A semiconductor car-grade full-substrate filled plastic package mold device of extreme silicon carbide power module

Abstract

The utility model belongs to semiconductor car rule extreme silicon carbide power module full base pad filling plastic package mould technical field, concretely relates to a kind of semiconductor car rule extreme silicon carbide power module full base pad filling plastic package mould device, including lower die backing plate and upper die holder, the symmetric distribution between lower die backing plate and upper die holder, the top of lower die backing plate is connected with lower die positioning plate.The utility model is provided with positioning block, positioning slot, connecting seat, spring, movable block, connecting column, connecting block and positioning insert block, when upper die holder and lower die holder close, the positioning insert block in the four corners of lower die holder outer wall will respectively embed in the positioning slot in the bottom of one positioning block, and with upper die holder constantly pressing down, movable block will extrude spring, so as to be able to play the role of positioning, and when upper die holder moves up, spring will drive movable block reset, so that positioning insert block can play the role of upper die holder auxiliary jacking, so as to simultaneously improve the convenience of mould opening.

Description

Technical Field

[0001] This utility model belongs to the technical field of semiconductor automotive-grade silicon carbide power module full substrate filling molding mold, specifically relating to a semiconductor automotive-grade silicon carbide power module full substrate filling molding mold device. Background Technology

[0002] The full-substrate-filled molding die for automotive-grade silicon carbide power modules is the core tooling for automotive-grade silicon carbide power module packaging. It is designed to meet the high reliability and high power density requirements of new energy vehicles. Its core feature is the "full-substrate-filled" process, which can achieve gapless molding between the chip and the substrate, greatly improving the module's heat dissipation performance and thermal cycling resistance. It effectively solves the problem of thermal stress concentration in traditional packaging. The mold adopts a high-precision cavity design to adapt to the high-frequency and high-voltage characteristics of silicon carbide devices, ensuring uniform coverage of the molding compound and guaranteeing the module's electrical insulation and structural stability.

[0003] Currently, existing semiconductor automotive-grade silicon carbide power module full substrate filling molding molds are typically processed by closing the upper and lower molds. However, traditional semiconductor automotive-grade silicon carbide power module full substrate filling molding molds do not have a good guiding structure, which may lead to poor stability when the upper and lower molds are pressed together, making it easy for positional deviations to cause molding failure. Furthermore, during the mold opening and upward movement process, the tight closure of the upper and lower molds may cause difficulties in mold opening, thereby reducing the mold opening efficiency of the stamping mold. Utility Model Content

[0004] The purpose of this invention is to provide a full-substrate filling molding device for automotive-grade silicon carbide power modules, which aims to solve the problem that existing automotive-grade silicon carbide power module full-substrate filling molding devices are usually processed by closing the upper and lower molds. However, traditional automotive-grade silicon carbide power module full-substrate filling molding devices do not have a good guiding structure, which may lead to poor stability when the upper and lower molds are pressed together, easy positional deviation leading to molding failure, and during the mold opening and upward movement, the tight closure of the upper and lower molds may cause inconvenience in mold opening, thereby reducing the mold opening efficiency of the stamping mold.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor automotive-grade silicon carbide power module full substrate filling molding mold device, including a lower mold pad and an upper mold base, wherein the lower mold pad and the upper mold base are symmetrically distributed, a lower mold positioning plate is connected to the top of the lower mold pad, a lower mold base is connected to the top of the lower mold positioning plate, a lower mold reset post is passed through the top of the lower mold base, and an AMB substrate is disposed on the top of the lower mold base; Four positioning blocks are fixedly connected to the outer wall of the upper mold base, and positioning slots are provided at the bottom of the four positioning blocks. Four connecting seats are fixedly connected to the outer wall of the lower mold base. Springs are installed inside the four connecting seats. One end of the spring is connected to a movable block. A connecting post is fixedly connected to the top of the movable block. A connecting block is fixedly connected to one end of the connecting post. A positioning insert is fixedly connected to the top of the connecting block.

[0006] In a preferred embodiment of the semiconductor automotive-grade silicon carbide power module full substrate filling molding device of this utility model, the positioning plug and the positioning slot are adapted to each other in size, and the cross-section of the positioning plug and the positioning slot are both trapezoidal.

[0007] In a preferred embodiment of the semiconductor automotive-grade silicon carbide power module full substrate filling molding device of this utility model, the four positioning blocks are positioned in pairs opposite each other, and the four connecting seats are positioned in pairs opposite each other.

[0008] As a preferred embodiment of the semiconductor automotive-grade silicon carbide power module full substrate filling molding device of this utility model, the positioning plug can form an elastic structure with the connecting seat through a spring, a movable block, a connecting column, and a connecting block.

[0009] As a preferred embodiment of the semiconductor automotive-grade silicon carbide power module full substrate filling molding device of this utility model, the upper mold base has a fixed frame fixedly connected to both outer walls, a connecting frame rotatably connected to one end of the fixed frame, a lead screw threaded through one end of the connecting frame, a locking block rotatably connected to the through end of the lead screw, and a fixed block fixedly connected to both outer walls of the lower mold base.

[0010] As a preferred embodiment of the semiconductor automotive-grade silicon carbide power module full substrate filling molding device of this utility model, the cross-section of the connecting frame is "L" shaped.

[0011] In a preferred embodiment of the semiconductor automotive-grade silicon carbide power module full substrate filling molding device of this utility model, two fixing blocks are provided, and the two fixing blocks are symmetrically distributed between them.

[0012] Compared with the prior art, the beneficial effects of this utility model are: With the arrangement of positioning blocks, positioning slots, connecting seats, springs, movable blocks, connecting pillars, connecting blocks, and positioning inserts, when the upper mold base and the lower mold base are closed, the positioning inserts at the four corners of the outer wall of the lower mold base will be embedded in the positioning slots at the bottom of a positioning block. As the upper mold base is continuously pressed down, the movable block will squeeze the spring, thereby playing a positioning role. When the upper mold base moves up, the spring will drive the movable block to reset, so that the positioning inserts can play a role in assisting the upper mold base to be lifted, thereby improving the convenience of mold opening.

[0013] By setting up a fixed frame, connecting frame, lead screw, locking block, and fixing block, after the lower mold base and upper mold base are closed, the connecting frames on both sides are flipped so that one end of the connecting frame is located at the bottom of the fixing block. At this time, by rotating the lead screw, the threaded connection structure between the lead screw and the connecting frame drives the locking block to move upward continuously until it contacts the fixing block and locks it, thereby ensuring the stability of the lower mold base and upper mold base after they are closed. Attached Figure Description

[0014] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the main structure of this utility model; Figure 2 This is a schematic diagram of the main cross-sectional structure of this utility model; Figure 3 This is a schematic diagram of the structure of this utility model from below; Figure 4 This is an enlarged structural diagram of the present invention (A). Figure 5 This is an enlarged structural schematic diagram of the present invention, B.

[0015] In the diagram: 1. Lower mold pad; 2. Lower mold positioning plate; 3. Lower mold base; 4. Lower mold reset post; 5. AMB base plate; 6. Upper mold base; 7. Positioning block; 8. Positioning slot; 9. Connecting seat; 10. Spring; 11. Movable block; 12. Connecting post; 13. Connecting block; 14. Positioning insert; 15. Fixing frame; 16. Connecting frame; 17. Lead screw; 18. Locking block; 19. Fixing block. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figures 1-5 The present invention provides the following technical solution: a semiconductor automotive-grade silicon carbide power module full substrate filling molding mold device, including a lower mold pad 1 and an upper mold base 6, the lower mold pad 1 and the upper mold base 6 are symmetrically distributed, the top of the lower mold pad 1 is connected to a lower mold positioning plate 2, the top of the lower mold positioning plate 2 is connected to a lower mold base 3, the top of the lower mold base 3 is penetrated by a lower mold reset post 4, and the top of the lower mold base 3 is provided with an AMB substrate 5; Four positioning blocks 7 are fixedly connected to the outer wall of the upper mold base 6. Positioning slots 8 are provided at the bottom of the four positioning blocks 7. Four connecting seats 9 are fixedly connected to the outer wall of the lower mold base 3. Springs 10 are installed inside the four connecting seats 9. One end of the spring 10 is connected to a movable block 11. A connecting post 12 is fixedly connected to the top of the movable block 11. A connecting block 13 is fixedly connected to one end of the connecting post 12. A positioning insert 14 is fixedly connected to the top of the connecting block 13.

[0018] Preferably, the positioning insert 14 is adapted to the size of the positioning slot 8, and the cross-section of the positioning insert 14 and the positioning slot 8 is trapezoidal. The four positioning blocks 7 are opposite each other in pairs, and the four connecting seats 9 are opposite each other in pairs. The positioning insert 14 can form an elastic structure with the connecting seat 9 through the spring 10, the movable block 11, the connecting post 12, and the connecting block 13.

[0019] In practical use, by closing the upper mold base 6 and the lower mold base 3, the positioning blocks 14 at the four corners of the outer wall of the lower mold base 3 will be respectively embedded in the positioning slots 8 at the bottom of the positioning block 7. As the upper mold base 6 is continuously pressed down, the movable block 11 will squeeze the spring 10, thereby playing a positioning role. When the upper mold base 6 moves up, the spring 10 will drive the movable block 11 to reset, so that the positioning blocks 14 can play a role in assisting the upper mold base 6 to be lifted, thereby improving the convenience of mold opening.

[0020] Preferably, a fixing frame 15 is fixedly connected to the outer walls of both sides of the upper mold base 6, a connecting frame 16 is rotatably connected to one end of the fixing frame 15, a lead screw 17 is threaded through one end of the connecting frame 16, and a locking block 18 is rotatably connected to the through end of the lead screw 17. A fixing block 19 is fixedly connected to the outer walls of both sides of the lower mold base 3. The cross-section of the connecting frame 16 is "L" shaped. There are two fixing blocks 19, and the two fixing blocks 19 are symmetrically distributed between them.

[0021] In practical use, by flipping the connecting brackets 16 on both sides so that one end can be located at the bottom of the fixing block 19, the screw 17 is rotated, and the threaded connection structure between the screw 17 and the connecting bracket 16 drives the locking block 18 to move upward continuously until it contacts the fixing block 19 and locks it, thereby ensuring the stability of the lower mold base 3 and the upper mold base 6 after they are closed.

[0022] Working principle: First, when the upper mold base 6 and the lower mold base 3 are closed, the positioning blocks 14 at the four corners of the outer wall of the lower mold base 3 will be inserted into the positioning slots 8 at the bottom of the positioning block 7 respectively. As the upper mold base 6 is pressed down, the movable block 11 will compress the spring 10, thereby achieving the positioning function. After the lower mold base 3 and the upper mold base 6 are closed, by flipping the connecting brackets 16 on both sides, one end of them can be located at the bottom of the fixed block 19. At this time, by rotating the screw 17, the threaded connection structure between the screw 17 and the connecting bracket 16 drives the lock. The clamping block 18 moves upward continuously until it contacts and locks with the fixing block 19, thereby ensuring the stability of the lower mold base 3 and the upper mold base 6 after they are closed. When the upper mold base 6 moves upward, the screw 17 is rotated in the opposite direction to make one end of it drive the locking block 18 to move downward away from the fixing block 19. At this time, the connecting frame 16 is flipped again and the upper mold base 6 is moved upward to open the mold. During this process, the spring 10 will drive the movable block 11 to reset, so that the positioning insert 14 can play the role of assisting in lifting the upper mold base 6, thereby improving the convenience of mold opening.

[0023] Finally, it should be noted that the above are merely preferred embodiments of this utility model and are not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A semiconductor automotive-grade silicon carbide power module full substrate filling molding die device, comprising a lower die pad (1) and an upper die base (6), wherein the lower die pad (1) and the upper die base (6) are symmetrically distributed, characterized in that: The lower mold pad (1) is connected to the top of the lower mold positioning plate (2), the lower mold positioning plate (2) is connected to the top of the lower mold base (3), the lower mold reset post (4) is passed through the top of the lower mold base (3), and the AMB base plate (5) is provided on the top of the lower mold base (3). Four positioning blocks (7) are fixedly connected to the outer wall of the upper mold base (6). Positioning slots (8) are provided at the bottom of the four positioning blocks (7). Four connecting seats (9) are fixedly connected to the outer wall of the lower mold base (3). Springs (10) are installed inside the four connecting seats (9). One end of the spring (10) is connected to a movable block (11). A connecting post (12) is fixedly connected to the top of the movable block (11). A connecting block (13) is fixedly connected to one end of the connecting post (12). A positioning insert (14) is fixedly connected to the top of the connecting block (13).

2. The semiconductor automotive-grade silicon carbide power module full substrate filling molding device according to claim 1, characterized in that: The positioning plug (14) is adapted to the size of the positioning slot (8), and the cross-section of the positioning plug (14) and the positioning slot (8) are both trapezoidal.

3. The semiconductor automotive-grade silicon carbide power module full substrate filling molding device according to claim 1, characterized in that: The four positioning blocks (7) are positioned opposite each other in pairs, and the four connecting seats (9) are positioned opposite each other in pairs.

4. The semiconductor automotive-grade silicon carbide power module full substrate filling molding device according to claim 1, characterized in that: The positioning plug (14) can form an elastic structure with the connecting seat (9) through the spring (10), the movable block (11), the connecting column (12), and the connecting block (13).

5. The semiconductor automotive-grade silicon carbide power module full substrate filling molding device according to claim 1, characterized in that: The upper mold base (6) is fixedly connected to the outer walls on both sides by a fixing frame (15), and a connecting frame (16) is rotatably connected to one end of the fixing frame (15). A lead screw (17) is threaded through one end of the connecting frame (16), and a locking block (18) is rotatably connected to the through end of the lead screw (17). The lower mold base (3) is fixedly connected to the outer walls on both sides by a fixing block (19).

6. The semiconductor automotive-grade silicon carbide power module full substrate filling molding device according to claim 5, characterized in that: The cross-section of the connecting frame (16) is "L" shaped.

7. The semiconductor automotive-grade silicon carbide power module full substrate filling molding device according to claim 5, characterized in that: There are two fixing blocks (19), and the two fixing blocks (19) are symmetrically distributed.

Images