A solder resist ink coating apparatus

Abstract

The utility model discloses a kind of solder resist ink coating equipment, including coating cabin and dismounting mechanism, coating cabin: its left and right two sides middle part are hinged with access door by hinge, the inside middle of coating cabin is equipped with movable mounting block, dismounting mechanism: it includes slot, spray head, limit block, locking assembly and adjusting assembly, the inside front side of mounting block is all opened in slot, the inside middle of spray head is all inserted in slot, limit block is all rotationally connected in the inside middle of mounting block, the rear side middle of spray head is all opened in limit slot, the outer surface of limit block is all installed with the inner wall of limit slot adjacent to vertical, locking assembly is all set in the lower end of mounting block, adjusting assembly is all set in the upper end of mounting block, this solder resist ink coating equipment, without using bolt, can carry out spray head dismounting replacement and the accurate adjustment of height, improve the spray head dismounting adjustment efficiency, and then improve the coating efficiency of solder resist ink.

Description

Technical Field

[0001] This utility model relates to the field of solder resist ink coating technology, specifically a solder resist ink coating device. Background Technology

[0002] Solder resist coating is a process in PCB manufacturing where a special liquid ink or resin is applied to the copper surface of the circuit board. This prevents solder from spreading and causing short circuits during soldering, while also protecting the copper traces from oxidation, corrosion, and environmental damage. Common coating methods include screen printing, spraying, or brushing. After a thin, uniform coating, it needs to be cured by heat or UV light to form a durable protective layer. Among these three methods, solder resist spraying is often used for mass PCB manufacturing due to its high precision, automation, and efficiency. Existing solder resist coating equipment typically consists of a laterally movable robotic arm composed of a linear module and connecting frame, with a nozzle fixed on the robotic arm. During operation, an external conveyor line transports the PCB board to the area below the nozzle. The robotic arm moves the nozzle laterally, evenly spraying solder resist ink onto the PCB board surface to achieve solder resist ink coating. To apply different solder resist inks or change the spraying height, simply tighten or loosen the connecting bolts to replace different nozzles or change their positions. Traditional solder resist ink coating equipment requires loosening or loosening bolts to disassemble and replace different nozzles and adjust the spraying height. The adjustment of the spraying height relies on the position of different bolt holes, which cannot be flexibly and precisely adjusted according to actual conditions. Insufficient bolt torque during installation affects the installation accuracy of the nozzle, while excessive torque can easily lead to stripping. Therefore, we propose a solder resist ink coating device. Utility Model Content

[0003] The technical problem to be solved by this utility model is to overcome the existing defects and provide a solder resist ink coating device that allows for the disassembly and replacement of the printhead and precise height adjustment without the use of bolts, thereby improving the efficiency of printhead disassembly and adjustment and thus improving the coating efficiency of solder resist ink, which can effectively solve the problems in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a solder resist ink coating device, comprising a coating chamber and a disassembly / assembly mechanism;

[0005] Coating chamber: Both the left and right sides are hinged with maintenance doors, and the front and rear sides of the middle of the coating chamber are equipped with movable mounting blocks.

[0006] The disassembly and assembly mechanism includes slots, nozzles, limiting blocks, locking components, and adjusting components. The slots are all located inside the front side of the mounting block, and the nozzles are all inserted into the center of the slots. The limiting blocks are rotatably connected to the center of the mounting block, and each nozzle has a limiting groove on its rear side. The outer surface of each limiting block mates with the inner wall of the vertically adjacent limiting groove, providing a foundation for nozzle installation and fixation. The locking components are located at the lower end of the mounting block, and the adjusting components are located at the upper end. This allows for nozzle disassembly and replacement, as well as precise height adjustment, without the use of bolts, improving the efficiency of nozzle disassembly and adjustment, and consequently, improving the coating efficiency of solder resist ink.

[0007] Furthermore, the locking assembly includes a knob, a tension spring, a limiting hole, and a limiting head. The knob is inserted into the lower middle of the mounting block. The lower end of the outer surface of the limiting block is inserted into the inner wall of the vertically adjacent knob. A tension spring is provided between the lower end of the limiting block and the bottom wall of the vertically adjacent knob. The limiting holes are all opened at the lower end of the mounting block. The limiting heads are respectively set on the front and rear sides of the upper end of the knob. The outer surface of the limiting heads is inserted into the inner wall of the vertically adjacent limiting hole, which can prevent the limiting block from deflecting after installation.

[0008] Furthermore, the locking assembly also includes anti-slip protrusions, which are respectively disposed on the left and right front ends of the knob one. The anti-slip protrusions are vertically adjacent to the limiting block. The anti-slip protrusions can increase the friction of the surface of the knob one, and at the same time, they can also indicate the position of the limiting block.

[0009] Furthermore, the adjustment assembly includes a connecting block, a lead screw, and a second knob. The upper end of each mounting block is slidably connected to a movable connecting block. The lead screw is rotatably connected to the lower middle of the connecting block. The outer surface of the lead screw is threadedly connected to the middle of the inner side of the vertically adjacent mounting block. The second knob is located at the upper end of the lead screw, providing a basis for adjusting the nozzle height.

[0010] Furthermore, the adjustment component also includes a scale, which is set on the upper front side of the mounting block. A groove is provided in the middle of the front side of the connecting block. The outer surface of the scale is slidably connected to the inner wall of the vertically adjacent groove. The movement distance of the nozzle can be quickly and accurately marked by the relative position between the scale and the connecting block.

[0011] Furthermore, it also includes linear modules, which are respectively set on the front and rear sides of the top wall of the coating chamber. The input end of the linear module is electrically connected to the output end of the microcontroller. The lower end of the slider of the linear module is fixedly connected to the upper end of the vertically adjacent connecting block. Sliding columns are provided on the front and rear sides of the upper end of the left and right side walls of the coating chamber. Sliding holes are opened in the middle of the upper end of the connecting block. The outer surface of the sliding column is slidably connected to the inner wall of the horizontally adjacent sliding hole, providing a basis for the uniform coating of solder resist ink.

[0012] Furthermore, it also includes a microcontroller, which is placed on the right side of the coating chamber. The input terminal of the microcontroller is electrically connected to an external power supply to provide control for the coating of solder resist ink.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This solder resist ink coating equipment has the following advantages:

[0014] 1. Rotating knob two drives the lead screw to rotate. When the lead screw rotates forward, the mounting block and the nozzle move upward, increasing the distance between the nozzle and the PCB board. When the lead screw rotates in reverse, the mounting block and the nozzle move downward, decreasing the distance between the nozzle and the PCB board. During adjustment, the relative position between the scale lines on the ruler and the connecting block can be observed to quickly and accurately calculate the nozzle's movement height, allowing for rapid and precise adjustment of the nozzle's height.

[0015] 2. The printhead can be initially fixed by the insertion of the slot and the printhead. By turning the knob, the limit block can be rotated, allowing it to enter or leave the limit groove, thereby further fixing and releasing the printhead. The elastic deformation of the tension spring, combined with the insertion of the limit head and the limit hole, allows the limit block to deflect after the installation is completed, enabling quick disassembly and replacement of the printhead. The entire process does not require bolt connections, avoiding the risk of stripping threads, improving the efficiency of printhead disassembly and adjustment, and thus improving the coating efficiency of solder resist ink. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the cross-sectional structure of the coating chamber of this utility model;

[0018] Figure 3 This is a schematic diagram of the disassembly and assembly mechanism of this utility model;

[0019] Figure 4 This is a cross-sectional structural diagram of the disassembly and assembly mechanism of this utility model;

[0020] Figure 5 This is a schematic diagram of the slot structure of this utility model;

[0021] Figure 6 This is a schematic diagram of the locking component of this utility model.

[0022] In the diagram: 1 Coating chamber, 2 Inspection door, 3 Mounting block, 4 Disassembly and assembly mechanism, 41 Slot, 42 Spray head, 43 Limiting block, 44 Locking assembly, 441 Knob I, 442 Tension spring, 443 Limiting hole, 444 Limiting head, 445 Anti-slip protrusion, 45 Adjustment assembly, 451 Connecting block, 452 Lead screw, 453 Knob II, 454 Scale, 5 Linear module, 6 Sliding column, 7 Sliding hole, 8 Microcontroller. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-6 This embodiment provides a technical solution: a solder resist ink coating device, including a coating chamber 1 and a disassembly and assembly mechanism 4;

[0025] Coating chamber 1: Both sides of the chamber are hinged with inspection doors 2. The center of the inspection doors 2 is provided with a transparent acrylic window. Movable mounting blocks 3 are provided on the front and rear sides of the center of the interior of the coating chamber 1. It also includes a microcontroller 8. The microcontroller 8 is placed on the right side of the coating chamber 1. The input terminal of the microcontroller 8 is electrically connected to an external power supply to provide control for the coating of solder resist ink.

[0026] The disassembly and assembly mechanism 4 includes slots 41, nozzles 42, limiting blocks 43, locking components 44, and adjusting components 45. Each slot 41 is located inside the front side of the mounting block 3, with a notch at its upper end. Each nozzle 42 is inserted into the center of the slot 41 and is connected to an external liquid supply system. Each limiting block 43 is rotatably connected to the center of the mounting block 3, with a limiting groove at the center of the rear side of each nozzle 42. The outer surface of each limiting block 43 engages with the inner wall of the vertically adjacent limiting groove. During installation, the outer surface of the limiting block 43 is engaged with the inner wall of the vertically adjacent limiting groove. After the limiting block 43 rotates 180 degrees, the limiting block 43 is completely separated from the limiting groove, providing a foundation for the installation and fixation of the nozzle 42. The locking components 44 are all located at the lower end of the mounting block 3, and the adjusting components 45 are all located at the upper end of the mounting block 3. The nozzle 42 can be disassembled and replaced and its height can be precisely adjusted without the use of bolts, which improves the efficiency of disassembly and adjustment of the nozzle 42, thereby improving the coating efficiency of the solder resist ink.

[0027] The locking assembly 44 includes a knob 441, a tension spring 442, a limiting hole 443, and a limiting head 444. The knob 441 is inserted into the lower center of the mounting block 3. The lower end of the outer surface of the limiting block 43 is inserted into the inner wall of the vertically adjacent knob 441. The lower end of the outer surface of the limiting block 43 is a hexagonal prism. A hexagonal hole is opened in the center of the inside of the knob 441. The outer surface of the hexagonal prism is inserted into the inner wall of the vertically adjacent hexagonal hole. A tension spring 442 is provided between the lower end of the limiting block 43 and the bottom wall of the vertically adjacent knob 441. A hook is provided between the lower end of the hexagonal prism and the lower end of the inner wall of the hexagonal hole. The upper and lower ends of the tension spring 442 are respectively hung on the corresponding hooks. When replacing the tension spring 442, only the knob 441 needs to be replaced. 441 is pulled out of the mounting block 3, and then the tension spring 442 can be quickly replaced by removing it from the hook. The limiting holes 443 are all opened at the lower end of the mounting block 3. The limiting heads 444 are respectively set on the front and rear sides of the upper end of the knob 441. The outer surface of the limiting head 444 is inserted into the inner wall of the vertically adjacent limiting hole 443, which can prevent the limiting block 43 from deflecting after installation. The locking component 44 also includes anti-slip protrusions 445. The anti-slip protrusions 445 are respectively set on the front end of the left and right sides of the knob 441. The anti-slip protrusions 445 are vertically adjacent to the limiting block 43. The anti-slip protrusions 445 can increase the friction of the surface of the knob 441 and also mark the position of the limiting block 43.

[0028] The adjusting assembly 45 includes a connecting block 451, a lead screw 452, and a knob 453. The upper end of each mounting block 3 is slidably connected to a movable connecting block 451. Each lead screw 452 is rotatably connected to the lower center of the inner end of each connecting block 451. The outer surface of each lead screw 452 is threadedly connected to the inner center of the vertically adjacent mounting block 3. A bellows can be added between the upper end of the mounting block 3 and the lower end of the connecting block 451. The bellows is fitted onto the outer surface of the lead screw 452 and can contract and expand as the mounting block 3 moves up and down. To provide sealing and lubrication for the lead screw 452, knobs 453 are all located at the upper end of the lead screw 452, providing a basis for adjusting the height of the nozzle 42. The adjustment assembly 45 also includes a scale 454, which is located at the upper front end of the mounting block 3. A groove is provided in the middle of the front side of the connecting block 451. The outer surface of the scale 454 is slidably connected to the inner wall of the vertically adjacent groove. The relative position between the scale 454 and the connecting block 451 can be used to quickly and accurately indicate the moving distance of the nozzle 42.

[0029] It also includes a linear module 5, which is respectively set on the front and rear sides of the top wall of the coating chamber 1. The linear module 5 is a common reciprocating displacement device in the prior art. The input end of the linear module 5 is electrically connected to the output end of the microcontroller 8. The lower end of the slider of the linear module 5 is fixedly connected to the upper end of the vertically adjacent connecting block 451. The front and rear sides of the upper end of the left and right side walls of the coating chamber 1 are provided with sliding pillars 6. The upper middle of the connecting block 451 is provided with a sliding hole 7. The outer surface of the sliding pillar 6 is slidably connected to the inner wall of the horizontally adjacent sliding hole 7, providing a basis for the uniform coating of solder resist ink.

[0030] The working principle of the solder resist ink coating equipment provided by this utility model is as follows: Before performing the solder resist ink coating work, the equipment is first installed, connected and adjusted. First, the coating chamber 1 is installed above the external conveyor line, and then the nozzle 42 is connected to the external liquid supply system. Then, the knob 453 is turned to drive the lead screw 452 to rotate. When the lead screw 452 rotates forward, the mounting block 3 and the nozzle 42 move upward, and the distance between the nozzle 42 and the PCB board increases. When the lead screw 452 rotates in reverse, the mounting block 3 and the nozzle 42 move downward, and the distance between the nozzle 42 and the PCB board decreases. During adjustment, the scale lines on the surface of the scale 454 can be observed to align with the connection. The relative positions between blocks 451 are quickly and accurately calculated to determine the moving height of the nozzle 42. Then, the solder resist coating process begins. An external conveyor line transports the PCB board to below the nozzle 42. The microcontroller 8 controls the linear module 5, which drives the connecting block 451, mounting block 3, and nozzle 42 to move laterally and reciprocally. The external liquid supply system operates, and the solder resist ink is sprayed from the nozzle of the nozzle 42. Combined with the lateral reciprocating movement of the nozzle 42, the solder resist ink is evenly coated onto the PCB board surface, achieving the solder resist coating process. When different solder resist inks need to be coated, only different nozzles 42 need to be replaced. Open the access door 2. Pinch the part of knob 441 with the anti-slip protrusion 445 and pull down knob 441. The tension spring 442 expands downward under force until the limiting head 444 is completely out of the limiting hole 443. At this time, knob 441 loses its limiting position. Rotate knob 441 180 degrees, and the limiting block 43 also rotates 180 degrees. Then release your fingers. The tension spring 442 contracts without force, and knob 441 moves upward. The limiting head 444 re-enters the limiting hole 443. At this time, as the limiting block 43 rotates, the limiting block 43 completely leaves the limiting groove. The nozzle 42 loses its upper and lower limiting effect. Move the nozzle 4 upward. 2. Then, move the nozzle 42 out horizontally from the notch at the top of the slot 41 to complete the disassembly of the nozzle 42. Then, insert the new nozzle 42 into the slot 41. After the nozzle 42 is inserted into place, pull down the knob 441 and rotate it 180 degrees so that the anti-slip protrusion 445 on the surface of the knob 441 deflects to the direction of the nozzle 42. At this time, the limiting block 43 also rotates 180 degrees and re-enters the limiting groove. Then, release the knob 441, and the limiting head 444 inserts into the limiting hole 443 so that the knob 441 can no longer deflect and the limiting block 43 can no longer deflect, thus completing the disassembly and replacement of the nozzle 42.

[0031] It is worth noting that the microcontroller 8 disclosed in the above embodiments is an STM32L011 D4 microcontroller, and the linear module 5 is a TKB136120C-600 linear module. The microcontroller 8 controls the operation of the linear module 5 using methods commonly used in the prior art.

[0032] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A solder resist ink coating device, characterized in that: Includes a coating chamber (1) and a disassembly / assembly mechanism (4); Coating chamber (1): The middle of its left and right sides is hinged with maintenance doors (2), and the front and rear sides of the middle of the coating chamber (1) are equipped with movable mounting blocks (3). The disassembly and assembly mechanism (4) includes a slot (41), a nozzle (42), a limiting block (43), a locking component (44), and an adjustment component (45). The slots (41) are all opened on the front side inside the mounting block (3). The nozzles (42) are all inserted into the middle of the slots (41). The limiting blocks (43) are all rotatably connected to the middle of the mounting block (3). The middle of the rear side of the nozzles (42) is opened with a limiting groove. The outer surface of the limiting blocks (43) is fitted with the inner wall of the vertically adjacent limiting groove. The locking components (44) are all set at the lower end of the mounting block (3). The adjustment components (45) are all set at the upper end of the mounting block (3).

2. The solder resist ink coating equipment according to claim 1, characterized in that: It also includes a microcontroller (8), which is placed on the right side of the coating chamber (1), and the input terminal of the microcontroller (8) is electrically connected to an external power source.

3. The solder resist ink coating equipment according to claim 1, characterized in that: The locking assembly (44) includes a knob (441), a tension spring (442), a limiting hole (443), and a limiting head (444). The knob (441) is inserted into the middle of the lower end of the mounting block (3). The lower end of the outer surface of the limiting block (43) is inserted into the inner wall of the vertically adjacent knob (441). A tension spring (442) is provided between the lower end of the limiting block (43) and the bottom wall of the vertically adjacent knob (441). The limiting holes (443) are all opened at the lower end of the mounting block (3). The limiting heads (444) are respectively set on the front and rear sides of the upper end of the knob (441). The outer surface of the limiting head (444) is inserted into the inner wall of the vertically adjacent limiting hole (443).

4. The solder resist ink coating equipment according to claim 3, characterized in that: The locking assembly (44) also includes anti-slip protrusions (445), which are respectively disposed on the front ends of the left and right sides of the knob (441), and the anti-slip protrusions (445) are vertically adjacent to the limiting block (43).

5. The solder resist ink coating equipment according to claim 2, characterized in that: The adjustment component (45) includes a connecting block (451), a lead screw (452), and a second knob (453). The upper end of each mounting block (3) is slidably connected to a movable connecting block (451). The lead screw (452) is rotatably connected to the lower middle of the inner end of the connecting block (451). The outer surface of the lead screw (452) is threadedly connected to the middle of the inner interior of the vertically adjacent mounting block (3). The second knob (453) is located at the upper end of the lead screw (452).

6. The solder resist ink coating equipment according to claim 5, characterized in that: The adjustment component (45) also includes a scale (454), which is located on the upper front side of the mounting block (3). A groove is provided in the middle of the front side of the connecting block (451), and the outer surface of the scale (454) is slidably connected to the inner wall of the vertically adjacent groove.

7. The solder resist ink coating equipment according to claim 5, characterized in that: It also includes a linear module (5), which is respectively set on the front and rear sides of the top wall of the coating chamber (1). The input end of the linear module (5) is electrically connected to the output end of the microcontroller (8). The lower end of the slider of the linear module (5) is fixedly connected to the upper end of the vertically adjacent connecting block (451). The front and rear sides of the upper end of the left and right side walls of the coating chamber (1) are provided with sliding columns (6). The upper middle of the inner end of the connecting block (451) is provided with a sliding hole (7). The outer surface of the sliding column (6) is slidably connected to the inner wall of the horizontally adjacent sliding hole (7).

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