Chip tray type appearance defect detection and sorting apparatus

Abstract

The utility model relates to chip detection technical field provides a kind of chip tray type appearance defect detection sorting equipment, comprising: workbench, the top of the workbench is sequentially fixed from left to right and installed with feed tray conveying module, feed tray storage component, good tray conveying module, bottom defect tray conveying module, good tray storage component, silk screen surface defect tray conveying module, silk screen surface defect tray storage component, bottom defect tray storage component and buffer tray conveying module.This utility model, by artificial loading, the stacked tray material is placed into feed tray storage component, sequentially completes bottom, silk screen surface AOI detection, data is synchronously uploaded system center, after detection, tray transfer module distributes corresponding conveying module, sorting module is sorted according to instruction, finally each tray is sent to good, defect etc. Corresponding storage component storage and upload information, realize cost reduction and efficiency increase, reduce labor intensity, adapt to mass production.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a chip tray-type appearance defect detection and sorting device. Background Technology

[0002] Chips are the core components of electronic devices, also known as microchips or integrated circuits. They are made of semiconductor materials such as silicon and are made by integrating millions to billions of electronic components such as transistors and resistors onto a tiny wafer through precision processes such as photolithography and etching. Chips are responsible for key tasks such as computing, storage, and signal processing. From small mobile phones and watches to large automobiles and spacecraft, everything is inseparable from the support of chips.

[0003] Due to the extremely precise structure and tiny size of chips (often measured in nanometers), they are prone to appearance defects during the manufacturing process due to environmental impurities and process deviations. These defects include surface scratches, cracks, stains, pin deformation, and encapsulation bubbles. These defects can lead to short circuits, performance degradation, or even complete failure of the chip. Therefore, appearance defect detection is a critical aspect of chip quality control.

[0004] In existing technologies, semiconductor particles (chips) need to undergo appearance defect detection during the production process. Based on the detection results, defective semiconductor particles (chips) are picked out. However, existing technologies mostly rely on manual observation with microscopes and manual sorting. This method is labor-intensive, has low production efficiency, and manual sorting is prone to errors, which is not conducive to mass production. Utility Model Content

[0005] The purpose of this invention is to solve the problem that in the existing technology, semiconductor particles (chips) need to be inspected for appearance defects during the production process, and defective semiconductor particles (chips) are picked out according to the inspection results. However, in the existing technology, manual observation with a microscope and manual sorting are often used. This method is labor-intensive, has low production efficiency, and is prone to sorting errors, which is not conducive to mass production.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a chip tray-type appearance defect detection and sorting device, comprising: a workbench, wherein the top of the workbench is fixedly installed from left to right with a feeding tray conveying module, a feeding tray storage component, a good product tray conveying module, a bottom defect tray conveying module, a good product tray storage component, a screen-printed surface defect tray conveying module, a screen-printed surface defect tray storage component, a bottom defect tray storage component, and a buffer tray conveying module; a bottom AOI detection component is fixedly installed on the top of the workbench near the feeding tray conveying module; a semiconductor particle sorting module and a tray transfer module are fixedly installed from front to back on the top of the workbench; an AOI detection and material handling module is fixedly installed on the top of the workbench near the semiconductor particle sorting module; an electrostatic eliminator is fixedly connected to one side of the semiconductor particle sorting module; and a screen-printed surface AOI detection module is fixedly installed on one side of the semiconductor particle sorting module.

[0007] Preferably, the feeding pallet storage assembly includes a fixing plate, which is fixedly installed at the bottom of the feeding pallet conveying module. Each of the four corners of the fixing plate is slidably connected with a discharge lifting guide rod, and a lifting plate is fixedly installed at one end of each of the two discharge lifting guide rods.

[0008] Preferably, a second fixing plate is fixedly installed at the other end of the plurality of discharge lifting guide rods, and a cylinder is fixedly installed on the opposite side of the second fixing plate and the first fixing plate.

[0009] Preferably, two mounting blocks are symmetrically fixedly installed on both sides of the top of the feeding pallet conveying module. A support block is rotatably connected to one side of the mounting block via a support rod. The bottom of the support block is provided with an inclined surface. A torsion spring is fixedly installed on the opposite side of the support block and the mounting block.

[0010] Preferably, a front baffle is fixedly installed on the top of the feeding pallet conveying module, and two rear baffles are symmetrically fixedly installed on the top of the feeding pallet conveying module.

[0011] Preferably, a photoelectric sensor is fixedly installed on one of the rear baffles near the top.

[0012] Compared with the prior art, the advantages and positive effects of this utility model are as follows: This invention involves manually loading stacked palletized materials into a feeding pallet storage component, which then conveys them to an AOI (Automated Optical Inspection) detection and material handling module. This module adsorbs semiconductor particles and sequentially performs AOI inspections on the bottom and silkscreened surfaces. The data is simultaneously uploaded to the system center. After inspection, the pallet transfer module sends the materials to the corresponding conveying module, and the sorting module sorts them according to instructions. Finally, each pallet is sent to the corresponding storage component for good or defective products, and the information is uploaded. This invention achieves cost reduction and efficiency improvement, reduces labor intensity, and is suitable for mass production.

[0013] This invention involves a pallet conveying module that delivers a pallet to the discharge position. The controller then drives a cylinder to retract, causing the fixed plate and discharge lifting guide rod to rise. The lifting plate then lifts the pallet, bringing it into contact with and pushing against the inclined surface of the support block. This causes the support block to rotate and the torsion spring to twist. Once the pallet's thrust disappears, the torsion spring resets, causing the support block to rotate back to its initial position. The controller then controls the cylinder to extend, causing the discharge lifting guide rod and lifting plate to fall back down. The pallet remains on the support block. When the full-material photoelectric sensor detects a signal, it indicates that the storage bin is full, enabling automatic pallet storage and effectively improving the automation level of the equipment. Attached Figure Description

[0014] Figure 1 A front view structural diagram of a chip tray-type appearance defect detection and sorting device provided by this utility model; Figure 2 A schematic diagram of the rear side structure of a chip tray-type appearance defect detection and sorting device provided by this utility model; Figure 3 A side view of the feeding tray storage component of a chip tray-type appearance defect detection and sorting device provided by this utility model; Figure 4 This utility model provides a chip tray-type appearance defect detection and sorting device. Figure 3 Enlarged structural diagram at point A in the middle; Figure 5 A bottom view of the feed tray storage component of a chip tray-type appearance defect detection and sorting device provided by this utility model.

[0015] Legend: 1. Feeding pallet conveying module; 2. Feeding pallet storage assembly; 201. Fixing plate one; 202. Discharge lifting guide rod; 203. Fixing plate two; 204. Lifting pallet; 205. Front baffle; 206. Rear baffle; 207. Photoelectric sensor; 208. Mounting block; 209. Support block; 210. Cylinder; 3. Good product pallet conveying module; 4. Bottom defective pallet conveying module; 5. Good product pallet storage assembly; 6. Screen-printed surface defective pallet conveying module; 7. Bottom defective pallet storage assembly; 8. Buffer pallet conveying module; 9. Semiconductor particle sorting module; 10. Static eliminator; 11. Pallet transfer module; 12. Screen-printed surface AOI inspection module; 13. Bottom AOI inspection assembly; 14. AOI inspection material handling module. Detailed Implementation

[0016] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0017] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0018] Examples, such as Figure 1 - Figure 5 As shown, this utility model provides a chip tray-type appearance defect detection and sorting device, including: a workbench, on the top of the workbench, from left to right, a feeding tray conveying module 1, a feeding tray storage component 2, a good product tray conveying module 3, a bottom defect tray conveying module 4, a good product tray storage component 5, a screen-printed surface defect tray conveying module 6, a screen-printed surface defect tray storage component, a bottom defect tray storage component 7, and a buffer tray conveying module 8 are fixedly installed; a bottom AOI detection component 13 is fixedly installed on the top of the workbench near the feeding tray conveying module 1; on the top of the workbench, from front to back, a semiconductor particle sorting module 9 and a tray transfer module 11 are fixedly installed; an AOI detection and material handling module 14 is fixedly installed on the top of the workbench near the semiconductor particle sorting module 9; an electrostatic eliminator 10 is fixedly connected to one side of the semiconductor particle sorting module 9; a screen-printed surface AOI detection module 12 is fixedly installed on one side of the semiconductor particle sorting module 9; the feeding tray storage component 2 is used to store the trays to be tested; and the feeding tray conveying module 1 is used to... The pallet is conveyed to the AOI inspection and picking module 14. The AOI inspection and picking module 14 works with the robot to pick up and transport the semiconductor particles in the pallet. The bottom AOI inspection component 13 is used to detect the bottom information of the semiconductor particles and upload the data. The screen printing surface AOI inspection module 12 is used to detect the screen printing surface information of the semiconductor particles and upload the data. The pallet transfer module 11 works with the robot to transfer the pallets to the corresponding conveying modules. The good product pallet conveying module 3 is used to convey the pallet containing good semiconductor particles. The bottom defect pallet conveying module 4 is used to convey the pallet containing bottom defect semiconductor particles. The screen printing surface defect pallet conveying module 6 is used to convey the pallet containing screen printing surface defect semiconductor particles. The buffer pallet conveying module 8 is used to convey the pallet containing sorting and transfer semiconductor particles. The semiconductor particle sorting module 9 works with the robot to classify semiconductor particles. The good product pallet storage component 5 is used to store good products. The bottom defect pallet storage component 7 is used to store bottom defect products. The screen printing surface defect pallet storage component is used to store screen printing surface defect products.

[0019] Furthermore, such as Figure 1 - Figure 5 As shown, the feeding pallet storage assembly 2 includes a fixing plate 201, which is fixedly installed at the bottom of the feeding pallet conveying module 1. Each of the four corners of the fixing plate 201 is slidably connected to a discharge lifting guide rod 202. One end of each of the two discharge lifting guide rods 202 is fixedly installed with a lifting plate 204. With the above configuration, the discharge lifting guide rods 202 can drive the lifting plate 204 to move upward and lift the pallet.

[0020] Furthermore, such as Figure 1 - Figure 5 As shown, a fixing plate 203 is fixedly installed at the other end of multiple discharge lifting guide rods 202. A cylinder 210 is fixedly installed on the opposite side of the fixing plate 203 and the fixing plate 1 201. The cylinder 210 is controlled by the controller to retract, so that it drives the fixing plate 203 and the discharge lifting guide rods 202 to rise.

[0021] Furthermore, such as Figure 1 - Figure 5 As shown, two mounting blocks 208 are symmetrically fixedly installed on both sides of the top of the feeding pallet conveying module 1. A support block 209 is rotatably connected to one side of the mounting block 208 via a support rod. The bottom of the support block 209 is provided with an inclined surface. A torsion spring is fixedly installed on the opposite side of the support block 209 and the mounting block 208. By making the pallet contact the inclined surface of the support block 209 and pushing it, the support block 209 rotates, and the torsion spring is twisted simultaneously. When the pushing force of the pallet on the support block 209 disappears, the support block 209 can be rotated in the opposite direction and returned to the initial position by the reset force of the torsion spring.

[0022] Furthermore, such as Figure 1 - Figure 5 As shown, a front baffle 205 is fixedly installed on the top of the feeding pallet conveying module 1, and two rear baffles 206 are symmetrically fixedly installed on the top of the feeding pallet conveying module 1. The front baffle 205 and the rear baffle 206 facilitate the front, rear, left and right limit of the pallet.

[0023] Furthermore, such as Figure 1 - Figure 5 As shown, a photoelectric sensor 207 is fixedly installed on one of the rear baffles 206 near the top. The photoelectric sensor 207 can detect whether the pallet in the hopper is full.

[0024] Working principle: During use, materials on stacked pallets are manually placed into the feeding pallet storage component 2. The feeding pallet storage component 2 then unloads the pallets onto the feeding pallet conveying module 1. The feeding pallet conveying module 1 transports the pallets to the AOI detection and picking module 14. The AOI detection and picking module 14 picks up the semiconductor particles from the pallet and transports them to the bottom AOI detection component 13. The AOI detection system detects the bottom information of the semiconductor particles and uploads the data to the system center. After the detection is completed, the AOI detection and picking module 14 puts the semiconductor particles back onto the pallet. After the bottom inspection of the entire tray is completed, the feeding tray conveyor module 1 then conveys the tray to the screen printing surface AOI inspection module 12. The AOI inspection system will detect the screen printing information of the semiconductor particles and upload the data to the system center. After the inspection is completed, the tray transfer module 11 will transfer the tray to the good product tray conveyor module 3, the bottom defect tray conveyor module 4, the screen printing surface defect tray conveyor module 6, and the buffer tray conveyor module 8, respectively. The semiconductor particle sorting module 9 will sort according to the instructions from the system center. After sorting is completed, each conveyor module will convey the tray to the good product tray. The storage component 5, the bottom defect tray storage component 7, and the screen printing defect tray storage component store and upload information to the system center for inspection, thereby saving labor costs, reducing the labor intensity of workers, improving production efficiency, and facilitating mass production. The tray is transported to the discharge position by the infeed tray conveyor module 1. At this time, the controller controls the cylinder 210 to retract, which drives the fixed plate 203 and the discharge lifting guide rod 202 to rise. The discharge lifting guide rod 202 drives the lifting plate 204 to move upward, lifting the tray so that the tray is aligned with the inclined surface of the support block 209. The pallet contacts and pushes, causing the support block 209 to rotate. Simultaneously, the torsion spring is twisted. When the pushing force of the pallet on the support block 209 disappears, the support block 209 can be rotated in the opposite direction and returned to its initial position by the reset force of the torsion spring. Then, the controller controls the cylinder 210 to extend, driving the discharge lifting guide rod 202 and the lifting plate 204 to fall back, leaving the pallet on the support block 209 until the full material photoelectric sensor 207 detects it, indicating that the hopper is full. This allows for automatic storage of the pallet, thereby improving the automation level of the equipment.

[0025] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the present utility model.

Claims

1. A chip tray-type appearance defect detection and sorting device, characterized in that, include: The workbench is provided with the following components fixedly installed on its top from left to right: a feeding pallet conveying module (1), a feeding pallet storage component (2), a good product pallet conveying module (3), a bottom defect pallet conveying module (4), a good product pallet storage component (5), a screen printing surface defect pallet conveying module (6), a screen printing surface defect pallet storage component, a bottom defect pallet storage component (7), and a buffer pallet conveying module (8). The bottom AOI detection component (13) is fixedly installed on the top of the workbench near the feeding pallet conveying module (1). The semiconductor particle sorting module (9) and the pallet transfer module (11) are fixedly installed on the top of the workbench from front to back. The AOI detection picking module (14) is fixedly installed on the top of the workbench near the semiconductor particle sorting module (9). An electrostatic eliminator (10) is fixedly connected to one side of the semiconductor particle sorting module (9). The screen printing surface AOI detection module (12) is fixedly installed on one side of the semiconductor particle sorting module (9).

2. The chip tray-type appearance defect detection and sorting device according to claim 1, characterized in that: The feeding pallet storage assembly (2) includes a fixing plate (201), which is fixedly installed at the bottom of the feeding pallet conveying module (1). Each of the four corners of the fixing plate (201) is slidably connected with a discharge lifting guide rod (202), and a lifting plate (204) is fixedly installed at one end of each of the two discharge lifting guide rods (202).

3. The chip tray-type appearance defect detection and sorting device according to claim 2, characterized in that: The other end of the plurality of discharge lifting guide rods (202) is fixedly installed with a second fixing plate (203), and a cylinder (210) is fixedly installed on the opposite side of the second fixing plate (203) and the first fixing plate (201).

4. The chip tray-type appearance defect detection and sorting device according to claim 3, characterized in that: The top of the feeding pallet conveying module (1) has two mounting blocks (208) fixedly installed symmetrically on both sides. One side of the mounting block (208) is rotatably connected to a support block (209) via a support rod. The bottom of the support block (209) is provided with an inclined surface. A torsion spring is fixedly installed on the opposite side of the support block (209) and the mounting block (208).

5. The chip tray-type appearance defect detection and sorting device according to claim 4, characterized in that: The top of the feeding pallet conveying module (1) is fixedly installed with a front baffle (205), and the top of the feeding pallet conveying module (1) is symmetrically fixedly installed with two rear baffles (206).

6. The chip tray-type appearance defect detection and sorting device according to claim 5, characterized in that: A photoelectric sensor (207) is fixedly installed on one of the rear panels (206) near the top.

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