Dual-drive pin module and die bonding apparatus

Abstract

The utility model relates to chip demoulding technical field, specifically disclose a double -drive thimble module and fixed crystal equipment, include: thimble cap, the thimble cap is used for adsorbing film, thimble body, thimble body swing setting in thimble cap, thimble direct -drive subassembly, thimble direct -drive subassembly's drive end is connected with thimble body, thimble direct -drive subassembly, thimble direct -drive subassembly's drive end is connected with thimble cap, wherein, when thimble direct -drive subassembly drives thimble body upward motion, to the chip on film is pushed out upward, thimble direct -drive subassembly is used for driving thimble cap adsorbs and drives film downward motion. The double -drive thimble module and fixed crystal equipment provided by the utility model can effectively solve the problem that chip shakes and shifts and chip bottom is damaged in the large -stroke demoulding process of traditional thimble module.

Description

Technical Field

[0001] This utility model relates to the field of chip demolding technology, and in particular to a dual-drive ejector pin module and die bonding equipment. Background Technology

[0002] In semiconductor manufacturing and packaging processes, ejector modules, as precision auxiliary demolding devices, are widely used in chip pickup, film peeling, and substrate separation. A typical ejector module usually includes an ejector cap for adsorbing or carrying film material, an ejector body disposed inside the ejector cap, and an ejector direct drive mechanism that drives the ejector body upward relative to the ejector cap. During operation, the ejector body lifts upward, separating the chip or film from the carrier so that it can be picked up by a robot or other manipulator.

[0003] However, as chip structures continue to evolve towards thinner profiles and higher integration, the required demolding height for some chips during packaging or testing has significantly increased. In such cases, if only the ejector pin body is used for upward lifting, the lifting height needs to be increased accordingly, which can easily lead to the following problems:

[0004] On the one hand, if the upward lifting stroke of the chip is too large, the chip is prone to shaking or displacement during the lifting process, which affects the stability and positioning accuracy of the chip picking.

[0005] On the other hand, lifting the chip upwards significantly can cause excessive pressure on the bottom of the chip by the ejector pin, which can easily lead to microcracks, breakage, or surface scratches on the bottom of the chip, seriously affecting the chip's reliability and yield.

[0006] Therefore, it is necessary to optimize the traditional ejector module to solve the problems of chip wobbling and displacement and bottom damage that easily occur during its long-stroke demolding process.

[0007] The information disclosed in this background section is included only to enhance the understanding of the context of this disclosure, and therefore may contain information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0008] One objective of this invention is to provide a dual-drive ejector module and die bonding equipment, which can effectively solve the problems of chip shaking and displacement and chip bottom damage that are prone to occur during the long-stroke demolding process of traditional ejector modules.

[0009] To achieve the above objectives, this utility model provides a dual-drive ejector pin module, comprising:

[0010] Pin cap, the pin cap being used to adsorb a thin film;

[0011] The ejector pin body is movably disposed within the ejector pin cap;

[0012] A direct-drive assembly for ejector pins, wherein the drive end of the direct-drive assembly for ejector pins is connected to the ejector pin body;

[0013] A pin cap direct drive assembly, wherein the drive end of the pin cap direct drive assembly is connected to the pin cap;

[0014] in,

[0015] When the ejector pin direct drive assembly drives the ejector pin body to move upward to push the chip on the film upward, the pin cap direct drive assembly is used to drive the ejector pin cap to attract and drive the film downward.

[0016] Optionally, the ejector pin direct drive assembly includes:

[0017] Ejector pin positioning base;

[0018] A pin support rod, wherein the pin body is mounted on the top of the pin support rod and the lower end of the pin support rod is slidably connected to the pin positioning base.

[0019] A direct drive mechanism for ejector pins is mounted on the ejector pin positioning base, and the drive end of the direct drive mechanism is connected to the ejector pin support rod to drive the ejector pin support rod to move up and down.

[0020] Optionally, the pin cap direct drive assembly includes:

[0021] A needle cap positioning base, which is fixedly disposed relative to the ejector pin positioning base;

[0022] A needle cap lifting plate, wherein the needle cap lifting plate is slidably connected to the needle cap positioning base in an up-down manner;

[0023] A pin cap is mounted and fixed on the pin cap lifting plate and is fitted over the outside of the pin body from top to bottom;

[0024] A rotating cam is located below the needle cap lifting plate and abuts against the needle cap lifting plate;

[0025] A cam-driven mechanism is mounted on the needle cap positioning base, and the driving end of the cam-driven mechanism is connected to the rotating cam.

[0026] A reset spring, the upper end of which is connected to the needle cap lifting plate and the lower end of which is connected to the pin positioning base, is used to drive the needle cap lifting plate downward to abut against the rotating cam.

[0027] Optionally, the bottom of the needle cap lifting plate is provided with a detachable cam abutment block.

[0028] Optionally, the top surface of the ejector cap is provided with an ejector hole at the center for the ejector body to pass through, and a number of vacuum suction holes are provided around the ejector hole.

[0029] Optionally, the ejector caps enclose a vacuum adsorption cavity, and each ejector hole communicates with the top of the vacuum adsorption cavity;

[0030] A linear sealed bearing is provided between the lower opening of the vacuum adsorption chamber and the ejector pin support rod.

[0031] Optionally, the pin cap direct drive assembly further includes:

[0032] A needle cap photoelectric sensor is mounted on the needle cap positioning base and electrically connected to the cam rotary drive mechanism.

[0033] A light-blocking plate for the needle cap is installed on the needle cap lifting plate and is used to enter the detection area of ​​the needle cap photoelectric sensor when the needle cap lifting plate reaches its highest position.

[0034] Optionally, the ejector pin direct drive assembly further includes:

[0035] A pin photoelectric sensor is mounted on the pin positioning base and electrically connected to the pin direct drive mechanism.

[0036] A light-blocking plate is mounted on the ejector pin support rod and is used to enter the detection area of ​​the ejector pin photoelectric sensor when the ejector pin body reaches its lowest position.

[0037] On the other hand, a die bonding apparatus is provided, comprising:

[0038] A crystal ring fixing platform is used to support the crystal ring; wherein a thin film is tightly stretched on the crystal ring, and a plurality of chips are disposed on the thin film;

[0039] Any of the dual-drive ejector pin modules described above is located below the thin film and is used to lift the chip upward while simultaneously driving the thin film downward.

[0040] A pick-up nozzle, located above the film, is used to pick up and transfer the chip that has been lifted up.

[0041] The beneficial effects of this invention are as follows: It provides a dual-drive ejector module and die bonding equipment. When a chip needs to be ejected, the ejector direct drive assembly drives the ejector body upward, and the ejector body passes through the ejector hole of the ejector cap, ejecting the chip on the film upward. At the same time, the ejector cap direct drive assembly drives the ejector cap to move the film downward. In this way, the demolding height of the chip relative to the die pick-up nozzle increases, but the actual lifting stroke of the ejector body decreases. The die pick-up nozzle is located above the film and adsorbs and transfers the ejected chip.

[0042] By employing a dual-drive mechanism of upward ejector pin movement and downward ejector pin cap movement, a large demolding height is achieved while reducing the ejector pin body's lifting stroke. This effectively prevents the chip from wobbling or shifting during the lifting process, improving the stability and positioning accuracy of chip removal. At the same time, it reduces the local pressure of the ejector pin body on the bottom of the chip, preventing damage such as microcracks, breakage, or surface scratches on the bottom of the chip, thus improving chip reliability and yield. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0044] Figure 1 A schematic diagram of the die bonding device provided in the embodiment;

[0045] Figure 2 This is an exploded view of the dual-drive ejector pin module provided in the embodiment;

[0046] Figure 3 This is a cross-sectional schematic diagram of the dual-drive ejector pin module provided in the embodiment.

[0047] In the picture:

[0048] 1. Dual-drive ejector pin module;

[0049] 101. Ejector cap; 1011. Vacuum adsorption chamber;

[0050] 102. Ejector pin body;

[0051] 103. Ejector pin direct drive assembly; 1031. Ejector pin positioning base; 1032. Ejector pin support rod; 1033. Ejector pin direct drive mechanism; 1034. Ejector pin photoelectric sensor; 1035. Ejector pin light shield;

[0052] 104. Needle cap direct drive assembly; 1041. Needle cap positioning base; 1042. Needle cap lifting plate; 1043. Rotary cam; 1044. Cam rotary drive mechanism; 1045. Reset spring; 1046. Cam abutment block; 1047. Needle cap photoelectric sensor; 1048. Needle cap light shield;

[0053] 105. Linear seal bearing;

[0054] 2. Crystal ring fixing platform. Detailed Implementation

[0055] In this utility model, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this utility model, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.

[0056] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit the invention.

[0057] In the description of this utility model, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " generally indicates that the preceding and following objects have an "or" logical relationship.

[0058] In this invention, terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy, or order between these entities or operations.

[0059] Without further limitations, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this invention is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a series of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.

[0060] Similar to the understanding in the Examination Guidelines, in this utility model, expressions such as "greater than," "less than," and "exceeding" are understood to exclude the stated number; expressions such as "above," "below," and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this utility model, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times," unless otherwise explicitly specified.

[0061] In the description of the embodiments of this utility model, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the convenience of describing the specific embodiments of this utility model or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.

[0062] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this utility model, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this utility model pertains, the specific meaning of the above terms in the embodiments of this utility model can be understood according to the specific circumstances.

[0063] The direct drive mechanism in this invention can be a linear motor, a cylinder, a hydraulic cylinder, or a motor lead screw and slider assembly, etc.; the rotary drive mechanism can be a servo motor, a stepper motor, or a rotary cylinder, etc.

[0064] This invention provides a dual-drive ejector module and die bonding equipment, which can effectively solve the problems of chip shaking and displacement and chip bottom damage that are prone to occur during the long-stroke demolding process of traditional ejector modules.

[0065] See Figure 1 The die bonding apparatus provided in this embodiment includes:

[0066] A crystal ring fixing platform 2 is used to support the crystal ring; wherein, a thin film is tightly stretched on the crystal ring, and a plurality of chips are disposed on the thin film;

[0067] The dual-drive ejector module 1 is located below the thin film and is used to lift the chip upward while driving the thin film downward.

[0068] A pick-up nozzle, located above the film, is used to pick up and transfer the chip that has been lifted up.

[0069] See Figure 2 The dual-drive ejector pin module 1 includes:

[0070] Pin cap 101, the pin cap 101 is used to adsorb the film;

[0071] The ejector body 102 is movably disposed within the ejector cap 101;

[0072] The ejector pin direct drive assembly 103 is connected to the ejector pin body 102 at its drive end.

[0073] A needle cap direct drive assembly 104, the drive end of which is connected to the pin cap 101;

[0074] in,

[0075] When the ejector pin direct drive assembly 103 drives the ejector pin body 102 to move upward to push the chip on the film upward, the pin cap direct drive assembly 104 drives the ejector pin cap 101 to adsorb and drive the film downward.

[0076] When chip ejection is required, the ejector pin direct drive assembly 103 drives the ejector pin body 102 upward. The ejector pin body 102 passes through the ejector pin hole of the ejector pin cap 101, ejecting the chip upward from the film. Simultaneously, the pin cap direct drive assembly 104 drives the ejector pin cap 101 to move the film downward. This increases the chip's demolding height relative to the pick-up nozzle, but reduces the actual lifting stroke of the ejector pin body 102. The pick-up nozzle, located above the film, picks up and transfers the ejected chip.

[0077] By employing a dual-drive mechanism of upward lifting of the ejector pin body 102 and downward movement of the ejector pin cap 101, a large demolding height is achieved while reducing the lifting stroke of the ejector pin body 102. This effectively prevents the chip from shaking or shifting during the lifting process, improving the stability and positioning accuracy of chip removal. At the same time, it reduces the local pressure of the ejector pin body 102 on the bottom of the chip, preventing damage such as microcracks, breakage, or surface scratches on the bottom of the chip, thereby improving the reliability and yield of the chip.

[0078] In this embodiment, the ejector pin direct drive assembly 103 includes:

[0079] Ejector positioning base 1031;

[0080] The ejector pin support rod 1032, the ejector pin body 102 is installed on the top of the ejector pin support rod 1032, and the lower end of the ejector pin support rod 1032 is slidably connected to the ejector pin positioning base 1031.

[0081] The ejector pin direct drive mechanism 1033 is mounted on the ejector pin positioning base 1031, and the drive end of the ejector pin direct drive mechanism 1033 is connected to the ejector pin support rod 1032 to drive the ejector pin support rod 1032 to move up and down.

[0082] Accordingly, the pin cap direct drive assembly 104 includes:

[0083] Needle cap positioning base 1041, which is fixedly disposed relative to the ejector pin positioning base 1031;

[0084] Needle cap lifting plate 1042, which is slidably connected to the needle cap positioning base 1041 in a vertical manner;

[0085] The ejector cap 101 is installed and fixed on the needle cap lifting plate 1042 and is sleeved on the outside of the ejector body 102 from top to bottom;

[0086] A rotating cam 1043 is located below the needle cap lifting plate 1042 and abuts against the needle cap lifting plate 1042;

[0087] A cam-driven mechanism 1044 is mounted on the needle cap positioning base 1041, and the driving end of the cam-driven mechanism 1044 is connected to the rotating cam 1043.

[0088] A reset spring 1045 is provided, with its upper end connected to the needle cap lifting plate 1042 and its lower end connected to the ejector pin positioning base 1031. The reset spring 1045 is used to drive the needle cap lifting plate 1042 to abut against the rotating cam 1043.

[0089] Optionally, the bottom of the needle cap lifting plate 1042 is provided with a detachable cam abutment block 1046.

[0090] It should be noted that the detailed working process of the pin cap direct drive assembly 104 is as follows:

[0091] (1) Initial / Reset State: In the initial state, the rotary cam 1043 is at the “high point” of its profile, and the ejector cap 101 is lifted at a high position to adsorb the film.

[0092] (2) Downward movement of the ejector cap 101: When the chip needs to be ejected, the cam drive mechanism 1044 drives the rotating cam 1043 to rotate from the "high point" to the "low point" of its profile (i.e., the return stroke). Since the reset spring 1045 always provides downward tension, when the high point of the rotating cam 1043 falls back, the pin cap lifting plate 1042 moves downward along with the cam profile under the tension of the reset spring 1045, thereby driving the ejector cap 101 to move downward.

[0093] The process of lifting the ejector pin body 102 upward: According to the preset timing or at the same time as the above-mentioned pin cap direct drive assembly 104 is activated, the ejector pin direct drive mechanism 1033 is activated, driving the ejector pin support rod 1032 to slide upward on the ejector pin positioning base 1031, thereby driving the ejector pin body 102 to move upward, passing through the ejector pin hole of the ejector pin cap 101 and lifting the chip.

[0094] That is, the two direct drive components move in concert: the upward movement of the ejector pin body 102 and the downward movement of the ejector pin cap 101 are synchronized, which allows the chip to obtain a larger relative demolding displacement.

[0095] (3) Return process: After the top crystal action is completed, the ejector pin direct drive mechanism 1033 drives the ejector pin support rod 1032 to move the ejector pin body 102 downward. At the same time, the cam rotary drive mechanism 1044 drives the rotary cam 1043 to rotate from the "low point" back to the "high point", pushing the needle cap lifting plate 1042 and the ejector pin cap 101 to overcome the tension of the reset spring 1045 and move upward, returning to the initial high position, ready for the next operation.

[0096] The dual-drive ejector module 1 provided in this embodiment uses independent drive mechanisms for the ejector direct drive assembly 103 and the needle cap direct drive assembly 104, which realizes precise coordinated movement of the ejector body 102 and the ejector cap 101. The ejector positioning base 1031 and the needle cap positioning base 1041 provide stable support to ensure movement accuracy. The reset spring 1045 ensures that the needle cap lifting plate 1042 always abuts against the rotating cam 1043, avoiding movement gaps and improving response speed and stability.

[0097] Furthermore, the cam abutment block 1046 is detachably installed on the bottom of the needle cap lifting plate 1042 by means of a snap-fit, magnetic attraction, or screw fixing, becoming a component that directly contacts and transmits motion to the rotating cam 1043. When the rotating cam 1043 rotates, the cam abutment block 1046, pushed by the cam profile or under the action of the return spring 1045, follows the cam profile downward, thereby driving the needle cap lifting plate 1042 to move up and down.

[0098] The cam abutment block 1046 is designed as a wear part with a detachable structure, which makes it easy to replace it separately after long-term use and wear, without having to replace the entire needle cap lifting plate 1042, significantly reducing maintenance costs and time. At the same time, the cam abutment block 1046 can be made of a material that is more wear-resistant or has more specific surface properties than the needle cap lifting plate 1042 body, extending the service life of the contact pair and improving the durability and precision retention of the entire direct drive assembly.

[0099] In this embodiment, the top surface of the ejector cap 101 has a center position with an ejector hole through which the ejector body 102 passes, and a plurality of vacuum suction holes are provided around the ejector hole. See also Figure 3 The ejector cap 101 surrounds and forms a vacuum adsorption cavity 1011, and each ejector hole communicates with the top of the vacuum adsorption cavity 1011; a linear sealing bearing 105 is provided between the lower opening of the vacuum adsorption cavity 1011 and the ejector support rod 1032.

[0100] During operation, the vacuum adsorption chamber 1011 is connected to a vacuum pump to generate negative pressure, and then the film is adsorbed through the vacuum suction hole, so that the film is tightly attached to the top surface of the ejector cap 101. When the ejector body 102 moves up and down in the ejector hole to eject the chip, the linear sealing bearing 105 allows the ejector support rod 1032 to move up and down while maintaining the sealing of the vacuum adsorption chamber 1011, preventing air leakage and maintaining a stable adsorption force.

[0101] In this embodiment, the pin cap direct drive assembly 104 further includes:

[0102] A needle cap photoelectric sensor 1047 is mounted on the needle cap positioning base 1041 and electrically connected to the cam rotary drive mechanism 1044.

[0103] A light-blocking plate 1048 is mounted on the needle cap lifting plate 1042 and is used to enter the detection area of ​​the needle cap photoelectric sensor 1047 when the needle cap lifting plate 1042 reaches its highest position.

[0104] When the cam-driven mechanism 1044 drives the rotating cam 1043 to rotate, causing the needle cap lifting plate 1042 to move the ejector cap 101 upward to the preset highest position (i.e., the initial / reset position), the needle cap light-blocking plate 1048 mounted on the needle cap lifting plate 1042 moves accordingly and enters the detection area of ​​the needle cap photoelectric sensor 1047. After detecting the needle cap light-blocking plate 1048, the needle cap photoelectric sensor 1047 sends a signal to the control system of the cam-driven mechanism 1044 to confirm that the ejector cap 101 has been accurately reset to the highest position, and then controls the cam-driven mechanism 1044 to stop its operation. Through the cooperation of the needle cap photoelectric sensor 1047 and the needle cap light-blocking plate 1048, the precise detection of the highest position of the ejector cap 101 is achieved, ensuring that the ejector cap 101 can accurately return to the preset initial position before each ejector action, improving the repeatability and reliability of the equipment movement; at the same time, it provides position feedback to the system, which can effectively prevent equipment failure caused by position deviation and improve the stability and safety of the entire module operation.

[0105] Optionally, the ejector pin direct drive assembly 103 further includes:

[0106] A pin photoelectric sensor 1034 is mounted on the pin positioning base 1031 and electrically connected to the pin direct drive mechanism 1033.

[0107] A light-blocking plate 1035 is mounted on the ejector support rod 1032 and is used to enter the detection area of ​​the ejector photoelectric sensor 1034 when the ejector body 102 reaches its lowest position.

[0108] Similar to the highest position reset detection of the ejector cap 101, the cooperation of the ejector photoelectric sensor 1034 and the ejector light blocking plate 1035 can realize the lowest position reset detection of the ejector body 102, so as to avoid the ejector body 102 not being reset properly when it retracts, which would affect the subsequent lifting movement.

[0109] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.

Claims

1. A dual-drive ejector pin module, characterized in that, include: A pin cap (101) is used to adsorb a thin film; The ejector body (102) is movably disposed within the ejector cap (101); A direct drive assembly (103) for ejector pins, wherein the drive end of the direct drive assembly (103) is connected to the ejector pin body (102); A needle cap direct drive assembly (104) is provided, the drive end of which is connected to the pin cap (101). in, When the ejector pin direct drive assembly (103) drives the ejector pin body (102) to move upward to push the chip on the film upward, the pin cap direct drive assembly (104) is used to drive the ejector pin cap (101) to adsorb and drive the film downward.

2. The dual-drive ejector pin module according to claim 1, characterized in that, The ejector pin direct drive assembly (103) includes: Ejector positioning base (1031); The ejector pin support rod (1032) is provided with the ejector pin body (102) mounted on the top of the ejector pin support rod (1032) and the lower end of the ejector pin support rod (1032) being slidably connected to the ejector pin positioning base (1031). The ejector pin direct drive mechanism (1033) is mounted on the ejector pin positioning base (1031), and the drive end of the ejector pin direct drive mechanism (1033) is connected to the ejector pin support rod (1032) to drive the ejector pin support rod (1032) to move up and down.

3. The dual-drive ejector pin module according to claim 2, characterized in that, The pin cap direct drive assembly (104) includes: A needle cap positioning base (1041) is fixedly disposed relative to the ejector pin positioning base (1031); The needle cap lifting plate (1042) is slidably connected to the needle cap positioning base (1041) in a vertical manner; The ejector cap (101) is installed and fixed on the ejector cap lifting plate (1042) and is sleeved on the outside of the ejector body (102) from top to bottom; A rotating cam (1043) is located below the needle cap lifting plate (1042) and abuts against the needle cap lifting plate (1042); A cam-driven mechanism (1044) is mounted on the needle cap positioning base (1041), and the driving end of the cam-driven mechanism (1044) is connected to the rotating cam (1043). A reset spring (1045) is provided, with its upper end connected to the needle cap lifting plate (1042) and its lower end connected to the ejector pin positioning base (1031), for driving the needle cap lifting plate (1042) to abut against the rotating cam (1043) downwards.

4. The dual-drive ejector pin module according to claim 3, characterized in that, The bottom of the needle cap lifting plate (1042) is provided with a detachable cam abutment block (1046).

5. The dual-drive ejector pin module according to claim 3, characterized in that, The top surface of the ejector cap (101) has an ejector hole at the center for the ejector body (102) to pass through, and a number of vacuum suction holes are provided around the ejector hole.

6. The dual-drive ejector pin module according to claim 5, characterized in that, The pin cap (101) encloses and forms a vacuum adsorption cavity (1011), and each pin hole is connected to the top of the vacuum adsorption cavity (1011); A linear sealed bearing (105) is provided between the lower opening of the vacuum adsorption chamber (1011) and the ejector pin support rod (1032).

7. The dual-drive ejector pin module according to claim 3, characterized in that, The pin cap direct drive assembly (104) also includes: A needle cap photoelectric sensor (1047) is mounted on the needle cap positioning base (1041) and electrically connected to the cam rotary drive mechanism (1044). A light-blocking plate (1048) is installed on the needle cap lifting plate (1042) and is used to enter the detection area of ​​the needle cap photoelectric sensor (1047) when the needle cap lifting plate (1042) reaches its highest position.

8. The dual-drive ejector pin module according to claim 2, characterized in that, The pin direct drive assembly (103) also includes: A pin photoelectric sensor (1034) is mounted on the pin positioning base (1031) and electrically connected to the pin direct drive mechanism (1033). A light-blocking plate (1035) is mounted on the ejector support rod (1032) and is used to enter the detection area of ​​the ejector photoelectric sensor (1034) when the ejector body (102) reaches its lowest position.

9. A die bonding apparatus, characterized in that, include: A crystal ring fixing platform (2) is used to support the crystal ring; wherein a thin film is tightly stretched on the crystal ring, and a number of chips are provided on the thin film; The dual-drive ejector module (1) as described in any one of claims 1-8 is located below the thin film and is used to lift the chip upward while driving the thin film downward. A pick-up nozzle, located above the film, is used to pick up and transfer the chip that has been lifted up.

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