An online position correction module and die bonding apparatus

Abstract

The utility model relates to die bonder technical field, specifically disclose an online position correction module and die bonder, including fixed bottom plate, be located the double push position correction board of fixed bottom plate top and install on the reciprocating drive mechanism of fixed bottom plate, wherein, the double push position correction board is equipped with the chip position correction groove that supplies the chip and put into, chip position correction groove chip position correction groove is equipped with the opposite setting and back push groove wall and push groove wall, reciprocating drive mechanism is used for first drive the push groove wall to the chip movement to the direction of pushing the chip to cross the predetermined position to the back push groove wall, then drive the back push groove wall to the chip movement to the direction of pushing the chip to move back to the predetermined position to the push groove wall. The utility model provides an online position correction module and die bonder, can cooperate with die pick-up suction nozzle to complete chip posture adjustment in the online mode, and further improve production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of die bonding equipment technology, and in particular to an online alignment module and die bonding equipment. Background Technology

[0002] Die bonding is a critical process in semiconductor packaging and LED manufacturing. Its core step is to pick up the chip from the blue film and precisely mount it onto the designated position on the substrate. In traditional die bonding equipment, the ejector pin mechanism lifts the chip upwards from the blue film, and the die bonding arm completes the pick-up operation. However, due to factors such as blue film expansion, uneven adhesion, or positional deviations during the ejection process, the chip often suffers from angular offset or inaccurate centering after being picked up, failing to meet the requirements of high-precision mounting. To address this, existing equipment generally incorporates an independent position correction platform: after picking up the chip, the arm must first place it on this correction platform, adjusting it through rotation and / or translation. Once the orientation correction is complete, the arm then picks it up again and transfers it to the substrate for mounting.

[0003] While this correction method can effectively improve the mounting accuracy, it significantly reduces the mounting efficiency per unit time due to the addition of a secondary chip pick-and-place process, becoming a bottleneck restricting the overall capacity improvement of die bonding equipment.

[0004] Therefore, existing die bonding equipment needs to be improved to solve the problem of its inability to complete chip orientation adjustment online, resulting in low production efficiency.

[0005] The information disclosed in this background section is included only to enhance the understanding of the context of this disclosure, and therefore may contain information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0006] One objective of this invention is to provide an online alignment module and die bonding equipment that can work with a die pick-up nozzle to adjust the chip orientation online, thereby improving production efficiency.

[0007] To achieve the above objectives, on the one hand, this utility model provides an online alignment module for pushing a chip adsorbed by a chip picker nozzle to a predetermined position, including a fixed base plate, a double-push alignment plate located above the fixed base plate, and a reciprocating drive mechanism mounted on the fixed base plate;

[0008] The dual-push alignment plate is provided with a chip alignment slot for chip placement, and the chip alignment slot is provided with a push-through slot wall and a push-back slot wall arranged opposite to each other.

[0009] The reciprocating drive mechanism is used to first move the push-through groove wall toward the chip to push the chip past a predetermined position in a direction close to the return groove wall, and then drive the return groove wall toward the chip to push the chip back to the predetermined position in a direction close to the push-through groove wall.

[0010] Optionally, the reciprocating drive mechanism includes:

[0011] A rotary drive mechanism is installed at the bottom of the fixed base plate, and the drive end of the rotary drive mechanism protrudes upward to pass through the fixed base plate;

[0012] The first link, one end of which is fixedly connected to the drive end of the rotary drive mechanism;

[0013] The second link has one end rotatably connected to the other end of the first link;

[0014] The third link has one end rotatably connected to the other end of the second link, and the other end of the third link rotatably connected to the double-push positioning plate.

[0015] Optionally, the double-push positioning plate is slidably connected to the fixed base plate.

[0016] Optionally, the double-push positioning plate is slidably connected to the fixed base plate via a slider guide rail assembly.

[0017] Optionally, the reciprocating drive mechanism is a motor lead screw module with controllable reciprocating stroke.

[0018] Optionally, the slots at both ends of the chip alignment slot have a funnel-shaped structure that gradually expands outward.

[0019] On the other hand, a die bonding device is provided, including a die-picking nozzle for adsorbing chips, a die-bonding swing arm for driving the die-picking nozzle to move, and several of the aforementioned online alignment modules.

[0020] The online alignment module is deployed along the movement path of the crystal pickup nozzle.

[0021] Optionally, the number of online alignment modules is two, and the directions in which the two online alignment modules push the chip are perpendicular to each other.

[0022] Optionally, at least one of the online alignment modules is provided with a lifting and avoidance direct drive mechanism at its bottom to drive the corresponding online alignment module to move up and down.

[0023] The beneficial effects of this utility model are as follows: It provides an online alignment module and die bonding equipment. When the online alignment module is working, firstly, the chip picked up by the die pick-up nozzle is placed in the chip alignment slot of the dual-push alignment plate. The reciprocating drive mechanism is activated, firstly causing the push slot wall to move towards the chip, pushing the chip towards the return push slot wall, so that the chip passes the predetermined position (i.e., slightly exceeds the target alignment point).

[0024] Subsequently, the reciprocating drive mechanism reverses its direction, driving the push-back groove wall towards the chip, pushing the chip back towards the push-back groove wall, and ultimately resetting the chip precisely to the predetermined position. The entire process, through the reciprocating motion of "push-back," eliminates chip positional deviations and achieves high-precision alignment.

[0025] Therefore, the online alignment module and die bonding equipment provided by this utility model can work with the die pick-up nozzle to complete the chip posture adjustment online, thereby improving production efficiency. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A schematic diagram of the die bonding device provided in the embodiment;

[0028] Figure 2 This is a schematic diagram of the structure of the online alignment module provided in the embodiment.

[0029] In the picture:

[0030] 1. Online positioning module;

[0031] 101. Fix the base plate;

[0032] 102. Double-push alignment board; 1021. Chip alignment slot; 1021a. Through-push slot wall; 1021b. Back-push slot wall;

[0033] 103. Reciprocating drive mechanism; 1031. Rotary drive mechanism; 1032. First link; 1033. Second link; 1034. Third link;

[0034] 104. Slider guide rail assembly;

[0035] 2. Crystal pickup nozzle;

[0036] 3. Die-bonding swing arm. Detailed Implementation

[0037] In this utility model, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this utility model, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0038] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit the invention.

[0039] In the description of this utility model, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " generally indicates that the preceding and following objects have an "or" logical relationship.

[0040] In this invention, terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy, or order between these entities or operations.

[0041] Without further limitations, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this invention is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a series of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0042] Similar to the understanding in the Examination Guidelines, in this utility model, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this utility model, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.

[0043] In the description of the embodiments of this utility model, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the convenience of describing the specific embodiments of this utility model or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0044] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this utility model, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this utility model pertains, the specific meaning of the above terms in the embodiments of this utility model can be understood according to the specific circumstances.

[0045] The direct drive mechanism in this invention can be a linear motor, a cylinder, a hydraulic cylinder, or a motor lead screw and slider assembly, etc.; the rotary drive mechanism can be a servo motor, a stepper motor, or a rotary cylinder, etc.

[0046] This invention provides an online alignment module and die bonding equipment, which can work with a die pick-up nozzle to complete chip posture adjustment online, thereby improving production efficiency.

[0047] See Figure 1 This embodiment provides a die bonding device, including a die-picking nozzle 2 for adsorbing chips, a die bonding swing arm 3 for driving the die-picking nozzle 2 to move, and a plurality of online alignment modules 1, wherein the online alignment modules 1 are arranged on the moving path of the die-picking nozzle 2.

[0048] Specifically, see Figure 2 The online alignment module 1 is used to push the chip adsorbed by the crystal picking nozzle 2 to a predetermined position. It includes a fixed base plate 101, a double push alignment plate 102 located above the fixed base plate 101, and a reciprocating drive mechanism 103 mounted on the fixed base plate 101.

[0049] The dual-push alignment plate 102 is provided with a chip alignment slot 1021 for chip placement. The chip alignment slot 1021 is provided with a push-through slot wall 1021a and a push-back slot wall 1021b arranged opposite to each other.

[0050] The reciprocating drive mechanism 103 is used to first move the push-through groove wall 1021a toward the chip to push the chip past a predetermined position in a direction close to the return groove wall 1021b, and then drive the return groove wall 1021b toward the chip to push the chip back to the predetermined position in a direction close to the push-through groove wall 1021a.

[0051] The working process of the die bonding equipment provided in this embodiment is as follows:

[0052] S10: First, the die-bonding arm 3 moves the die-picking nozzle 2 to the top of the chip to pick up the chip, and then the die-bonding arm 3 moves the die-picking nozzle 2 (with the chip adsorbed at the bottom) to the chip alignment slot 1021 of the online alignment module 1.

[0053] S20: The online alignment module 1 calibrates the chip and pushes it to the predetermined position.

[0054] When the online alignment module 1 is working, firstly, the chip picked up by the crystal pick-up nozzle 2 is placed in the chip alignment slot 1021 of the dual-push alignment plate 102. The reciprocating drive mechanism 103 is activated, firstly causing the push-slot wall 1021a to move towards the chip, pushing the chip towards the return push-slot wall 1021b, so that the chip passes the predetermined position (i.e., slightly exceeds the target alignment point).

[0055] Subsequently, the reciprocating drive mechanism 103 reverses its action, driving the push-back groove wall 1021b toward the chip, pushing the chip back toward the push-over groove wall 1021a, and finally resetting the chip precisely to the predetermined position. The entire process, through the reciprocating action of "push-back," eliminates the chip's positional deviation and achieves high-precision alignment.

[0056] It should be noted that because the pick-up nozzle 2 and the chip are kept relatively stationary through vacuum adsorption, as long as the lateral thrust of the slot wall is sufficient to overcome the vacuum suction of the pick-up nozzle 2, the chip can be pushed laterally, causing it to shift laterally relative to the pick-up nozzle 2. During this lateral movement, the vacuum suction remains constant, preventing the chip from falling downwards. Furthermore, due to the vacuum suction, even if the chip has not been pushed past the slot wall 1021a, it will immediately stop moving when the push-back ends, instead of continuing to drift forward due to inertia and causing the retraction to fail.

[0057] By pushing through the pusher wall 1021a and pushing back through the pusher wall 1021b, the chip can be precisely aligned to the predetermined position. This online alignment method eliminates the need for secondary chip handling, achieving online alignment and significantly improving the production efficiency of the die bonding equipment.

[0058] S30: After calibration, the pick-up nozzle 2 continues to move to the substrate position for mounting.

[0059] In this embodiment, the double-push positioning plate 102 is slidably connected to the fixed base plate 101, and the reciprocating drive mechanism 103 includes:

[0060] A rotary drive mechanism 1031 is installed on the bottom of the fixed base plate 101, and the drive end of the rotary drive mechanism 1031 extends upward to pass through the fixed base plate 101.

[0061] The first link 1032, one end of which is fixedly connected to the drive end of the rotary drive mechanism 1031;

[0062] The second link 1033, one end of which is rotatably connected to the other end of the first link 1032;

[0063] The third link 1034, one end of which is rotatably connected to the other end of the second link 1033, and the other end of which is rotatably connected to the double push positioning plate 102.

[0064] Furthermore, the double-push alignment plate 102 is slidably connected to the fixed base plate 101 via a slider guide rail assembly 104. The slider guide rail assembly 104 further optimizes the accuracy and smoothness of the sliding connection, enhances the guidance of movement through the push groove wall 1021a, extends the service life, and improves the repeatability of the alignment.

[0065] The reciprocating drive mechanism 103 provided in this embodiment is an ingenious linkage mechanism. The motion of the entire system is driven entirely by the continuous rotation of the rotary drive mechanism 1031. The linkage mechanism converts the rotational motion into sequential linear motion of the two slot walls. Its detailed working process is as follows:

[0066] (1) Initial / Reset Stage: When the drive end (such as the motor shaft) of the rotary drive mechanism 1031 rotates to a certain angle, the double-push alignment plate 102 is positioned at one end of its stroke through the transmission of the first connecting rod 1032, the second connecting rod 1033, and the third connecting rod 1034. At this time, the double-push alignment plate 102 is kept stable on the fixed base plate 101 by the slider guide rail assembly 104. The chip is placed into the chip alignment slot 1021 by the chip pick-up nozzle 2.

[0067] (2) Over-push correction stage (over-push groove wall 1021a action): The rotary drive mechanism 1031 rotates continuously in one direction, and its drive end pushes or pulls the second link 1033 through the first link 1032. The power is transmitted to the third link 1034 through the second link 1033. Since the third link 1034 is hinged to the double push alignment plate 102, and the movement of the double push alignment plate 102 is restricted by the slider guide rail assembly 104 to only slide in a straight line, the linkage mechanism converts the rotational motion into the linear motion of the double push alignment plate 102. In the first half cycle of the rotation at the drive end (e.g., 0° to 180°), the linkage mechanism drives the double push alignment plate 102 to slide, so that the over-push groove wall 1021a faces and contacts the chip, pushes the chip to move in the direction of the back push groove wall 1021b, and makes the chip center cross the predetermined target position.

[0068] (3) Reverse positioning stage (reverse push groove wall 1021b action): The rotary drive mechanism 1031 continues to rotate in the same direction, entering the second half of the cycle (e.g., 180° to 360°). The motion trajectory of the linkage mechanism changes, and it begins to drive the double push alignment plate 102 to slide in the opposite direction. At this time, the over-push groove wall 1021a moves away from the chip, while the reverse push groove wall 1021b begins to face and contact the other side of the chip, pushing the chip back towards the over-push groove wall 1021a, and finally accurately positioning the chip in the predetermined position.

[0069] (4) Cycle preparation: After the drive end of the rotary drive mechanism 1031 completes one cycle (360°), the double push alignment plate 102 completes one "over-push-back push" reciprocating motion and returns to the vicinity of the initial position, ready to carry out the next alignment cycle.

[0070] It is understandable that the above linkage mechanism drive scheme, through a single rotation drive, utilizes the natural change in the force transmission direction of the linkage mechanism at different phases (the conversion between pull and push) to automatically and mechanically realize the complex timing action of "advancing through the push groove wall 1021a while simultaneously pushing back to avoid it, and then advancing through the push groove wall 1021b while simultaneously retreating through the push groove wall 1021a".

[0071] Furthermore, the two ends of the chip alignment slot 1021 are flared outwards in a trumpet shape, which facilitates the chip to enter and exit the chip alignment slot 1021 laterally and reduces the risk of interference.

[0072] In some other embodiments, the reciprocating drive mechanism 103 can also be a motor screw module with controllable reciprocating stroke. First, it drives forward with a large stroke to push the double-push alignment plate 102 over, and then drives backward with a small stroke to push the double-push alignment plate 102 back, which can also realize the alignment of the chip.

[0073] Optionally, the number of online alignment modules 1 is two, and the directions in which the two online alignment modules 1 push the chip are perpendicular to each other. At least one of the online alignment modules 1 has a lifting and avoidance direct drive mechanism at its bottom that drives the corresponding online alignment module 1 to move up and down.

[0074] The chip pick-up nozzle 2 passes through two online alignment modules 1 in sequence. The first online alignment module 1 pushes and pushes back along the X direction to correct the chip's position in the X direction. The second online alignment module 1 pushes and pushes back along the Y direction to correct the chip's position in the Y direction, thereby achieving precise two-dimensional position correction.

[0075] In this embodiment, when alignment is required: the lifting and avoiding direct drive mechanism drives the online alignment module 1 to rise to the working height for chip calibration. After alignment is completed: the lifting and avoiding direct drive mechanism immediately drives the online alignment module 1 to descend back to the low position to avoid interference or collision with the moving chip.

[0076] In some other embodiments, the opening direction of the chip alignment slot 1021 of the first online alignment module 1 can be aligned with the moving path of the chip pick-up nozzle 2. In this case, the chip can pass directly through the online alignment module 1 as if passing through a tunnel without interference. Theoretically, this platform can be fixed in height and does not need to be set up with a lifting and avoidance direct drive mechanism.

[0077] Accordingly, the opening direction of the chip alignment slot 1021 of the second online alignment module 1 must be perpendicular to the chip movement path. This means that the solid part of the dual-push alignment plate 102 will directly block the chip's movement path. Therefore, a lifting and obstacle avoidance direct drive mechanism can be set only at the bottom of the second online alignment module 1: when the chip needs to be aligned in the second online alignment module 1, the second online alignment module 1 rises to work; when the chip needs to be moved into or out of this position, the second online alignment module 1 must be lowered, so that the dual-push alignment plate 102 is lowered below the chip's movement path, thereby making room for the chip to pass.

[0078] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. An online positioning module for pushing a chip adsorbed by a chip-collecting nozzle (2) to a predetermined position, characterized in that, It includes a fixed base plate (101), a double-push positioning plate (102) located above the fixed base plate (101), and a reciprocating drive mechanism (103) mounted on the fixed base plate (101). The dual-push alignment plate (102) is provided with a chip alignment slot (1021) for chip placement. The chip alignment slot (1021) is provided with a push-through slot wall (1021a) and a push-back slot wall (1021b) arranged opposite to each other. The reciprocating drive mechanism (103) is used to first move the push-through groove wall (1021a) toward the chip to push the chip past a predetermined position in a direction close to the push-back groove wall (1021b), and then drive the push-back groove wall (1021b) toward the chip to push the chip back to the predetermined position in a direction close to the push-through groove wall (1021a).

2. The online positioning module according to claim 1, characterized in that, The reciprocating drive mechanism (103) includes: A rotary drive mechanism (1031) is installed at the bottom of the fixed base plate (101), and the drive end of the rotary drive mechanism (1031) extends upward to pass through the fixed base plate (101). The first link (1032) has one end fixedly connected to the drive end of the rotary drive mechanism (1031); The second link (1033) has one end rotatably connected to the other end of the first link (1032); The third link (1034) has one end rotatably connected to the other end of the second link (1033) and the other end rotatably connected to the double push positioning plate (102).

3. The online positioning module according to claim 2, characterized in that, The double-push positioning plate (102) is slidably connected to the fixed base plate (101).

4. The online positioning module according to claim 3, characterized in that, The double-push positioning plate (102) is slidably connected to the fixed base plate (101) via the slider guide rail assembly (104).

5. The online positioning module according to claim 1, characterized in that, The reciprocating drive mechanism (103) is a motor screw module with controllable reciprocating stroke.

6. The online positioning module according to claim 1, characterized in that, The chip alignment slot (1021) has a horn-shaped structure with the slot openings at both ends gradually expanding outwards.

7. A die bonding apparatus, characterized in that, It includes a chip pick-up nozzle (2) for adsorbing chips, a die-bonding swing arm (3) for moving the chip pick-up nozzle (2), and several online alignment modules (1) as described in any one of claims 1-6. The online alignment module (1) is located on the moving path of the crystal picking nozzle (2).

8. The die bonding apparatus according to claim 7, characterized in that, The number of online alignment modules (1) is two, and the directions in which the two online alignment modules (1) push the chip are perpendicular to each other.

9. The die bonding apparatus according to claim 8, characterized in that, At least one of the online alignment modules (1) is provided with a lifting and avoidance direct drive mechanism at its bottom, which drives the corresponding online alignment module (1) to move up and down.

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