Bonding apparatus

Abstract

The application discloses a bonding device, comprising: a first disc body and a second disc body oppositely arranged in a first direction, one side of the first disc body facing the second disc body is used for arranging a first wafer, and one side of the second disc body facing the first disc body is used for arranging a second wafer; and a needle mechanism comprising a plurality of needles arranged on the first disc body, wherein the plurality of needles comprises a center needle and at least one peripheral needle group, the peripheral needle group comprises a plurality of needle units uniformly distributed along the circumference of the center needle, and each needle unit comprises at least one needle.

Description

Technical Field

[0001] This invention relates to the field of wafer bonding technology, and more particularly to a bonding apparatus. Background Technology

[0002] With the continuous development of semiconductor technology, wafer bonding technology has been widely used. Wafer bonding technology is a technology that uses bonding to bond two wafers together to achieve vertical interconnection between the two wafers.

[0003] Currently, wafer bonding is mainly performed using bonding equipment. The bonding equipment mainly includes an upper chuck and a lower chuck, which are used for adsorption of the upper and lower wafers, respectively. During the bonding process, pressure is applied to the upper wafer by a pin in the middle of the upper chuck. As the upper wafer changes shape, the bonding wave moves from the center of the wafer to the edge, and then releases the adsorption vacuum of the upper wafer from the center to the edge in sequence, so that the two wafers are bonded under the action of the bonding wave.

[0004] However, existing bonding devices still need improvement. Utility Model Content

[0005] The purpose of this application is to provide a bonding device.

[0006] This application discloses a bonding device, comprising: A first disk and a second disk are arranged opposite to each other in a first direction. The side of the first disk facing the second disk is used to set a first wafer, and the side of the second disk facing the first disk is used to set a second wafer. The ejector mechanism includes a plurality of ejector pins disposed on the first disk body. The plurality of ejector pins are located on the side of the first wafer facing away from the second wafer. Each ejector pin extends along the first direction and is capable of reciprocating in the first direction. Each ejector pin is capable of applying a force to the first wafer during the movement. The plurality of ejector pins includes a central ejector pin and at least one peripheral ejector pin group. The peripheral ejector pin group includes a plurality of ejector pin units evenly distributed along the circumference of the central ejector pin, and each ejector pin unit includes at least one ejector pin.

[0007] In some alternative embodiments, the ejector unit includes a plurality of ejector pins, wherein the plurality of ejector pins in the ejector unit are located on the same straight line as the central ejector pin.

[0008] In some alternative embodiments, the at least one peripheral ejector pin group includes a plurality of peripheral ejector pin groups, which are distributed sequentially along a direction away from the central ejector pin.

[0009] In some alternative implementations, for any two adjacent peripheral ejector pin groups, a plurality of ejector pin units in one peripheral ejector pin group correspond one-to-one with a plurality of ejector pin units in another peripheral ejector pin group, and the plurality of ejector pins in one ejector pin unit and the plurality of ejector pins in the corresponding ejector pin unit are located on the same straight line.

[0010] In some alternative implementations, for any two adjacent peripheral ejector pin groups, a plurality of ejector pin units in one peripheral ejector pin group correspond one-to-one with a plurality of ejector pin units in another peripheral ejector pin group, and the plurality of ejector pins in one ejector pin unit and the plurality of ejector pins in the corresponding ejector pin unit are located on two different straight lines.

[0011] In some alternative embodiments, the at least one peripheral ejector pin group includes three peripheral ejector pin groups, and the distance between any two adjacent peripheral ejector pin groups is equal.

[0012] In some alternative embodiments, the bonding apparatus further includes a controller, a drive mechanism, and a detector; the detector is used to detect whether the bonding wave is uniform, and the controller is used to control the drive mechanism to drive each of the pins to move along the first direction.

[0013] In some alternative embodiments, the controller is used to control the drive mechanism to drive a plurality of peripheral ejector pin groups to apply force to the first wafer in a direction away from the central ejector pin.

[0014] In some alternative embodiments, the first disk body includes an inner region and a peripheral region surrounding the inner region, the plurality of pins are disposed in the inner region, the peripheral region is provided with adsorption holes, one opening of the adsorption hole is disposed on the side of the peripheral region facing the first wafer, and the other opening of the adsorption hole is used to connect to a first vacuum device.

[0015] In some alternative embodiments, the peripheral region includes multiple adsorption sub-regions, which are distributed sequentially along a direction away from the inner region; the adsorption pores in different adsorption sub-regions are isolated.

[0016] Compared with related technologies, in this application, the multiple ejector pins include a central ejector pin and at least one peripheral ejector pin group. The peripheral ejector pin group includes multiple ejector pin units evenly distributed along the circumference of the central ejector pin. Each ejector pin unit includes at least one ejector pin. With this configuration, in addition to applying force to the first wafer through the central ejector pin, force can also be applied to the first wafer through the ejector pins in the peripheral ejector pin group, thereby improving the bonding effect.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this specification. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this specification and, together with the description, serve to explain the principles of this specification.

[0019] Figure 1 This is a schematic diagram of the first and second wafers in the related technology.

[0020] Figure 2 This is a schematic diagram of the bonding of the first and second wafers in the related technology.

[0021] Figure 3 This is a schematic diagram of a bonding device according to an embodiment of this application.

[0022] Figure 4 This is a schematic diagram showing the layout of the central ejector pin and the peripheral ejector pin assembly in an embodiment of this application.

[0023] Figure 5 This is a schematic diagram of the first disk body according to an embodiment of this application.

[0024] Figure 6 This is a block diagram of a bonding device according to an embodiment of this application.

[0025] Figure 7 This is a schematic diagram of the bonding process according to an embodiment of this application.

[0026] Reference numerals: 1. First wafer; 2. Second wafer; 3. Bubble; 4. First disk; 401. Internal region; 402. Peripheral region; 4021. Adsorption sub-region; 5. Second disk; 6. Ejector pin; 6A. Central ejector pin; 7. Peripheral ejector pin group; 701. Ejector pin unit; 8. Ejector pin mechanism; 9. First dashed circle; 10. Second dashed circle; 11. Vacuum chuck; 12. Pin holder; 1201. Support beam; 1202. Frame; 13. Adsorption hole; 14. Detector; 15. Controller; 16. Drive mechanism. Detailed Implementation

[0027] The technical solutions in the embodiments (or "embodiments") of this application will be clearly and completely described herein with reference to the accompanying drawings. In the following description, when referring to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0028] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0029] In related technologies, such as Figure 1 As shown, the bonding equipment can only push downwards through the center pin until the first wafer 1 and the second wafer 2 make contact. From this point, the bonding wave begins to diffuse from the contact point. However, if the surface of the first wafer 1 or the second wafer 2 is excessively warped, twisted, or bulged, the tension during bonding will be too high. In this case, the bonding wave will not flow out evenly, leading to the formation of bubbles 3 (such as...). Figure 2 Bonding failed.

[0030] To address the aforementioned problems, this application provides a bonding device. For example... Figure 3 and Figure 4 As shown, the bonding device may include a first disk body 4, a second disk body 5, and an ejector mechanism 8, wherein: The first disk 4 and the second disk 5 are arranged opposite to each other in a first direction. The side of the first disk 4 facing the second disk 5 is used to place the first wafer 1. The side of the second disk 5 facing the first disk 4 is used to place the second wafer 2. The ejector mechanism 8 includes a plurality of ejector pins 6 disposed on the first disk 4. The plurality of ejector pins 6 are located on the side of the first wafer 1 facing away from the second wafer 2. Each ejector pin 6 extends along the first direction and is capable of reciprocating in the first direction; each ejector pin 6 can apply a force to the first wafer 1 during the movement. Among them, the plurality of ejector pins 6 includes a central ejector pin 6A and at least one peripheral ejector pin group 7. The peripheral ejector pin group 7 includes a plurality of ejector pin units 701 evenly distributed circumferentially along the central ejector pin 6A. Each ejector pin unit 701 includes at least one ejector pin 6.

[0031] The bonding apparatus of this application includes a plurality of ejector pins 6, including a central ejector pin 6A and at least one peripheral ejector pin group 7. The peripheral ejector pin group 7 includes a plurality of ejector pin units 701 evenly distributed along the circumference of the central ejector pin 6A. Each ejector pin unit 701 includes at least one ejector pin 6. With this configuration, in addition to applying force to the first wafer 1 through the central ejector pin 6A, force can also be applied to the first wafer 1 through the ejector pins 6 in the peripheral ejector pin group 7, thereby improving the bonding effect.

[0032] The following is a detailed description of each part of the bonding device according to the embodiments of this application: The first disk 4 and the second disk 5 are disposed opposite each other in a first direction. The thickness direction of the first disk 4 may be the same as the thickness direction of the second disk 5. The first direction may be the thickness direction of the first disk 4 and the second disk 5. The first disk 4 is used to set the first wafer 1. The first disk 4 may be circular, but this disclosure is not limited thereto. In a direction perpendicular to the first direction, such as... Figure 5 As shown, the first disk 4 may include an inner region 401 and an outer region 402. The inner region 401 may be circular or other shapes. The outer region 402 may surround the inner region 401, that is, the outer region 402 may be annular. Taking the inner region 401 of the first disk 4 as an example, the outer region 402 may be annular. The outer region 402 of the first disk 4 has a plurality of adsorption holes 13 on the side facing the first wafer 1. One opening of the adsorption hole 13 is located on the side of the outer region 402 facing the first wafer 1, and the other opening of the adsorption hole 13 is used to connect to a first vacuum device. The first vacuum device is used to evacuate the adsorption holes 13, so that the first wafer 1 can be adsorbed onto the first disk 4.

[0033] Furthermore, such as Figure 5 As shown, the peripheral region 402 of the first disk 4 includes multiple adsorption sub-regions 4021, which are sequentially distributed along a direction away from the inner region 401. The adsorption pores 13 in different adsorption sub-regions 4021 are isolated. This arrangement allows the adsorption pores 13 in different adsorption sub-regions 4021 to be controlled independently. In other words, this application can control the vacuum degree of the adsorption pores 13 in one adsorption sub-region 4021 to be different from the vacuum degree of the adsorption pores 13 in another adsorption sub-region 4021. In one embodiment, the multiple adsorption sub-regions 4021 include a first adsorption sub-region 4021 and a second adsorption sub-region 4021.

[0034] Taking a circular first disk 4 as an example, the second disk 5 can also be circular. The second disk 5 is used to hold the second wafer 2 to be bonded to the first wafer 1. The second disk 5 has an adsorption channel. One end of the adsorption channel is open for connection to a second vacuum device, and the other end is open on the side of the second disk 5 facing the first disk 4. The second vacuum device is used to evacuate the adsorption channel, thereby allowing the second wafer 2 to be adsorbed onto the second disk 5. Furthermore, the side of the second disk 5 facing the first disk 4 can be a convex curved surface, that is, the side of the second disk 5 facing the first disk 4 bulges towards the first disk 4.

[0035] The ejector mechanism 8 includes a plurality of ejector pins 6 disposed on the first disk 4, located on the side of the first wafer 1 facing away from the second wafer 2. The ejector pins 6 are spaced apart on a plane perpendicular to a first direction. Each ejector pin 6 extends along the first direction and is capable of reciprocating in that direction. Each ejector pin 6 can apply a force to the first wafer 1 during its movement. Specifically, each ejector pin 6 can approach and contact the first wafer 1 in the first direction to apply a force to it; each ejector pin 6 can also move away from the first wafer 1 in the first direction to separate from it.

[0036] The aforementioned plurality of ejector pins 6 may include a central ejector pin 6A and at least one peripheral ejector pin group 7. Specifically, the ejector pins 6 within the first dashed circle 9, excluding the central ejector pin 6A, belong to the first peripheral ejector pin group 7; the ejector pins 6 within the first dashed circle 9 and the second dashed circle 10 belong to the second peripheral ejector pin group 7; and the ejector pins 6 outside the second dashed circle 10 belong to the third peripheral ejector pin group 7. The central ejector pin 6A can contact the center of the first wafer 1 to apply force to the center of the first wafer 1. Taking a circular first wafer 1 as an example, the center of the first wafer 1 can be the center of the circle.

[0037] The bonding process of the bonding device in this application is as follows: (e.g., ...) Figure 7 As shown, the second wafer 2 deforms and bulges. The central ejector pin 6A applies a force to the center of the first wafer 1, causing the central region of the first wafer 1 to move closer to and contact the second wafer 2. During the deformation of the first wafer 1, the bonding wave moves from the center to the edge, thereby releasing the adsorption vacuum of the first disk 4 on the first wafer 1 sequentially from the center to the edge. This allows the first wafer 1 and the second wafer 2 to complete bonding under the action of the bonding wave. When the central ejector pin 6A applies a force to the first wafer 1, the ejector pins 6 in the peripheral ejector pin group 7 are in a separated state from the first wafer 1.

[0038] Each peripheral ejector pin group 7 includes a plurality of ejector pin units 701 uniformly distributed circumferentially along the central ejector pin 6A. Specifically, each peripheral ejector pin group 7 includes three ejector pin units 701 uniformly distributed circumferentially along the central ejector pin 6A. Each ejector pin unit 701 includes at least one ejector pin 6. For example, each ejector pin unit 701 includes a plurality of ejector pins 6, such as two ejector pins 6. The plurality of ejector pins 6 in each ejector pin unit 701 are located on the same straight line as the central ejector pin 6A, that is, the plurality of ejector pins 6 in each ejector pin unit 701 are distributed radially along the first wafer 1.

[0039] The aforementioned at least one peripheral ejector pin group 7 includes multiple peripheral ejector pin groups 7, which are distributed sequentially along a direction away from the central ejector pin 6A. For example, at least one peripheral ejector pin group 7 includes at least three peripheral ejector pin groups 7, and the distance between any two adjacent peripheral ejector pin groups 7 is equal.

[0040] In one embodiment, for any two adjacent peripheral ejector groups 7, a plurality of ejector units 701 in one peripheral ejector group 7 correspond one-to-one with a plurality of ejector units 701 in the other peripheral ejector group 7, and a plurality of ejector pins 6 in one ejector unit 701 and a plurality of ejector pins 6 in the corresponding ejector unit 701 are located on the same straight line. Taking an example where each ejector unit 701 includes two ejector pins 6, for any two adjacent peripheral ejector groups 7, the two ejector pins 6 in one ejector unit 701 and the two ejector pins 6 in the corresponding ejector unit 701 are located on the same straight line (this straight line passes through the central ejector pin 6A). In another embodiment, for any two adjacent peripheral ejector groups 7, a plurality of ejector units 701 in one peripheral ejector group 7 correspond one-to-one with a plurality of ejector units 701 in the other peripheral ejector group 7, and a plurality of ejector pins 6 in one ejector unit 701 and a plurality of ejector pins 6 in the corresponding ejector unit 701 are located on two different straight lines.

[0041] In addition, such as Figure 4 As shown, the bonding device according to this application embodiment may further include a needle holder 12. The needle holder 12 may include multiple support beams 1201, and the multiple ejector pins 6 located on the same straight line are located on the same support beam 1201. Further, the needle holder 12 may also include a frame 1202. The multiple support beams 1201 are all connected to the frame 1202. The orthographic projection of the frame 1202 onto the first disc 4 may be triangular. The frame 1202 is also provided with a vacuum suction cup 11, through which the frame 1202 can be adsorbed onto the first disc 4.

[0042] like Figure 6As shown, the bonding apparatus of this application embodiment may further include a controller 15, a drive mechanism 16, and a detector 14. The detector 14 is used to detect whether the bonding wave is uniform. The detector 14 can be an image detector. When the detector 14 detects bubbles 3 between the two wafers after bonding, it is considered that the bonding wave is non-uniform. The controller 15 is used to control the drive mechanism 16 to drive each ejector pin 6 to move along a first direction. Further, the detector 14 is used to detect whether the bonding wave is uniform after the central ejector pin 6A applies a force to the first wafer 1. When the detected bonding wave is non-uniform, the controller 15 is used to control the drive mechanism 16 to drive the ejector pins 6 in the peripheral ejector pin group 7 to move towards the first wafer 1, so as to apply a force to the first wafer 1 (at this time, the central ejector pin 6A is separated from the first wafer 1), to further form a bonding wave, thereby eliminating the bubbles 3. Specifically, the controller 15 is used to control the drive mechanism 16 to drive multiple peripheral ejector pin groups 7 to move sequentially towards the first wafer 1 along a direction away from the central ejector pin 6A, so as to apply a force to the first wafer 1. Taking a three-element peripheral ejector group 7 as an example, the controller 15 controls multiple ejector pins 6 in the first peripheral ejector group 7 (the peripheral ejector group 7 closest to the center ejector pin 6A is the first peripheral ejector group 7) to apply pressure to the first wafer 1 at the first moment, controls multiple ejector pins 6 in the second peripheral ejector group 7 to apply pressure to the first wafer 1 at the second moment, and controls multiple ejector pins 6 in the last peripheral ejector group 7 (the peripheral ejector group 7 closest to the center ejector pin 6A is the last peripheral ejector group 7) to apply pressure to the first wafer 1 at the third moment. The second moment is after the first moment, and the third moment is after the second moment.

[0043] It should be noted that the technical solutions or features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A bonding apparatus, characterized in that, include: A first disk and a second disk are arranged opposite to each other in a first direction. The side of the first disk facing the second disk is used to set a first wafer, and the side of the second disk facing the first disk is used to set a second wafer. The ejector mechanism includes a plurality of ejector pins disposed on the first disk body. The plurality of ejector pins are located on the side of the first wafer facing away from the second wafer. Each ejector pin extends along the first direction and is capable of reciprocating in the first direction. Each ejector pin is capable of applying a force to the first wafer during the movement. The plurality of ejector pins includes a central ejector pin and at least one peripheral ejector pin group. The peripheral ejector pin group includes a plurality of ejector pin units evenly distributed along the circumference of the central ejector pin, and each ejector pin unit includes at least one ejector pin.

2. The bonding apparatus according to claim 1, characterized in that, The ejector pin unit includes multiple ejector pins, and the multiple ejector pins in the ejector pin unit are located on the same straight line as the central ejector pin.

3. The bonding apparatus according to claim 1 or 2, characterized in that, The at least one peripheral ejector pin group includes multiple peripheral ejector pin groups, which are distributed sequentially along a direction away from the central ejector pin.

4. The bonding apparatus according to claim 3, characterized in that, For any two adjacent peripheral ejector pin groups, a plurality of ejector pin units in one peripheral ejector pin group correspond one-to-one with a plurality of ejector pin units in the other peripheral ejector pin group, and the plurality of ejector pins in one ejector pin unit and the plurality of ejector pins in the corresponding ejector pin unit are located on the same straight line.

5. The bonding apparatus according to claim 4, characterized in that, The bonding device further includes a needle holder, which comprises multiple support beams, and the multiple ejector pins located in a straight line are located on the same support beam.

6. The bonding apparatus according to claim 3, characterized in that, The at least one peripheral ejector pin group includes three peripheral ejector pin groups, and the distance between any two adjacent peripheral ejector pin groups is equal.

7. The bonding apparatus according to claim 3, characterized in that, The bonding device further includes a controller, a drive mechanism, and a detector; the detector is used to detect whether the bonding wave is uniform, and the controller is used to control the drive mechanism to drive each of the pins to move along the first direction.

8. The bonding apparatus according to claim 7, characterized in that, The controller is used to control the drive mechanism to drive multiple peripheral ejector pin groups to apply force to the first wafer in a direction away from the central ejector pin.

9. The bonding apparatus according to claim 1, characterized in that, The first disk body includes an inner region and a peripheral region surrounding the inner region. The plurality of pins are disposed in the inner region. The peripheral region is provided with adsorption holes. One opening of the adsorption hole is located on the side of the peripheral region facing the first wafer, and the other opening of the adsorption hole is used to connect to a first vacuum device.

10. The bonding apparatus according to claim 9, characterized in that, The peripheral region includes multiple adsorption sub-regions, which are distributed sequentially along a direction away from the inner region; the adsorption pores in different adsorption sub-regions are isolated.

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