An automatic blow cleaning machine clamping mechanism

Abstract

The utility model provides a kind of automatic blow machine clamping mechanism, including chassis, the top surface of chassis is connected with bearing table, and the outer periphery of bearing table is equipped with pre-positioning clamping mechanism, and pre-positioning clamping mechanism includes at least one swingable pre-positioning clamping assembly and the first drive mechanism of driving pre-positioning clamping assembly swing.The free end of pre-positioning clamping assembly is equipped with the first air bag towards bearing table.Pre-positioning clamping assembly is connected with two-stage clamping mechanism.The first drive mechanism drives pre-positioning clamping assembly swing, to drive the first air bag contact wafer edge and complete pre-positioning, subsequently two-stage clamping mechanism act and exert clamping force to wafer.The utility model can realize uniform clamping to wafer, avoid the rupture or microcrack of brittle material due to concentrated locking force, improve the safety and reliability of clamping process.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, and specifically relates to an automatic purging machine clamping mechanism. Background Technology

[0002] In high-end process equipment such as semiconductor dry etching and chemical vapor deposition, diffusers are crucial for achieving uniformity in wafer surface processing. These components are typically made from brittle materials like high-performance alumina ceramics through precision sintering. Existing diffusers usually employ mechanical clamping, which requires a concentrated clamping force exceeding 100N to overcome the gas flow pressure within the process chamber and ensure sealing. However, alumina ceramic materials have extremely low allowable contact pressure (typically less than 0.15MPa). This massive concentrated load easily induces microcracks and stress concentration in the clamping contact area, and can even lead to hidden damage or breakage of the component after repeated assembly and disassembly, seriously threatening the cleanliness of the process chamber and production safety.

[0003] Furthermore, the clamping requirements for wafers, chips, and substrates during semiconductor manufacturing and packaging are extremely stringent. Any form of microscopic scratches, cracks, or stress concentration must be avoided, as these defects can lead to device performance degradation or failure. The clamping force must be highly uniformly distributed to prevent warping or uneven stress. Traditional mechanical clamping methods struggle to meet all these requirements, especially when handling ultra-thin wafers or flexible substrates.

[0004] Therefore, the above problems urgently need to be solved. Utility Model Content

[0005] Purpose of the utility model: In order to overcome the above shortcomings, this utility model provides an automatic blower clamping mechanism that can uniformly clamp the wafer, avoid the fracture of brittle materials or the generation of micro-cracks due to concentrated clamping force, and improve the safety and reliability of the clamping process.

[0006] Technical Solution: To achieve the above objectives, this utility model provides an automatic blower clamping mechanism, including a chassis, a support platform connected to the top surface of the chassis, and a pre-positioning clamping mechanism on the outer periphery of the support platform. The pre-positioning clamping mechanism includes at least one swingable pre-positioning clamping component and a first driving mechanism for driving the pre-positioning clamping component to swing. The free end of the pre-positioning clamping component has a first airbag facing the support platform. The pre-positioning clamping component is connected to a secondary clamping mechanism. The first driving mechanism drives the pre-positioning clamping component to swing, causing the first airbag to contact the wafer edge to complete the pre-positioning. Subsequently, the secondary clamping mechanism actuates and applies clamping force to the wafer. This utility model can achieve uniform clamping of the wafer, avoiding the fracture of brittle materials or the generation of micro-cracks due to concentrated clamping force, thus improving the safety and reliability of the clamping process. The first airbag is connected to an external air source, and the clamping force is applied uniformly through the first airbag, absorbing the impact force during the clamping process. By monitoring the air pressure of the first airbag, the swing angle of the pre-positioning clamping component is controlled to avoid excessive clamping pressure and prevent damage to the wafer surface.

[0007] Furthermore, in the aforementioned automatic blower clamping mechanism, the pre-positioning clamping component includes a clamping arm, which is rotatably connected to the chassis via a rotating shaft. The rotating shaft passes through the chassis and is driven by the first drive mechanism. The first drive mechanism is a servo motor that drives the clamping arm to swing, thereby adjusting the angle of the clamping arm to accommodate wafers of different sizes. The first drive mechanism is equipped with a torque sensing device to detect the output torque in real time, thereby precisely controlling the contact force between the first airbag and the edge of the wafer to ensure smooth and impact-free clamping.

[0008] Furthermore, in the aforementioned automatic purging machine clamping mechanism, at least a portion of the clamping arm is constructed as a cam structure. The cam structure of the clamping arm can clamp wafers of different sizes, improving the adaptability of the mechanism.

[0009] Furthermore, in the aforementioned automatic blower clamping mechanism, the first drive mechanism is a gear transmission system, which includes a central wheel driven by a drive component and multiple satellite wheels meshing with the central wheel. The satellite wheels are coaxially connected to the rotating shaft to drive their rotation. The satellite wheels are evenly distributed on the outer circumference of the central wheel. The central wheel drives the satellite wheels to cause multiple clamping arms to swing synchronously, clamping the wafer at the center position of the support platform, ensuring the consistency and stability of the clamping action.

[0010] Furthermore, in the aforementioned automatic purging machine clamping mechanism, the secondary clamping mechanism includes a base, on which a worm gear is rotatably connected. The worm gear is positioned along the center line of the pre-positioning clamping assembly. A secondary clamping arm is rotatably connected to the base, and the worm gear and the secondary clamping arm mesh. The base is connected to a second drive structure that is driven by the worm gear. The second drive structure is a drive motor, used to drive the worm gear to rotate, thereby causing the secondary clamping arm to swing. The secondary clamping mechanism is used for re-fixing after the pre-positioning clamping assembly has clamped the arm. The second drive structure is a servo motor equipped with a position sensor, used to provide real-time feedback on the displacement status of the clamping arm, ensuring closed-loop control and precise execution of the clamping action. The secondary clamping mechanism achieves a self-locking function through the transmission structure of the worm gear driving the secondary clamping arm, preventing loosening during clamping, thereby further improving clamping stability and accuracy.

[0011] Furthermore, in the aforementioned automatic blower clamping mechanism, the end of the secondary clamping arm away from the worm gear is connected to a clamping part that contacts the wafer, and the clamping part is located at the bottom of the secondary clamping arm.

[0012] Furthermore, in the aforementioned automatic blower clamping mechanism, the clamping part includes a rigid support column connected to the secondary clamping arm, and a flexible contact layer covering the outside of the rigid support column. The flexible contact layer at the end of the secondary clamping arm can evenly distribute pressure under clamping force, avoiding damage to the wafer edge.

[0013] Furthermore, in the aforementioned automatic purging machine clamping mechanism, the flexible contact layer is configured as an airbag. By configuring the flexible contact layer as an airbag, the airbag is connected to an external air source, and inert gas is injected into the airbag. A pressure gauge connected via a pipeline detects pressure changes within the airbag to determine whether the clamping force is stable. This enables real-time monitoring of the wafer clamping status and allows for timely triggering of a protection mechanism in abnormal situations. This effectively prevents wafer damage or displacement due to excessive or uneven clamping force, ensuring the safety and stability of the wafer during the purging process.

[0014] Furthermore, in the aforementioned automatic purging machine clamping mechanism, the secondary clamping arm includes a meshing part and a connecting part. The meshing part has external teeth on its outer periphery and meshes with the worm gear. The connecting part is rectangular and has a clearance groove on the side of the connecting part near the worm gear, which provides clearance for the worm gear. The clearance groove is used to accommodate part of the worm gear's volume, thereby preventing interference between the secondary clamping arm and the worm gear when the arm rotates, and improving transmission smoothness.

[0015] Furthermore, in the aforementioned automatic purging machine clamping mechanism, a sealing groove is provided on the top surface of the support platform, extending along the outer edge of the support platform. The sealing groove is used to house a sealing ring. Multiple vacuum holes are provided within the sealing groove, densely distributed within its inner area. These vacuum holes are connected to a vacuum system. The vacuum holes are connected to an external vacuum pump via connecting pipes, used to apply negative pressure adsorption to the back side of the wafer, preventing displacement or vibration of the wafer during purging. The sealing ring ensures a tight seal between the support platform and the back side of the wafer, thereby improving the adsorption effect and preventing airflow leakage from affecting purging efficiency.

[0016] As can be seen from the above technical solution, this utility model has the following beneficial effects: The automatic blower clamping mechanism of this utility model can achieve uniform clamping of the wafer, avoiding the fracture of brittle materials or the generation of micro-cracks due to concentrated clamping force, thus improving the safety and reliability of the clamping process. The first airbag and the flexible contact layer configured as the airbag are respectively connected to an external air source to absorb the impact force during the clamping process. By monitoring the air pressure, the swing angle of the pre-positioning clamping component and the secondary clamping mechanism is controlled to avoid excessive clamping pressure and prevent damage to the wafer surface. By detecting the air pressure changes of the first airbag and the flexible contact layer configured as the airbag, the protection mechanism can be triggered in time under abnormal conditions, effectively preventing the wafer from being damaged or displaced due to excessive or uneven clamping force. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the clamping mechanism of the automatic purging machine of this utility model; Figure 2 This is a top view of the clamping mechanism of the automatic purging machine of this utility model; Figure 3 This is a schematic diagram of the structure of the first driving mechanism; Figure 4 As shown Figure 1 A magnified view of a portion of the image; Figure 5 This is a schematic diagram of the structure of the secondary clamping arm.

[0018] In the figure: 1. Chassis, 2. Support platform, 21. Sealing groove, 22. Vacuum hole, 3. Pre-positioning clamping assembly, 32. First drive mechanism, 34. First airbag, 31. Clamping arm, 33. Rotating shaft, 321. Center wheel, 322. Satellite wheel, 4. Secondary clamping mechanism, 41. Base, 42. Worm gear, 43. Secondary clamping arm, 431. Engaging part, 432. Connecting part, 4321. Clearance groove, 44. Second drive mechanism, 45. Clamping part, 451. Rigid support column, 452. Flexible contact layer. Detailed Implementation

[0019] Example

[0020] like Figure 1An automatic purging machine clamping mechanism is shown, comprising a chassis 1, a support platform 2 connected to the top surface of the chassis 1, and a pre-positioning clamping mechanism on the outer periphery of the support platform 2. The pre-positioning clamping mechanism includes at least one swingable pre-positioning clamping component 3 and a first drive mechanism 32 for driving the pre-positioning clamping component 3 to swing. The free end of the pre-positioning clamping component 3 is provided with a first airbag 34 facing the support platform 2. The pre-positioning clamping component 3 is connected to a secondary clamping mechanism 4. The first drive mechanism 32 drives the pre-positioning clamping component 3 to swing, so that the first airbag 34 contacts the edge of the wafer to complete the pre-positioning. Subsequently, the secondary clamping mechanism 4 actuates and applies clamping force to the wafer. The first airbag 34 is connected to an external air source.

[0021] like Figure 2 The automatic purging machine clamping mechanism shown includes a pre-positioning clamping assembly 3 comprising a clamping arm 31, which is rotatably connected to the chassis 1 via a rotating shaft 33. The rotating shaft 33 passes through the chassis 1 and is driven by a first drive mechanism 32. The first drive mechanism 32 is a servo motor.

[0022] In this embodiment, at least a portion of the clamping arm 31 is constructed as a cam structure.

[0023] In this embodiment, a sealing groove 21 is provided on the top surface of the support platform 2, and the sealing groove 21 is arranged along the outer side of the support platform 2. The sealing groove 21 is used to install a sealing ring. Multiple vacuum holes 22 are provided inside the sealing groove 21, densely distributed in the inner area of ​​the sealing groove 21. The vacuum holes 22 are connected to a vacuum system. The vacuum holes 22 are connected to an external vacuum pump through connecting pipes, and are used to apply negative pressure adsorption force to the back side of the wafer to prevent the wafer from shifting or vibrating during the purging process. The sealing ring is used to ensure the seal between the support platform 2 and the back side of the wafer, thereby improving the adsorption effect and preventing airflow leakage from affecting the purging efficiency.

[0024] like Figure 3 The automatic purging machine clamping mechanism shown has a first drive mechanism 32 that is a gear transmission system. It includes a central wheel 321 driven by a drive member and multiple satellite wheels 322 that mesh with the central wheel 321. The satellite wheels 322 are coaxially connected to the rotating shaft 33 to drive its rotation. The satellite wheels 322 are evenly distributed on the outer periphery of the central wheel 321.

[0025] like Figure 4The automatic blower clamping mechanism shown includes a secondary clamping mechanism 4 comprising a base 41, to which a worm gear 42 is rotatably connected. The worm gear 42 is positioned along the center line of the pre-positioning clamping assembly 3. A secondary clamping arm 43 is rotatably connected to the base 41, and the worm gear 42 and the secondary clamping arm 43 mesh. A second drive structure 44 is connected to the base 41 and is driven by the worm gear 42. The second drive structure 44 is a drive motor used to drive the worm gear 42 to rotate, thereby causing the secondary clamping arm 43 to swing. The second drive structure 44 is a servo motor equipped with a position sensor for real-time feedback of the clamping arm's displacement status.

[0026] The secondary clamping mechanism 4 is used to re-fix the pre-positioned clamping component 3 after clamping, ensuring closed-loop control and precise execution of the clamping action. The secondary clamping mechanism 4 achieves a self-locking function through the transmission structure of the worm gear 42 driving the secondary clamping arm 43, preventing loosening during clamping and further improving clamping stability and accuracy.

[0027] In this embodiment, the end of the secondary clamping arm 43 away from the worm gear 42 is connected to a clamping part 45 that contacts the wafer, and the clamping part 45 is located at the bottom of the secondary clamping arm 43.

[0028] In this embodiment, the clamping part 45 includes a rigid support column 451 connected to the secondary clamping arm 43, and a flexible contact layer 452 covering the outside of the rigid support column 451. The flexible contact layer 452 evenly distributes pressure under the clamping force, avoiding damage to the wafer edge.

[0029] In this embodiment, the flexible contact layer 452 is configured as an airbag. The flexible contact layer 452 is configured as an airbag, which is connected to an external air source. Inert gas is injected into the airbag, and a pressure gauge connected to the pipeline detects pressure changes within the airbag to determine whether the clamping force is stable. This enables real-time monitoring of the wafer clamping status and allows for timely triggering of protection mechanisms in abnormal situations. This effectively prevents wafer breakage or displacement due to excessive or uneven clamping force, ensuring the safety and stability of the wafer during the purging process.

[0030] like Figure 5 The automatic purging machine clamping mechanism shown includes a secondary clamping arm 43 comprising an engaging portion 431 and a connecting portion 432. The engaging portion 431 has external teeth on its outer periphery and engages with a worm gear 42. The connecting portion 432 is rectangular and has a clearance groove 4321 on the side near the worm gear 42. The clearance groove 4321 provides clearance to the worm gear 42. The clearance groove 4321 accommodates part of the volume of the worm gear 42, thereby preventing interference with the worm gear 42 during rotation of the secondary clamping arm 43 and improving transmission smoothness.

[0031] The working steps of this utility model include: First, the robotic arm places the wafer on the surface of the support platform 2. The primary clamping assembly 3 is activated to initially clamp and position the wafer. This includes the central wheel 321 in the first drive mechanism 32 driving the satellite wheels 322 to rotate, causing multiple clamping arms 31 to swing synchronously, thus clamping the wafer at the center of the support platform 2. The first drive mechanism 32 is equipped with a torque sensing device to detect the output torque in real time, and a pressure gauge in the pipeline connected to the first airbag 34 to detect the pressure of the first airbag 34 in real time. When the torque of the first airbag 34 or the first drive mechanism 32 reaches a set value, the first drive mechanism 32 stops moving, at which point the wafer is at the center of the support platform 2. A vacuum pump is activated to evacuate the vacuum chamber below the support platform 2, causing the wafer to be tightly adhered to the surface of the support platform 2. Then, the second drive mechanism 44 starts working, driving the worm gear 42 to rotate, causing the secondary clamping arm 43 to swing around the meshing part 431, causing the clamping part 45 to slowly contact the edge of the wafer. After the flexible contact layer 452, shaped like an airbag, adheres to the wafer surface, the internal air pressure changes. This change is detected by a barometer. When the air pressure reaches a preset range, confirming reliable clamping, the secondary clamping arm 43 stops moving. At this time, the purging device starts to clean the wafer surface. Throughout the process, the clamping system continuously monitors the wafer clamping status and adjusts in real time based on feedback signals to ensure uniform and stable clamping force, preventing wafer displacement or damage during purging. After purging, the system automatically releases the negative pressure in the vacuum chamber 2. Then, the first drive mechanism 32 and the second drive mechanism 44 rotate in opposite directions, driving the clamping arm 31 and the secondary clamping arm 43 to reset, separating the clamping part 45 from the wafer. After confirming complete release, the robotic arm restarts to remove the wafer from the carrier stage 2, completing the entire purging process. The entire operation is highly automated, with precise clamping, protecting the wafer from damage and improving wafer processing efficiency and yield.

[0032] The above embodiments are exemplary and are intended to illustrate the technical concept and features of this utility model, so that those skilled in the art can understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the scope of protection of this utility model.

Claims

1. An automatic purging machine clamping mechanism, characterized in that: The device includes a chassis (1), a support platform (2) connected to the top surface of the chassis (1), a pre-positioning clamping mechanism provided on the outer periphery of the support platform (2), the pre-positioning clamping mechanism including at least one swingable pre-positioning clamping component (3) and a first driving mechanism (32) for driving the pre-positioning clamping component (3) to swing; the free end of the pre-positioning clamping component (3) is provided with a first airbag (34) facing the support platform (2); the pre-positioning clamping component (3) is connected to a secondary clamping mechanism (4); the first driving mechanism (32) drives the pre-positioning clamping component (3) to swing, so as to drive the first airbag (34) to contact the edge of the wafer to complete the pre-positioning, and then the secondary clamping mechanism (4) operates and applies clamping force to the wafer.

2. The automatic purging machine clamping mechanism according to claim 1, characterized in that: The prepositioning clamping assembly (3) includes a clamping arm (31), which is rotatably connected to the chassis (1) via a rotating shaft (33); the rotating shaft (33) passes through the chassis (1) and is driven to connect with the first drive mechanism (32).

3. The automatic purging machine clamping mechanism according to claim 2, characterized in that: At least a portion of the clamping arm (31) is constructed as a cam structure.

4. The automatic purging machine clamping mechanism according to claim 2, characterized in that: The first drive mechanism (32) is a gear transmission system, which includes a central wheel (321) driven by a drive member and a plurality of satellite wheels (322) meshing with the central wheel (321). The satellite wheels (322) are coaxially connected to the rotating shaft (33) to drive it to rotate. The satellite wheels (322) are evenly distributed around the outer periphery of the center wheel (321).

5. The automatic purging machine clamping mechanism according to claim 1, characterized in that: The secondary clamping mechanism (4) includes a base (41), on which a worm gear (42) is rotatably connected. The worm gear (42) is arranged along the center line of the pre-positioned clamping assembly (3). The base (41) is rotatably connected to a secondary clamping arm (43), and the worm gear (42) and the secondary clamping arm (43) mesh. The base (41) is connected to a second driving structure (44) that is driven to the worm gear (42). The second driving structure (44) is a drive motor used to drive the worm gear (42) to rotate and thus drive the secondary clamping arm (43) to swing.

6. The automatic purging machine clamping mechanism according to claim 5, characterized in that: The secondary clamping arm (43) is connected to a clamping part (45) that contacts the wafer at one end away from the worm (42), and the clamping part (45) is located at the bottom of the secondary clamping arm (43).

7. The automatic purging machine clamping mechanism according to claim 6, characterized in that: The clamping part (45) includes a rigid support column (451) connected to the secondary clamping arm (43) and a flexible contact layer (452) covering the outside of the rigid support column (451).

8. The automatic purging machine clamping mechanism according to claim 7, characterized in that: The flexible contact layer (452) is configured as an airbag.

9. The automatic purging machine clamping mechanism according to claim 5, characterized in that: The secondary clamping arm (43) includes a meshing part (431) and a connecting part (432). The meshing part (431) has external teeth on its outer periphery. The meshing part (431) and the worm (42) are meshed together. The connecting part (432) is rectangular. The connecting part (432) has a relief groove (4321) on the side near the worm (42). The relief groove (4321) provides relief to the worm (42).

10. The automatic purging machine clamping mechanism according to claim 1, characterized in that: The top surface of the support platform (2) is provided with a sealing groove (21), which is arranged along the outer side of the support platform (2). The sealing groove (21) is used to set a sealing ring. The sealing groove (21) is provided with a plurality of vacuum holes (22), which are densely distributed in the inner area of ​​the sealing groove (21). The vacuum holes (22) are connected to a vacuum system.

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