An air fryer
Patent Information
- Application Number
- CN202521848397.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-28
- Publication Date
- 2026-10-20
- Estimated Expiration
- 2035-08-28
AI Technical Summary
[0005]本实用新型提供了一种空气炸锅,以解决现有空气炸锅内部冷却风路设计不佳,冷却气路中的气流在流动至电机处时会被风扇吸走,使得流动至电路板处的冷却气流较少,无法对电路板形成良好散热的问题
[0026]本方案中,进风通道在竖直面的投影覆盖电路板上方的间隙,使得进风通道内的部分气流能够流动至电路板的上方,进入该间隙内,从而与电路板的顶面接触,增大气流与电路板的接触面积,提高电路板的冷却效果。
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Figure CN224864369U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of kitchen appliance technology, specifically relating to an air fryer. Background Technology
[0002] An air fryer is a cooking appliance that uses rapidly circulating hot air to heat and bake food. It mainly uses hot air to replace the hot oil in a frying pan to cook the food. At the same time, the hot air blows away the moisture on the surface of the food, giving the food an effect similar to deep-frying.
[0003] During cooking, the temperature inside an air fryer reaches extremely high levels, sometimes exceeding 200°C. Heat overflows from the cooking chamber into the mounting chamber where various components are housed. This high temperature environment can damage electrical components such as the motor, fan, and circuit boards inside the mounting chamber, reducing their lifespan. Therefore, many air fryers incorporate cooling air ducts to allow cool outside air to enter the mounting chamber and cool the internal components.
[0004] In existing technologies, the air inlet of an air fryer's cooling airflow path is typically located at the rear end of the top of the outer casing, while the circuit board (display panel) is usually positioned at the front for user convenience. The motor and fan are centrally located between the circuit board and the air inlet, within the cooking cavity. For example, Chinese patent CN220308981U discloses a cooking appliance equipped with a waterproof circuit board device, where the air inlet is located at the rear end of the casing, the display panel at the front, and the motor between the two. This means the motor is positioned on the path of airflow towards the control panel. Therefore, when the cooling airflow reaches the area where the motor is located, the strong suction of the fan draws most of the airflow away, leaving less cooling airflow reaching the control panel and failing to provide adequate heat dissipation. This poor heat dissipation of the control panel will eventually affect its reliability and lifespan. Utility Model Content
[0005] This invention provides an air fryer to solve the problem of poor internal cooling air path design in existing air fryers, where the airflow in the cooling air path is sucked away by the fan when it reaches the motor, resulting in less cooling airflow reaching the circuit board and failing to provide good heat dissipation for the circuit board.
[0006] The technical solution adopted in this utility model is as follows:
[0007] An air fryer includes an outer shell with an upper mounting cavity and a lower cooking cavity inside the shell. A circuit board and a fan assembly are disposed in the mounting cavity. The outer shell includes a housing and a top cover covering the housing. The mounting cavity has an air inlet. An air intake channel is formed between the top wall of the housing and the top cover, connecting the air inlet and the mounting cavity. The air intake channel guides the airflow entering from the air inlet to the circuit board.
[0008] In this invention, the circuit board constitutes the display and control panel of the air fryer, located at the front for easy user operation. The fan assembly, including a motor and a fan, is situated between the circuit board and the air inlet, closer to the center of the cooking cavity. This facilitates the even distribution of the heated airflow from the fan into the lower cooking cavity, promoting hot air circulation and improving heating uniformity across the cavity. Furthermore, an air inlet channel is formed between the top wall of the shell and the top cover, extending laterally to the circuit board. In this configuration, the fan assembly is located below the top wall of the housing, while the air inlet is located above it. This design allows the top wall to act as a barrier, ensuring that the cooling airflow entering through the inlet flows smoothly to the area containing the circuit board, cooling it down. During this process, the top wall's obstruction minimizes the suction force exerted by the fan assembly on the airflow within the intake channel, thus prioritizing the cooling of the circuit board. More cooling airflow is directed towards the circuit board, cooling it first, before flowing to the fan assembly to dissipate heat. This reduces the risk of excessive temperature rise in the circuit board, improving its lifespan and operational reliability.
[0009] The air inlet channel has an air outlet, the circuit board is located outside the air outlet, and the air outlet faces the circuit board.
[0010] In this design, the circuit board is located outside the air outlet. The air outlet faces the circuit board, allowing the cooling airflow from the air inlet channel to directly blow onto the circuit board for air cooling. Simultaneously, because the circuit board is located outside the air inlet channel, it does not encroach on the space within the channel. This allows the air inlet channel to be designed as a relatively long and narrow structure, increasing the air pressure and velocity within it. This enables more efficient intake of external airflow through the air inlet and allows the airflow to rush towards the circuit board at a higher speed, ensuring full contact and improving heat exchange with the circuit board.
[0011] The air inlet channel has an air outlet, and at least a portion of the circuit board extends into the air inlet channel from the air outlet.
[0012] In this design, at least a portion of the circuit board extends into the air intake channel from the air outlet. This allows the cooling airflow to come into contact with the circuit board before exiting the air outlet, increasing the contact time between the cooling airflow and the circuit board and improving heat dissipation. Simultaneously, because at least a portion of the circuit board is located inside the air intake channel, the channel surrounds at least a portion of the circuit board, allowing the airflow to contact all surfaces of the circuit board, increasing the contact area and creating an enveloping effect on the circuit board, further enhancing the cooling performance.
[0013] The air inlet channel has a flared section, and the air outlet is located in the flared section to increase the width of the airflow channel at the air outlet.
[0014] In this design, the flared section not only increases the width of the air inlet channel but also increases the opening area of the air outlet. This allows the airflow in the air inlet channel to diffuse when it reaches the air outlet, thus enabling the airflow to act more dispersedly on the circuit board and make more contact with the circuit board, thereby increasing the contact area between the airflow and the circuit board.
[0015] The projection of the air outlet on the vertical plane covers the projection of the circuit board on the vertical plane.
[0016] In this design, the air outlet is located on one side of the circuit board, and its projection on the vertical plane covers the projection of the circuit board on the vertical plane. The air outlet forms a full coverage of the circuit board on the vertical plane, so that the airflow blowing out of the air outlet can not only contact the side of the circuit board, but also some airflow can flow to the top of the circuit board and contact the top surface of the circuit board, and some airflow can flow to the bottom of the circuit board and contact the bottom surface of the circuit board. Some airflow also flows over the left and right sides of the circuit board and contacts the sides. In this way, the airflow can more comprehensively wrap the circuit board, further increasing the heat dissipation area of the circuit board and improving the heat dissipation effect.
[0017] The top wall of the housing bends downward at the air outlet to form a windbreak, which extends to the bottom of the circuit board.
[0018] In this design, the baffle separates the circuit board and the fan assembly vertically, placing the circuit board in the air intake channel above the baffle and the fan assembly below, allowing airflow from the air intake channel to reach the circuit board. Furthermore, the downward bending extension of the baffle increases the width of the airflow channel at the outlet. Because the baffle is located below the circuit board, some airflow can pass beneath it, contacting the bottom surface and improving the contact effect between the cooling airflow and the circuit board, thus increasing cooling efficiency.
[0019] The housing is also provided with an exhaust port that communicates with the mounting cavity. The exhaust port and the air inlet are offset in the circumferential direction of the housing.
[0020] In this design, after the cooling airflow comes into contact with and exchanges heat with components such as the circuit board and fan assembly within the mounting cavity, it flows out through the exhaust vent. At this point, the airflow temperature is relatively high. The exhaust vent and air inlet are circumferentially misaligned, placing them on different sides of the housing. This makes it difficult for the high-temperature airflow exiting the exhaust vent to reach the air inlet, ensuring that the air inlet draws in cooler airflow. This prevents high-temperature airflow from being drawn into the air inlet and re-entering the air intake channel, which would reduce cooling efficiency.
[0021] The air inlet is formed in the housing, or the air inlet is formed in the top cover, or the air inlet is located between the housing and the top cover.
[0022] In this solution, the location of the air inlet can be flexibly designed according to the specific materials and structure of the top cover and the shell, as well as the ease of processing. The air inlet can be set on the top cover, the shell, or the two can be combined to form a gap to form the air inlet, so as to achieve convenient air intake and improve the overall appearance quality of the machine.
[0023] A viewing window is provided on the front side of the housing, and a viewing window channel component is provided in the mounting cavity corresponding to the viewing window. The circuit board is located between the air inlet channel and the viewing window channel component. The side of the viewing window channel component facing the circuit board is provided with an air guide transition surface that is recessed towards the viewing window, so as to guide the airflow discharged from the air inlet channel to the fan assembly.
[0024] In this design, users can observe the cooking status of the food inside the cooking cavity through a viewing window. The viewing window and the viewing channel together form a sealed cavity. Simultaneously, the viewing channel is located downstream of the circuit board and features an air guide transition surface. This surface guides the airflow after it contacts the circuit board, allowing the cooling airflow to cool it before being redirected downwards by the air guide transition surface and flowing to the fan assembly for further cooling. This ensures that the airflow sequentially cools both the circuit board and the fan assembly along its path within the mounting cavity, improving cooling efficiency. Furthermore, the air guide transition surface makes the airflow redirection smoother and gentler, further enhancing airflow efficiency and reducing the possibility of turbulence.
[0025] There is a gap between the circuit board and the top cover, and the projection of the air intake channel on the vertical plane covers the projection of the gap on the vertical plane.
[0026] In this design, the vertical projection of the air intake channel covers the gap above the circuit board, allowing some of the airflow within the air intake channel to flow to the top of the circuit board and enter the gap, thereby contacting the top surface of the circuit board, increasing the contact area between the airflow and the circuit board, and improving the cooling effect of the circuit board. Attached Figure Description
[0027] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:
[0028] Figure 1 This is a cross-sectional view of an air fryer according to one embodiment of the present invention;
[0029] Figure 2 This is a cross-sectional view of a portion of an air fryer according to one embodiment of the present invention, wherein the arrows indicate the flow direction of the cooling airflow within the mounting cavity;
[0030] Figure 3 This is a schematic diagram of the top structure of the housing according to one embodiment of the present invention, wherein the arrow indicates the flow direction of the airflow in the air inlet channel;
[0031] Figure 4 for Figure 3 A magnified view of area A in the middle;
[0032] Figure 5 This is a schematic diagram of the structure of an air fryer according to one embodiment of the present invention, wherein the shell part is not shown, and the arrow indicates the flow direction of the airflow used for cooling.
[0033] in:
[0034] 1. Housing; 11. Cooking cavity; 12. Mounting cavity; 13. Air inlet channel; 131. Air outlet; 132. Flared section; 14. Exhaust outlet; 15. Extension; 16. Baffle; 17. Air guide; 18. Reflector; 19. Cooling channel;
[0035] 2. Fryer components;
[0036] 3. Circuit board; 31. Gap;
[0037] 4. Fan components;
[0038] 5. Top cover; 51. Air inlet;
[0039] 6. Viewing window; 61. Viewing window channel component; 62. Air guide transition surface; 63. Viewing glass;
[0040] 7. Mounting bracket; 71. Air intake slot. Detailed Implementation
[0041] To more clearly illustrate the overall concept of this utility model, a detailed description will be provided below with reference to the accompanying drawings.
[0042] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.
[0043] Furthermore, it should be understood in the description of this utility model that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0044] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0045] In this invention, unless otherwise expressly specified and limited, the first feature "on" or "below" the second feature may be in direct contact with the first and second features, or indirect contact through an intermediate medium. In the description of this specification, references to terms such as "implementation," "example," "aspect," or "specific example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0046] like Figure 1 , Figure 2 , Figure 3As shown, an air fryer includes an outer shell, which includes a housing 1 and a top cover 5 covering the housing 1. The outer shell has an upper mounting cavity 12 and a lower cooking cavity 11. The mounting cavity 12 is provided with a circuit board 3 and a fan assembly 4. The mounting cavity 12 has an air inlet 51. The fan assembly 4 is located between the air inlet 51 and the circuit board 3. An air intake channel 13 is formed between the top wall of the housing 1 and the top cover 5, which connects the air inlet 51 and the mounting cavity 12. The air intake channel 13 guides the airflow entering from the air inlet 51 to the circuit board 3.
[0047] Understandably, circuit board 3 constitutes the display and control panel of the air fryer, located at the front for easy user operation. The fan assembly 4, including a motor and a fan, is located between circuit board 3 and air inlet 51, closer to the center of cooking cavity 11. This facilitates the even distribution of heated airflow from the fan into the cooking cavity 11 below, promoting hot air circulation within the cooking cavity 11 and improving the heating uniformity of different areas within the cooking cavity 11.
[0048] In this invention, an air inlet channel 13 is formed between the top of the housing 1 and the top cover 5. The circuit board 3 is located on one side of the air inlet channel 13, which extends laterally to the circuit board 3. Thus, the fan assembly 4 is located below the top wall of the housing 1, while the air inlet 51 is located above the top wall of the housing 1. This design allows the top wall of the housing 1 to obstruct the fan assembly 4, placing it outside the air inlet channel 13. This allows the cooling airflow entering through the air inlet 51 to flow smoothly to the area where the circuit board 3 is located, cooling it down. During this process, the obstruction of the top wall of the housing 1 minimizes the suction force of the fan assembly 4 on the airflow within the air inlet channel 13, thereby increasing the cooling priority of the circuit board 3. More cooling airflow flows to the circuit board 3, preferentially acting on it to cool it before flowing to the fan assembly 4 to dissipate heat. This reduces the risk of excessive temperature rise in the circuit board 3, improving its service life and operational reliability.
[0049] It should be noted that this utility model does not limit the structure of the air fryer, which can be one of the following embodiments:
[0050] Implementation Method 1: In this implementation method, as follows Figure 1 As shown, the side wall of the housing 1 has an opening that connects to the cooking chamber 11. The air fryer also includes a fryer assembly 2, which can be pushed or pulled into or removed from the cooking chamber 11 through the opening. The mounting cavity 12 is located in the housing 1 above the cooking chamber 11, and the circuit board 3 is located on the front top surface of the housing 1.
[0051] Implementation Method 2: In this embodiment, the housing 1 includes a pot body and a cover located above the pot body. The cooking chamber 11 is located in the pot body, and the mounting chamber 12 is located in the cover. The cover can be flipped relative to the pot body to open or close the cooking chamber 11. The air fryer also includes a fryer assembly 2. When the cover is opened, an opening is formed at the top of the cooking chamber 11, and the fryer assembly 2 can be inserted into or removed from the cooking chamber 11 through the opening at the top.
[0052] Preferably, such as Figure 2 As shown, a reflector 18 is also provided inside the housing 1. The reflector 18 is located above the cooking cavity 11 to separate the cooking cavity 11 and the mounting cavity 12, and to isolate the heat in the cooking cavity 11, thereby reducing the possibility of the heat in the cooking cavity 11 dissipating into the mounting cavity 12 above.
[0053] It should be noted that the present invention does not limit the relative position of the circuit board 3 and the air inlet channel 13. In one embodiment, the air inlet channel 13 has an air outlet 131, the circuit board 3 is located outside the air outlet 131, and the air outlet 131 faces the circuit board 3.
[0054] The circuit board 3 is located outside the air outlet 131. The air outlet 131 faces the circuit board 3, allowing the cooling airflow in the air inlet channel 13 to flow out of the air outlet 131 and directly blow onto the circuit board 3 for air cooling. At the same time, since the circuit board 3 is located outside the air inlet channel 13, it does not encroach on the space inside the air inlet channel 13. This allows the air inlet channel 13 to be designed as a relatively long and narrow structure, thereby increasing the air pressure and flow rate inside it. On the one hand, it can more efficiently draw in external airflow through the air inlet 51, and on the other hand, it can allow the airflow to rush towards the circuit board 3 at a faster speed, making full contact with the circuit board 3 and improving the heat exchange effect with the circuit board 3.
[0055] In another implementation, such as Figure 1 , Figure 2 As shown, the air inlet channel 13 has an air outlet 131, and at least a portion of the circuit board 3 extends into the air inlet channel 13 from the air outlet 131.
[0056] At least a portion of the circuit board 3 extends into the air intake channel 13 from the air outlet 131. This allows the cooling airflow to come into contact with the circuit board 3 before exiting the air outlet 131 during its flow within the air intake channel 13, thereby increasing the contact time between the cooling airflow and the circuit board 3 and improving heat dissipation. Simultaneously, since at least a portion of the circuit board 3 is located inside the air intake channel 13, the air intake channel 13 surrounds at least a portion of the circuit board 3, allowing the airflow to contact all surfaces of the circuit board 3, increasing the contact area, and further enhancing the cooling effect by creating an enveloping effect on the circuit board 3.
[0057] Preferably, such as Figure 2 As shown, the air inlet channel 13 has a flared section 132, and the air outlet 131 is located in the flared section 132 to increase the flow channel width at the air outlet 131.
[0058] The flared section 132 not only increases the width of the air inlet channel 13, but also increases the opening area of the air outlet 131. This allows the airflow in the air inlet channel 13 to diffuse when it reaches the air outlet 131, thus making the airflow more dispersed and acting on the circuit board 3, and increasing the contact area between the airflow and the circuit board 3.
[0059] It should be noted that this embodiment does not limit the expansion direction of the flared section 132. In one embodiment, such as... Figure 2 As shown, the flared section 132 expands vertically to increase the width of the air inlet channel 13 in the height direction, allowing the airflow to contact not only the sides of the circuit board 3, but also its top and bottom surfaces. In another embodiment, the flared section 132 expands horizontally to increase the width of the air inlet channel 13, allowing the airflow to contact not only the side of the circuit board 3 facing the air outlet 131, but also its two sides in the width direction. Preferably, the flared section 132 expands in both the height and width directions to further increase the area of the air outlet 131, allowing the airflow to flow over all surfaces of the circuit board 3, forming an enveloping effect and improving the cooling effect.
[0060] Furthermore, such as Figure 2 , Figure 3 As shown, the projection of the air outlet 131 on the vertical plane covers the projection of the circuit board 3 on the vertical plane.
[0061] The air outlet 131 is located on one side of the circuit board 3 in the horizontal direction. Its projection on the vertical plane covers the projection of the circuit board 3 on the vertical plane. The air outlet 131 forms a full coverage of the circuit board 3 in the vertical direction, so that the airflow blown out of the air outlet 131 can not only contact the side of the circuit board 3, but also some airflow can flow to the top of the circuit board 3 and contact the top surface of the circuit board 3, and some airflow can flow to the bottom of the circuit board 3 and contact the bottom surface of the circuit board 3. In this way, the airflow can more comprehensively wrap the circuit board 3, further increasing the heat dissipation area of the circuit board 3 and improving the heat dissipation effect.
[0062] In a preferred embodiment, such as Figure 2 As shown, the top wall of the housing 1 bends downward at the air outlet 131 to form a windbreak 16, which extends to the bottom of the circuit board 3.
[0063] The baffle 16 separates the circuit board 3 and the fan assembly 4 vertically, placing the circuit board 3 in the air inlet channel 13 above the baffle 16 and the fan assembly 4 below the baffle 16, allowing airflow from the air inlet channel 13 to reach the circuit board 3. Furthermore, the downward bending extension of the baffle 16 increases the width of the airflow channel at the air outlet 131. Since the baffle 16 is located below the circuit board 3, some airflow can pass under the circuit board 3 and contact its bottom surface, thus improving the contact effect between the cooling airflow and the circuit board 3 and increasing cooling efficiency.
[0064] It should be noted that this embodiment does not limit the bending method of the windbreak 16. In one example, such as Figure 2 As shown, the windbreak 16 bends downward in a stepped shape, causing the width of the air inlet channel 13 to increase abruptly at this point. In another example, the windbreak 16 gradually widens downward to form a trumpet-shaped air outlet 131, which gradually increases the width of the air inlet channel 13 and enhances the guiding effect on the airflow at the air outlet 131.
[0065] Specifically, such as Figure 2 As shown, the top wall of the housing 1 also includes an extension 15 located upstream of the windbreak 16. The extension 15 extends horizontally, and a portion of the air inlet channel 13 is formed between the extension 15 and the top cover 5. The minimum distance H between the extension 15 and the top cover 5 is not less than 10mm, that is, the flow channel height at the narrowest point of the air inlet channel 13 is not less than 10mm. This is to leave sufficient space below for installing the fan assembly 4 and to ensure the flow channel width of the air inlet channel 13 to ensure smooth air intake.
[0066] As a preferred embodiment of this utility model, such as Figure 1 , Figure 2 , Figure 3 As shown, the housing 1 is also provided with an exhaust port 14 that communicates with the mounting cavity 12. The exhaust port 14 and the air inlet 51 are offset in the circumferential direction of the housing 1.
[0067] Specifically, such as Figure 2 As shown, the top wall of the housing 1 has a connecting port below the circuit board 3, which connects the air inlet channel 13 and the lower mounting cavity 12. This allows the airflow in the air inlet channel 13 to cool the circuit board 3 and then enter the lower mounting cavity 12 through the connecting port to cool the internal fan assembly 4. Finally, the airflow is discharged through the exhaust port 14.
[0068] After the cooling airflow comes into contact with and exchanges heat with components such as the circuit board 3 and the fan assembly 4 in the mounting cavity 12, it flows out through the exhaust port 14. At this time, the airflow temperature is relatively high. The exhaust port and the air inlet 51 are circumferentially misaligned, so that they are located on different sides of the housing 1. This makes it difficult for the high-temperature airflow discharged from the exhaust port 14 to flow to the air inlet 51, ensuring that the air inlet 51 draws in the cooler airflow. This prevents the high-temperature airflow from being drawn into the air inlet 51 and re-entering the air intake channel 13, which would reduce the cooling efficiency.
[0069] Specifically, such as Figure 2 , Figure 3 As shown, circuit board 3 is located on the front side of housing 1 (facing the user), exhaust vent 14 is located on the rear side of housing 1 (away from the user), and air inlets 51 are located on the left and right sides of housing 1. This allows outside cold air to enter the air intake channel 13 through air inlets 51, flow towards the front of housing 1, come into contact with circuit board 3, flow downwards and change direction, and flow from the front to the exhaust vent 14 on the rear side.
[0070] Preferably, such as Figure 2 , Figure 3 As shown, a guide section 17 is provided on the rear side of the housing 1, and an exhaust port 14 is provided on the guide section 17. The guide section 17 bends upward so that the exhaust port 14 faces upward.
[0071] In a preferred embodiment, such as Figure 5 As shown, the housing 1 includes a base located below the cooking chamber 11. The base has an air intake. During the operation of the air fryer, outside air can also enter the housing 1 through the air intake. The outside of the fryer assembly 2 extending into the cooking chamber 11 also has a cooling channel 19. The airflow entering from the bottom flows upward in the cooling channel 19 to cool the fryer assembly 2 placed in the cooking chamber 11. Then, the cooling airflow enters the mounting cavity 12 and merges with the cooling airflow entering from the air inlet 51, and is discharged through the exhaust port 14.
[0072] Furthermore, the fryer assembly 2 includes a pot body extending into the cooking chamber 11, and a handle portion that closes the opening of the cooking chamber 11. The pot body has a square structure, and the handle portion is located on one side of the pot body, such as... Figure 5 As shown, cooling channels 19 are located on the other three sides of the pot body so that the airflow entering from the air intake flows upward along the side walls of the three sides of the pot body.
[0073] This invention does not limit the arrangement of the air inlet 51. In one embodiment, the air inlet 51 is formed in the housing 1; for example, a hole can be made in the housing 1 to form the air inlet 51. In another embodiment, the air inlet 51 is formed in the top cover 5. In yet another embodiment, the air inlet 51 is disposed between the housing 1 and the top cover 5; for example, an assembly gap can be provided between the top cover 5 and the top wall of the housing 1 to form the air inlet 51.
[0074] In practical applications, the location of the air inlet 51 can be flexibly designed according to the specific materials, structure, and ease of processing of the top cover 5 and the housing 1, so as to achieve convenient air intake while improving the overall appearance quality of the machine.
[0075] Preferably, such as Figure 2 , Figure 3 , Figure 4 As shown, in one embodiment, a mounting bracket 7 is provided on the top of the housing 1, and the top cover 5 is fixed to the mounting bracket 7. Specifically, the mounting bracket 7 forms a mounting groove, the top cover 5 is fixed in the mounting groove, and the mounting bracket 7 raises the top cover 5 so that an air intake channel 13 is formed between the top cover 5 and the top wall of the housing 1. Figure 3 , Figure 4 As shown, the air inlet 51 is formed between the mounting bracket 7 and the top cover 5. Specifically, as... Figure 4 As shown, the upper surface of the mounting bracket 7 is provided with an air inlet groove 71. When the top cover 5 is installed on the mounting bracket 7, the top cover 5 and the air inlet groove 71 cooperate to form an air inlet 51. There are multiple air inlets 71 arranged at intervals to sort and rectify the airflow.
[0076] When assembling the housing 1 and the top cover 5, the mounting bracket 7 can be fixed to the top of the housing 1 first, and then the top cover 5 can be fixed to the mounting bracket 7. Alternatively, the top cover 5 can be fixed to the mounting bracket 7 first, forming a single component, and then the component can be fixed together to the top of the housing 1.
[0077] As a preferred embodiment of this utility model, such as Figure 1 , Figure 2 As shown, a viewing window 6 is provided on the front side of the housing 1, and a viewing window channel component 61 is provided in the mounting cavity 12 corresponding to the viewing window 6. The circuit board 3 is located between the air inlet channel 13 and the viewing window channel component 61. The side of the viewing window channel component 61 facing the circuit board 3 is provided with a guide transition surface 62 that is recessed towards the viewing window 6, so as to guide the airflow discharged from the air inlet channel 13 to the fan assembly 4.
[0078] Users can observe the cooking status of the food inside the cooking cavity 11 through the viewing window 6. The viewing window channel component 61 and the viewing window 6 together form a sealed cavity. Simultaneously, the viewing window channel component 61 is located downstream of the circuit board 3 and is equipped with an air guide transition surface 62. This surface guides the airflow after it comes into contact with the circuit board 3, allowing the cooling airflow to cool the circuit board 3 before being guided downwards by the air guide transition surface 62 and flowing to the fan assembly 4 for further cooling. This ensures that the airflow sequentially cools both the circuit board 3 and the fan assembly 4 along its path within the mounting cavity 12, improving cooling efficiency. Furthermore, the air guide transition surface 62 makes the airflow direction smoother and gentler, improving airflow efficiency and reducing the possibility of turbulence.
[0079] Specifically, such as Figure 2 As shown, a viewing glass 63 is also provided below the viewing window 6. The viewing glass 63 is connected to the viewing window channel 61 and the viewing window 6 respectively. The three together form a sealed cavity, and the viewing glass 63 seals the bottom of the sealed cavity.
[0080] Specifically, the air guide transition surface 63 can be an arc surface, an inclined surface, or an irregular curved surface, as long as it can guide the airflow through the circuit board 3 into the mounting cavity 12 below, so that the airflow comes into contact with the fan assembly 4. There are no restrictions here.
[0081] Preferably, such as Figure 2 As shown, there is a gap 31 between the circuit board 3 and the top cover 5. The projection of the air inlet channel 13 on the vertical plane covers the projection of the gap 31 on the vertical plane. The projection of the air inlet channel 13 on the vertical plane covers the gap 31 above the circuit board 3, allowing some of the airflow in the air inlet channel 13 to flow to the top of the circuit board 3 and enter the gap 31, thereby contacting the top surface of the circuit board 3, increasing the contact area between the airflow and the circuit board 3, and improving the cooling effect of the circuit board 3.
[0082] For any parts not mentioned in this utility model, existing technologies can be used or referenced.
[0083] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.
[0084] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.
Claims
1. An air fryer, comprising a shell, wherein the shell has an upper mounting cavity and a lower cooking cavity, the mounting cavity housing a circuit board and a fan assembly, characterized in that, The housing includes a shell and a top cover covering the shell. The mounting cavity has an air inlet. An air intake channel is formed between the top wall of the shell and the top cover, connecting the air inlet and the mounting cavity. The air intake channel guides the airflow entering from the air inlet to the circuit board.
2. The air fryer according to claim 1, characterized in that, The air inlet channel has an air outlet, the circuit board is located outside the air outlet, and the air outlet faces the circuit board.
3. The air fryer according to claim 1, characterized in that, The air inlet channel has an air outlet, and at least a portion of the circuit board extends into the air inlet channel from the air outlet.
4. The air fryer according to claim 2 or 3, characterized in that, The air inlet channel has a flared section, and the air outlet is located in the flared section to increase the flow channel width at the air outlet.
5. The air fryer according to claim 4, characterized in that, The projection of the air outlet on the vertical plane covers the projection of the circuit board on the vertical plane.
6. The air fryer according to claim 2, characterized in that, The top wall of the housing bends downward at the air outlet to form a windbreak, which extends to the bottom of the circuit board.
7. The air fryer according to claim 1, characterized in that, The housing is also provided with an exhaust port that communicates with the mounting cavity, and the exhaust port and the air inlet are offset from each other in the circumferential direction of the housing.
8. The air fryer according to claim 1, characterized in that, The air inlet is formed in the housing, or the air inlet is formed in the top cover, or the air inlet is disposed between the housing and the top cover.
9. The air fryer according to claim 1, characterized in that, A viewing window is provided on the front side of the housing, and a viewing window channel component is provided in the mounting cavity corresponding to the viewing window. The circuit board is located between the air inlet channel and the viewing window channel component. The side of the viewing window channel component facing the circuit board is provided with an air guiding transition surface that is recessed towards the viewing window, so as to guide the airflow discharged from the air inlet channel to the fan assembly.
10. The air fryer according to claim 1, characterized in that, There is a gap between the circuit board and the top cover, and the projection of the air intake channel on the vertical plane covers the projection of the gap on the vertical plane.
Citation Information
Patent Citations
Cooking utensil provided with circuit board waterproof device
CN220308981U