inner wall of the placement stage 2, so that negative pressure gas acts within the negative pressure hole 7 to adsorb and fix the placed wafer. The downward movement of the piston rod 6 is connected to the rotation of the pull rod 8, causing the sliding rod 9 to slide close to the placement stage 2 along the outer wall of the limiting rod 10 for centering. According to the needs of wafers of different widths, the third electric push rod 15 is activated, causing the limiting block 16 to contact the two sides of the wafer, clamping and fixing the two sides of the wafer for detection. After fixing the wafer, the second motor 17 is activated, and through the rotation of the first gear 18, the second gear 19 is driven to rotate, driving the second detector 20 to perform a ring-shaped detection along the upper and lower sides of the wafer, improving the efficiency of omnidirectional detection of the upper and lower sides of the wafer.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer surface defect scanning and positioning stage, comprising a device body (1), characterized in that: The outer wall of the device body (1) is fixedly connected to a placement platform (2), a wafer body (4) is placed on the top of the placement platform (2), a first detector (3) is provided on the top of the device body (1) above the wafer body (4), a piston rod (6) is slidably connected to the inner wall of the placement platform (2), a negative pressure hole (7) is opened on the top of the placement platform (2), a second motor (17) is provided on the outer wall of the device body (1), a first gear (18) is fixedly connected to the output end of the second motor (17), a second gear (19) is meshed with the outer wall of the first gear (18) and sleeved on the outer wall of the placement platform (2), and a second detector (20) is provided on the outer wall of the second gear (19) below the wafer body (4).

2. The wafer surface defect scanning and positioning stage according to claim 1, characterized in that: The bottom of the main body (1) of the device is fixedly connected to a first electric push rod (5) which is fixedly connected to the outer wall of the piston rod (6).

3. The wafer surface defect scanning and positioning stage according to claim 1, characterized in that: The piston rod (6) is rotatably connected to a pull rod (8) on its outer wall, and one end of the pull rod (8) is rotatably connected to a sliding rod (9) that is slidably connected to the outer wall of the device body (1).

4. A wafer surface defect scanning and positioning stage according to claim 3, characterized in that: The outer wall of the sliding rod (9) is slidably connected to a limiting rod (10) which is fixedly connected to the outer wall of the main body (1) of the device.

5. A wafer surface defect scanning and positioning stage according to claim 3, characterized in that: The sliding rod (9) and the pulling rod (8) are provided in two sets, and the positions of the two sets of sliding rods (9) and pulling rods (8) are symmetrical about the central axis of the piston rod (6).

6. A wafer surface defect scanning and positioning stage according to claim 1, characterized in that: The outer wall of the placement platform (2) is equipped with a pressure relief valve.

7. A wafer surface defect scanning and positioning stage according to claim 3, characterized in that: The outer wall of the sliding rod (9) is provided with a second electric push rod (11), one end of the second electric push rod (11) is fixedly connected to a lifting rod (12) that is slidably connected to the inner wall of the sliding rod (9), the outer wall of the lifting rod (12) is provided with a first motor (13), and the output end of the first motor (13) is fixedly connected to a rotating block (14).

8. A wafer surface defect scanning and positioning stage according to claim 7, characterized in that: The outer wall of the rotating block (14) is provided with a third electric push rod (15), and one end of the third electric push rod (15) is fixedly connected to a limiting block (16) located on one side of the wafer body (4).

9. A wafer surface defect scanning and positioning stage according to claim 1, characterized in that: The top of the main body (1) of the device is also provided with a second gear (19) and a second detector (20).

10. A wafer surface defect scanning and positioning stage according to claim 8, characterized in that: A soft silicone pad is provided at the contact point between the inner sidewall of the limiting block (16) and the sidewall of the wafer body (4).

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