A multi-point clamping device for wafer production

Abstract

The utility model relates to the technical field of semiconductor, disclose a kind of multi-point clamping device for wafer production, including support assembly, telescopic component, adsorption component and rotating component. Telescopic component is adjusted clamping range by telescopic link and connecting rod, and wafer edge clamping is realized in cooperation with clamping block;Adsorption component and the suction cup of rotating component generate negative pressure by air pump, respectively in different circumstances adsorption wafer bottom;The motor drive lifting platform of rotating component drives wafer lifting and rotation. The device realizes the multi-point stable clamping and flexible operation of wafer, is suitable for wafer production process, is compatible with different thickness and size wafer, can be completed clamping, lifting, rotating operation without repositioning, process conversion time is shortened, and production continuity is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, specifically to a multi-point clamping device for wafer production. Background Technology

[0002] In the wafer manufacturing process, clamping and transfer are critical steps that directly affect the processing accuracy and yield of wafers. As the basic material for high-precision electronic components, wafers have a smooth surface and a brittle texture. They can crack or deform even under slight uneven external force. Therefore, the stability, accuracy, and safety requirements of the clamping device are extremely high.

[0003] A search revealed existing technology (application number: CN202222670798.3), which describes a "wafer slicing clamping device." This utility model features a structure in which a long shaft and clamping arms cooperate to form clamping points on the outer circumferential surface of a silicon ingot. When the end of the silicon ingot is sliced ​​by a slicing machine, the silicon ingot does not wobble or vibrate, overcoming the phenomenon of slicing plane misalignment and improving the slicing quality of the wafer.

[0004] However, although existing technologies have structures such as long shafts and clamping arms that work together to form clamping points on the outer circumference of the silicon ingot, preventing the silicon ingot from shaking or vibrating when the end of the silicon ingot is sliced ​​by the slicing machine, thus overcoming the phenomenon of slicing plane misalignment and improving the slicing quality of the wafer, there are still some shortcomings: traditional devices mostly use mechanical claws for single-point or two-point clamping, with a fixed clamping range, making it difficult to adapt to wafers of different specifications. In addition, the contact area between the mechanical claw and the edge of the wafer is small, which can easily cause the edge of the wafer to crack due to excessive local pressure. The lifting and rotating mechanisms of existing devices are mostly designed separately, with poor linkage and low adjustment accuracy. Furthermore, repositioning is required when changing processes, which reduces production efficiency. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a multi-point clamping device for wafer production.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a multi-point clamping device for wafer production, comprising: a support assembly disposed on the ground; a telescopic assembly, one end of which is fixedly connected to the support assembly and the other end of which is slidably connected to the support assembly; an adsorption assembly disposed on the support assembly; and a rotating assembly disposed on the support assembly; wherein the rotating assembly comprises: a second air pump disposed on the support assembly; an air supply pipe, one end of which is fixedly connected to the second air pump; and a lifting assembly disposed on the support assembly and fixedly connected to the other end of the air supply pipe.

[0007] As a further description of the above technical solution: The support assembly includes: a bracket, which is set on the ground; a first guide rod, which is fixedly connected to the upper side of the bracket; and a second guide rod, which is fixedly connected to the lower side of the bracket.

[0008] As a further description of the above technical solution: The telescopic assembly includes: a support block fixedly connected to the support assembly; two sets of first connecting rods, one end of which is rotatably connected to the support block; a rotating shaft rotatably connected to the other end of the first connecting rod; two sets of second connecting rods, one end of which is rotatably connected to the rotating shaft; a first telescopic rod, both ends of which are fixedly connected to the two sets of rotating shafts respectively; a telescopic base rotatably connected to the other end of the two sets of second connecting rods and slidably connected to the first guide rod; a second telescopic rod, one end of which is fixedly connected to the telescopic base; and a clamping base fixedly connected to the other end of the second telescopic rod.

[0009] As a further description of the above technical solution: The adsorption assembly includes: a first air pump, mounted on a support assembly; an air inlet pipe, one end of which is fixedly connected to the first air pump; a support base, fixedly connected to the other end of the air inlet pipe; and a first suction cup, mounted on the support base.

[0010] As a further description of the above technical solution: The lifting assembly includes: a base plate, mounted on a support assembly; a motor, mounted on the base plate; a lifting platform, fixedly connected to the output end of the motor; and a second suction cup, mounted on the lifting platform.

[0011] As a further description of the above technical solution: A clamping block is fixedly connected to the clamping base for pressing the wafer.

[0012] As a further description of the above technical solution: The first suction cup and the second suction cup, under the control of the first air pump and the second air pump respectively, adsorb wafers through the air pump under different working conditions.

[0013] This utility model has the following beneficial effects: The clamping block of the telescopic component works in conjunction with the suction cups of the adsorption and rotation components to form a multi-point clamping structure, which has high adsorption stability and prevents the wafer from slipping or being damaged during operation. The telescopic component is adjustable via the first and second telescopic rods, covering a wide range of wafer sizes. The clamping force is adjustable and compatible with wafers of different thicknesses and sizes. The telescopic and rotation components are linked, so clamping, lifting, and rotation operations can be completed without repositioning, shortening process changeover time and improving production continuity. Attached Figure Description

[0014] Figure 1 This is a front view of a multi-point clamping device for wafer production proposed in this utility model; Figure 2 This is a schematic diagram of the structure of a telescopic component of a multi-point clamping device for wafer production proposed in this utility model; Figure 3 This is a left view of a multi-point clamping device for wafer production proposed in this utility model; Figure 4 This is a schematic diagram of the lifting assembly of a multi-point clamping device for wafer production proposed in this utility model; Legend: 1. Support assembly; 11. Bracket; 12. First guide rod; 13. Second guide rod; 2. Telescopic assembly; 21. Support block; 22. First connecting rod; 23. Rotating shaft; 24. Second connecting rod; 25. First telescopic rod; 26. Telescopic base; 27. Second telescopic rod; 28. Clamping base; 29. ​​Clamping block; 3. Adsorption assembly; 31. First air pump; 32. Air inlet pipe; 33. Support base; 34. First suction cup; 4. Rotating assembly; 41. Second air pump; 42. Air supply pipe; 43. Lifting assembly; 431. Base plate; 432. Motor; 433. Lifting platform; 434. Second suction cup. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0017] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. Example

[0018] like Figures 1 to 4 As shown, this embodiment provides a multi-point clamping device for wafer production, comprising: a support assembly 1, disposed on the ground; a telescopic assembly 2, one end of which is fixedly connected to the support assembly 1, and the other end of which is slidably connected to the support assembly 1; an adsorption assembly 3, disposed on the support assembly 1; and a rotating assembly 4, disposed on the support assembly 1. The rotating assembly 4 comprises: a second air pump 41, disposed on the support assembly 1; an air supply pipe 42, one end of which is fixedly connected to the second air pump 41; and a lifting assembly 43, disposed on the support assembly 1 and fixedly connected to the other end of the air supply pipe 42.

[0019] In this embodiment, the telescopic component and the lifting component constitute a multi-point clamping device for wafer production according to this application.

[0020] It should also be noted that the second air pump 41 provides negative pressure to the lifting assembly 43 through the air supply pipe 42, and the lifting assembly 43 realizes wafer adsorption and rotation.

[0021] Specifically, the support assembly 1 includes: a bracket 11, which is set on the ground; a first guide rod 12, which is fixedly connected to the upper side of the bracket 11; and a second guide rod 13, which is fixedly connected to the lower side of the bracket 11.

[0022] In this embodiment, the first guide rod 12 and the second guide rod 13 restrict the sliding direction of the telescopic assembly 2.

[0023] Specifically, the telescopic assembly 2 includes: a support block 21, fixedly connected to the support assembly 1; two sets of first connecting rods 22, one end of which is rotatably connected to the support block 21; a rotating shaft 23, rotatably connected to the other end of the first connecting rod 22; two sets of second connecting rods 24, one end of which is rotatably connected to the rotating shaft 23; a first telescopic rod 25, both ends of which are fixedly connected to the two sets of rotating shafts 23 respectively; a telescopic base 26, rotatably connected to the other end of the two sets of second connecting rods 24, and slidably connected to the first guide rod 12; a second telescopic rod 27, one end of which is fixedly connected to the telescopic base 26; and a clamping base 28, fixedly connected to the other end of the second telescopic rod 27.

[0024] In this embodiment, the first telescopic rod 25 extends and retracts, causing the first connecting rod 22 and the second connecting rod 24 to rotate around the rotating shaft 23, adjusting the distance between the telescopic base 26 and the support block 21; the second telescopic rod 27 extends and retracts, driving the clamping base 28 to move closer to or away from the wafer.

[0025] Specifically, the adsorption component 3 includes: a first air pump 31, which is mounted on the support component 1; an air inlet pipe 32, one end of which is fixedly connected to the first air pump 31; a support base 33, which is fixedly connected to the other end of the air inlet pipe 32; and a first suction cup 34, which is mounted on the support base 33.

[0026] In this embodiment, the first air pump 31 draws air through the air inlet pipe 32, and the first suction cup 34 generates negative pressure to adsorb the upper surface of the wafer.

[0027] Specifically, the lifting assembly 43 includes: a base plate 431, which is mounted on the support assembly 1; a motor 432, which is mounted on the base plate 431; a lifting platform 433, which is fixedly connected to the output end of the motor 432; and a second suction cup 434, which is mounted on the lifting platform 433.

[0028] With this configuration, motor 432 drives lifting platform 433 to achieve lifting and rotation, and second suction cup 434 adsorbs the lower surface of the wafer.

[0029] Specifically, a clamping block 29 is fixedly connected to the clamping base 28 for pressing the wafer.

[0030] Among them, the clamping block 29 directly contacts the edge of the wafer, increasing the contact area and avoiding scratches.

[0031] Specifically, the first suction cup 34 and the second suction cup 434, under the control of the first air pump 31 and the second air pump 41 respectively, adsorb wafers through the air pump under different working conditions.

[0032] In this embodiment, the suction cup is controlled by a corresponding air pump to generate negative pressure under different working conditions, so as to achieve wafer fixation without damage.

[0033] In practical use, the operating principle is as follows: First, the operator activates the first telescopic rod 25 according to the size of the wafer being processed, causing the first connecting rod 22 and the second connecting rod 24 to rotate and extend, moving the support base 33 to the designated position. Then, the first air pump 31 is activated, and the wafer is placed on the first suction cup 34 and fixed. The second telescopic rod 27 is then controlled to extend and retract, bringing the clamping base 28 to the designated position, so that the clamping block 29 lightly presses on the surface of the wafer to ensure its flatness and prevent the wafer from breaking or shifting under high-speed mechanical force. If it is necessary to change the processing position, the first air pump 31 must be turned off to stop the operation. The wafer is adsorbed onto the first suction cup 34. The lifting platform 433 is raised and the second air pump 41 is turned on, so that the wafer is adsorbed onto the second suction cup 434. The motor 432 is turned on to rotate the lifting platform 433 to change the wafer processing position. Then the lifting platform 433 is lowered to the original position. The second air pump 41 is turned off and the first air pump 31 is turned on, so that the wafer is adsorbed onto the first suction cup 34 again for processing. To prevent the air supply pipe 42 from getting tangled on the surface of the lifting platform 433 when it rotates, if the lifting platform 433 needs to be processed for the other half turn after rotating half a turn in one direction, it needs to be rotated in the opposite direction.

[0034] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multi-point clamping device for wafer fabrication, characterized in that: include: Support component (1) is set on the ground; The telescopic component (2) is fixedly connected to the support component (1) at one end and slidably connected to the support component (1) at the other end; Adsorption component (3) is disposed on support component (1); Rotating component (4) is mounted on support component (1); The rotating assembly (4) includes: The second air pump (41) is mounted on the support assembly (1); The gas supply pipe (42) is fixedly connected at one end to the second gas pump (41); The lifting assembly (43) is mounted on the support assembly (1) and fixedly connected to the other end of the gas supply pipe (42).

2. The multi-point clamping device for wafer production according to claim 1, characterized in that: The support component (1) includes: The bracket (11) is set on the ground; The first guide rod (12) is fixedly connected to the upper side of the bracket (11); The second guide rod (13) is fixedly connected to the lower side of the bracket (11).

3. A multi-point clamping device for wafer manufacturing according to claim 2, characterized in that: The telescopic component (2) includes: The support block (21) is fixedly connected to the support assembly (1); The first link (22) is in two sets, with one end rotatably connected to the support block (21); The pivot (23) is rotatably connected to the other end of the first connecting rod (22); The second link (24) is in two sets, with one end rotatably connected to the rotating shaft (23); The first telescopic rod (25) is fixedly connected at both ends to two sets of rotating shafts (23); The telescopic base (26) is rotatably connected to the other end of the two sets of second connecting rods (24) and slidably connected to the first guide rod (12); The second telescopic rod (27) is fixedly connected at one end to the telescopic base (26); The clamping base (28) is fixedly connected to the other end of the second telescopic rod (27).

4. A multi-point clamping device for wafer manufacturing according to claim 3, characterized in that: The adsorption component (3) includes: The first air pump (31) is mounted on the support assembly (1); The air intake pipe (32) is fixedly connected at one end to the first air pump (31); The support base (33) is fixedly connected to the other end of the intake pipe (32); The first suction cup (34) is mounted on the support base (33).

5. A multi-point clamping device for wafer manufacturing according to claim 4, characterized in that: The lifting assembly (43) includes: The base plate (431) is mounted on the support assembly (1); The motor (432) is mounted on the base plate (431); The lifting platform (433) is fixedly connected to the output end of the motor (432); The second suction cup (434) is mounted on the lifting platform (433).

6. A multi-point clamping device for wafer manufacturing according to claim 5, characterized in that: A clamping block (29) is fixedly connected to the clamping base (28) for pressing the wafer.

7. A multi-point clamping device for wafer production according to claim 6, characterized in that: The first suction cup (34) and the second suction cup (434) adsorb wafers under different working conditions under the control of the first air pump (31) and the second air pump (41), respectively.

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