Wafer debonding jig

Abstract

The utility model provides a kind of wafer debonding jig, belong to semiconductor manufacturing technology field;Solve the problem that the existing process generally exists long debonding time, consumes wax removal solution, difficult operation;The jig includes bottom support and handle, wherein bottom support is used to support bonded glass holder and wafer, and bottom support is hollow annular tray, and the large ring of annular tray is used to support the periphery of glass holder, so that the wafer in the middle of glass holder is exposed from the small ring inside annular tray;The bottom of bottom support is provided with at least two supporting feet;Handle is arranged on the side of bottom support, at least one is set, for placing the jig with bonded glass holder and wafer into debonding wax removal solution;The utility model can realize the rapid debonding between bonded wafer and glass holder.

Description

Technical Field

[0001] This invention provides a wafer debonding fixture, belonging to the field of semiconductor manufacturing technology. Background Technology

[0002] In the production of semiconductor lasers, the thickness of the epitaxial wafer needs to be controlled at around 100µm to meet the equipment processing requirements. In many cases, during mechanical back-side grinding and polishing, the wafer needs to be temporarily bonded to a glass substrate, and then debonded after thinning and polishing.

[0003] Currently, the commonly used bonding and debonding method involves bonding the wafer and glass substrate with wax, and then removing the wax layer by immersion in a dewaxing solution after thinning and polishing to achieve debonding. Existing debonding processes on the market typically involve placing the attached wafer glass substrate upside down in a culture dish filled with dewaxing solution (wafer facing down) and waiting 1 hour or longer to complete the debonding process.

[0004] When wafers are bonded to glass substrates using beeswax, they undergo a pressing process using a wafer press, resulting in a very tight bond between the wafer and the substrate. During debonding, the substrate presses the wafer to the bottom, preventing the dewaxing solution from fully contacting the wafer and the interlayer beeswax, leading to excessively long debonding times. During production, personnel cannot visually confirm whether the wafer has completely detached from the substrate and must repeatedly lift and hold the substrate to verify. When removing the substrate after debonding, there is a risk of it slipping and falling, damaging the wafer, when handled with tweezers. Furthermore, the spillage of dewaxing solution during substrate removal also causes unnecessary waste. Utility Model Content

[0005] To address the problems of long debonding time, high consumption of dewaxing solution, and difficult operation in existing processes, this invention proposes a wafer debonding fixture.

[0006] The technical solution adopted by this utility model is as follows: a wafer debonding fixture, including a base and a handle, wherein the base is used to support the bonded glass tray and wafer, the base is a hollow annular tray, the large ring of the annular tray is used to support the periphery of the glass tray, so that the wafer in the middle of the glass tray is exposed from the small ring of the annular tray; the bottom of the base is provided with at least two support feet; the handle is provided on the side of the base, at least one handle is provided, for placing the fixture containing the bonded glass tray and wafer into the debonding wax solution.

[0007] Furthermore, the base is a hollow annular tray, with the inner diameter of the larger ring of the annular tray being larger than the diameter of the circular glass tray, and the inner diameter of the smaller ring of the annular tray being smaller than the diameter of the circular wafer.

[0008] Furthermore, the base is a hollow square or rectangular ring-shaped tray.

[0009] Furthermore, the base has two symmetrical handles on its side.

[0010] Furthermore, the bottom of the base is provided with three equally spaced support feet.

[0011] Optionally, the fixture may be made entirely of polytetrafluoroethylene (PTFE).

[0012] Optionally, the entire fixture can be 3D printed in one piece.

[0013] Optionally, the fixture may be integrally molded using a thermoplastic process.

[0014] The advantages of this utility model over the prior art are as follows: 1. The fixture design allows the glass tray to be suspended in the air, exposing part of the wafer and immersing it completely in the dewaxing solution; 2. The fixture is designed with a lifting arm, so that after the wafer is detached, the fixture and glass holder can be directly removed from the dewaxing solution; 3. Improved results: The debonding step can be completed in about 1 minute, and the glass holder is easy to remove and not easy to fall off. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings: Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 This is a front view of the present invention; Figure 3 This is a side view of the present invention; Figure 4 This is a top view of the present invention; In the picture: 1 is the base, 2 is the handle, and 3 is the support foot. Detailed Implementation

[0016] like Figure 1-4 As shown, this utility model provides a wafer debonding fixture, including a base 1 and a handle 2. The base 1 is used to support the bonding glass tray and the wafer. The base 1 is a hollow annular tray. The large ring of the annular tray supports the periphery of the glass tray, so that the wafer in the middle of the glass tray is exposed from the small ring of the annular tray, allowing the wafer to be completely immersed in the dewaxing solution. The bottom of the base 1 is provided with at least two support feet 3, which are used to ensure the stability of the entire fixture. The handle 2 is provided on the side of the base 1, with at least one handle, for placing the fixture containing the bonding glass tray and the wafer into the debonding solution, and removing the fixture and the glass tray from the dewaxing solution after debonding is completed.

[0017] To ensure effectiveness, this embodiment features a large ring with an inner diameter of 114mm, a wall thickness of 2.8mm, a depth of 6mm, a small ring with an inner diameter of 105mm, a depth of 2.8mm, a support foot height of 3mm, and a handle height of 100mm.

[0018] The working principle of this utility model is as follows: Before debonding, the glass tray is preheated to the preheating temperature for a period of time, and the dewaxing liquid is preheated to the preheating temperature for a period of time. Then, the glass tray and wafer to be debonded are placed on the base tray 1 with the wafer facing down. The fixture is placed into the preheated dewaxing liquid through the handle 2. According to the preheating temperature and time, the debonding step can be completed in about 1 minute.

[0019] The preheating temperature can be set between 95-105℃, the preheating time for the glass holder is 3-5 minutes, and the preheating time for the dewaxing liquid is 35-40 minutes.

[0020] Several specific implementation examples are given below. Example

[0021] The bottom of the base 1 is provided with three supporting feet 3, and the side of the base 1 is provided with two symmetrical handles 2, and the handles 2 are hollow in the middle. The entire fixture is made of high temperature and corrosion resistant polytetrafluoroethylene material, which can be 3D printed in one piece.

[0022] When using the glass holder, the preheating temperature is 101℃ and the preheating time is 3 minutes. The dewaxing liquid is heated at 101℃ and the preheating time is 35 minutes. Example

[0023] The bottom of the base 1 is provided with two support feet 3, which are long strips. The side of the base 1 is provided with a handle 2, which is hollow in the middle. The entire fixture is made of high temperature and corrosion resistant polytetrafluoroethylene material and can be integrally molded by injection molding process.

[0024] When using, the glass holder should be preheated to 98℃ for 4 minutes, and the dewaxing liquid should be preheated to 98℃ for 38 minutes. Example

[0025] The bottom of the base 1 is provided with four support feet 3, which are cylindrical in shape. The sides of the base 1 are provided with two symmetrical handles 2, and the handles 2 are hollow in the middle. The entire fixture is made of high temperature and corrosion resistant polytetrafluoroethylene material and can be 3D printed in one piece.

[0026] When using, the glass holder should be preheated to 95℃ for 5 minutes, and the dewaxing liquid should be preheated to 95℃ for 40 minutes. Example

[0027] The base 1 is a hollow square ring tray, suitable for rectangular or square glass trays and wafers. The bottom of the base 1 is provided with four support feet 3, which are cylindrical in shape. The two short sides of the base 1 are provided with two symmetrical handles 2, and the handles 2 are hollow in the middle. The entire fixture is made of high temperature and corrosion resistant polytetrafluoroethylene material and can be 3D printed in one piece.

[0028] When using the glass holder, the preheating temperature is 103℃ and the preheating time is 3 minutes. The dewaxing liquid is heated at 103℃ and the preheating time is 35 minutes.

[0029] Regarding the specific structure of this utility model, it should be noted that the connection relationships between the various component modules adopted in this utility model are definite and achievable. Except as specifically described in the embodiments, their specific connection relationships can bring about corresponding technical effects and solve the technical problems proposed by this utility model without relying on the execution of corresponding software programs. The models of the components, modules, and specific components appearing in this utility model, the connection methods between them, and the conventional usage methods and expected technical effects brought about by the above-mentioned technical features, unless specifically described, are all publicly disclosed content in patents, journal articles, technical manuals, technical dictionaries, and textbooks that can be obtained by those skilled in the art before the application date, or belong to conventional technology, common knowledge, and other existing technologies in this field. There is no need to elaborate, which makes the technical solution provided in this case clear, complete, and achievable, and can reproduce or obtain corresponding physical products based on this technical means.

[0030] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A wafer debonding fixture, characterized in that: The device includes a base and a handle. The base is used to support the bonded glass tray and wafer. The base is a hollow annular tray. The large ring of the annular tray supports the periphery of the glass tray, allowing the wafer in the center of the glass tray to protrude from the small ring of the annular tray. The bottom of the base is provided with at least two support feet. The handle is provided on the side of the base, with at least one handle, for placing the fixture containing the bonded glass tray and wafer into the debonding wax solution.

2. The wafer debonding fixture according to claim 1, characterized in that: The base is a hollow circular tray. The inner diameter of the larger ring of the circular tray is larger than the diameter of the circular glass tray, while the inner diameter of the smaller ring of the circular tray is smaller than the diameter of the circular wafer.

3. The wafer debonding fixture according to claim 1, characterized in that: The base is a hollow square or rectangular ring-shaped tray.

4. A wafer debonding fixture according to claim 1, characterized in that: The base has two symmetrical handles on its side.

5. A wafer debonding fixture according to claim 1, characterized in that: The bottom of the base has three equally spaced support feet.

6. A wafer debonding fixture according to any one of claims 1-5, characterized in that: The fixture is made entirely of polytetrafluoroethylene (PTFE).

7. A wafer debonding fixture according to any one of claims 1-5, characterized in that: The entire fixture is 3D printed in one piece.

8. A wafer debonding fixture according to any one of claims 1-5, characterized in that: The fixture is integrally molded using thermoplastic technology.

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