Automatic powder adding machine for tin paste stirring

CN224865357UActive Publication Date: 2026-10-20DONGGUAN JIEZHEN MASCH EQUIP CO LTD
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Patent Information

Application Number
CN202522528215.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-28
Publication Date
2026-10-20
Estimated Expiration
2035-11-28

AI Technical Summary

Technical Problem

[0002]锡膏在搅拌过程中逐渐加入粉末(锡粉)是电子焊接工艺(如SMT表面贴装)中确保锡膏性能稳定、焊接质量可靠的关键操作,然而现有技术中是人工加粉(锡粉),人工加粉因为加粉速度不均匀,会导致搅拌不均匀使锡膏产品内部有气泡、锡粉与其它载体没有完全搅拌均匀等缺陷,为此提出锡膏搅拌自动加粉机

Benefits of technology

[0010]与现有技术相比,本实用新型的有益效果是:通过振动器将锡粉落料斗内部的锡粉缓慢震落至锡粉落料管内部,并再通过锡粉落料管将锡粉分次导流至锡膏搅拌桶内部,使得锡膏搅拌机对锡膏搅拌桶内部锡膏进行搅拌时,通过分次、缓慢加入锡粉,并配合锡膏搅拌机的搅拌剪切力,可逐步打破团聚体,使锡粉颗粒均匀分散在膏体中,最终形成具有触变性的锡膏。

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Abstract

The utility model discloses a tin paste stirs automatic powder adding machine, be provided with tin paste stirring barrel in the tin paste stirrer inside, and be provided with the movable support of tin paste stirrer one side, the movable support is provided with the lifting workbench of up and down movement in its one side, and the lifting workbench is provided with the tin powder hopper that goes up and down movement with its synchronization, and the tin powder hopper bottom end inclined pipe is connected with the tin powder drop tube that tin powder stored in its inside is guided to the tin paste stirring barrel inside, and one side of the outside of tin powder hopper sets up the vibrator that it carries out vibration, through the vibrator, the tin powder in the tin powder hopper inside is slowly shaken and falls to the tin powder drop tube inside, through the slow addition of tin powder in batches, and cooperate the stirring shear force of tin paste stirrer, can gradually break the reunion, make tin powder particle even dispersion in the paste, finally form the tin paste with thixotropy.
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Description

Technical Field

[0001] This utility model relates to the field of solder paste processing, and in particular to an automatic solder paste mixing and powder adding machine. Background Technology

[0002] The gradual addition of powder (tin powder) during the mixing process of solder paste is a key operation in electronic soldering processes (such as SMT surface mount) to ensure stable solder paste performance and reliable soldering quality. However, in the existing technology, the powder (tin powder) is added manually. Manual powder addition can lead to uneven mixing due to uneven powder addition speed, resulting in defects such as air bubbles inside the solder paste product and incomplete mixing of tin powder with other carriers. Therefore, an automatic powder adding machine for solder paste mixing is proposed. Utility Model Content

[0003] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the above problems.

[0004] An automatic solder paste mixing and powder feeding machine includes a solder paste mixing tank inside the solder paste mixer and a movable frame on one side of the solder paste mixer. The movable frame is equipped with a lifting worktable that moves up and down on one side, and the lifting worktable is equipped with a solder powder hopper that moves up and down synchronously with it. The bottom end of the solder powder hopper is connected to an inclined pipe that guides the solder powder stored inside to the inside of the solder paste mixing tank. A vibrator is installed on one side of the outside of the solder powder hopper to vibrate it.

[0005] Preferably, a discharge valve is provided between the tin powder discharge hopper and the tin powder discharge pipe, and an electric butterfly valve motor is provided on one side of the discharge valve, and the electric butterfly valve motor drives an electric butterfly valve connecting rod that can be inserted into the discharge valve.

[0006] Preferably, a limiting frame is provided between the lifting worktable and the solder powder hopper, and the limiting component is located laterally at the top of one side of the lifting worktable, and the solder powder hopper is vertically inserted between the limiting frames.

[0007] Preferably, a weighing sensor is provided between the limiting frame and the lifting work platform, and the weighing sensors are all distributed at the bottom of the lifting work platform, with the limiting frame horizontally mounted on the weighing sensors.

[0008] Preferably, a hydraulic cylinder is provided between the lifting worktable and the movable frame, and the hydraulic cylinder is located on one side of the bottom end of the movable frame, and the hydraulic cylinder is provided with a lifting rod to drive the lifting platform to move up and down on the side of the movable frame.

[0009] Preferably, the movable frame is equipped with a control unit for controlling the hydraulic cylinder, and the control unit is located at the bottom end of the other side of the movable frame, and a control unit mounting base for fixing and supporting the control unit is provided on the other side of the movable frame.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows: the tin powder inside the tin powder hopper is slowly shaken down to the tin powder discharge pipe by the vibrator, and then the tin powder is guided to the tin paste mixing tank in batches through the tin powder discharge pipe. When the tin paste mixer stirs the tin paste in the tin paste mixing tank, the tin powder is added in batches and slowly, and with the stirring shear force of the tin paste mixer, the agglomerates can be gradually broken down, so that the tin powder particles are evenly dispersed in the paste, and finally a thixotropic tin paste is formed.

[0011] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 A schematic diagram of an automatic solder paste mixing and powder adding machine;

[0014] Figure 2 Another structural schematic diagram of an automatic solder paste mixing and powder adding machine;

[0015] Figure 3 This is another structural schematic diagram of an automatic solder paste mixing and powder adding machine;

[0016] Figure 4 This is a structural diagram of the lifting worktable;

[0017] Figure 5 This is a schematic diagram of the transport frame.

[0018] The following components are shown in the diagram: 1. Solder paste mixer; 2. Movable frame; 3. Solder paste mixing tank; 4. Control unit; 5. Solder powder hopper; 6. Limiting frame; 7. Solder powder discharge pipe; 8. Vibrator; 9. Lifting worktable; 10. Discharge port; 11. Hydraulic cylinder; 12. Lifting rod; 13. Discharge valve port; 14. Electric butterfly valve motor; 15. Weighing sensor; 16. Electric butterfly valve connecting rod; 17. Control unit mounting base. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-5 In this embodiment of the invention, the automatic solder paste mixing and powder feeding machine includes a solder paste mixing tank 3 located inside the solder paste mixer 1, and a movable frame 2 located on one side of the solder paste mixer 1. The movable frame 2 is equipped with a lifting worktable 9 that moves up and down on one side, and the lifting worktable 9 is equipped with a solder powder hopper 5 that moves up and down synchronously with it. The bottom end of the solder powder hopper 5 is connected to an inclined tube with a solder powder discharge pipe 7 that guides the solder powder stored inside to the solder paste mixing tank 3, and the outside of the solder powder hopper 5... A vibrator 8 is installed on one side to vibrate the solder powder. The vibrator 8 slowly shakes the solder powder inside the solder powder hopper 5 into the solder powder discharge pipe 7. The solder powder is then guided into the solder paste mixing tank 3 in stages through the solder powder discharge pipe 7. When the solder paste mixer 1 stirs the solder paste in the solder paste mixing tank 3, the solder powder is added in stages and slowly. With the stirring and shearing force of the solder paste mixer 1, the agglomerates can be gradually broken up, so that the solder powder particles are evenly dispersed in the paste, and finally a thixotropic solder paste is formed.

[0021] A discharge valve port 13 is pipe-connected between the solder powder hopper 5 and the solder powder discharge pipe 7. An electric butterfly valve motor 14 is provided on one side of the discharge valve port 13. The electric butterfly valve motor 14 drives an electric butterfly valve connecting rod 16 that can be inserted into the discharge valve port 13. The electric butterfly valve motor 14 drives the electric butterfly valve connecting rod 16 to divert the solder powder falling from the solder powder hopper 5 into the discharge valve port 13, so that the solder powder can fall into the solder powder discharge pipe 7 in batches and be guided into the solder paste mixing tank 3 in batches through the solder powder discharge pipe 7.

[0022] A limiting frame 6 is provided between the lifting worktable 9 and the solder powder hopper 5. The limiting frame 6 is located horizontally at the top of one side of the lifting worktable 9, and the solder powder hopper 5 is vertically inserted between the limiting frames 6. A weighing sensor 15 is provided between the limiting frame 6 and the lifting worktable 9. The weighing sensors 15 are all distributed at the bottom of the lifting worktable 9, and the limiting frame 6 is horizontally mounted on the weighing sensors 15. Thus, the weighing sensors 15 can fix the limiting frame 6 together with the solder powder hopper 5 to the lifting worktable 9, so that the lifting worktable 9 can drive the solder powder hopper 5 to lift and weigh the solder powder inside the solder powder hopper 5.

[0023] A hydraulic cylinder 11 is provided between the lifting work platform 9 and the movable frame 2, and the hydraulic cylinder 11 is located on one side of the bottom end of the movable frame 2. The hydraulic cylinder 11 is provided with a lifting rod 12 that drives the lifting platform 9 to move up and down on the side of the movable frame 2.

[0024] The movable frame 2 is equipped with a control unit 4 for controlling the hydraulic cylinder 11, and the control unit 4 is located at the bottom of the other side of the movable frame 2. The other side of the movable frame 2 is equipped with a control unit mounting base 17 for fixing and supporting the control unit 4.

[0025] A discharge port 10 is provided in the pipeline between the solder powder discharge pipe 7 and the solder paste mixing tank 3. The discharge port 10 is located obliquely on the side of the solder paste mixing tank 3, and the discharge port 10 is connected to the solder powder discharge pipe 7 through the pipeline, so that the solder powder inside the solder powder discharge hopper 5 can slide into the solder paste mixing tank 3 through the discharge port 10.

[0026] The automatic solder paste mixing and powder adding machine also includes the following operating steps:

[0027] S1. First, add the solder powder into the solder powder hopper 5 and weigh it simultaneously through at least three weighing sensors 15.

[0028] S2, the solder powder hopper 5 rises to a height that matches the solder paste mixer 1;

[0029] S3. Connect the solder powder feeding pipe 7 to the feeding port 10 of the solder paste mixing tank 3, and ensure that the solder powder feeding pipe 7 and the solder paste mixing tank 3 do not come into contact, so as not to affect the weight display of the weighing sensor 15.

[0030] S4. Set the feeding speed of the tin powder, specifying the unit of feeding in kilograms per minute;

[0031] S5. First, turn on the solder paste mixer 1 to make the mixing paddle inside the solder paste mixer 1 rotate, and drive the electric butterfly valve motor 14 to open the discharge valve 13 at the bottom of the solder powder discharge hopper 5, so that the solder powder inside the solder powder discharge hopper 5 flows into the solder paste mixer 1 at a uniform speed.

[0032] S6. During the powder feeding process, the electronic control system will monitor the flow rate of the solder powder in real time. If the powder feeding speed is too fast, the electric butterfly valve motor 14 will close the discharge valve 13. If the powder feeding speed is too slow, the electric butterfly valve motor 14 will open the discharge valve 13 and activate the electric vibratory hammer.

[0033] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention.

Claims

1. An automatic solder paste mixing and powder feeding machine, comprising a solder paste mixing tank disposed inside a solder paste mixer, and a movable frame disposed on one side of the solder paste mixer, characterized in that, The movable frame is equipped with a lifting worktable that moves up and down on one side, and the lifting worktable is equipped with a solder powder hopper that moves up and down synchronously with it. The bottom end of the solder powder hopper is connected to an inclined tube that guides the solder powder stored inside to the inside of the solder paste mixing tank. A vibrator is provided on one side of the outside of the solder powder hopper to vibrate it.

2. The automatic solder paste mixing and powder adding machine according to claim 1, characterized in that, A discharge valve is provided between the solder powder hopper and the solder powder discharge pipe, and an electric butterfly valve motor is provided on one side of the discharge valve. The electric butterfly valve motor drives an electric butterfly valve connecting rod that can be inserted into the discharge valve.

3. The automatic solder paste mixing and powder adding machine according to claim 1, characterized in that, A limit frame is provided between the lifting worktable and the solder powder hopper, and the limit component is located horizontally at the top of one side of the lifting worktable, and the solder powder hopper is vertically inserted between the limit frames.

4. The automatic solder paste mixing and powder adding machine according to claim 3, characterized in that, A weighing sensor is installed between the limiting frame and the lifting work platform, and the weighing sensors are all distributed at the bottom of the lifting work platform, with the limiting frame horizontally mounted on the weighing sensors.

5. The automatic solder paste mixing and powder adding machine according to claim 1, characterized in that, A hydraulic cylinder is installed between the lifting platform and the movable frame, and the hydraulic cylinder is located on one side of the bottom end of the movable frame. The hydraulic cylinder is equipped with a lifting rod that drives the lifting platform to move up and down on the side of the movable frame.

6. The automatic solder paste mixing and powder adding machine according to claim 5, characterized in that, The movable frame is equipped with a control unit for controlling the hydraulic cylinder, and the control unit is located at the bottom of the other side of the movable frame. A control unit mounting base for fixing and supporting the control unit is provided on the other side of the movable frame.