Rotary chuck adapted to multiple sizes of wafers

Abstract

The utility model belongs to the field of semiconductor manufacturing technology, concretely relates to a kind of rotary chuck suitable for multiple size wafers, the surface of rotary chuck is provided with multiple groups of top pin holes distributed in different diameter annular, each group of top pin holes has the same central axis of symmetry with rotary chuck, lifting top pin is arranged in each top pin hole, vacuum port is opened in the upper surface of lifting top pin, the vacuum port of same group lifting top pin is communicated with same vacuum passage, solenoid valve is arranged on each vacuum passage and connected with vacuum device, lifting top pin, solenoid valve and vacuum device are electrically connected with controller, by setting multiple groups of annular distribution lifting top pin structure on the surface of rotary chuck, cooperate with solenoid valve to control vacuum passage, the adaptation to different size wafers is realized;Lifting top pin can be switched in adsorbing wafer and limiting wafer according to wafer size, the lifting top pin of limiting wafer can be lowered before and after process, and wafer is conveniently taken out.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically relating to a rotary chuck adapted to wafers of multiple sizes. Background Technology

[0002] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and is not necessarily to be construed as an admission or in any way implying that such information constitutes prior art known to those skilled in the art.

[0003] A wafer is a silicon chip used in the fabrication of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. Various circuit element structures can be fabricated on silicon wafers to create IC products with specific electrical functions. Wafer fabrication involves processes such as cleaning, etching, deposition, coating, and photolithography. During these processes, the wafer must be stably and precisely fixed in the correct position to ensure efficient chip production.

[0004] A rotary chuck is used in semiconductor manufacturing processes to vacuum-hold and fix wafers onto a chuck. Through high-speed rotation, it performs operations such as cleaning, etching, deposition, coating, and photolithography on the wafer. Traditional rotary chucks are typically designed with fixed positioning structures and vacuum suction areas for specific wafer sizes. When switching to different wafer sizes, a dedicated wafer-sized chuck must be replaced, or manual adjustment of mechanical components is required. Furthermore, the vacuum suction area is mostly fixed in layout and cannot be dynamically adjusted according to wafer size, making it unsuitable for both large and small wafers. For example, current conventional rotary chucks are suitable for assisting in the processing of 8-inch wafers. When 10-inch wafers are subsequently developed, existing rotary chucks are not backward compatible. Additionally, when processing small wafers in other situations, existing 8-inch rotary chucks are not backward compatible.

[0005] When small-scale experiments are conducted in laboratories, research institutes, corporate R&D centers, and other research organizations, engineers and scientists frequently need to use wafers of different sizes (such as 4-inch, 6-inch, and 8-inch) to test new materials, processes, or equipment. They may need to switch between these wafers multiple times a day. Because existing rotary chucks are of fixed sizes, they are difficult to adapt to wafers of different sizes simultaneously. Each wafer size requires a dedicated rotary chuck, necessitating frequent purchases of rotary chucks suitable for multiple different sizes. This is extremely costly, takes up a lot of space, and takes time, severely slowing down the R&D progress. Utility Model Content

[0006] To address the shortcomings of existing technologies, this invention provides a rotary chuck adaptable to wafers of various sizes. By setting multiple sets of annularly distributed lifting pin structures on the surface of the rotary chuck, and cooperating with solenoid valves to control the vacuum channels, it achieves adaptation to wafers of different sizes. The lifting pins can switch between adsorbing and limiting wafers according to the wafer size. The lifting pins for limiting wafers can be lowered before and after the process to facilitate wafer removal.

[0007] To achieve the above objectives, this utility model is implemented through the following technical solution: In a first aspect, this utility model provides a rotary chuck adaptable to wafers of multiple sizes. The surface of the rotary chuck is provided with multiple sets of pin holes distributed in annular arrangement with different diameters. Each set of pin holes has the same central axis of symmetry as the rotary chuck. A lifting pin is provided in each pin hole. A vacuum port is provided on the upper surface of the lifting pin. The vacuum ports of the same set of lifting pins are connected to the same vacuum channel. A solenoid valve is provided on each vacuum channel and connected to a vacuum device. The lifting pin, solenoid valve and vacuum device are electrically connected to a controller.

[0008] Preferably, a pressure sensor is provided on each of the vacuum channels, and the pressure sensor is electrically connected to the controller.

[0009] Preferably, a stress sensor is provided on the surface of the rotary chuck, and the stress sensor is electrically connected to the controller.

[0010] Preferably, the lifting pin includes a vacuum tube and a shock-absorbing layer sleeved outside the vacuum tube, with one end of the vacuum tube connected to the vacuum port and the other end connected to the vacuum channel.

[0011] More preferably, the vacuum tube is connected to the vacuum channel via a corrugated pipe.

[0012] Preferably, the lifting speed and lifting state of each group of lifting pins are the same.

[0013] Preferably, the number of top pin holes in each group of top pin holes is greater than or equal to three.

[0014] Preferably, the included angle between adjacent top pin holes in each group of top pin holes is equal.

[0015] Preferably, at least three sets of top pin holes are provided, wherein the first set is 1 inch away from the center of the rotary chuck, and the other sets are respectively set at a distance of 2(n-1) inches from the center of the rotary chuck, where n is the number of sets in each group.

[0016] More preferably, seven sets of top pin holes are provided. The first set is 1 inch away from the center of the rotary chuck, and the other sets are set around the center of the rotary chuck with radii of 2, 4, 6, 8, 10, and 12 inches respectively.

[0017] The beneficial effects achieved by one or more technical solutions of this utility model are as follows: (1) By setting multiple sets of annularly distributed lifting pin structures on the surface of the rotating chuck, and cooperating with solenoid valves to control the vacuum channels, the system can adapt to wafers of different sizes. The lifting pins can switch between adsorbing and limiting wafers according to the wafer size. The lifting pins for limiting wafers can be lowered before and after the process to facilitate wafer removal. Further, a pressure sensor can be set to detect the wafer, thereby automatically adjusting the lifting height of each set of lifting pins to ensure that the vacuum adsorption area is precisely matched with the edge of the wafer, thus improving the wafer adsorption effect. Further, a stress sensor can be set to monitor the stress value on the wafer surface. When the stress value on the wafer surface is about to reach the maximum stress value that the wafer itself can bear, the vacuum value is reduced until the vacuum is turned off.

[0018] (2) The rotating chuck of this utility model can be adapted to a variety of wafers of different sizes, which greatly reduces the research and development threshold and cost of laboratories, research institutes, enterprise R&D centers and research institutions, and greatly improves R&D efficiency. Attached Figure Description

[0019] The accompanying drawings, which form part of this specification, are used to provide a further understanding of this utility model. The illustrative embodiments of this utility model and their descriptions are used to explain this utility model and do not constitute an improper limitation of this utility model.

[0020] Figure 1 This is a top view of the rotating chuck adapted to multi-size wafers in this utility model. Figure 2 This is a cross-sectional view of the rotating chuck adapted to multi-size wafers in this utility model. In the diagram, 1 is the top pin hole, 2 is the lifting top pin, 3 is the vacuum channel, 4 is the vacuum device, 21 is the vacuum port, 22 is the vacuum tube, 23 is the shock-absorbing layer, and 24 is the corrugated pipe. Detailed Implementation

[0021] To more clearly illustrate the overall concept of this utility model, a detailed description will be provided below with reference to the accompanying drawings.

[0022] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments of this utility model and the features thereof can be combined with each other.

[0023] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0024] Furthermore, it should be understood in the description of this utility model that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] In this invention, unless otherwise expressly specified and limited, the first feature "on" or "below" the second feature may be in direct contact with the first and second features, or indirect contact through an intermediate medium. In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0028] As a specific implementation method, such as Figure 1 and Figure 2 As shown, a rotary chuck adaptable to wafers of various sizes is provided. The surface of the rotary chuck is provided with multiple sets of pin holes 1 distributed in annular arrangement with different diameters. Each set of pin holes 1 has the same central axis of symmetry as the rotary chuck. A lifting pin 2 is provided in each pin hole 1. A vacuum port 21 is provided on the upper surface of the lifting pin 2. The vacuum ports 21 of the same set of lifting pins 2 are connected to the same vacuum channel 3. A solenoid valve (not shown) is provided on each vacuum channel 3 and connected to a vacuum device 4. The lifting pin 2, the solenoid valve and the vacuum device 4 are electrically connected to a controller (not shown).

[0029] The lifting top pin 2 has a built-in motor, which (not shown) is electrically connected to the controller.

[0030] In this embodiment, the wafer size is first determined, and the lifting pins 2 covering the wafer size area are marked in the controller as having an adsorption function, while the remaining lifting pins 2 have a limiting function. During operation, before the process begins, the controller closes the solenoid valve on the vacuum channel 3 connected to the limiting lifting pins 2 and lowers the limiting lifting pins 2 (lower than the horizontal plane of the adsorption lifting pins 2 or to the surface of the rotary chuck) to allow the wafer to be placed in. The vacuum device 4 is then opened, causing the vacuum port 21 of the adsorption lifting pins 2 to create a vacuum that adsorbs the wafer. After the wafer is adsorbed, the adsorption lifting pins 2 descend to the surface of the rotary chuck, and the limiting lifting pins 2 rise to restrict the wafer's displacement. After the process is completed, the limiting lifting pins 2 descend and the adsorption lifting pins 2 rise, and the vacuum device 4 is closed to make it easier to remove the processed wafer.

[0031] In a preferred embodiment, a pressure sensor (not shown) is provided on each vacuum channel 3, and the pressure sensor 3 is electrically connected to the controller.

[0032] By setting pressure sensor 3, it is possible to monitor whether the vacuum port 21 of each set of lifting pins 2 is in a vacuum state after the wafer is placed. By feeding the information back to the controller, the controller automatically marks the function of the lifting pins 2 and automatically closes the solenoid valves corresponding to the non-adsorption groups, reducing the steps of manually setting the controller. In this embodiment, the wafer can be placed directly, and after the wafer is placed, the adsorption function of the lifting pins 2 is marked by pressure sensor 3 to further complete the adsorption of the wafer.

[0033] In a preferred embodiment, a stress sensor (not shown) is disposed on the surface of the rotating chuck, and the stress sensor is electrically connected to the controller. The stress sensor can monitor the stress value on the wafer surface, and when the stress value on the wafer surface is about to reach the maximum stress value that the wafer itself can withstand, the vacuum value is reduced until the vacuum is turned off.

[0034] In a preferred embodiment, the lifting top pin 2 includes a vacuum tube 22 and a shock-absorbing layer 23 sleeved on the outside of the vacuum tube 22. One end of the vacuum tube 22 is connected to the vacuum port 21, and the other end is connected to the vacuum channel 3.

[0035] The built-in vacuum tube 22 can rise and fall synchronously with the top pin and shorten the length of the vacuum channel. The damping layer 23 can reduce the resonance effect of the contact surface between the wafer and the lifting top pin 2 and avoid damage caused by collision between the wafer and the lifting top pin 2.

[0036] In a preferred embodiment, the vacuum tube 22 is connected to the vacuum channel 3 via the bellows 24.

[0037] The bellows 24 is used to improve the dynamic sealing effect between the vacuum tube 22 and the vacuum channel 3.

[0038] In one preferred embodiment, the lifting speed and lifting state of each set of lifting pins 2 are the same. The lifting pins 2 can be controlled by one motor or each can be controlled by its own motor.

[0039] Ensure the synchronous lifting of the lifting top pins 2 in the same group, thereby avoiding wafer tilting.

[0040] In a preferred embodiment, the number of top pin holes 1 in each group of top pin holes 1 is greater than or equal to three.

[0041] Setting multiple top pin holes 1 can increase the adsorption strength of the wafer and ensure that the wafer is placed horizontally.

[0042] In a preferred embodiment, the included angle between adjacent top pin holes 1 in each group of top pin holes 1 is equal.

[0043] The equally angled distribution of the top pin holes 1 (i.e., equally angled distribution of the lifting top pins 2) can achieve a uniform distribution of adsorption force, prevent imbalance during rotation, and reduce stress concentration at the wafer edge.

[0044] In a preferred embodiment, the top pin hole 1 is provided in at least three groups, wherein the first group is 1 inch away from the center of the rotating chuck, and the other groups are set around the center of the rotating chuck with radii of 2, 4, 6, 8, 10 and 12 inches, where n is the number of groups in each group.

[0045] In one preferred embodiment, the top pin hole 1 is provided in seven groups. The first group is 1 inch away from the center of the rotary chuck, and the other groups are arranged in a ring at distances of 2, 4, 6, 8, 10 and 12 inches from the center of the rotary chuck, respectively.

[0046] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A rotary chuck adaptable to wafers of multiple sizes, characterized in that, The surface of the rotating chuck is provided with multiple sets of pin holes (1) arranged in annular shape with different diameters. Each set of pin holes (1) has the same central axis of symmetry as the rotating chuck. Each pin hole (1) is provided with a lifting pin (2). The upper surface of the lifting pin (2) is provided with a vacuum port (21). The vacuum ports (21) of the same set of lifting pins (2) are connected to the same vacuum channel (3). Each vacuum channel (3) is provided with a solenoid valve and connected to a vacuum device (4). The lifting pin (2), the solenoid valve and the vacuum device (4) are electrically connected to the controller.

2. The rotary chuck as described in claim 1, characterized in that, A pressure sensor is provided on each of the vacuum channels (3), and the pressure sensor is electrically connected to the controller.

3. The rotary chuck as described in claim 1, characterized in that, A stress sensor is installed on the surface of the rotating chuck, and the stress sensor is electrically connected to the controller.

4. The rotary chuck as described in claim 1, characterized in that, The lifting pin (2) includes a vacuum tube (22) and a shock-absorbing layer (23) sleeved on the outside of the vacuum tube (22). One end of the vacuum tube (22) is connected to the vacuum port (21), and the other end is connected to the vacuum channel (3).

5. The rotary chuck as described in claim 4, characterized in that, The vacuum tube (22) is connected to the vacuum channel (3) through the corrugated pipe (24).

6. The rotary chuck as described in claim 1, characterized in that, The lifting speed and lifting state of each set of lifting pins (2) are the same.

7. The rotary chuck as described in claim 1, characterized in that, The number of top pin holes (1) in each group is greater than or equal to three.

8. The rotary chuck as described in claim 1, characterized in that, The included angle between adjacent pin holes (1) in each group of pin holes (1) is equal.

9. The rotary chuck as described in claim 1, characterized in that, The top pin hole (1) is provided in at least three groups, wherein the first group is 1 inch away from the center of the rotating chuck, and the other groups are respectively set at a distance of 2(n-1) inches from the center of the rotating chuck, where n is the number of groups in each group.

10. The rotary chuck as described in claim 9, characterized in that, The top pin hole (1) is set in seven groups. The first group is 1 inch away from the center of the rotating chuck, and the other groups are set around the center of the rotating chuck with radii of 2, 4, 6, 8, 10 and 12 inches.

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