A size measuring device for silicon carbide wafer production

Abstract

The utility model relates to the technical field of silicon carbide wafer production and manufacturing, disclose a size measuring equipment for silicon carbide wafer production, including substrate, the lower surface connection hollow box of substrate, the upper surface one side is equipped with cleaning tank, the other side is equipped with the measuring tank of wafer measuring instrument, there is cleaning mechanism in the cleaning tank, is used for the cleaning of wafer, the side of substrate near measuring tank is equipped with sucking disc, its both sides are connected sliding block, and the end of substrate is equipped with transmission assembly drive sucking disc movement, one side in the box has collection tank, and the side of substrate near cleaning tank is inclined plane, and the low point through hole is connected collection tank through hose, the baffle with sliding slot is equipped in the box, and the sliding block of sliding slot is connected to place the box up and down, the cleaning mechanism contains water inlet, rotating electrical machine and the support with nozzle, transmission assembly contains drive motor, screw rod and guide rod, the equipment integrates cleaning and measuring function, realizes wafer efficient processing and accurate measurement, and production efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of silicon carbide wafer manufacturing technology, specifically to a size measuring device for silicon carbide wafer production. Background Technology

[0002] In the dimensional measurement stage of silicon carbide wafer production, if the wafer thickness uniformity is off, it will lead to uneven photoresist coating during device fabrication, ultimately affecting the electrical performance of the chip; if the edge chipping occurs, stress concentration during packaging will cause the chip to crack.

[0003] Existing wafer measurement equipment lacks an automated transfer mechanism, requiring manual handling of wafers between the cleaning and measurement units. This not only increases labor costs but also increases the risk of secondary contamination due to impurities adhering to the wafer surface. Furthermore, manual transfer cannot guarantee positional accuracy, potentially causing wafer collision damage and severely impacting the continuity and efficiency of the production process. Even when cleaning functions are included, many devices employ fixed spraying methods, resulting in incomplete cleaning as the cleaning solution cannot evenly cover the wafer surface. Residual contaminants can interfere with subsequent dimensional measurement accuracy. Additionally, the lack of a dedicated wastewater collection system leads to the indiscriminate discharge of cleaning wastewater, polluting the environment and failing to meet environmental protection standards. Moreover, the poor integration of wafer storage and measurement processes further reduces overall production efficiency.

[0004] Therefore, there is an urgent need for a dimensional measurement device for silicon carbide wafer production that can achieve automatic wafer transfer, uniform cleaning, centralized waste liquid recycling, and integrate cleaning and measurement. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a dimensional measurement device for silicon carbide wafer production.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a dimensional measuring device for silicon carbide wafer production, comprising a substrate, the lower surface of which is connected to the upper surface of a housing, the interior of which is hollow, one side of the upper surface of which is connected to the lower end of a cleaning chamber, and the side of the upper surface of which is away from the cleaning chamber connected to the lower end of a measuring chamber, a wafer measuring instrument being installed inside the measuring chamber, a cleaning mechanism being provided inside the cleaning chamber for cleaning the wafer, a suction cup being placed on the side of the upper surface of which is close to the measuring chamber, one end of a sliding block being connected to both sides of the suction cup, and a transmission assembly being provided on the end of the side of the substrate close to the measuring chamber for driving the suction cup.

[0007] As a further description of the above technical solution:

[0008] A collection box is placed inside the box. The upper surface of the substrate is inclined on the side near the cleaning box, and a through hole is provided at the lowest point. One end of the through hole is connected to the hose, and the other end is connected to the opening of the collection box.

[0009] As a further description of the above technical solution:

[0010] Inside the box, a partition is provided in the middle on the side away from the collection box. The upper and lower surfaces of the partition are provided with sliding grooves, and sliders are slidably connected to the sliding grooves. The sliders are respectively connected to the lower surface of the upper box and the upper surface of the lower box.

[0011] As a further description of the above technical solution:

[0012] The cleaning mechanism includes a water inlet, one end of which passes through the top surface of the cleaning tank and is rotatably connected to the middle position of the upper surface of the bracket. A rotary motor is provided on one side of the water inlet, and the output shaft of the rotary motor is connected to the drive wheel. A driven wheel is rotatably connected below the water inlet. The drive wheel and the driven wheel are connected by a belt.

[0013] As a further description of the above technical solution:

[0014] The lower surface of the driven wheel is connected to the upper surface of the bracket via a column, and multiple nozzles are evenly arranged on the lower surface of the bracket.

[0015] As a further description of the above technical solution:

[0016] The transmission assembly includes a drive motor, which is disposed on one side of the substrate. The output shaft of the drive motor is connected to one end of a screw, which is placed inside one side of the upper surface of the substrate. The other end of the screw is rotatably connected to the inner wall of the substrate.

[0017] As a further description of the above technical solution:

[0018] The two ends of the guide rod are rotatably connected inside the side of the upper surface of the substrate away from the screw. One of the sliding blocks on both sides of the suction cup is threadedly connected to the screw, and the other is slidably connected to the guide rod.

[0019] This utility model has the following beneficial effects:

[0020] 1. Automatic transfer of wafers between the cleaning and measuring boxes is achieved through a transmission assembly, reducing manual intervention, avoiding contamination and damage during wafer handling, and improving the continuity and efficiency of the production process.

[0021] Second, the cleaning mechanism uses a rotating motor to drive the support to rotate, and the multi-nozzle design achieves uniform cleaning of the wafer surface. At the same time, the combination of inclined guide and collection box enables centralized recycling of waste liquid, which not only ensures the cleaning effect to improve the accuracy of subsequent measurements, but also meets the requirements of environmentally friendly production. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0023] Figure 2 This is an exploded view of the overall structure of this utility model;

[0024] Figure 3 This is an exploded view of the cleaning mechanism structure of this utility model;

[0025] Figure 4 This is a cross-sectional view of the transmission component structure of this utility model.

[0026] Legend:

[0027] 1. Base plate; 2. Housing; 3. Cleaning tank; 4. Measuring tank; 5. Cleaning mechanism; 6. Transmission assembly; 7. Suction cup; 8. Collection box; 9. Partition plate; 10. Placement box; 501. Water inlet; 502. Rotary motor; 503. Drive wheel; 504. Driven wheel; 505. Belt; 506. Bracket; 507. Nozzle; 601. Drive motor; 602. Screw; 603. Guide rod. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] Example 1:

[0032] like Figures 1 to 4 As shown in the figure, this embodiment provides a dimensional measurement device for silicon carbide wafer production, including a substrate 1. The lower surface of the substrate 1 is connected to the upper surface of a housing 2. The interior of the housing 2 is hollow. One side of the upper surface of the substrate 1 is connected to the lower end of a cleaning tank 3, and the side of the upper surface of the substrate 1 away from the cleaning tank 3 is connected to the lower end of a measuring tank 4. A wafer measuring instrument is installed inside the measuring tank 4. A cleaning mechanism 5 is provided inside the cleaning tank 3 for cleaning the wafer. A suction cup 7 is placed on the side of the upper surface of the substrate 1 near the measuring tank 4. One end of a sliding block is connected to both sides of the suction cup 7. A transmission assembly 6 is provided at the end of the substrate 1 near the measuring tank 4 for driving the suction cup 7.

[0033] In this embodiment, the cleaning mechanism 5 and the transmission assembly 6 constitute a dimension measuring device for silicon carbide wafer production according to this application.

[0034] It should also be noted that the wafer manufacturing in this application can be silicon carbide wafers, silicon-based wafers, gallium nitride wafers, etc. Figure 1 In this embodiment, silicon carbide wafers are used as an example for wafer production. Of course, other types of wafer production can also adopt similar structures, which will not be described in detail below.

[0035] Understandable Figure 1 The diagram only schematically illustrates some of the components included in the measuring device; the actual shape, size, location, and construction of these components are not subject to change. Figure 1 Due to limitations, the measuring equipment can also include, compared to Figure 1 More or fewer parts.

[0036] In addition, in this embodiment, the measuring box 4 is equipped with high-precision wafer measuring instruments (such as laser thickness gauges, optical profile gauges, and diameter and notch measuring instruments). With the substrate 1 and the box 2 as the basic framework, the cleaning box 3 and the measuring box 4 are placed on both sides of the substrate 1. The suction cup 7 moves through the sliding block and the transmission component 6 to realize the transfer of the wafer between the cleaning and measuring stations, thus building the core structure of the equipment and providing basic support for subsequent cleaning and measuring operations.

[0037] Specifically, a collection box 8 is placed inside one side of the box body 2. The upper surface of the base plate 1 is inclined on the side near the cleaning box 3, and a through hole is provided at the low point. One end of the through hole is connected to the hose, and the other end is connected to the opening of the collection box 8.

[0038] In this embodiment, the wastewater generated during cleaning flows along the inclined surface of the substrate 1 and is introduced into the collection box 8 through the through hole and the hose, so as to realize the centralized collection of cleaning wastewater and avoid wastewater pollution of equipment and environment.

[0039] Specifically, a partition 9 is provided in the middle of the side of the box 2 away from the collection box 8. The upper and lower surfaces of the partition 9 are provided with sliding grooves, and sliders are slidably connected to the sliding grooves. The sliders are respectively connected to the lower surface of the upper box 10 and the upper surface of the lower box 10.

[0040] As a preferred implementation, the partition 9 divides the internal space of the box 2, and the placement box 10 is pulled along the slide groove by a slider to realize the classified storage of measured wafers and wafers to be measured, thereby improving the convenience of wafer retrieval.

[0041] Example 2:

[0042] A cleaning mechanism 5 is provided based on embodiment 1.

[0043] Specifically, the cleaning mechanism 5 includes a water inlet 501. One end of the water inlet 501 passes through the top surface of the cleaning tank 3 and is rotatably connected to the middle position of the upper surface of the bracket 506. A rotary motor 502 is provided on one side of the water inlet 501, and the output shaft of the rotary motor 502 is connected to the drive wheel 503. A driven wheel 504 is rotatably connected below the water inlet 501. The drive wheel 503 and the driven wheel 504 are connected by a belt 505.

[0044] In this embodiment, the rotary motor 502 drives the drive wheel 503 to rotate, which in turn drives the driven wheel 504 to rotate via the belt 505, thereby driving the bracket 506 to rotate, providing power for the rotational cleaning action of the cleaning mechanism 5.

[0045] Specifically, the lower surface of the driven wheel 504 is connected to the upper surface of the bracket 506 via a column, and a plurality of nozzles 507 are evenly arranged on the lower surface of the bracket 506.

[0046] With this configuration, the cleaning fluid enters the support 506 through the inlet 501 and is sprayed out through the nozzle 507. At the same time, the support 506 rotates with the driven wheel 504, so as to achieve uniform coverage of the cleaning fluid on the wafer surface and improve the cleaning effect.

[0047] Example 3:

[0048] A transmission component 6 is provided based on embodiment 2.

[0049] Specifically, the transmission assembly 6 includes a drive motor 601, which is disposed on one side of the substrate 1. The output shaft of the drive motor 601 is connected to one end of a screw 602. The screw 602 is placed inside one side of the upper surface of the substrate 1, and the other end of the screw 602 is rotatably connected to the inner wall of the substrate 1.

[0050] The drive motor 601 drives the screw 602 to rotate in both directions, which in turn moves the sliding block connected to the screw 602, providing power for the horizontal movement of the chuck 7 and realizing the transfer of the wafer to the work station.

[0051] Specifically, the two ends of the guide rod 603 are rotatably connected inside the side of the upper surface of the substrate 1 away from the screw 602, and one of the sliding blocks on both sides of the suction cup 7 is threadedly connected to the screw 602, and the other is slidably connected to the guide rod 603.

[0052] In this embodiment, when the screw 602 drives the sliding block to move, the guide rod 603 restricts the rotation of the sliding block to ensure that the sliding block moves in a straight line, thus ensuring the stability of the chuck 7 during its movement and preventing the wafer from shifting or falling off.

[0053] In actual use, firstly, the drive motor 601 is started. The output shaft of the drive motor 601 drives the screw 602 to rotate. The rotation of the screw 602 causes the threaded sliding block to move horizontally. The movement of the sliding block causes the suction cup 7 to move. At this time, the suction cup 7 slides to one side of the cleaning tank 3. After the suction cup 7 slides out of the cleaning tank 3, the wafer is placed on the upper surface of the suction cup 7. Then, the drive motor 601 is started to move the suction cup 7 and the wafer into the cleaning tank 3. Then, the external water source is turned on, and the cleaning fluid flows into the interior of the bracket 506 through the water inlet 501. The bracket 506 distributes the fluid evenly to the nozzle 507, and then the cleaning fluid is sprayed out through the nozzle 507. Then, the rotary motor 502 is started. The output shaft of the rotary motor 502 drives the drive wheel 503 to rotate. Since the drive wheel 503 and the driven wheel 504 are connected by a belt 505, the rotation of the drive wheel 503 drives the driven wheel 504 to rotate. Since the rotation of the water inlet 501 connects to the driven wheel 504, the rotation of the drive wheel 503 drives the driven wheel 504 to rotate. The support 506 is connected to the driven wheel 504 via a column, so the driven wheel 504 drives the support 506 to rotate, uniformly cleaning the wafer surface. At this time, the wastewater after cleaning flows into the hose through the inclined surface of the upper surface of the substrate 1 near the cleaning tank 3, and then flows into the collection tank 8 for collection. After cleaning is completed, the drive motor 601 is started to drive the suction cup 7 and the wafer to the inside of the measurement tank 4 for measurement. After the measurement is completed, the drive motor 601 is started again to push out the suction cup 7 and the wafer, and then the wafer is removed. Then the upper placement box 10 is pulled so that the slider on the lower surface of the placement box 10 moves along the slide groove, thereby detaching from the inside of the tank 2. Then the measured wafer is placed inside the placement box 10. Then the lower placement box 10 is pulled so that the placement box 10 slides along the slide groove via the slider on the upper surface. Then the unmeasured wafer is taken out and placed on the upper surface of the suction cup 7 for measurement. At this time, the collection tank 8 can be taken out to clean the waste liquid.

[0054] Both the rotary motor 502 and the drive motor 601 are electrically connected to the PLC controller, which is electrically connected to an external power supply. The PLC controller facilitates the power supply control of the electrical equipment, ensuring that the equipment can be powered on when needed, thus avoiding the situation where power cannot be supplied when power is required.

[0055] It should be noted that the controller can be a conventional known device that is controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific embodiments of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0056] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A dimensional measuring device for silicon carbide wafer production, characterized in that: The system includes a substrate (1), the lower surface of which is connected to the upper surface of a housing (2). The interior of the housing (2) is hollow. One side of the upper surface of the substrate (1) is connected to the lower end of a cleaning tank (3), and the side of the upper surface of the substrate (1) away from the cleaning tank (3) is connected to the lower end of a measuring tank (4). A wafer measuring instrument is installed inside the measuring tank (4). A cleaning mechanism (5) is provided inside the cleaning tank (3). The cleaning mechanism (5) is used for cleaning the wafer. A suction cup (7) is placed on the side of the upper surface of the substrate (1) near the measuring tank (4). One end of a sliding block is connected to both sides of the suction cup (7). A transmission component (6) is provided at the end of the side of the substrate (1) near the measuring tank (4). The transmission component (6) is used for the transmission of the suction cup (7).

2. The dimensional measuring device for silicon carbide wafer production according to claim 1, characterized in that: A collection box (8) is placed inside one side of the box (2). The upper surface of the substrate (1) is inclined on the side near the cleaning box (3), and a through hole is provided at the low point. One end of the through hole is connected to the hose, and the other end is connected to the opening of the collection box (8).

3. The dimensional measuring device for silicon carbide wafer production according to claim 2, characterized in that: Inside the box (2), a partition (9) is provided in the middle on the side away from the collection box (8). The upper and lower surfaces of the partition (9) are provided with sliding grooves, and sliders are slidably connected to the sliding grooves. The sliders are respectively connected to the lower surface of the upper box (10) and the upper surface of the lower box (10).

4. The dimensional measuring device for silicon carbide wafer production according to claim 3, characterized in that: The cleaning mechanism (5) includes a water inlet (501). One end of the water inlet (501) passes through the top surface of the cleaning tank (3) and is rotatably connected to the middle position of the upper surface of the bracket (506). A rotary motor (502) is provided on one side of the water inlet (501), and the output shaft of the rotary motor (502) is connected to the drive wheel (503). A driven wheel (504) is rotatably connected below the water inlet (501). The drive wheel (503) and the driven wheel (504) are connected by a belt (505).

5. The dimensional measuring device for silicon carbide wafer production according to claim 4, characterized in that: The lower surface of the driven wheel (504) is connected to the upper surface of the bracket (506) via a column, and a plurality of nozzles (507) are evenly arranged on the lower surface of the bracket (506).

6. The dimensional measuring device for silicon carbide wafer production according to claim 5, characterized in that: The transmission assembly (6) includes a drive motor (601), which is disposed on one side of the substrate (1). The output shaft of the drive motor (601) is connected to one end of a screw (602). The screw (602) is placed inside one side of the upper surface of the substrate (1), and the other end of the screw (602) is rotatably connected to the inner wall of the substrate (1).

7. The dimensional measuring device for silicon carbide wafer production according to claim 6, characterized in that: The two ends of the guide rod (603) are rotatably connected inside the side of the upper surface of the substrate (1) away from the screw (602). One of the sliding blocks on both sides of the suction cup (7) is threadedly connected to the screw (602), and the other is slidably connected to the guide rod (603).

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