Wafer box transfer mechanism and transfer system

Abstract

The utility model discloses a wafer transfer mechanism and transfer system, mechanism includes clamping jaw subassembly and conveyance subassembly, clamping jaw subassembly is used for holding the wafer box of being equipped with wafer, and conveyance subassembly is used for driving clamping jaw subassembly moves along the first target path, clamping jaw subassembly includes the first clamping piece and the second clamping piece of opposite setting and limiting post, and the both ends of limiting post are connected with the first clamping piece and the second clamping piece respectively, and the target gap is separated between the first clamping piece and the second clamping piece, and the target gap is determined based on the thickness of wafer box, clamping jaw subassembly is installed on conveyance subassembly through micro motion subassembly, and micro motion subassembly is used for driving clamping jaw subassembly to micro motion to the direction of being away from wafer box after limiting post contacts wafer box to avoid the collision to wafer box. The present application improves wafer box transfer efficiency, and reduces the damage probability to wafer in the transfer process.

Description

Technical Field

[0001] This utility model belongs to the field of wafer transfer technology, specifically relating to a wafer box transfer mechanism and transfer system. Background Technology

[0002] Wafers are the core material in semiconductor manufacturing, and their production process involves multiple steps, including photolithography, etching, ion implantation, and chemical vapor deposition. Wafer transfer is a crucial step in semiconductor manufacturing, involving the safe and efficient transfer of wafers from one location to another for subsequent processing and testing. Current transfer processes are inefficient, and due to issues with robotic grippers, wafers are easily damaged, affecting product quality. Utility Model Content

[0003] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a wafer transfer mechanism and wafer transfer system, which solves the problems of low transfer efficiency and easy damage to wafers during the wafer transfer process in the prior art.

[0004] According to one aspect of this application, a wafer transfer mechanism is disclosed, including a gripper assembly and a transport assembly. The gripper assembly is detachably mounted on the transport assembly. The gripper assembly is used to grip a wafer cassette containing wafers. The transport assembly is used to drive the gripper assembly to move along a first target path to transfer the transfer cassette from a first target position to a second target position. The gripper assembly includes a limiting post and a first clamping member and a second clamping member disposed opposite to each other. One end of the limiting post is connected to the first clamping member, and the other end of the limiting post is connected to the second clamping member. A target gap is spaced between the first clamping member and the second clamping member. The target gap is determined based on the thickness of the wafer cassette. The gripper assembly is mounted on the transport assembly via a micro-motion component. The micro-motion component is used to drive the gripper assembly to move slightly away from the wafer cassette after the limiting post contacts the wafer cassette, so as to avoid collision with the wafer cassette.

[0005] In some embodiments, the gripper assembly is mounted on the micro-motion assembly via a mounting base.

[0006] In some embodiments, the first clamping member includes a first clamping plate and a first mounting plate, and the second clamping member includes a second clamping plate and a second mounting plate. The first clamping plate is located above the second clamping plate. One end of the first mounting plate is connected to the first clamping plate, and the other end of the first mounting plate is mounted on the mounting base. The second mounting plate is located below the first mounting plate. One end of the second mounting plate is connected to the second clamping plate, and the other end of the second mounting plate is mounted on the mounting base.

[0007] In some embodiments, an anti-disengagement hook is provided on the non-connecting end of the first clamping plate. The anti-disengagement hook extends from the first clamping plate toward the second clamping plate for a target length, and the target length is determined based on the groove depth of the wafer cassette.

[0008] In some embodiments, a ramp is provided on the non-connecting end of the second clamping plate, the ramp being inclined from the first plate surface of the second clamping plate to the second plate surface of the second clamping plate.

[0009] In some embodiments, the target gap is adjustable.

[0010] According to another aspect of this application, a wafer transfer system is also disclosed, the system including a transport mechanism and the wafer transfer mechanism described in any of the preceding claims, the transport component including a transport box and a transport component, the transport box being detachably mounted on the transport component, the transport box being used to place multiple wafer cassettes at intervals, the transport component being used to drive the transport box to move along a second target path to transport the transport box from a third target position to a fourth target position, wherein the second target path is perpendicular to the first target path.

[0011] In some embodiments, the baggage handling component is configured as a sliding component, and the baggage case is mounted on the sliding component to slide along the second target path under the action of the sliding component, so as to achieve movement from the third target position to the fourth target position.

[0012] In some embodiments, the shipping case includes a first partition and a second partition disposed opposite to each other. The first partition has a plurality of first slots spaced apart, and the second partition has a plurality of second slots spaced apart. The first slots and the second slots are disposed opposite to each other and correspond one-to-one. The wafer cassette is supported by the first slots and the second slots.

[0013] In some embodiments, the shipping mechanism further includes a guide plate, the guide plate being disposed within a slider of the sliding assembly, the slider sliding relative to the guide plate.

[0014] This utility model includes, but is not limited to, the following beneficial effects: (1) The gripper assembly of this application can be detachably installed on the transport assembly, which improves the convenience of maintenance and replacement of the gripper assembly, and also facilitates the upgrading and customization of the gripper assembly; (2) The gripper of this application can match the thickness and groove depth of the wafer box, ensuring the clamping and positioning of the wafer box and improving the transfer efficiency of the wafer box; (3) By setting the micro-motion component, this application can avoid collisions with the wafer box, reduce collision damage to the wafer, and help improve product quality; (4) The combined use of the gripper assembly and the transport assembly can realize automated transfer, reduce manual intervention, improve production efficiency, reduce human error, and reduce labor costs; (5) The first The non-connecting end of the clamping plate is equipped with an anti-disengagement hook, which can cooperate with the slot of the wafer box to hook the wafer box and improve the stability of the wafer box during the transfer process; (6) By setting a ramp, it is convenient for the second clamping plate to extend into the bottom of the wafer box, which improves the clamping efficiency of the clamping claw on the wafer box; (7) By setting a shipping mechanism, the shipping box can be transported to the fourth target position. The cooperation between the shipping mechanism and the transfer mechanism distributes the overall transfer path of the transfer system to the shipping mechanism and the transfer mechanism to be completed together, which can reduce the transfer path length of the transfer mechanism and improve the overall transfer efficiency of the wafer box; (8) By setting a guide plate, the sliding guidance of the shipping components can be realized, which improves the stability of the shipping box during the shipping process. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0016] Figure 1 This is a schematic diagram of the transfer mechanism according to an embodiment of the present utility model; Figure 2 This is a partial schematic diagram of the transfer mechanism according to an embodiment of the present utility model; Figure 3 This is a schematic diagram of the transfer system according to an embodiment of the present invention; Figure 4 This is a partial enlarged view of the transfer system at point I according to an embodiment of the present invention; Figure 5 This is a plan view of the transfer system of this utility model from one angle; Figure 6 This is another plan view of the transfer system according to this utility model embodiment; In the figure, 1-transfer mechanism, 11-gripper assembly, 111-first clamping component, 1111-first clamping plate, 1112-first mounting plate, 1113-anti-disengagement hook, 112-second clamping component, 1121-second clamping plate, 1122-second mounting plate, 1123-ramp, 113-limiting post, 12-transport component, 13-micro-motion component, 131-slider, 132-slide groove, 14-mounting seat, 2-shipment mechanism, 21-shipment box, 211-wafer box, 22-shipment component, 23-guide plate. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0018] According to one aspect of this application, a wafer transfer mechanism is disclosed, specifically, as follows: Figure 1 and Figure 2 As shown, the wafer transfer mechanism 1 includes a gripper assembly 11 and a transport assembly 12. The gripper assembly 11 is detachably mounted on the transport assembly 12. The gripper assembly 11 is used to grip the wafer cassette 211 containing the wafer. The transport assembly 12 is used to drive the gripper assembly 11 to move along a first target path to transfer the transfer cassette from the first target position to the second target position. The gripper assembly 11 includes a limiting post 113 and a first clamping member 111 and a second clamping member 112 disposed opposite to each other. One end of the limiting post 113 is connected to the first clamping member 111, and the other end of the limiting post 113 is connected to the second clamping member 112. A target gap is spaced between the first clamping member 111 and the second clamping member 112. The target gap is determined based on the thickness of the wafer cassette 211. The gripper assembly 11 is mounted on the transport assembly 12 via the micro-motion assembly 13. The micro-motion assembly 13 is used to drive the gripper assembly 11 to move slightly away from the wafer cassette 211 after the limiting post 113 contacts the wafer cassette 211, so as to avoid collision with the wafer cassette 211.

[0019] The first target position can be the initial position where the wafer cassette 211 needs to be transferred, and the second target position can be the position where the wafer cassette 211 will proceed to the next process after being transferred. In this embodiment, the transport component 12 moves linearly based on a linear guide rail. In this embodiment, the gripper component 11 is detachably mounted on the transport component 12, improving the convenience of maintenance and replacement of the gripper component 11, and also facilitating upgrades and customization of the gripper component 11. Furthermore, the grippers of this application can match the thickness and groove depth of the wafer cassette 211, ensuring the clamping and positioning of the wafer cassette 211 and improving the transfer efficiency of the wafer cassette 211. Moreover, by setting the micro-motion component 13, this application can avoid collisions with the wafer cassette, reducing collision damage to the wafer and helping to improve product quality. Furthermore, the cooperative use of the gripper component 11 and the transport component 12 can realize automated transfer, reduce manual intervention, improve production efficiency, reduce human error, and reduce labor costs.

[0020] In some embodiments, the gripper assembly 11 is mounted on the micro-motion assembly 13 via a mounting base 14. In one example, the micro-motion assembly 13 is configured as a linear guide assembly, including a groove 132 and a slider 131, the slider 131 sliding within the groove 132, and the linear guide assembly being controlled by a cylinder. The slider 131 is connected to the transport assembly 12, and the groove 132 is mounted on the mounting base 14.

[0021] In some embodiments, the first clamping member 111 includes a first clamping plate 1111 and a first mounting plate 1112, and the second clamping member 112 includes a second clamping plate 1121 and a second mounting plate 1122. The first clamping plate 1111 is located above the second clamping plate 1121. One end of the first mounting plate 1112 is connected to the first clamping plate 1111, and the other end of the first mounting plate 1112 is mounted on the mounting base 14. The second mounting plate 1122 is located below the first mounting plate 1112. One end of the second mounting plate 1122 is connected to the second clamping plate 1121, and the other end of the second mounting plate 1122 is mounted on the mounting base 14. It is understood that the relative arrangement of the first clamping plate 1111 and the second clamping plate 1121 provides a stable clamping space, ensuring the stability of the wafer cassette 211 during transport. The first mounting plate 1112 and the second mounting plate 1122 are respectively connected to their respective clamping plates and mounted on the mounting base 14. This design allows the gripper assembly 11 to be adjusted vertically to accommodate wafer cassettes 211 of different thicknesses. Furthermore, the vertical arrangement of the first mounting plate 1112 and the second mounting plate 1122 helps save space, making the entire gripper assembly 11 more compact and easier to integrate into automated equipment with limited space.

[0022] In some embodiments, an anti-disengagement hook 1113 is provided on the non-connecting end of the first clamping plate 1111. The anti-disengagement hook 1113 extends from the first clamping plate 1111 towards the second clamping plate 1121 by a target length, the target length being determined based on the groove depth of the wafer cassette 211. In one example, the anti-disengagement hook 1113 can be cylindrical, triangular, or rectangular. The specific shape can be set according to actual needs and is not specifically limited here. By providing the anti-disengagement hook 1113, it can cooperate with the groove of the wafer cassette 211 to hook the wafer cassette 211, improving the stability of the wafer cassette 211 during the transfer process.

[0023] In some embodiments, a ramp 1123 is provided on the non-connecting end of the second clamping plate 1121, and the ramp 1123 is inclined from the first plate surface of the second clamping plate 1121 to the second plate surface of the second clamping plate 1121. By providing the ramp 1123, it is convenient for the second clamping plate 1121 to extend into the bottom of the wafer cassette 211, thereby improving the clamping efficiency of the grippers on the wafer cassette 211.

[0024] In some embodiments, the target gap is adjustable. It is understood that by adjusting the target gap, the grippers can be adapted to wafer cassettes 211 of different thicknesses, thereby improving the scalability of the transfer mechanism 1 of this application.

[0025] According to another aspect of this application, a wafer transfer system is also disclosed, specifically, as follows: Figures 3 to 6 As shown, the system includes a transport mechanism 2 and a wafer transfer mechanism 1 as described above. The transport assembly 22 includes a transport box 21 and the transport assembly 22. The transport box 21 is detachably mounted on the transport assembly 22. Multiple wafer cassettes 211 are spaced apart inside the transport box 21. The transport assembly 22 drives the transport box 21 along a second target path to transport the transport box 21 from a third target position to a fourth target position. The second target path is perpendicular to the first target path. Specifically, the second target path being perpendicular to the first target path can mean that the second target path is spatially perpendicular to the first target path.

[0026] In some embodiments, the transport component 22 is configured as a sliding component, and the transport box 21 is mounted on the sliding component to slide along the second target path under the drive of the sliding component, thereby realizing the movement from the third target position to the fourth target position. The third target position may coincide with the first target position. By setting the transport mechanism 2, the transport box 21 can be transported to the fourth target position. The coordinated operation of the transport mechanism 2 and the transfer mechanism 1 distributes the overall transfer path of the transfer system to be completed jointly by the transport mechanism 2 and the transfer mechanism 1, which can reduce the transfer path length of the transfer mechanism 1 and improve the overall transfer efficiency of the wafer cassette 211. In some embodiments, the shipping case 21 includes a first partition and a second partition disposed opposite to each other. The first partition is provided with a plurality of first slots spaced apart, and the second partition is provided with a plurality of second slots spaced apart. The first slots and the second slots are disposed opposite to each other and correspond one to one. The wafer cassette 211 is supported by the first slots and the second slots.

[0027] In some embodiments, the shipping mechanism 2 further includes a guide plate 23, which is spaced within the sliding member of the sliding assembly, and the sliding member slides relative to the guide plate. It is understood that by providing the guide plate 23, the shipping assembly 22 can be guided to slide, improving the stability of the baggage box 21 during shipping.

[0028] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A wafer cassette transfer mechanism, characterized in that, The transfer mechanism (1) includes a gripper assembly (11) and a transport assembly (12). The gripper assembly (11) is detachably mounted on the transport assembly (12). The gripper assembly (11) is used to grip the wafer cassette (211) containing the wafer. The transport assembly (12) is used to drive the gripper assembly (11) to move along a first target path to transfer the transfer box from the first target position to the second target position. The gripper assembly (11) includes a limiting post (113) and a first clamping member (111) and a second clamping member (112) disposed opposite to each other. One end of the limiting post (113) is connected to the first clamping member (111), and the other end of the limiting post (113) is connected to the second clamping member (112). A target gap is spaced between the first clamping member (111) and the second clamping member (112), and the target gap is determined based on the thickness of the wafer cassette (211). The gripper assembly (11) is mounted on the transport assembly (12) via a micro-motion assembly (13). The micro-motion assembly (13) is used to drive the gripper assembly (11) to move slightly away from the wafer cassette (211) after the limiting post (113) contacts the wafer cassette (211) in order to avoid collision with the wafer cassette (211).

2. The wafer cassette transfer mechanism according to claim 1, characterized in that, The gripper assembly (11) is mounted on the micro-motion assembly (13) via a mounting base (14).

3. The wafer cassette transfer mechanism according to claim 2, characterized in that, The first clamping member (111) includes a first clamping plate (1111) and a first mounting plate (1112). The second clamping member (112) includes a second clamping plate (1121) and a second mounting plate (1122). The first clamping plate (1111) is located above the second clamping plate (1121). One end of the first mounting plate (1112) is connected to the first clamping plate (1111), and the other end of the first mounting plate (1112) is mounted on the mounting base (14). The second mounting plate (1122) is located below the first mounting plate (1112). One end of the second mounting plate (1122) is connected to the second clamping plate (1121), and the other end of the second mounting plate (1122) is mounted on the mounting base (14).

4. The wafer cassette transfer mechanism according to claim 3, characterized in that, An anti-disengagement hook (1113) is provided on the non-connection end of the first clamping plate (1111). The anti-disengagement hook (1113) extends from the first clamping plate (1111) toward the direction close to the second clamping plate (1121) by a target length. The target length is determined based on the groove depth of the wafer cassette (211).

5. The wafer cassette transfer mechanism according to claim 3, characterized in that, A ramp (1123) is provided on the non-connecting end of the second clamping plate (1121), and the ramp (1123) is inclined from the first plate surface of the second clamping plate (1121) to the second plate surface of the second clamping plate (1121).

6. The wafer cassette transfer mechanism according to claim 1, characterized in that, The target gap is adjustable.

7. A transfer system, characterized in that, The system includes a shipping mechanism (2) and a wafer transfer mechanism as described in any one of claims 1-6, and further includes a shipping box (21) and a shipping assembly (22). The shipping box (21) is detachably mounted on the shipping assembly (22). The shipping box (21) is used to place multiple wafer cassettes (211) at intervals. The shipping assembly (22) is used to drive the shipping box (21) to move along a second target path to transport the shipping box (21) from a third target position to a fourth target position, wherein the second target path is perpendicular to the first target path.

8. The transfer system according to claim 7, characterized in that, The transport component (22) is configured as a sliding component, and the transport box (21) is mounted on the sliding component to slide along the second target path under the drive of the sliding component, so as to realize the movement from the third target position to the fourth target position.

9. The transfer system according to claim 7, characterized in that, The shipping container (21) includes a first partition and a second partition arranged opposite to each other. The first partition has a plurality of first slots spaced apart, and the second partition has a plurality of second slots spaced apart. The first slots and the second slots are arranged opposite to each other and correspond one-to-one. The wafer cassette (211) is supported by the first slots and the second slots.

10. The transfer system according to claim 8, characterized in that, The shipping mechanism (2) also includes a guide plate (23), which is spaced within the sliding member of the sliding assembly, and the sliding member slides relative to the guide plate (23).

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