An end effector

Abstract

The utility model relates to the technical field of semiconductor processing equipment discloses a kind of end effector, including integrally-formed mounting plate, gas passage is opened on it, one end of gas passage is connected vacuum equipment through vacuum pipeline, and another end is along the mounting plate and is divided into M (M is greater than or equal to 3) strands and respectively has suction cup assembly, and vacuum chuck is made of inelastic material material.The utility model, by using integrated structure design, each component gas passage is not needed to be mutually aligned and connected, the loss generated after effective long time operation is further guaranteed vacuum value precision;Suction cup is made of inelastic material, can be in the protection wafer surface simultaneously, when putting piece needs to be disconnected vacuum in short time, suction cup will not restore initial shape after disconnecting vacuum, leading to wafer unable to put piece.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment technology, specifically to an end effector. Background Technology

[0002] A wafer handling robot is a highly precise and clean automated robotic system specifically designed to safely, quickly, and contaminantly transport wafers between semiconductor manufacturing equipment (e.g., from memory cassettes to process reaction chambers). A typical wafer handling robot system usually includes a robot body, an end effector, and a driver.

[0003] The end effector, acting as the robot's "hand," comes into direct contact with the wafer. It is typically made of advanced composite materials (such as carbon fiber) or specially coated aluminum alloys to ensure high strength, lightweight, low gas release, and no particulate generation. Common types include: Fork type: providing support from the wafer edge or bottom; Clamping type: gently clamping the wafer edge (requires very precision and gentleness); Vacuum type: supporting and positioning the wafer by using negative pressure to adhere to the back of the wafer.

[0004] CN222637265U discloses an end effector for a robot, which is divided into three parts: a connecting block, a mounting plate, and a handling component, for handling and carrying wafers. The thickness of the first and second ceramic handling components is between 5.0mm and 6.5mm. This end effector adopts a split structure design, which facilitates logistics and transportation, but requires high assembly precision in actual use. With increasing service life, friction and loosening can easily occur at the connection points of various components, adversely affecting cleanliness. Furthermore, during vacuuming, misalignment of the gas channels at the connection points of various components can lead to gas loss, compromising vacuum accuracy. Simultaneously, the actuator generates negative pressure through a vacuum suction cup to adsorb the wafer onto the suction cup pad. While using an elastic material suction cup pad, such as rubber, can further protect the wafer surface, in actual use, the vacuum needs to be broken quickly during wafer placement. If an elastic material is used for the suction cup, it will retain its pre-adsorption shape after the vacuum is broken, causing the wafer to be bounced away and preventing wafer placement. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides an end effector that solves the problems of existing split-type end effectors, such as adverse effects on cleanliness, easy gas loss, inability to guarantee vacuum accuracy, and poor protection of wafer surfaces.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] An end effector includes an integrally formed mounting plate with a gas channel for evacuation. One end of the gas channel is connected to a vacuum device via a vacuum tube, and the other end extends along the mounting plate into M (M≥3) strands, each connected to a suction cup assembly. The suction cup assembly includes a suction cup pad, a buffer pad, and a vacuum suction cup. The suction cup pad is detachably mounted on the mounting plate. The vacuum suction cup is connected to the gas channel via an air passage provided on the suction cup pad. The buffer pad is provided between the vacuum suction cup and the suction cup pad. The vacuum suction cup is made of a non-elastic material.

[0008] Preferably, the suction cup assembly further includes a connecting interface for connecting a gas channel and an air path. The outlet end of the air path is connected to multiple sets of vacuum suction cups and buffer pads to achieve multi-point adsorption / support for the wafer.

[0009] Preferably, the buffer pad is sleeved outside the vacuum suction cup and its top end is fixed to the vacuum suction cup, and the Shore hardness of the buffer pad is 20~50.

[0010] Preferably, the gas channel is sunken and arranged on the mounting plate, and a channel sealing plate matching the shape of the gas channel is fixedly installed on the mounting plate. The channel sealing plate is integrally formed.

[0011] Preferably, the suction cup pad is detachably connected to the mounting plate via fixing screws and screw holes, and the mounting plate is provided with mounting grooves at the top and bottom to accommodate the fixing screws.

[0012] Preferably, a cover plate flush with the surface of the mounting plate is fixedly provided on the mounting groove. The cover plate has an inspection port that matches the position of the fixing screw. The lower end face of the cover plate and the mounting groove form a cavity to accommodate the fixing screw after it is unscrewed.

[0013] Preferably, the suction cup pad is a retractable structure with an internal air passage.

[0014] This utility model has the following beneficial effects:

[0015] This end effector features an integrated design with fewer components; the integrated mounting plate has an air supply channel, eliminating the need for alignment and connection of air supply channels between individual components, effectively reducing losses during long-term operation and further ensuring vacuum accuracy; the chuck is made of a non-elastic material, which protects the wafer surface and prevents the chuck from returning to its initial shape after the vacuum needs to be broken during wafer placement, thus preventing wafer placement from being interrupted. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2This is a schematic diagram of the wafer adsorption state structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the disassembled structure of the components of this utility model;

[0019] Figure 4 This utility model Figure 3 Enlarged structural diagram of region A in the middle;

[0020] Figure 5 This is a schematic diagram of the suction cup assembly and placement groove layout of this utility model;

[0021] Figure 6 This is a schematic diagram of the overall disassembled structure of the suction cup assembly of this utility model.

[0022] In the diagram: 1. Mounting plate; 2. Gas channel; 3. Channel sealing plate; 4. Suction cup assembly; 41. Suction cup pad; 42. Buffer pad; 43. Vacuum suction cup; 44. Connecting interface; 5. Mounting slot; 6. Fixing screw; 7. Cover plate; 8. Inspection port; 9. Wafer. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] An end effector includes an integrally formed mounting plate 1 with a gas channel 2. One end of the gas channel 2 is connected to a vacuum device via a vacuum pipeline, and the other end extends along the mounting plate 1 into M (M≥3) strands, each connected to a suction cup assembly 4. The suction cup assembly 4 includes a suction cup pad 41, a buffer pad 42, and a vacuum suction cup 43. The suction cup pad 41 is detachably mounted on the mounting plate 1. The vacuum suction cup 43 is connected to the gas channel 2 via an air passage provided on the suction cup pad 41. The buffer pad 42 is provided between the vacuum suction cup 43 and the suction cup pad 41. The vacuum suction cup 43 is made of a non-elastic material.

[0025] like Figure 1 and Figure 2As shown, in the above technical solution, the suction cup assembly 4 is mounted on an integrated mounting plate 1, and the mounting plate 1 has fewer parts, which not only saves installation time but also avoids the adverse effects of loose components and friction on cleanliness. The integrated mounting plate 1 has an air supply channel, eliminating the need for alignment and connection between the air supply channels of each component, effectively avoiding losses and further ensuring vacuum accuracy. The suction cup is made of a non-elastic material, which protects the surface of the wafer 9 while preventing it from returning to its initial shape after the vacuum is disconnected for a short time during wafer placement, thus avoiding the problem of wafer 9 being unable to be placed. This avoids the adverse effects of traditional elastic vacuum suction cups 43, which are prone to elastic reset during wafer placement. A buffer pad 42 is placed between the suction cup pad 41 and the vacuum suction cup 43, providing double buffering against the slight vibrations generated during wafer 9 adsorption and preventing potential wear on the bottom of the wafer 9 when the surface of the buffer pad 42 directly contacts the wafer 9.

[0026] The vacuum suction cup 43 can be made of polyaryletherketone (PEEK) or a material that can achieve the same function, effectively avoiding the impact of its elastic deformation on the placement of the sheet when the vacuum is broken. In the above technical solution, there are four sets of suction cup assemblies 4, which are arranged symmetrically in pairs. In actual application, the number of suction cup assemblies 4 can be determined according to the number of strands M that are separated from the gas channel 2, so as to meet the requirements of different equipment.

[0027] The suction cup assembly 4 also includes a connecting interface 44, which connects the gas channel 2 to the gas path. The outlet of the gas path connects to multiple sets of vacuum suction cups 43 and buffer pads 42 to achieve multi-point adsorption / support for the wafer 9. Figure 5 and Figure 6 As shown, in this technical solution, only one set of vacuum suction cups 43 and buffer pads 42 are provided at one end of the suction cup pad 41 to achieve single-point adsorption / support (one set) of wafer 9. In practical applications, the number of vacuum suction cups 43 can be expanded to achieve multi-point support of wafer 9.

[0028] The buffer pad 42 is sleeved and arranged outside the vacuum suction cup 43, with its top end fixed to the vacuum suction cup 43. The Shore hardness of the buffer pad 42 is 20. Figure 5 and Figure 6As shown, in this technical solution, the vacuum chuck 43, through the installation method of the buffer pad 42 and the chuck pad 41, has a certain degree of rotational freedom on its surface. Utilizing the gravity of the wafer 9 and the vacuum suction force of the vacuum chuck 43 on the wafer 9, the upper surface of the vacuum chuck 43 is parallel to the lower surface of the wafer 9, thus eliminating gaps between the wafer 9 and the vacuum chuck 43 and preventing loss of vacuum pressure. This allows for contact with the bottom surface of the wafer 9, achieving the support of the wafer 9. After the vacuum equipment is turned on, the gas channel 2 connects to the chuck assembly 4, and the suction force generated by the vacuum chuck 43 achieves the adsorption of the wafer 9. The slight vibrations generated during adsorption are absorbed by the chuck and the buffer pad 42, preventing damage to the surface of the wafer 9.

[0029] Test the effect of the hardness of the 42-level buffer pad on the vacuum value

[0030] Conditions: Clean room at 22℃ and 55% humidity

[0031] First, connect the air inlet of the end effector to the vacuum regulating valve. Install a vacuum pressure gauge on the regulating valve to display the pressure value supplied to the end effector. Then, connect the pressure gauge to a vacuum generator that can display the vacuum value. The vacuum generator provides a negative pressure set to -96 kPa.

[0032] Test procedure: The wafer is placed on top of the end effector coaxially. The end effector is kept horizontal and moves upward at a speed of 300 mm / s. After the wafer is removed, the pressure value of the vacuum pressure gauge is checked.

[0033]

[0034] Gas channel 2 is recessed and arranged on mounting plate 1. A channel sealing plate 3, matching the shape of gas channel 2, is fixedly installed on mounting plate 1. The channel sealing plate 3 is integrally formed. Figure 2 As shown, in this technical solution, an integrally machined channel sealing plate 3 is used to ensure the sealing of the entire gas channel 2. At the same time, it reduces the number of component connections and improves the connection of the entire end effector during long-term operation, making it less prone to gas loss and ensuring the accuracy of the vacuum value.

[0035] In this technical solution, the suction cup pad 41 is detachably connected to the mounting plate 1 by means of fixing screws and screw holes, and the mounting plate 1 is provided with mounting grooves 5 at the top and bottom to accommodate the fixing screws.

[0036] A cover plate 7, flush with the surface of the mounting plate 1, is fixedly installed on the mounting groove 5. The cover plate 7 has an inspection port 8 that matches the position of the fixing screws. The lower end face of the cover plate 7 and the mounting groove 5 form a cavity to accommodate the unscrewed fixing screws. Figure 5 and Figure 6As shown in the above technical solution, after the fixing screw is unscrewed during maintenance, it will remain in the cavity formed by the cover plate 7 and the placement groove, which avoids the fixing screw being lost during maintenance and facilitates maintenance operations.

[0037] In this technical solution, the suction cup pad is a retractable structure with an internal air passage. The retractable suction cup pad can be used to accommodate the adsorption of wafers of different sizes, thereby improving the applicability of the entire end effector.

[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An end effector, characterized in that, It includes an integrally molded mounting plate with gas channels. One end of the gas channels is connected to a vacuum device via a vacuum tube, and the other end extends along the mounting plate into M (M≥3) strands, each connected to a suction cup assembly. The suction cup assembly includes a suction cup pad, a buffer pad, and a vacuum suction cup. The suction cup pad is detachably mounted on the mounting plate. The vacuum suction cup is connected to the gas channels via an air passage set on the suction cup pad. The buffer pad is set between the vacuum suction cup and the suction cup pad. The vacuum suction cup is made of a non-elastic material.

2. The end effector according to claim 1, characterized in that: The suction cup assembly also includes a connection interface, which connects the gas channel and the gas path. The gas path outlet is connected to multiple sets of vacuum suction cups and buffer pads to achieve multi-point adsorption / support for the wafer.

3. The end effector according to claim 2, characterized in that: The buffer pad is sleeved outside the vacuum suction cup and its top end is fixed to the vacuum suction cup. The Shore hardness of the buffer pad is 20~50.

4. The end effector according to claim 3, characterized in that: The gas channel is sunken and arranged on the mounting plate, and a channel sealing plate that matches the shape of the gas channel is fixedly installed on the mounting plate. The channel sealing plate is integrally formed.

5. The end effector according to any one of claims 1-3, characterized in that: The suction cup pad is detachably connected to the mounting plate via fixing screws and screw holes. The mounting plate has recessed mounting grooves to accommodate the fixing screws.

6. The end effector according to claim 5, characterized in that: A cover plate flush with the surface of the mounting plate is fixedly installed on the mounting groove. An inspection port that matches the position of the fixing screw is opened on the cover plate. The lower end face of the cover plate and the mounting groove form a cavity to accommodate the fixing screw after it is unscrewed.

7. The end effector according to claim 5, characterized in that: The suction cup pad is a retractable structure with an internal air passage.

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