A constant temperature water bath shaking device

Abstract

The application relates to a constant-temperature water bath oscillation device, and relates to the technical field of silicon wafer cleaning equipment.The device comprises a machine body, an oscillation mechanism and a water bath tank arranged in the machine body; a clamping assembly for fixing a silicon wafer is arranged in the water bath tank; the oscillation mechanism is connected with the clamping assembly and is used for driving the clamping assembly to reciprocate in the water bath tank; the machine body is further provided with a spraying cover and a circulating pump; the circulating pump is connected with the spraying cover and the water bath tank through pipelines to form a circulating loop. The clamping assembly is used for fixing the silicon wafer, so that displacement or inclination of the silicon wafer in the cleaning process is avoided, the thoroughness of cleaning is ensured, damage and pollution are avoided, reciprocating movement of the oscillation mechanism and design of the spraying cover and the circulating loop ensure that water flow uniformly covers the surface of the silicon wafer, dead angles are reduced, the cleaning effect and efficiency are improved, the device can clean multiple silicon wafers at the same time, work efficiency and space utilization are improved, and energy consumption is effectively reduced.

Description

Technical Field

[0001] This application relates to the field of silicon wafer cleaning equipment technology, and in particular to a constant temperature water bath oscillation device. Background Technology

[0002] A constant-temperature water bath shaker is an experimental device that combines water bath heating with mechanical oscillation principles. It is widely used in biochemical fields such as cell culture, genetic engineering, drug development, nanomaterial synthesis, and food fermentation. Its main function is to provide a stable temperature-controlled environment for experiments by adjusting the water bath temperature and oscillation frequency. With advancements in microelectronics technology, modern constant-temperature water bath shakers have integrated microprocessors, enabling them to control temperature and oscillation parameters. They also feature a modular, partitioned design, making them indispensable equipment in industrial production.

[0003] However, while existing constant-temperature water bath oscillators perform well in basic experiments, they still have limitations in certain industry applications. For example, the silicon wafer cleaning process in the photovoltaic industry has high equipment requirements. During the cleaning process, the silicon wafers need to maintain a stable position in the water bath oscillation to ensure cleaning uniformity and efficiency, but existing constant-temperature water bath oscillators struggle to achieve this goal. Furthermore, the water bath space in existing equipment is not fully utilized, resulting in insufficient process adaptability and impacting production efficiency.

[0004] Therefore, there is an urgent need for a new constant temperature water bath oscillator to solve the problems of poor wafer fixation and insufficient space utilization during the silicon wafer cleaning process, improve the adaptability and ease of operation of the equipment, and thus meet the high standard requirements of modern production processes. Utility Model Content

[0005] To address the problems of unstable silicon wafer fixation, low space utilization, and uneven cleaning in existing technologies, this application provides a constant temperature water bath oscillation device.

[0006] The constant temperature water bath oscillation device provided in this application adopts the following technical solution: A constant temperature water bath oscillation device includes a body, an oscillation mechanism, and a water bath tank disposed within the body. The water bath tank is provided with a clamping assembly for fixing silicon wafers. The oscillation mechanism is connected to the clamping assembly and is used to drive the clamping assembly to reciprocate within the water bath tank. The body is also provided with a spray cover and a circulation pump. The circulation pump is connected to the spray cover and the water bath tank through a pipeline to form a circulation loop.

[0007] By adopting the above technical solution and the design of the clamping component, the silicon wafers are firmly fixed during the cleaning process, preventing displacement or tilting due to vibration or water flow impact. This avoids incomplete cleaning, damage, or contamination caused by silicon wafer instability, improving the reliability and stability of the cleaning process. Simultaneously, it allows multiple silicon wafers to be cleaned simultaneously in the same water bath, improving equipment efficiency and effectively increasing the space utilization of the water bath, reducing equipment size and energy consumption. During the cleaning process, the vibration mechanism drives the clamping component in reciprocating motion, ensuring the silicon wafer surface is evenly washed by the water flow, guaranteeing uniformity and effectiveness. The design of the spray cover and circulation loop allows the cleaning solution to more evenly cover the silicon wafer surface, reducing dead zones and preventing incomplete cleaning in certain areas, thereby improving cleaning efficiency and quality.

[0008] In one specific implementation, the clamping assembly includes multiple sets of clamping arms, each set of clamping arms being connected to the oscillation mechanism. Each set of clamping arms has multiple clamping slots, and the silicon wafer is detachably inserted into the clamping slots.

[0009] By adopting the above technical solution, and through the design of multiple clamping arms and clamping slots, multiple sets of silicon wafers can be cleaned efficiently at the same time, thereby improving space utilization efficiency and equipment working efficiency. The clamping slot design of the clamping components can not only clamp silicon wafers, but also support quick disassembly and replacement. Users can adjust the number and configuration of silicon wafers according to cleaning needs, thereby improving the flexibility and ease of operation of the equipment.

[0010] In one specific implementation, the machine body is provided with a through movable cavity, and the oscillation mechanism includes an oscillation frame assembly and a motor and a lead screw disposed in the movable cavity. The output end of the motor is connected to the lead screw, and a slider is threadedly connected to the lead screw. One side of the oscillation frame assembly is connected to the slider, and the other side is connected to the clamping arm assembly.

[0011] By adopting the above technical solution, and utilizing the designed lead screw and slider transmission system, as well as the cooperation between the oscillating frame assembly and the clamping arm assembly, a highly efficient and uniform cleaning effect can be achieved. The synergistic effect of the lead screw and the motor ensures that the slider can move stably along the axial direction, driving the oscillating frame assembly to perform orderly oscillating motion, thereby making the clamping arm assembly oscillate synchronously, ensuring that the clamped silicon wafer remains in a stable state throughout the entire cleaning process.

[0012] In one specific implementation, the oscillation frame assembly includes: The horizontal connecting part is fixed to the slider; A transition extension extends from the active cavity and along the outer wall of the machine body; The vertical transmission part extends into the water bath and connects to the clamping arm assembly.

[0013] By adopting the above technical solution, the coordinated work of the horizontal connecting part, the transition extension part and the vertical transmission part enables the entire oscillation frame assembly to accurately transmit motion and realize oscillation action.

[0014] In one specific implementation, the clamping arm assembly is detachably connected to the oscillating frame assembly.

[0015] By adopting the above technical solution, when it is necessary to replace the clamping arm assembly for cleaning or maintenance, the operator only needs to easily disassemble the connection between the clamping arm assembly and the vibration frame assembly. The disassembled clamping arm assembly can be cleaned or repaired separately, and it is convenient to detect and replace any clamping arm assembly parts that may be worn or damaged.

[0016] In one specific implementation, the spray cover covers the top of the opening of the water bath, and the spray cover is provided with a plurality of spray nozzles.

[0017] By adopting the above technical solution, the design of the spray cover and spray nozzles enables the cleaning liquid to evenly cover the entire silicon wafer surface, ensuring that every part of the silicon wafer is thoroughly cleaned, improving cleaning quality and efficiency. The number and layout of the spray nozzles can be adjusted according to the shape of the silicon wafer and cleaning requirements to further optimize the spraying effect.

[0018] In one specific implementation, a control unit is also included, which is electrically connected to the circulating pump and the oscillation mechanism.

[0019] By adopting the above technical solution, the intelligent adjustment and control of the working state of the circulation pump and the oscillation mechanism of the control unit can automatically adjust the cleaning mode according to the cleaning needs of different silicon wafers. This not only improves the cleaning efficiency, but also optimizes the cleaning effect according to the different materials and degree of contamination of the silicon wafers, avoiding over- or under-cleaning.

[0020] In one specific implementation, the water bath is equipped with a heating module and a temperature sensor, both of which are electrically connected to the control unit.

[0021] By adopting the above technical solution, the temperature of the water bath can be adjusted by combining the heating module and the temperature sensor to ensure that the cleaning solution is always within the ideal temperature range, thereby improving the cleaning effect. When the temperature is suitable, the stains are easier to dissolve and remove, thus shortening the cleaning time and improving the cleaning efficiency.

[0022] In one specific implementation, the water bath is provided with a drain outlet, and a solenoid valve is provided at the drain outlet, the solenoid valve being electrically connected to the control unit.

[0023] By adopting the above technical solution, the combination of solenoid valve and control unit realizes the automated drainage function, reduces manual intervention, and users only need to set the drainage conditions or time, and the system can automatically complete the drainage process, improving the convenience of operation.

[0024] In one specific implementation, the control unit includes a button switch, a touch screen interface, and a controller integrated on the touch screen interface. The button switch is used to control the opening and closing of the circulating pump, the oscillation mechanism, and the heating module, and the touch screen interface is used to set and display operating parameters.

[0025] By adopting the above technical solution, users can quickly and directly control the opening and closing of the circulation pump, oscillation mechanism and heating module through button switches, simplifying the operation steps; at the same time, the touch screen operation interface provides intuitive parameter settings and display, improving the convenience of equipment operation. Users can quickly adjust working conditions through a simple touch interface without the need for cumbersome physical control or complex operations.

[0026] In summary, the beneficial technical effects of this application are as follows: The device improves the cleaning effect and efficiency of silicon wafers through the effective coordination of innovative clamping component design, oscillation mechanism, spray cover, and water circulation system; the clamping component ensures the silicon wafers are firmly fixed, preventing displacement or tilting during cleaning, thus guaranteeing the stability of the silicon wafers during the cleaning process; the oscillation mechanism and water circulation system work together to ensure that the water flow evenly covers the surface of the silicon wafers, eliminating dead corners and further improving the uniformity and quality of cleaning; simultaneously, the equipment supports simultaneous cleaning of multiple silicon wafers, optimizing space utilization and reducing energy consumption. In addition, the equipment is equipped with an automated control system and a user-friendly interface. Users can adjust and display cleaning parameters via the touch screen, and flexibly adjust the oscillation amplitude, frequency, and water circulation intensity. At the same time, the push-button switches make the start and stop control of each component easier. The entire cleaning process can be optimized and adjusted according to different needs, reducing manual intervention and improving ease of operation. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of the constant temperature water bath oscillation device according to an embodiment of this application.

[0028] Figure 2 It is a cross-sectional view used to show the internal structure of a constant temperature water bath oscillation device.

[0029] Explanation of reference numerals in the attached drawings: 1. Body; 11. Water bath; 12. Movable cavity; 13. Drain outlet; 2. Vibration mechanism; 21. Motor; 22. Lead screw; 23. Slider; 24. Vibration frame assembly; 241. Horizontal connection part; 242. Transition extension part; 243. Vertical transmission part; 3. Clamping assembly; 31. Clamping arm assembly; 4. Spray cover; 41. Spray nozzle; 5. Circulation pump; 51. Water outlet pipe; 52. Water inlet pipe; 6. Silicon wafer; 7. Control unit; 71. Touch screen operation interface; 72. Button switch; 8. Heating module; 9. Temperature sensor. Detailed Implementation

[0030] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.

[0031] Reference Figure 1 and Figure 2 This application discloses a constant temperature water bath oscillation device, including but not limited to applications in silicon wafer cleaning operations in the photovoltaic industry.

[0032] The constant temperature water bath oscillation device includes a body 1, an oscillation mechanism 2, and a water bath 11 inside the body 1. The water bath 11 serves as the main working area, used to carry the cleaning liquid and hold the silicon wafer 6 to be cleaned. The water bath 11 is equipped with a clamping component 3, which can effectively clamp and fix the silicon wafer 6, preventing the silicon wafer 6 from shifting or tilting under the impact of water flow and oscillation. The oscillation mechanism 2 is connected to the clamping assembly 3. The oscillation mechanism 2 is used to drive the clamping assembly 3 to reciprocate within the water bath 11, thereby achieving oscillation motion. The oscillation motion can simulate the cleaning effect of physical oscillation, so that the surface of the silicon wafer 6 can be cleaned evenly under the scouring of water flow, ensuring that every area of ​​the surface of the silicon wafer 6 is affected by the water flow, and ensuring the comprehensive cleanliness of the surface of the silicon wafer 6. The machine body 1 is also equipped with a spray cover 4 and a circulation pump 5. The circulation pump 5 is connected to the spray cover 4 and the water bath 11 through a pipeline to form a circulation loop. In this embodiment, the water outlet of the circulation pump 5 is connected to the spray cover 4 through the water outlet pipe 51, and the water inlet of the circulation pump 5 is connected to the water bath 11 through the water inlet pipe 52. The circulation pump 5 includes, but is not limited to, a vacuum self-priming pump, which can maintain a stable water flow and pressure during the cleaning process to ensure that the cleaning liquid is evenly sprayed onto the surface of the silicon wafer 6. The spray cover 4 is located at the top of the opening of the water bath 11 and is designed to cover the entire working area of ​​the water bath 11. The spray cover 4 has several spray nozzles 41 evenly distributed. The number and layout of the spray nozzles 41 can be adjusted according to the shape of the silicon wafer 6 and the cleaning requirements to ensure that the cleaning liquid can fully cover the surface of the silicon wafer 6.

[0033] During the cleaning process, the user places the silicon wafer 6 on the clamping assembly 3 in the water bath 11 and secures the silicon wafer 6 firmly with the clamping assembly 3. After the circulation pump 5 is started, water is continuously drawn and delivered to the spray cover 4. The spray nozzle 41 sprays the cleaning solution evenly onto the surface of the silicon wafer 6, ensuring that each silicon wafer 6 can be cleaned evenly. At the same time, the oscillation mechanism 2 is started, driving the clamping assembly 3 to reciprocate, so that the silicon wafer 6 generates a movement similar to physical oscillation in the water bath 11, thereby ensuring that the water flow is evenly rinsed onto the surface of the silicon wafer 6, achieving thorough cleaning. During this process, through the continuous extraction of the circulating pump 5 and the close cooperation of the spray system, the cleaning fluid can be effectively recovered within the equipment, reducing the consumption of cleaning fluid and saving water resources. In addition, the implementation of oscillation motion ensures the uniformity of cleaning, avoiding localized insufficient cleaning due to uneven water flow, thereby reducing cleaning time and improving production efficiency.

[0034] In this embodiment, the body 1 has a through-cavity 12 along its length, which is located at the bottom of the water bath 11. The oscillation mechanism 2 includes an oscillation frame assembly 24 and a motor 21 and a lead screw 22 located in the through-cavity 12. The output end of the motor 21 is connected to the lead screw 22, and the other end of the lead screw 22 is rotatably mounted on the inner wall of the through-cavity 12. The lead screw 22 is horizontally arranged along the length of the through-cavity 12. A slider 23 is threadedly connected to the lead screw 22. The slider 23 slides along the inner bottom wall of the through-cavity 12 and abuts against it. Multiple sets of oscillation frame assemblies 24 can be installed on the slider 23. One side of the oscillation frame assembly 24 is connected to the slider 23, and the other side is connected to the clamping mechanism. The efficient and uniform cleaning effect is achieved through the transmission system of lead screw 22 and slider 23, as well as the cooperation of oscillation frame assembly 24 and clamping arm assembly 31. The synergistic effect of lead screw 22 and motor 21 ensures that slider 23 can move stably along the axial direction, driving oscillation frame assembly 24 to perform orderly oscillation, thereby making the clamping mechanism oscillate synchronously, ensuring that the clamped silicon wafer 6 remains stable throughout the cleaning process. During cleaning, the oscillation amplitude and frequency can be flexibly adjusted by adjusting the speed of motor 21 and the thread structure of lead screw 22, and the oscillation intensity can be adjusted according to different cleaning needs to optimize the cleaning effect.

[0035] The clamping assembly 3 includes multiple sets of clamping arms 31, each corresponding to and connected to the oscillation frame assembly 24. In this embodiment, one set of clamping arms 31 and one set of oscillation frame assembly 24 are used as an example. In other implementations, there are multiple sets of clamping arms 31 and oscillation frame assembly 24. The clamping arms 31 and the oscillation frame assembly 24 are detachably connected. In this embodiment, the clamping arms 31 and the oscillation frame assembly 24 are connected by, but not limited to, snap-fit ​​connections, bolt connections, etc. This allows the clamping arms 31 to be easily disassembled for cleaning or maintenance, reducing equipment downtime and facilitating the detection and replacement of potentially worn or damaged clamping arms 31 components. In this embodiment, each clamping arm assembly 31 is provided with multiple clamping slots. The silicon wafer 6 is detachably inserted into the clamping slots. The silicon wafer 6 can be inserted into the corresponding clamping slots according to its size and quantity, ensuring that the silicon wafer 6 is firmly fixed and not easily displaced. The clamping arm assembly 31 can stably clamp the silicon wafer 6 through its structural design, ensuring that it remains stable during the cleaning process. Through the design of multiple clamping arm assemblies 31 and clamping slots, multiple sets of silicon wafers 6 can be cleaned efficiently at the same time, thereby improving the space utilization efficiency and the working efficiency of the equipment.

[0036] In this embodiment, the oscillation frame assembly 24 includes a horizontal connecting part 241, a transition extension part 242, and a vertical transmission part 243. The horizontal connecting part 241 is fixed to the slider 23 and moves synchronously with the slider 23. The transition extension part 242 extends out of the movable cavity 12 and extends along the outer wall of the machine body 1, transmitting the movement of the slider 23 to the vertical transmission part 243 in the water bath 11, while avoiding the impact on the internal space of the machine body 1 during the movement. The vertical transmission part 243 extends into the water bath 11 and connects with the corresponding clamping arm assembly 31, so that the oscillation frame assembly 24 can realize left and right oscillation movement in the water bath 11. This movement drives the clamping arm assembly 31 to vibrate synchronously, thereby effectively cleaning the clamped silicon wafer 6.

[0037] The constant temperature water bath oscillation device also includes a control unit 7, which is electrically connected to the circulation pump 5 and the oscillation mechanism 2. The intelligent adjustment of the control unit 7 can control the working state of the circulation pump 5 and the oscillation mechanism 2, and automatically adjust the cleaning mode according to the cleaning needs of different silicon wafers 6. This not only improves the cleaning efficiency, but also optimizes the cleaning effect according to the different materials and degree of dirt on the silicon wafers 6, avoiding over- or under-cleaning.

[0038] Based on this, the water bath 11 is also equipped with a heating module 8 and a temperature sensor 9. Both the heating module 8 and the temperature sensor 9 are electrically connected to the control unit 7. In this embodiment, the heating module 8 includes, but is not limited to, an electric heating tube. The temperature sensor 9 monitors the temperature of the cleaning liquid in the water bath 11 in real time and feeds the temperature data back to the control unit 7. The control unit 7 automatically adjusts the working state of the heating module 8 according to the feedback signal from the temperature sensor 9 and the cleaning temperature set by the user. When the temperature in the water bath 11 is lower than the set value, the control unit 7 will start the heating module 8 to increase the temperature. When the temperature reaches the set range, the control unit 7 will stop the operation of the heating module 8 to ensure temperature stability.

[0039] In a specific implementation, the control unit 7 includes a push-button switch 72, a touch screen interface 71, and a controller integrated on the touch screen interface 71. The controller is electrically connected to the circulating pump 5, the motor 21 of the oscillation mechanism 2, the heating module 8, and the temperature sensor 9. Multiple push-button switches 72 are provided to control the opening and closing of the circulating pump 5, the motor 21 of the oscillation mechanism 2, and the heating module 8, respectively. In this embodiment, the push-button switch 72 also includes a power switch to control the opening and closing of the entire device. The push-button switch 72 is easy to operate and can quickly respond to user needs to perform basic equipment opening and closing operations. The touchscreen interface 71 provides an intuitive user interaction platform. Users can set and display the operating parameters of the water bath 11 by touching the touchscreen interface 71, such as the operating speed of the circulation pump 5, the power and direction of the motor 21 of the oscillation mechanism 2 (to control the oscillation frequency and amplitude), and the temperature of the heating module 8. These settings can be adjusted through simple digital input, sliders, or preset options to ensure the efficient operation of the system. The push-button switch 72 and the touch screen interface 71 work together to form a user-friendly and efficient control system. Users first use the push-button switch 72 to turn each device (circulating pump 5, oscillation mechanism 2, heating module 8) on or off; then, they use the touch screen interface to adjust operating parameters (such as temperature, oscillation frequency, etc.) and monitor the operating status of the equipment in real time. The touch screen interface 71 and the push-button switch 72 complement each other, providing flexible control methods to meet different operating needs.

[0040] To further optimize the cleaning process, the water bath 11 is also equipped with a drain outlet 13 and a solenoid valve. The solenoid valve is electrically connected to the controller of the control unit 7. The solenoid valve is controlled to open and close by an electrical signal to ensure that the cleaning solution can be discharged in a timely manner after a period of use, maintaining the cleanliness of the liquid in the water bath 11. When the cleaning solution needs to be replaced, the user can send a signal to the solenoid valve through the controller (control unit 7), and the solenoid valve will open, and the cleaning solution will begin to drain from the water bath 11. Through the automatic drainage function, the user can set the drainage conditions or time, and the system will automatically complete the drainage process, avoiding manual intervention and improving the ease of operation.

[0041] The implementation principle of this application embodiment is as follows: Before operation, the user places the silicon wafer 6 to be cleaned on the clamping assembly 3 in the water bath 11. Specifically, the silicon wafer 6 is inserted into the clamping slots of the clamping arm assembly 31 in sequence to ensure that the silicon wafer 6 is firmly fixed and not easily displaced. The power is turned on by the button switch 72, and various working parameters in the cleaning process are set through the touch screen operation interface 71. Specifically, the power and speed of the circulation pump 5 are set to adjust the water flow rate and ensure that the scouring intensity of the water flow is suitable for different cleaning needs. The speed and direction of the motor 21 in the oscillation mechanism 2 are set to adjust the amplitude and frequency of the oscillation to achieve uniform cleaning of the surface of the silicon wafer 6. The heating temperature of the heating module 8 in the water bath 11 is set to adjust the heating temperature of the cleaning solution in the water bath 11. During cleaning, the heating module 8 is activated by the button switch 72. The heating tube of the heating module 8 heats according to the preset parameters. The temperature sensor 9 detects the temperature of the cleaning liquid in the water bath 11 in real time and feeds the data back to the controller of the control unit 7. The controller issues corresponding instructions to the heating module 8 based on the temperature data to ensure that the temperature is within the set temperature range and that the cleaning process is carried out at a constant temperature. The circulation pump 5 is activated by button switch 72, and water is drawn from the water bath 11 and transported through pipes to the spray cover 4. The spray nozzle 41 sprays the cleaning solution evenly onto the surface of the silicon wafer 6, ensuring that each silicon wafer 6 is fully rinsed by the water flow. During the cleaning process, the circulation pump 5 maintains the continuous circulation of the cleaning solution, allowing the cleaning solution to cover the surface of the silicon wafer 6 more evenly. At the same time, the motor 21 of the oscillation mechanism 2 is activated by button switch 72. The motor 21 drives the transmission system of the lead screw 22 and the slider 23, causing the clamping arm assembly 31 to oscillate back and forth in the water bath 11. The vibration of the silicon wafer 6 clamping arm assembly 31 simulates the cleaning effect of physical oscillation, so that the surface of the silicon wafer 6 can be evenly rinsed by the water flow. After cleaning is completed, the user can control the solenoid valve of the drain outlet 13 through the touch screen interface 71 on the control unit 7 to start the drainage program. The solenoid valve will automatically open and close according to the set conditions or time to discharge the cleaning liquid in the water bath 11. At this time, the drain outlet 13 will discharge the cleaning liquid to keep the water bath 11 clean so that the next round of cleaning operation can be carried out.

[0042] The constant temperature water bath oscillation device of this application ensures a uniform and thorough cleaning effect on the silicon wafer 6 by controlling the water flow and oscillation motion. The oscillation mechanism 2 inside the device works in conjunction with the clamping component 3 to simulate the cleaning effect of physical oscillation, so that the water flow evenly washes the surface of the silicon wafer 6, avoiding the problems of uneven cleaning or insufficient cleaning in some areas. The circulation pump 5 works in coordination with the spray cover 4 and the water bath 11, so that the cleaning solution can be effectively recycled within the system, reducing liquid waste and improving the utilization efficiency of water resources. In addition, the constant temperature water bath system ensures a constant temperature of the cleaning solution through a temperature control module, thereby improving the stability of the cleaning effect. Meanwhile, the intelligent adjustment function of the control unit 7 enhances the automation and ease of operation of the equipment. Users can flexibly adjust cleaning parameters, such as water flow rate, oscillation frequency and heating temperature, through the touch screen interface 71 and button switch 72 to meet the cleaning needs of different silicon wafers 6. The equipment is also equipped with an automatic drainage system, which can discharge the cleaning liquid according to the set conditions, further optimizing the efficiency and convenience of the cleaning process. This device not only improves the cleaning quality of silicon wafers 6, but also significantly improves production efficiency.

[0043] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A constant temperature water bath oscillation device, characterized in that: The device includes a body (1), an oscillation mechanism (2), and a water bath (11) located inside the body (1). The water bath (11) is provided with a clamping assembly (3) for fixing a silicon wafer (6). The oscillation mechanism (2) is connected to the clamping assembly (3) and is used to drive the clamping assembly (3) to reciprocate within the water bath (11). The body (1) is also provided with a spray cover (4) and a circulation pump (5). The circulation pump (5) is connected to the spray cover (4) and the water bath (11) through a pipeline to form a circulation loop.

2. The constant temperature water bath oscillation device according to claim 1, characterized in that: The clamping assembly (3) includes multiple sets of clamping arms (31), each set of clamping arms (31) is connected to the oscillation mechanism (2), and each set of clamping arms (31) is provided with multiple clamping slots, and the silicon wafer (6) can be detachably inserted into the clamping slots.

3. The constant temperature water bath oscillation device according to claim 2, characterized in that: The body (1) is provided with a through movable cavity (12). The oscillation mechanism (2) includes an oscillation frame assembly (24) and a motor (21) and a lead screw (22) located in the movable cavity (12). The output end of the motor (21) is connected to the lead screw (22). A slider (23) is threaded onto the lead screw (22). One side of the oscillation frame assembly (24) is connected to the slider (23), and the other side is connected to the clamping arm assembly (31).

4. The constant temperature water bath oscillation device according to claim 3, characterized in that: The oscillation frame assembly (24) includes: The horizontal connecting part (241) is fixed to the slider (23); A transition extension (242) extends out of the active cavity (12) and along the outer wall of the body (1); The vertical transmission part (243) extends into the water bath (11) and connects to the clamping arm assembly (31).

5. The constant temperature water bath oscillation device according to claim 3, characterized in that: The clamping arm assembly (31) is detachably connected to the oscillation frame assembly (24).

6. The constant temperature water bath oscillation device according to claim 1, characterized in that: The spray cover (4) covers the top of the opening of the water bath (11), and the spray cover (4) is provided with a plurality of spray nozzles (41).

7. The constant temperature water bath oscillation device according to claim 1, characterized in that: It also includes a control unit (7), which is electrically connected to the circulating pump (5) and the oscillation mechanism (2).

8. The constant temperature water bath oscillation device according to claim 7, characterized in that: The water bath (11) is equipped with a heating module (8) and a temperature sensor (9), both of which are electrically connected to the control unit (7).

9. The constant temperature water bath oscillation device according to claim 8, characterized in that: The control unit (7) includes a button switch (72), a touch screen operation interface (71), and a controller integrated on the touch screen operation interface (71). The button switch (72) is used to control the opening and closing of the circulation pump (5), the oscillation mechanism (2), and the heating module (8). The touch screen operation interface (71) is used to set and display operating parameters.

10. The constant temperature water bath oscillation device according to claim 7, characterized in that: The water bath (11) is provided with a drain outlet (13), and a solenoid valve is provided at the drain outlet (13). The solenoid valve is electrically connected to the control unit (7).

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