A lead-free solder paste production device

Abstract

The utility model discloses a kind of lead-free solder paste production devices, including base, support frame, stirring bucket and stirring structure, the base middle part is equipped with positioning recess, the stirring bucket is placed in positioning recess, the support frame is L-shaped and one end is vertically fixed and installed on base, the stirring structure is equipped in the other end of support frame and is correspondingly arranged with stirring bucket;The stirring structure includes electric telescopic rod, cover and stirring assembly, the electric telescopic rod is equipped in the top of support frame and free end penetrates support frame and extends to below, the cover is equipped on the free end of electric telescopic rod, the stirring assembly is installed on the bottom wall of cover.The utility model relates to the technical field of lead-free solder paste, specifically provides a kind of lead-free solder paste production device.

Description

Technical Field

[0001] This utility model relates to the field of lead-free solder paste technology, specifically to a lead-free solder paste production device. Background Technology

[0002] Lead-free solder paste is an environmentally friendly soldering material that does not contain harmful lead and poses no harm to the environment or human health. Its production process mainly involves mixing solder powder and flux in a certain proportion and dispersing them evenly, while controlling indicators such as viscosity and humidity.

[0003] Mixing is an important production step, and mixing equipment is generally used for mixing. Mixing solder powder and flux at one time results in high viscosity in some areas, which takes a long time to disperse fully. At the same time, it is easy to stick to the inner wall of the mixing drum. Manual scraping by workers is labor-intensive and inefficient, which affects the mixing production efficiency. Utility Model Content

[0004] The technical problem this invention aims to solve is that when solder powder is added to flux in a single step, the local viscosity is too high, making it difficult to stir and disperse. At the same time, it tends to adhere to the inner wall of the mixing tank, making it inconvenient to clean.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: This utility model proposes a lead-free solder paste production device, comprising a base, a support frame, a mixing tank, and a mixing structure. The base has a positioning recess in the middle, and the mixing tank is placed inside the positioning recess. The support frame is L-shaped with one end vertically fixed to the base. The mixing structure is located at the other end of the support frame and corresponds to the mixing tank. The mixing structure includes an electric telescopic rod, a cap, and a mixing assembly. The electric telescopic rod is located at the top of the support frame, with its free end penetrating the support frame and extending downwards. The cap is located on the free end of the electric telescopic rod, and the mixing assembly is installed on the bottom wall of the cap.

[0006] Preferred technical solution 1: The stirring assembly includes a stirring motor, a drive shaft, and a uniform feeding assembly. The bottom of the cover is provided with a drive chamber. The upper end of the drive shaft is rotatably mounted on the top wall of the drive chamber, and the lower end extends through and to the bottom of the drive chamber. The lower end of the drive shaft is connected to a stirring rod by a thread. The stirring motor is located on the top of the cover, and the power output shaft extends into the drive chamber. Sprockets are respectively provided on the power output shaft and the drive shaft. Chains are sleeved on the two sets of sprockets, and the chains mesh with the two sets of sprockets respectively. The uniform feeding assembly is located at the bottom of the drive chamber.

[0007] Preferred technical solution 2: The uniform feeding component includes a feeding bin, a storage box, and a feeding shaft. The feeding bin is located below the drive bin. The upper end of the feeding shaft is located on the power output shaft of the stirring motor, and the lower end is rotatably located inside the feeding bin. The feeding shaft is equipped with spiral stirring blades. The storage box is installed on the top of the cover and is connected to the feeding bin by a connecting pipe.

[0008] Preferred technical solution 3: The stirring rod is provided with stirring blades and a scraper at the bottom.

[0009] Preferred technical solution four: The top of the support frame is provided with a process hole.

[0010] Preferred technical solution five: A controller is provided on one side of the support frame, and the electric telescopic rod and the stirring motor are both electrically connected to the controller.

[0011] The lead-free solder paste production apparatus proposed in this utility model has the following beneficial effects achieved by adopting the above structure:

[0012] (1) The stirring rod in the stirring structure is threadedly connected to the drive shaft, which is convenient for disassembly, installation and cleaning. The stirring rod is equipped with stirring blades and a scraper at the bottom, which is used to scrape the bottom and side walls of the stirring tank.

[0013] (2) By using a stirring motor, drive shaft and uniform feeding component to drive stirring and uniform feeding at the same time, the solder powder and flux are mixed at one time, resulting in high local viscosity and requiring a long time to disperse fully. Attached Figure Description

[0014] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0015] Figure 1 This is a schematic diagram of the overall structure of a lead-free solder paste production device proposed in this utility model. Figure 1 ;

[0016] Figure 2 This is a schematic diagram of the overall structure of a lead-free solder paste production device proposed in this utility model. Figure 2 ;

[0017] Figure 3 This is a schematic diagram of the stirring structure of a lead-free solder paste production device proposed in this utility model;

[0018] Figure 4 This is a schematic diagram of the internal stirring structure of a lead-free solder paste production device proposed in this utility model.

[0019] Figure 5 for Figure 4 A magnified view of part A.

[0020] The components are as follows: 1. Base, 2. Support frame, 3. Mixing tank, 4. Mixing structure, 5. Electric telescopic rod, 6. Cover, 7. Mixing motor, 8. Drive shaft, 9. Drive chamber, 10. Mixing rod, 11. Sprocket, 12. Chain, 13. Discharge bin, 14. Storage box, 15. Discharge shaft, 16. Spiral mixing blade, 17. Connecting pipe, 18. Mixing blade, 19. Scraper, 20. Process hole, 21. Controller. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0022] It should be noted that the terms “front,” “back,” “left,” “right,” “up,” and “down” used in the following description refer to the directions shown in the attached diagram, while the terms “inside” and “outside” refer to the directions toward or away from the geometric center of a specific component, respectively.

[0023] Example 1

[0024] like Figures 1-5 As shown, the technical solution adopted by this utility model is as follows: A lead-free solder paste production device includes a base 1, a support frame 2, a mixing tank 3, and a mixing structure 4. The base 1 has a positioning recess in the middle, and the mixing tank 3 is placed in the positioning recess. The support frame 2 is L-shaped and one end is vertically fixed on the base 1. The mixing structure 4 is located at the other end of the support frame 2 and is correspondingly arranged with the mixing tank 3. The mixing structure 4 includes an electric telescopic rod 5, a cover 6, and a mixing assembly. The electric telescopic rod 5 is located at the top of the support frame 2 and its free end passes through the support frame 2 and extends downward. The cover 6 is located on the free end of the electric telescopic rod 5. The mixing assembly is installed on the bottom wall of the cover 6. A process hole 20 is opened at the top of the support frame 2 to avoid the mixing motor 7 and the storage tank 14.

[0025] Example 2

[0026] Based on Example 1, such as Figures 3-5As shown, the mixing assembly includes a mixing motor 7, a drive shaft 8, and a uniform feeding assembly. A drive chamber 9 is located at the bottom of the cover 6. The upper end of the drive shaft 8 is rotatably mounted on the top wall of the drive chamber 9, and the lower end extends through and below the drive chamber 9. A mixing rod 10 is threadedly connected to the lower end of the drive shaft 8. The mixing rod 10 has mixing blades 18 and a scraper 19 at its bottom for scraping the bottom and side walls of the mixing tank 3. The mixing motor 7 is located at the top of the cover 6, and its power output shaft extends into the drive chamber 9. The power output shaft and the drive shaft 8 are respectively equipped with… There are sprockets 11, and chains 12 are fitted on two sets of sprockets 11. The chains 12 mesh with the two sets of sprockets 11 respectively. The uniform feeding component is located at the bottom of the drive chamber 9. The uniform feeding component includes a feeding chamber 13, a storage box 14 and a feeding shaft 15. The feeding chamber 13 is located below the drive chamber 9. The upper end of the feeding shaft 15 is located on the power output shaft of the stirring motor 7 and the lower end is rotatably located in the feeding chamber 13. The feeding shaft 15 is provided with spiral stirring blades 16. The storage box 14 is installed on the top of the cover 6 and a connecting pipe 17 is provided between it and the feeding chamber 13.

[0027] The support frame 2 has a controller 21 on one side, and the electric telescopic rod 5 and the stirring motor 7 are electrically connected to the controller 21.

[0028] In practical use, the soldering powder is placed in the storage box 14 and enters the feeding hopper 13 without passing through the connecting pipe 17. During the mixing process, the electric telescopic rod 5 is activated to drive the sealing cover 6 to match and seal with the mixing tank 3. The mixing motor 7 is started, and the feeding shaft 15 is driven to rotate through the power output shaft of the mixing motor 7, which in turn drives the spiral mixing blade 16 to evenly sprinkle the soldering powder into the mixing tank 3. At the same time, the drive shaft 8 is driven to rotate with the cooperation of the sprocket 11 and the chain 12, which in turn drives the mixing rod 10 to rotate. The mixing is fully and evenly mixed by the mixing blade 18. The bottom wall of the mixing tank 3 is scraped by the scraper 19. After the mixing is completed, the inner wall of the mixing tank 3 is scraped by the two sides of the scraper 19 during the upward process.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, material, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, material, or apparatus.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A lead-free solder paste production apparatus, comprising a base (1), a support frame (2), a mixing tank (3), and a mixing structure (4), characterized in that: The base (1) has a positioning recess in the middle, the stirring tank (3) is placed in the positioning recess, the support frame (2) is L-shaped and one end is vertically fixed on the base (1), the stirring structure (4) is located at the other end of the support frame (2) and is correspondingly arranged with the stirring tank (3); the stirring structure (4) includes an electric telescopic rod (5), a cover (6) and a stirring assembly, the electric telescopic rod (5) is located at the top of the support frame (2) and its free end passes through the support frame (2) and extends to the bottom, the cover (6) is located on the free end of the electric telescopic rod (5), and the stirring assembly is installed on the bottom wall of the cover (6).

2. The lead-free solder paste production apparatus according to claim 1, characterized in that: The stirring assembly includes a stirring motor (7), a drive shaft (8), and a uniform feeding assembly. The bottom of the cover (6) is provided with a drive chamber (9). The upper end of the drive shaft (8) is rotatably mounted on the top wall inside the drive chamber (9), and the lower end extends through and to the bottom of the drive chamber (9). The lower end of the drive shaft (8) is connected to a stirring rod (10) by a thread. The stirring motor (7) is located on the top of the cover (6), and the power output shaft extends into the drive chamber (9). The power output shaft and the drive shaft (8) are respectively provided with sprockets (11). Chains (12) are sleeved on the two sets of sprockets (11), and the chains (12) mesh with the two sets of sprockets (11). The uniform feeding assembly is located at the bottom of the drive chamber (9).

3. The lead-free solder paste production apparatus according to claim 2, characterized in that: The uniform feeding assembly includes a feeding bin (13), a storage tank (14), and a feeding shaft (15). The feeding bin (13) is located below the drive chamber (9). The upper end of the feeding shaft (15) is located on the power output shaft of the stirring motor (7), and the lower end is rotatably located inside the feeding bin (13). The feeding shaft (15) is provided with a spiral stirring blade (16). The storage tank (14) is installed on the top of the cover (6) and a connecting pipe (17) is provided between it and the feeding bin (13).

4. The lead-free solder paste production apparatus according to claim 3, characterized in that: The stirring rod (10) is provided with stirring blades (18) and scraper (19) at the bottom.

5. The lead-free solder paste production apparatus according to claim 4, characterized in that: The top of the support frame (2) is provided with a process hole (20).

6. The lead-free solder paste production apparatus according to claim 5, characterized in that: A controller (21) is provided on one side of the support frame (2), and the electric telescopic rod (5) and the stirring motor (7) are both electrically connected to the controller (21).

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