A high-stability press device for chip packaging

Abstract

The utility model relates to chip packaging equipment technical field discloses a high stability press bonding device for chip packaging, including support platform, support platform top fixedly connected with support frame, is equipped with press bonding assembly in support frame inner top connection, is equipped with guide component in press bonding assembly side connection, is equipped with buffer assembly in press bonding assembly connection, is equipped with placing assembly in support platform top connection, support frame front side is hinged with the protective door, is equipped with fixed component between the protective door and support frame connection. The utility model has the advantages compared with prior art: use guide component to be convenient for to the press bonding direction accurate direction finding, avoid the shift when moving press bonding, guarantee press bonding position accuracy, use buffer assembly to be convenient for in the press bonding instant to alleviate the impact force to chip, prevent chip damage, improve chip packaging quality, use fixed component to be convenient for the protective door fixed in support frame front side, shield support frame internal structure, when not using to its protection, avoid dust to accumulate too much.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging equipment technology, and in particular to a high-stability pressing device for chip packaging. Background Technology

[0002] During the chip packaging process, a pressing device is needed to press the chip and the packaging substrate together to ensure a secure connection.

[0003] Existing high-stability lamination devices for chip packaging lack stability during lamination. They are prone to displacement during vertical lamination, resulting in inaccurate lamination positions and affecting chip packaging quality. Furthermore, they lack a buffering effect during lamination, causing a large impact force at the moment of lamination, which may damage the chip. In addition, it is not easy to protect the device when not in use, and dust easily accumulates on its worktable, affecting the cleanliness of subsequent chip lamination. Therefore, the device has certain shortcomings. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a highly stable pressing device for chip packaging.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a high-stability pressing device for chip packaging, comprising a support platform, a support frame fixedly connected to the top of the support platform, a pressing component connected to the top of the support frame, a guide component connected to the side of the pressing component, a buffer component connected inside the pressing component, a placement component connected to the top of the support platform, a protective door hinged to the front side of the support frame, and a fixing component connected between the protective door and the support frame;

[0006] The guide assembly includes a movable plate, with sliders fixedly connected to both sides of the movable plate. Vertical grooves are provided on both sides of the inner wall of the support frame, and the sliders are slidably connected in the vertical grooves.

[0007] As a further description of the above technical solution:

[0008] The buffer assembly includes a pressure plate, a slide rod fixedly connected to the top of the pressure plate, a circular groove opened in the movable plate, the slide rod sliding in the circular groove, a first spring fixedly connected to the bottom of the movable plate, the bottom of the first spring fixedly connected to the top of the pressure plate, and a limit plate fixedly connected to the top of the slide rod.

[0009] As a further description of the above technical solution:

[0010] The fixing component includes a protective frame, which is fixedly connected to the side of the support frame. A limit rod is slidably connected inside the protective frame. A baffle is fixedly connected to one end of the limit rod. A second spring is fixedly connected between the baffle and the inner wall of the protective frame. A limit hole is opened on the side of the protective door. One end of the limit rod is slidably connected inside the limit hole. The baffle is located inside the protective frame.

[0011] As a further description of the above technical solution:

[0012] The placement component includes a workbench, which is fixedly connected to the top of the support platform. The top of the workbench has a placement slot and an auxiliary slot. An anti-slip pad is fixedly connected to the bottom of the placement slot, and the placement slot and the auxiliary slot are connected to each other.

[0013] As a further description of the above technical solution:

[0014] The pressing assembly includes a cylinder, which is fixedly connected to the top of the support frame by bolts, and the output end of the cylinder is fixedly connected to the top of the movable plate.

[0015] As a further description of the above technical solution:

[0016] Both the vertical groove and the slider are T-shaped.

[0017] As a further description of the above technical solution:

[0018] A soft pad is fixedly connected to the bottom of the pressure plate.

[0019] This utility model has the following beneficial effects:

[0020] 1. In this utility model, in the high-stability pressing device for chip packaging, the use of a guide component facilitates precise guidance of the pressing direction during pressing, avoids deviation during moving pressing, and ensures the accuracy of the pressing position.

[0021] 2. In this utility model, in the high-stability pressing device used for chip packaging, the use of a buffer component helps to reduce the impact force on the chip during pressing, prevent chip damage, and improve chip packaging quality.

[0022] 3. In this utility model, in the high-stability pressing device for chip packaging, the use of a fixing component makes it easy to fix the protective door to the front side of the support frame to shield the internal structure of the support frame and protect it when not in use to avoid excessive dust accumulation. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of a high-stability pressing device for chip packaging proposed in this utility model.

[0024] Figure 2 A partial structural diagram of a high-stability lamination device for chip packaging proposed in this utility model. Figure 1 ;

[0025] Figure 3 This invention proposes a high-stability pressing device for chip packaging. Figure 2 Enlarged view of point A in the middle;

[0026] Figure 4 This invention proposes a high-stability pressing device for chip packaging. Figure 1 Enlarged view at point B in the middle;

[0027] Figure 5 A partial structural diagram of a high-stability lamination device for chip packaging proposed in this utility model. Figure 2 .

[0028] Legend:

[0029] 1. Support platform; 2. Support frame; 3. Cylinder; 4. Moving plate; 5. Circular groove; 6. Slide rod; 7. Limiting plate; 8. Pressure plate; 9. Vertical groove; 10. Slider; 11. Soft pad; 12. First spring; 13. Worktable; 14. Placement groove; 15. Auxiliary groove; 16. Anti-slip pad; 17. Protective door; 18. Protective frame; 19. Limiting hole; 20. Limiting rod; 21. Baffle; 22. Second spring. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] Reference Figures 1-5 The present invention provides an embodiment of a high-stability pressing device for chip packaging, comprising a support platform 1, a support frame 2 fixedly connected to the top of the support platform 1, a pressing component connected to the top of the support frame 2, a guide component connected to the side of the pressing component, a buffer component connected inside the pressing component, a placement component connected to the top of the support platform 1, a protective door 17 hinged to the front side of the support frame 2, and a fixing component connected between the protective door 17 and the support frame 2.

[0032] The guide assembly includes a movable plate 4, with sliders 10 fixedly connected to both sides of the movable plate 4. Vertical grooves 9 are provided on both sides of the inner wall of the support frame 2, and the sliders 10 are slidably connected in the vertical grooves 9 for greater stability.

[0033] The buffer assembly includes a pressure plate 8, with a slide rod 6 fixedly connected to the top of the pressure plate 8. A circular groove 5 is formed inside the movable plate 4, and the slide rod 6 slides within the circular groove 5. A first spring 12 is fixedly connected to the bottom of the movable plate 4, and the bottom of the first spring 12 is fixedly connected to the top of the pressure plate 8. A limit plate 7 is fixedly connected to the top of the slide rod 6. The fixing assembly includes a protective frame 18, which is fixedly connected to the side of the support frame 2. A limit rod 20 is slidably connected inside the protective frame 18. A baffle 21 is fixedly connected to one end of the limit rod 20. A second spring 22 is fixedly connected between the baffle 21 and the inner wall of the protective frame 18. A limit hole 19 is formed on the side of the protective door 17, and the limit rod 20... One end is slidably connected to the limiting hole 19, and the baffle 21 is located inside the protective frame 18; the placement assembly includes a worktable 13, which is fixedly connected to the top of the support platform 1. The top of the worktable 13 has a placement groove 14 and an auxiliary groove 15. An anti-slip pad 16 is fixedly connected to the bottom of the placement groove 14. The placement groove 14 and the auxiliary groove 15 are connected to each other to facilitate the removal of the chip and the substrate; the pressing assembly includes a cylinder 3, which is fixedly connected to the top of the support frame 2 by bolts. The output end of the cylinder 3 is fixedly connected to the top of the moving plate 4; the vertical groove 9 and the slider 10 are both T-shaped; a soft pad 11 is fixedly connected to the bottom of the pressure plate 8 to avoid damage to the chip.

[0034] Working principle: The packaging substrate is placed on top of the anti-slip pad 16 in the placement groove 14, and then the chip is placed on top of the packaging substrate for initial positioning and fixation. Then, the cylinder 3 is activated to drive the moving plate 4 downward. At the same time, the moving plate 4 drives the sliders 10 on both sides to slide in the vertical groove 9, which facilitates precise guidance of the pressing direction during pressing and avoids deviation during pressing, ensuring the accuracy of the pressing position. This drives the pressure plate 8 downward. When the soft pad 11 at the bottom of the pressure plate 8 contacts the chip and presses it, the first spring 12 is compressed, and at the same time, the slide rod 6 slides in the circular groove 5. This design facilitates reducing the impact on the chip during pressing, preventing chip damage, and improving chip packaging quality. When not in use, the baffle 21 is pulled out from inside the protective frame 18, causing one end of the limiting rod 20 to slide out from the limiting hole 19. At the same time, the second spring 22 is stretched. Then, the protective door 17 is brought close to the support frame 2, the baffle 21 is released, and under the action of the second spring 22, the baffle 21 is brought close to the protective frame 18, so that one end of the limiting rod 20 slides in the limiting hole 19. This makes it easy to fix the protective door 17 to the front of the support frame 2 to cover the internal structure of the support frame 2 and protect it when not in use.

[0035] All electrical components mentioned in this article are electrically connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device such as a computer for control. The specific embodiments disclosed herein omit detailed descriptions of known functions and components. For example, the cylinder is a device or equipment that exists in the prior art or can be implemented by the prior art. Its power supply, specific composition and principle are clear to those skilled in the art, so they will not be described in detail. In order to ensure the compatibility of the equipment, the operating methods used are consistent with the parameters of commercially available instruments.

[0036] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "setting," "connection," "fixing," "screw connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. The terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-stability pressing device for chip packaging, comprising a support platform (1), characterized in that: The support platform (1) is fixedly connected to the top of the support frame (2), and a pressing component is connected to the top of the support frame (2). A guide component is connected to the side of the pressing component, and a buffer component is connected inside the pressing component. A placement component is connected to the top of the support platform (1). A protective door (17) is hinged to the front side of the support frame (2), and a fixing component is connected between the protective door (17) and the support frame (2). The guide assembly includes a movable plate (4), on both sides of which sliders (10) are fixedly connected. Vertical grooves (9) are provided on both sides of the inner wall of the support frame (2), and the sliders (10) are slidably connected in the vertical grooves (9).

2. The high-stability lamination device for chip packaging according to claim 1, characterized in that: The buffer assembly includes a pressure plate (8), a slide rod (6) is fixedly connected to the top of the pressure plate (8), a circular groove (5) is opened in the moving plate (4), the slide rod (6) slides in the circular groove (5), a first spring (12) is fixedly connected to the bottom of the moving plate (4), the bottom of the first spring (12) is fixedly connected to the top of the pressure plate (8), and a limit plate (7) is fixedly connected to the top of the slide rod (6).

3. The high-stability lamination device for chip packaging according to claim 1, characterized in that: The fixing component includes a protective frame (18), which is fixedly connected to the side of the support frame (2). A limit rod (20) is slidably connected inside the protective frame (18). A baffle (21) is fixedly connected to one end of the limit rod (20). A second spring (22) is fixedly connected between the baffle (21) and the inner wall of the protective frame (18). A limit hole (19) is opened on the side of the protective door (17). One end of the limit rod (20) is slidably connected inside the limit hole (19). The baffle (21) is located inside the protective frame (18).

4. The high-stability lamination device for chip packaging according to claim 1, characterized in that: The placement assembly includes a workbench (13), which is fixedly connected to the top of the support platform (1). The top of the workbench (13) is provided with a placement slot (14) and an auxiliary slot (15). An anti-slip pad (16) is fixedly connected to the bottom of the placement slot (14). The placement slot (14) and the auxiliary slot (15) are connected to each other.

5. The high-stability lamination device for chip packaging according to claim 1, characterized in that: The pressing assembly includes a cylinder (3), which is fixedly connected to the top of the support frame (2) by bolts, and the output end of the cylinder (3) is fixedly connected to the top of the moving plate (4).

6. The high-stability lamination device for chip packaging according to claim 1, characterized in that: Both the vertical groove (9) and the slider (10) are T-shaped.

7. A high-stability lamination device for chip packaging according to claim 2, characterized in that: A soft pad (11) is fixedly connected to the bottom of the pressure plate (8).

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