Wafer chuck

Abstract

A wafer chuck, comprising chucking assemblies, a linear motion mechanism and a rack, a fixed end of the linear motion mechanism is arranged on the rack, an execution component of the linear motion mechanism is provided with a platform, the chucking assemblies are arranged on the platform, the chucking assemblies comprise supporting assemblies and centering clamping assemblies, the supporting assemblies are arranged in a circumferential array on the platform in at least three numbers, there is a gap between two adjacent supporting assemblies, the supporting assemblies are composed of supporting parts of different diameters and lifting parts serving as driving, the supporting parts are arranged on the platform through the lifting parts respectively, the hydraulic rods II of the multiple chucking assemblies are matched with each other, the buckles are synchronously contracted, positioning of wafers of different specifications is realized, meanwhile, the wafers of different specifications are fixed at different heights according to the supporting tables of different heights, and operation space is left for devices of other processes.

Description

Technical Field

[0001] This utility model relates to the field of wafer fixing technology, specifically a wafer chuck. Background Technology

[0002] The wafer chuck and semiconductor equipment disclosed in CN222995380U involve a wafer chuck holding a wafer, with one end of the wafer abutting against a holding part. The holding part is fixedly mounted on a wafer carrier to ensure initial wafer positioning. After initial positioning using the holding part, a clamping block slides towards the holding part, securing the wafer on the wafer carrier at the clamping position. In semiconductor equipment operation, to accommodate wafers of different sizes, multiple wafer chucks with different size placement areas are designed. An electrostatic chuck uses attraction to fix the wafer chuck to the electrostatic chuck. While this prior art achieves wafer fixation, it cannot simultaneously handle multiple wafer sizes. When fixing wafers of different sizes, manual adjustment of the holding part is required, a time-consuming and labor-intensive process that reduces the continuity and efficiency of wafer processing. Furthermore, the wafer-fixing platform area is large, and the wafer is tightly attached to the platform surface, leaving no operating space for other components working on the wafer. Utility Model Content

[0003] The purpose of this invention is to provide a wafer chuck to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: A wafer chuck includes a clamping assembly, a linear motion mechanism, and a frame. The fixed end of the linear motion mechanism is mounted on the frame, and a platform is provided on its actuating component. The clamping assembly is mounted on the platform. The clamping assembly includes a support assembly and a centering clamping assembly. There are at least three support assemblies arranged in a circumferential array on the platform, with a gap between adjacent support assemblies. Each support assembly consists of support parts of different diameters and a lifting part that serves as a drive. The support parts are respectively mounted on the platform via the lifting parts. A centering clamping component is installed at the distance between two adjacent supporting components.

[0005] Furthermore, the support assembly includes a support platform and hydraulic rods I. The support platform, which serves as a support part, and the hydraulic rods I, which serve as lifting parts, are both at least two in number and correspond one-to-one. The fixed end of each hydraulic rod I is fixedly connected to the platform, and the actuating end is fixedly connected to the support platform.

[0006] Furthermore, the height of support platforms with different diameters in the same support component varies. Specifically, the support platform closer to the center of the platform is taller, and the height adjustment range of hydraulic rod I is larger.

[0007] Furthermore, the centering clamping assembly includes hydraulic rod II, hydraulic rod III, and a buckle. The fixed end of hydraulic rod II is fixed on the platform and placed horizontally and radially, and the actuating end is fixedly connected to the fixed end of hydraulic rod III. The actuating end of hydraulic rod III is equipped with a buckle for clamping the wafer.

[0008] Compared with the prior art, the beneficial effects of this utility model are: this utility model achieves the positioning of wafers of different specifications by cooperating with the hydraulic rods II of multiple clamping components and synchronously retracting the buckles. At the same time, according to the support platform with different heights, wafers of different specifications are fixed at different heights, freeing up operating space for equipment in other processes. Attached Figure Description

[0009] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the clamping assembly of this utility model; Figure 3 This is a schematic diagram of the support component of this utility model; Figure 4 This is a schematic diagram of the centering clamping component of this utility model; In the diagram: 1 clamping assembly, 11 support assembly, 111 support platform, 112 hydraulic rod I, 12 centering clamping assembly, 121 hydraulic rod II, 122 hydraulic rod III, 123 buckle, 2 linear motion mechanism, 21 platform, 3 frame. Detailed Implementation

[0010] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0011] Example: Please see Figures 1 to 4 This utility model provides a wafer chuck technical solution: A wafer chuck includes a clamping assembly 1, a linear motion mechanism 2, and a frame 3. The fixed end of the linear motion mechanism 2 is mounted on the frame 3, and a platform 21 is mounted on its actuating component. The linear motion mechanism 2 controls the overall movement of the platform 21 and all clamping assemblies 1 on the platform 21. The clamping assembly 1 is mounted on the platform 21 and includes a support assembly 11 and a centering clamping assembly 12. There are at least three support assemblies 11 arranged in a circumferential array on the platform 21. The support assembly 11 provides support for the wafer and prevents the wafer from deforming due to gravity. There is a gap between two adjacent support assemblies 11. The support assembly 11 consists of support parts of different diameters and lifting parts as drives. The support parts are mounted on the platform 21 through the lifting parts. Different sizes of wafers occupy different support parts, and the height of their lifting parts is also different. A centering clamping component 12 is provided at the distance between two adjacent supporting components 11, and multiple centering clamping components 12 realize the positioning of the wafer.

[0012] In a preferred embodiment, the support assembly 11 includes a support platform 111 and hydraulic rods I 112. The support assembly 11 has at least two support platforms 111 as support parts and two hydraulic rods I 112 as lifting parts, and they correspond one-to-one. The fixed end of each hydraulic rod I 112 is fixedly connected to the platform 21, and the actuating end is fixedly connected to the support platform 111. The hydraulic rod I 112 controls the lifting of the support platform 111 connected to it.

[0013] In a preferred embodiment, the support platforms 111 of different diameters in the same support component 11 have different heights. Specifically, the support platform 111 that is closer to the center of the platform 21 has a higher height and a larger height adjustment range of the hydraulic rod I 112. There is no overlapping area between adjacent support platforms 111, and they can cooperate with each other to form a horizontal plane of uniform height.

[0014] In a preferred embodiment, the centering clamping assembly 12 includes a hydraulic rod II 121, a hydraulic rod III 122, and a latch 123. The fixed end of the hydraulic rod II 121 is fixed on the platform 21 and placed horizontally radially, while the actuating end is fixedly connected to the fixed end of the hydraulic rod III 122. The hydraulic rod II 121 controls the linear movement of the latch 123 in the radial direction to achieve the clamping and loosening of the latch 123. The actuating end of the hydraulic rod III 122 is equipped with the latch 123 for clamping the wafer. The hydraulic rod III 122 controls the linear movement of the latch 123 in the direction perpendicular to the platform 21 to ensure that the latch 123 is always aligned with the edge of the wafer.

[0015] The working principle of this invention is as follows: In the initial state, hydraulic rod II 121 is at its maximum extension, and hydraulic rod III 122 is at its retraction limit, causing the latch 123 to be at its lowest position. All support platforms 111 are at the height of the support platform 111 with the largest diameter, forming a supporting plane. When the wafer is placed on the support platform 111, the retraction of hydraulic rod II 121 controls the latch 123 to move linearly towards the center. The extension of hydraulic rod III 122 aligns the latch 123 with the edge of the wafer. The support platforms 111 begin to extend according to their diameter, starting with the platform with the largest diameter... The hydraulic rod I112 of the support platform 111 at the largest position stops retracting, while the hydraulic rods I112 at other positions continue to extend, raising and reducing the support plane of the wafer. If the latch still fails to position and lock the wafer, the hydraulic rod I112 at the largest diameter position continues to extend, further raising and shrinking the support plane until the latch 123 positions and locks the wafer. Ultimately, the height of the support platform 111, which does not support the wafer, is lower than the wafer, freeing up space for other equipment. Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer chuck, comprising a clamping assembly (1), a linear motion mechanism (2), and a frame (3), wherein the fixed end of the linear motion mechanism (2) is disposed on the frame (3), and a platform (21) is provided on its actuating component, and the clamping assembly (1) is disposed on the platform (21), characterized in that: The clamping assembly (1) includes a support assembly (11) and a centering clamping assembly (12). There are at least three support assemblies (11) arranged in a circumferential array on the platform (21). There is a gap between two adjacent support assemblies (11). The support assembly (11) consists of support parts of different diameters and lifting parts as drives. The support parts are respectively set on the platform (21) through the lifting parts. A centering clamping component (12) is provided at the distance between two adjacent support components (11).

2. A wafer chuck according to claim 1, characterized in that: The support assembly (11) includes a support platform (111) and a hydraulic rod I (112). The support platform (111) serving as a support part and the hydraulic rod I (112) serving as a lifting part in the support assembly (11) are both at least two and correspond one-to-one. The fixed end of each hydraulic rod I (112) is fixedly connected to the platform (21), and the execution end is fixedly connected to the support platform (111).

3. A wafer chuck according to claim 2, characterized in that: The heights of different diameter support platforms (111) in the same support component (11) are different. Specifically, the support platform (111) closer to the center of the platform (21) is higher and the height adjustment range of hydraulic rod I (112) is larger.

4. A wafer chuck according to claim 3, characterized in that: The centering clamping assembly (12) includes hydraulic rod II (121), hydraulic rod III (122) and buckle (123). The fixed end of the hydraulic rod II (121) is fixed on the platform (21) and placed horizontally and radially. The actuating end is fixedly connected to the fixed end of the hydraulic rod III (122). The actuating end of the hydraulic rod III (122) is equipped with buckle (123) for clamping the wafer.

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