An ultrasonic sieving device and a solid-state electrolyte sieving system

Abstract

The application provides an ultrasonic screening device and a solid-state electrolyte screening system, and relates to the technical field of solid-state electrolyte screening. The ultrasonic screening device comprises an ultrasonic control module, an ultrasonic transducer and a screen mesh connected in sequence, and the ultrasonic control module comprises a fundamental wave generator and a high-frequency transformer. The output end of the fundamental wave generator is connected with the input end of the high-frequency transformer, and the output end of the high-frequency transformer is connected with the input end of the ultrasonic transducer. The application introduces the fundamental wave generator with flexible configuration parameters, and adjusts the signal output by the fundamental wave generator through the high-frequency transformer, so that the ultrasonic control module can dynamically adjust the signal parameters, thereby reducing the failure rate of the entire ultrasonic screening device and greatly improving the screening production efficiency of the solid-state electrolyte.

Description

Technical Field

[0001] This application relates to the field of solid electrolyte sieving technology, and more specifically, to an ultrasonic sieving device and a solid electrolyte sieving system. Background Technology

[0002] In the production process of solid electrolytes, sieving is a crucial step to ensure that the particle size distribution of the material meets the requirements. Currently, ultrasonic sieving equipment is mostly used to process solid electrolyte powder in this step to improve sieving efficiency and accuracy.

[0003] However, the ultrasonic controllers in existing ultrasonic screening equipment have fixed parameters, meaning they can only provide vibration output at a fixed frequency. This fixed operating mode easily leads to problems such as screen clogging and decreased screening rate, resulting not only in poor equipment stability and high failure rate, but also severely restricting the screening efficiency of solid electrolytes.

[0004] In summary, how to improve the sieving efficiency of solid electrolytes is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] The purpose of this application is to provide an ultrasonic screening device and a solid electrolyte screening system to improve the screening efficiency of solid electrolytes.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows: On the one hand, this application provides an ultrasonic sieving device, the device comprising an ultrasonic control module, an ultrasonic transducer and a screen connected in sequence; The ultrasonic control module includes a fundamental wave generator and a high-frequency transformer; The output terminal of the fundamental frequency generator is connected to the input terminal of the high-frequency transformer, and the output terminal of the high-frequency transformer is connected to the input terminal of the ultrasonic transducer.

[0007] Furthermore, the ultrasonic control module also includes a modulation wave generator and a modulation amplifier; The input terminal of the modulation amplifier is connected to the output terminals of the fundamental wave generator and the modulation wave generator, respectively, and the output terminal of the modulation amplifier is connected to the input terminal of the high-frequency transformer.

[0008] Furthermore, the ultrasonic control module also includes a power supply module; The input terminal of the power module is connected to an external power supply system, and the output terminal of the power module is connected to the fundamental wave generator, the modulating wave generator, and the modulation amplifier, respectively.

[0009] Furthermore, the modulation amplifier includes: a first switching transistor, a second switching transistor, and a power switching transistor; The positive power supply terminal of the fundamental wave generator, the positive power supply terminal of the modulation wave generator, the first terminal of the first switching transistor, and the first terminal of the second switching transistor are all connected to the positive output terminal of the power module. The negative power supply terminal of the fundamental wave generator, the negative power supply terminal of the modulation wave generator, and the first terminal of the power switch are all connected to the negative output terminal of the power module. The output terminal of the modulation wave generator is connected to the control terminal of the first switching transistor, the second terminal of the first switching transistor and the output terminal of the fundamental wave generator are both connected to the control terminal of the second switching transistor, and the second terminal of the second switching transistor is connected to the control terminal of the power switching transistor. The first and second input terminals of the high-frequency transformer are respectively connected to the first terminal of the second switching transistor and the second terminal of the power switching transistor, and the first and second output terminals of the high-frequency transformer are respectively connected to the first and second input terminals of the ultrasonic transducer.

[0010] Furthermore, the ultrasonic control module also includes a first LC component, and the modulation amplifier also includes a first resistor, an RC component, and a second LC component; One end of the first LC component is connected to the positive output terminal of the power module, and the other end of the first LC component is connected to the positive power supply terminal of the fundamental wave generator, the positive power supply terminal of the modulated wave generator, the first terminal of the first switching transistor, the first terminal of the second switching transistor, and one end of the first resistor. The other end of the first resistor is connected to the control terminal of the second switching transistor. One end of the RC component is connected to the output terminal of the fundamental wave generator, and the other end of the RC component is connected to the control terminal of the second switching transistor. One end of the second LC component is connected to the first end of the power switch, and the other end of the second LC component is connected to the negative output terminal of the power module.

[0011] Furthermore, the first LC component includes a first inductor, a first capacitor, and a second capacitor; the second LC component includes a second inductor, a third capacitor, and a fourth capacitor; and the RC component includes a second resistor and a fifth capacitor. One end of the first inductor is connected to the positive output terminal of the power supply module, and the other end of the first inductor is connected to one end of the first capacitor, one end of the second capacitor, the positive power supply terminal of the fundamental wave generator, the positive power supply terminal of the modulation wave generator, the first end of the first switching transistor, the first end of the second switching transistor, and one end of the first resistor; the other ends of the first capacitor and the second capacitor are both grounded. One end of the second resistor is connected to the output terminal of the fundamental frequency generator, and the other end of the second resistor is connected to the control terminal of the second switching transistor. The fifth capacitor is connected in parallel across the two ends of the second resistor. One end of the second inductor is connected to the first end of the power switch, and the other end of the second inductor is connected to the negative output terminal of the power module; one end of the third capacitor and the fourth capacitor are both connected to one end of the second inductor, and the other end of the third capacitor and the fourth capacitor are both connected to the other end of the second inductor.

[0012] Furthermore, both the first and second switching transistors are PNP transistors, and the power switching transistor is an NPN transistor; The control terminal, first terminal, and second terminal of the first and second switching transistors are respectively the base, emitter, and collector of a PNP transistor; The control terminal, first terminal, and second terminal of the power switch are the base, emitter, and collector of the NPN transistor, respectively.

[0013] Furthermore, the ultrasonic sieving device also includes a housing; the ultrasonic control module is located inside the housing, the ultrasonic transducer and the screen are both located outside the housing, and the housing is grounded.

[0014] Furthermore, the ultrasonic sieving device also includes an adjustment knob and a display screen, both of which are mounted on the outer casing.

[0015] On the other hand, this application also provides a solid electrolyte sieving system, which includes an ultrasonic sieving device as described in any of the foregoing embodiments.

[0016] Compared with the prior art, this application has the following advantages: This application provides an ultrasonic screening device and a solid electrolyte screening system. The ultrasonic screening device includes an ultrasonic control module, an ultrasonic transducer, and a screen connected in sequence. The ultrasonic control module includes a fundamental frequency generator and a high-frequency transformer. The output of the fundamental frequency generator is connected to the input of the high-frequency transformer, and the output of the high-frequency transformer is connected to the input of the ultrasonic transducer. Compared to existing ultrasonic controllers with fixed frequencies, this application introduces a fundamental frequency generator with flexibly configurable parameters and adjusts the signal output of the fundamental frequency generator through a high-frequency transformer. This allows the ultrasonic control module to dynamically adjust the signal parameters to better adapt to the type of ultrasonic transducer, thereby reducing the failure rate of the entire ultrasonic screening device and greatly improving the screening efficiency of solid electrolytes. Attached Figure Description

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0018] Figure 1 This is one of the structural schematic diagrams of an ultrasonic sieving device provided in an embodiment of this application; Figure 2 This is a second schematic diagram of the structure of an ultrasonic sieving device provided in an embodiment of this application; Figure 3 This is the third schematic diagram of the structure of an ultrasonic sieving device provided in the embodiments of this application; Figure 4 This is a circuit diagram of an ultrasonic sieving device provided in an embodiment of this application.

[0019] Icons: 10-Ultrasonic sieving device; 100-Ultrasonic control module; 110-Fundamental wave generator; 120-High frequency transformer; 130-Modulation wave generator; 140-Modulation amplifier; 141-RC component; 142-Second LC component; 150-Power module; 160-First LC component; 200-Ultrasonic transducer; 300-Screen; 400-Housing; Q1-First switching transistor; Q2-Second switching transistor; Q3-Power switching transistor; R1-First resistor; R2-Second resistor; L1-First inductor; L2-Second inductor; C1-First capacitor; C2-Second capacitor; C3-Third capacitor; C4-Fourth capacitor; C5-Fifth capacitor; F-Fuse. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0021] In the description of this application, it should be noted that relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. The term "connection" should be interpreted broadly, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0022] As described in the background section, the ultrasonic controllers in existing ultrasonic screening equipment can only provide vibration output at a fixed frequency. This fixed operating mode easily leads to problems such as screen clogging and decreased screening rate, resulting in poor equipment stability, high failure rate, and severely restricting the screening efficiency of solid electrolytes. Therefore, how to improve the screening efficiency of solid electrolytes is a technical problem that urgently needs to be solved by those skilled in the art.

[0023] To address the aforementioned technical problems, this application provides an ultrasonic sieving device that can be used to sieve solid electrolytes as well as other fine solid powders (particle size of 0.3~500 micrometers). Furthermore, this device can be widely applied in the new energy industry, rare metal industry, pharmaceutical industry, and other fields.

[0024] Specifically, please refer to Figure 1 The ultrasonic sieving device 10 provided in this application embodiment includes an ultrasonic control module 100, an ultrasonic transducer 200, and a screen 300 connected in sequence.

[0025] The ultrasonic control module 100 includes a fundamental wave generator 110 and a high-frequency transformer 120.

[0026] The output of the fundamental frequency generator 110 is connected to the input of the high-frequency transformer 120, and the output of the high-frequency transformer 120 is connected to the input of the ultrasonic transducer 200.

[0027] Compared to the fixed-frequency ultrasonic controllers in the prior art, this application introduces a fundamental wave generator 110 with flexibly configurable parameters and adjusts the signal output of the fundamental wave generator 110 through a high-frequency transformer 120. This allows the ultrasonic control module 100 to dynamically adjust the signal parameters to better adapt to the type of ultrasonic transducer 200, thereby reducing the failure rate of the entire ultrasonic screening device 10 and greatly improving the screening efficiency of solid electrolytes.

[0028] In one alternative implementation, please refer to Figure 2 The ultrasonic control module 100 also includes a modulation wave generator 130 and a modulation amplifier 140.

[0029] The input terminal of the modulation amplifier 140 is connected to the output terminal of the fundamental wave generator 110 and the output terminal of the modulation wave generator 130, respectively. The output terminal of the modulation amplifier 140 is connected to the input terminal of the high frequency transformer 120. The output terminal of the high frequency transformer 120 is connected to the input terminal of the ultrasonic transducer 200. The output terminal of the ultrasonic transducer 200 is connected to the screen 300.

[0030] The fundamental frequency generator 110 is used to generate a reference wave with a corresponding frequency and duty cycle according to the type of the ultrasonic transducer 200.

[0031] The modulation wave generator 130 is used to generate a modulation wave with a corresponding frequency and duty cycle according to the type of solid electrolyte to be screened.

[0032] The modulation amplifier 140 is used to modulate and amplify the reference wave according to the modulation wave to generate a second pulse signal.

[0033] The high-frequency transformer 120 is used to boost the second pulse signal to generate the first pulse signal. For example, the second pulse signal is a low-voltage, high-current pulse of 2~30A. The high-frequency transformer 120 boosts the low-voltage, high-current pulse to 160V~420V to obtain a high-voltage, high-current pulse (i.e., the first pulse signal), thereby driving the ultrasonic transducer 200.

[0034] The ultrasonic transducer 200 is used to convert the first pulse signal into mechanical energy to drive the screen 300 to vibrate.

[0035] Understandably, the fundamental wave generator 110, as the core component of the ultrasonic control module 100, generates a reference wave with a corresponding frequency and duty cycle based on the type of ultrasonic transducer 200 used. By flexibly adjusting these two parameters—reference frequency and duty cycle—the fundamental wave generator 110 enables the same ultrasonic control module 100 to adapt to different types of ultrasonic transducers 200, thereby meeting the needs of different screening scenarios. Specifically, the frequency of the reference wave is adjusted according to the rated frequency of the ultrasonic transducer 200 to achieve efficient energy conversion; the duty cycle of the reference wave is adjusted according to the driving requirements of the ultrasonic transducer 200 to optimize driving performance and prevent overload. For example, the fundamental wave generator 110 can generate a PWM square wave with a frequency of 15~38kHz (covering the operating frequency band of common ultrasonic transducers 200) and a duty cycle of 40% as the reference wave. That is, the reference wave generated by the fundamental wave generator 110 ensures that the ultrasonic transducer 200 operates at its optimal efficiency point, not only improving screening efficiency but also effectively extending the service life of the device.

[0036] The modulated wave generator 130 generates a modulated wave with a corresponding frequency and duty cycle based on the type of solid electrolyte to be screened (such as particle diameter). The modulation amplifier 140 modulates and amplifies the reference wave according to this modulated wave, generating an intermittent short pulse sequence (i.e., the second pulse signal). The high-frequency transformer 120 then boosts the second pulse signal to generate the first pulse signal. Optionally, the frequency of the modulated wave can be set in the low-frequency range of 10~950Hz to control the time interval between pulse packets. By flexibly adjusting the modulation frequency and duty cycle, the pulse sequence can be matched to the mechanical resonant frequency of different electrolyte particles (for example, large electrolyte particles require low-frequency, high-energy pulses to drive them, while small electrolyte particles are suitable for higher-frequency, shorter-duration pulses), thereby effectively improving the screening efficiency of solid electrolytes.

[0037] Based on the above design, this application introduces a fundamental wave generator 110 and a modulated wave generator 130 with flexibly configurable parameters, enabling the ultrasonic control module 100 to dynamically adjust various signal parameters according to the type of ultrasonic transducer 200 and the material characteristics of the solid electrolyte to be screened. The first pulse signal, after modulation, amplification, and voltage boosting, drives the ultrasonic transducer 200 to output mechanical energy, causing the screen 300 to generate a non-fixed frequency, adaptive vibration mode, thereby improving the screening rate and reducing the device failure rate. In other words, the ultrasonic screening device 10 provided in this application significantly improves the production efficiency of solid electrolyte screening by optimizing various signal parameters during the screening process.

[0038] In addition, the amplitude and power of the signal can be adjusted by the modulation amplifier 140 and the high-frequency transformer 120 to generate a corresponding first pulse signal. This pulse signal is converted into mechanical energy of a corresponding magnitude by the ultrasonic transducer 200 to adapt to the screens 300 with different structures, thereby preventing solid electrolytes from sticking to the screens 300, reducing the failure rate of the device, and further improving the screening efficiency of solid electrolytes.

[0039] Further, please refer to Figure 3 The ultrasonic control module 100 also includes a power supply module 150. The input terminal of the power supply module 150 is connected to an external power supply system, and the output terminal of the power supply module 150 is connected to the fundamental wave generator 110, the modulating wave generator 130, and the modulation amplifier 140, respectively.

[0040] The power supply module 150 is used to convert an external power supply voltage (e.g., 220V AC mains) into a reference voltage (e.g., 6~24V DC) to power the fundamental wave generator 110, the modulated wave generator 130, and the modulation amplifier 140.

[0041] Furthermore, to ensure that the ultrasonic sieving device 10 can be used for a long time in a conductive dust environment and to further reduce the device failure rate, as an optional implementation, the ultrasonic sieving device 10 also includes a housing 400. The ultrasonic control module 100 is disposed inside the housing 400, while the ultrasonic transducer 200 and the screen 300 are both disposed outside the housing 400, and the housing 400 is grounded.

[0042] Optionally, the ultrasonic sieving device 10 also includes an adjustment knob and a display screen. Both the adjustment knob and the display screen are mounted on the housing 400. The adjustment knob is used to adjust the reference parameters and modulation parameters, and the display screen is used to display the reference parameters and modulation parameters. The reference parameters include the frequency and duty cycle of the reference wave, and the modulation parameters include the frequency and duty cycle of the modulated wave.

[0043] To better understand the signal modulation and amplification process, please refer to [link / reference]. Figure 4 In one alternative implementation, the modulation amplifier 140 includes a first switch Q1, a second switch Q2, and a power switch Q3.

[0044] The positive power supply terminals of the fundamental wave generator 110, the modulator 130, the first terminal of the first switch Q1, and the first terminal of the second switch Q2 are all connected to the positive output terminal of the power module 150. The negative power supply terminals of the fundamental wave generator 110, the modulator 130, and the first terminal of the power switch Q3 are all connected to the negative output terminal of the power module 150. The output terminal of the modulator 130 is connected to the control terminal of the first switch Q1. The second terminal of the first switch Q1 and the output terminal of the fundamental wave generator 110 are both connected to the control terminal of the second switch Q2. The second terminal of the second switch Q2 is connected to the control terminal of the power switch Q3. The first and second input terminals of the high-frequency transformer 120 are connected to the first terminal of the second switch Q2 and the second terminal of the power switch Q3, respectively. The first and second output terminals of the high-frequency transformer 120 are connected to the first and second input terminals of the ultrasonic transducer 200, respectively.

[0045] The first switch Q1 is used to amplify the current of the modulated wave and control the switching on and off of the second switch Q2 according to the amplified modulated wave.

[0046] The second switch Q2 is used to amplify the current of the reference wave and generate a modulated pulse signal under the control of the first switch Q1.

[0047] The power switch Q3 is used to amplify the modulated pulse signal to obtain a second pulse signal.

[0048] Understandably, since the second terminal of the first switch Q1 is connected to the control terminal of the second switch Q2, the first switch Q1 can rhythmically turn off the second switch Q2 under the action of the modulation wave, thereby modulating the reference wave to generate a pulse signal. This pulse signal is then amplified by the power switch Q3 to obtain a low-voltage, high-current second pulse signal. Finally, this second pulse signal is boosted by the high-frequency transformer 120 to obtain a high-voltage, high-current first pulse signal, thus effectively driving the ultrasonic transducer 200.

[0049] In addition, to improve signal quality and system stability, in another optional embodiment, the ultrasonic control module 100 further includes a first LC component 160, and the modulation amplifier 140 further includes a first resistor R1, an RC component 141, and a second LC component 142.

[0050] In this circuit, one end of the first LC component 160 is connected to the positive output terminal of the power module 150, and the other end of the first LC component 160 is connected to the positive power supply terminal of the fundamental wave generator 110, the positive power supply terminal of the modulator 130, the first terminal of the first switch Q1, the first terminal of the second switch Q2, and one end of the first resistor R1. The other end of the first resistor R1 is connected to the control terminal of the second switch Q2. One end of the RC component 141 is connected to the output terminal of the fundamental wave generator 110, and the other end of the RC component 141 is connected to the control terminal of the second switch Q2. One end of the second LC component 142 is connected to the first terminal of the power switch Q3, and the other end of the second LC component 142 is connected to the negative output terminal of the power module 150. The input terminal of the power module 150 is connected to an external power supply system through a fuse F.

[0051] Furthermore, the first LC component 160 includes a first inductor L1, a first capacitor C1, and a second capacitor C2; the second LC component 142 includes a second inductor L2, a third capacitor C3, and a fourth capacitor C4; and the RC component 141 includes a second resistor R2 and a fifth capacitor C5.

[0052] One end of the first inductor L1 is connected to the positive output terminal of the power module 150. The other end of the first inductor L1 is connected to one end of the first capacitor C1, one end of the second capacitor C2, the positive power supply terminal of the fundamental wave generator 110, the positive power supply terminal of the modulating wave generator 130, the first end of the first switch Q1, the first end of the second switch Q2, and one end of the first resistor R1. The other ends of the first capacitor C1 and the second capacitor C2 are both grounded.

[0053] One end of the second resistor R2 is connected to the output terminal of the fundamental frequency generator 110, and the other end of the second resistor R2 is connected to the control terminal of the second switching transistor Q2. The fifth capacitor C5 is connected in parallel across the two ends of the second resistor R2.

[0054] One end of the second inductor L2 is connected to the first terminal of the power switch Q3, and the other end of the second inductor L2 is connected to the negative output terminal of the power module 150. One end of the third capacitor C3 and the fourth capacitor C4 are both connected to one end of the second inductor L2, and the other end of the third capacitor C3 and the fourth capacitor C4 are both connected to the other end of the second inductor L2.

[0055] Optionally, the first switching transistor Q1 and the second switching transistor Q2 are both PNP transistors, and the power switching transistor Q3 is an NPN transistor. The control terminal, first terminal, and second terminal of the first switching transistor Q1 are the base, emitter, and collector of the PNP transistor, respectively. The control terminal, first terminal, and second terminal of the second switching transistor Q2 are the base, emitter, and collector of the PNP transistor, respectively. The control terminal, first terminal, and second terminal of the power switching transistor Q3 are the base, emitter, and collector of the NPN transistor, respectively.

[0056] It should be noted that, in order to adapt to the needs of different application scenarios, the modulation amplifier 140 can also adopt multi-stage drive or parallel drive designs to improve power. Furthermore, this application does not limit the specific type or quantity of the high-frequency transformer 120.

[0057] Furthermore, this application embodiment also provides a solid electrolyte sieving system, which includes an ultrasonic sieving device 10 as described in any of the foregoing embodiments.

[0058] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0059] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An ultrasonic sieving device, characterized in that, The device includes an ultrasonic control module, an ultrasonic transducer, and a screen connected in sequence. The ultrasonic control module includes a fundamental wave generator and a high-frequency transformer; The output terminal of the fundamental frequency generator is connected to the input terminal of the high-frequency transformer, and the output terminal of the high-frequency transformer is connected to the input terminal of the ultrasonic transducer.

2. The ultrasonic sieving device according to claim 1, characterized in that, The ultrasonic control module also includes a modulation wave generator and a modulation amplifier; The input terminal of the modulation amplifier is connected to the output terminals of the fundamental wave generator and the modulation wave generator, respectively, and the output terminal of the modulation amplifier is connected to the input terminal of the high-frequency transformer.

3. The ultrasonic sieving device according to claim 2, characterized in that, The ultrasonic control module also includes a power supply module. The input terminal of the power module is connected to an external power supply system, and the output terminal of the power module is connected to the fundamental wave generator, the modulating wave generator, and the modulation amplifier, respectively.

4. The ultrasonic sieving device according to claim 3, characterized in that, The modulation amplifier includes: a first switching transistor, a second switching transistor, and a power switching transistor; The positive power supply terminal of the fundamental wave generator, the positive power supply terminal of the modulation wave generator, the first terminal of the first switching transistor, and the first terminal of the second switching transistor are all connected to the positive output terminal of the power module. The negative power supply terminal of the fundamental wave generator, the negative power supply terminal of the modulation wave generator, and the first terminal of the power switch are all connected to the negative output terminal of the power module. The output terminal of the modulation wave generator is connected to the control terminal of the first switching transistor, the second terminal of the first switching transistor and the output terminal of the fundamental wave generator are both connected to the control terminal of the second switching transistor, and the second terminal of the second switching transistor is connected to the control terminal of the power switching transistor. The first and second input terminals of the high-frequency transformer are respectively connected to the first terminal of the second switching transistor and the second terminal of the power switching transistor, and the first and second output terminals of the high-frequency transformer are respectively connected to the first and second input terminals of the ultrasonic transducer.

5. The ultrasonic sieving device according to claim 4, characterized in that, The ultrasonic control module further includes a first LC component, and the modulation amplifier further includes a first resistor, an RC component, and a second LC component; One end of the first LC component is connected to the positive output terminal of the power module, and the other end of the first LC component is connected to the positive power supply terminal of the fundamental wave generator, the positive power supply terminal of the modulated wave generator, the first terminal of the first switching transistor, the first terminal of the second switching transistor, and one end of the first resistor. The other end of the first resistor is connected to the control terminal of the second switching transistor. One end of the RC component is connected to the output terminal of the fundamental wave generator, and the other end of the RC component is connected to the control terminal of the second switching transistor. One end of the second LC component is connected to the first end of the power switch, and the other end of the second LC component is connected to the negative output terminal of the power module.

6. The ultrasonic sieving device according to claim 5, characterized in that, The first LC component includes a first inductor, a first capacitor, and a second capacitor; the second LC component includes a second inductor, a third capacitor, and a fourth capacitor; and the RC component includes a second resistor and a fifth capacitor. One end of the first inductor is connected to the positive output terminal of the power supply module, and the other end of the first inductor is connected to one end of the first capacitor, one end of the second capacitor, the positive power supply terminal of the fundamental wave generator, the positive power supply terminal of the modulation wave generator, the first end of the first switching transistor, the first end of the second switching transistor, and one end of the first resistor; the other ends of the first capacitor and the second capacitor are both grounded. One end of the second resistor is connected to the output terminal of the fundamental frequency generator, and the other end of the second resistor is connected to the control terminal of the second switching transistor. The fifth capacitor is connected in parallel across the two ends of the second resistor. One end of the second inductor is connected to the first end of the power switch, and the other end of the second inductor is connected to the negative output terminal of the power module; one end of the third capacitor and the fourth capacitor are both connected to one end of the second inductor, and the other end of the third capacitor and the fourth capacitor are both connected to the other end of the second inductor.

7. The ultrasonic sieving device according to claim 4, characterized in that, Both the first and second switching transistors are PNP transistors, and the power switching transistor is an NPN transistor. The control terminal, first terminal, and second terminal of the first and second switching transistors are respectively the base, emitter, and collector of a PNP transistor; The control terminal, first terminal, and second terminal of the power switch are the base, emitter, and collector of the NPN transistor, respectively.

8. The ultrasonic sieving device according to claim 1, characterized in that, The ultrasonic screening device also includes a housing; The ultrasonic control module is located inside the housing, while the ultrasonic transducer and the screen are located outside the housing, and the housing is grounded.

9. The ultrasonic sieving device according to claim 8, characterized in that, The ultrasonic sieving device also includes an adjustment knob and a display screen, both of which are located on the outer casing.

10. A solid electrolyte sieving system, characterized in that, The solid electrolyte sieving system includes the ultrasonic sieving device as described in any one of claims 1-9.

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