Ultrasonic cleaning device for silicon carbide wafer production

Abstract

The utility model relates to wafer cleaning equipment technical field discloses a kind of ultrasonic cleaning devices for silicon carbide wafer production, the device includes frame, cleaning assembly, clamping assembly, rotating mechanism and lifting mechanism;Frame is rectangular, inside is connected cleaning assembly by bolt, and cleaning assembly contains outer layer and inner layer;Clamping assembly is in the clamping disc lower end support link solid plate, upper end sliding groove link with clamping plate's support, clamping disc is provided with positioning hole, and there is spring's positioning pin in sliding support deep hole, and positioning pin is limited with the cooperation of positioning hole;Rotary motor output shaft of rotating mechanism link driving wheel, clamping disc link driven wheel, and driving wheel is connected with driven wheel by belt cooperation with the projection recess cooperation;Lifting plate side of lifting mechanism link support plate, other side link screw rod, screw rod bottom link rotating rod, rotating rod is connected drive motor by bevel gear set, and there is guide rod on both sides of screw rod;The device clamping is stable, and cleaning is comprehensive, and the efficiency and quality of silicon carbide wafer cleaning are improved.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer cleaning equipment, specifically an ultrasonic cleaning device for silicon carbide wafer production. Background Technology

[0002] In the silicon carbide wafer production process, ultrasonic cleaning is a key step to ensure the cleanliness of the wafer surface and the accuracy of subsequent processing.

[0003] A search revealed existing technology (application number: CN200410087733.X), which describes a "double-sided cleaning type ultrasonic jet cleaning device." This device supports semiconductor wafers with a bracket, completes the cleaning operation with the help of ultrasonic cleaning components, and uses the bracket's lifting mechanism to move the wafers in and out of the cleaning area. However, as silicon carbide wafer fabrication technology develops towards higher precision and multiple specifications, the clamping structure of the aforementioned existing technology relies solely on the bracket for simple support and lacks an adjustable limiting design to adapt to different wafer specifications. When faced with silicon carbide wafers of different sizes, it cannot achieve stable clamping, and wafer displacement and collisions are likely to occur during cleaning or transfer. Furthermore, the device does not have a wafer rotation mechanism, so the wafer remains in a fixed state during the cleaning process, and surface cleaning can only be achieved through the flow of the cleaning medium, which can easily lead to incomplete cleaning in certain areas. This makes it difficult to meet the stringent surface cleanliness requirements of high-precision silicon carbide wafer production.

[0004] Therefore, there is an urgent need for an ultrasonic cleaning device for silicon carbide wafer production that has an adjustable and stable clamping structure, wafer rotation function, and a precise lifting mechanism. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing an ultrasonic cleaning device for silicon carbide wafer production.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an ultrasonic cleaning device for silicon carbide wafer production, comprising a frame, the frame being rectangular and having a cleaning assembly internally connected by bolts, the cleaning assembly being used for cleaning the wafer, a lifting mechanism being connected to one side of the cleaning assembly, the lifting mechanism being used for picking up the wafer, the side of the lifting mechanism near the cleaning assembly being connected to the upper surface of a rotating mechanism, the rotating mechanism being used for rotating the wafer, the lower end of the rotating mechanism being connected to a clamping assembly, the clamping assembly being used for clamping the wafer, the cleaning assembly comprising an outer layer, the outer wall of the outer layer being connected to the inner wall of the frame, and an inner layer being placed inside the outer layer.

[0007] As a further description of the above technical solution:

[0008] The clamping assembly includes two clamping discs, with the lower ends of the clamping discs facing each other connected to both ends of the bracket. The upper surface of the bracket is connected to the lower end of the stabilizing plate. The upper ends of the clamping discs facing each other are slidably connected to both ends of the bracket via a sliding groove, and the lower surface of the bracket is connected to the upper end of the clamping plate.

[0009] As a further description of the above technical solution:

[0010] The clamping plate has multiple positioning holes on the side away from the slide groove. One end of the sliding bracket has a deep hole and a positioning pin slides in the hole. One end of the positioning pin is engaged with the positioning hole and the other end is connected to one end of a spring. The other end of the spring is connected to the bottom surface of the deep hole of the sliding bracket.

[0011] As a further description of the above technical solution:

[0012] The rotating mechanism includes a rotary motor, which is mounted on the upper surface of the support plate. The upper ends of the support arms are connected around the lower surface of the support plate. The lower ends of the support arms wrap around both sides of the clamping disc. The clamping disc, which is away from the positioning hole and away from the slide groove, is connected to the middle of the driven wheel.

[0013] As a further description of the above technical solution:

[0014] The output shaft of the rotary motor is connected to the drive wheel, and the drive wheel and the driven wheel are connected by a belt. The outer walls of the drive wheel and the driven wheel are provided with protrusions, and the inner wall of the belt is provided with grooves.

[0015] As a further description of the above technical solution:

[0016] The lifting mechanism includes a lifting box, which is disposed on one side of the outer wall and has a lifting plate at its upper end. The lower surface of one side of the lifting plate is connected to the upper surface of the support plate, and the other side of the lifting plate is connected to the upper end of a screw. The screw is threadedly connected to the inside of the lifting box and its bottom is slidably connected to the top of the rotating rod.

[0017] As a further description of the above technical solution:

[0018] The lower end of the rotating rod is connected to one side of the bevel gear set, and the other side of the bevel gear set is connected to the output shaft of the drive motor. Guide rods are provided on both sides of the screw. The upper end of the guide rod is connected to the lower surface of the lifting plate, and the other end slides inside the lifting box.

[0019] This utility model has the following beneficial effects:

[0020] 1. The clamping assembly of the device adopts a positioning pin and positioning hole matching structure. Pressing the positioning pin can flexibly adjust the position of the clamping plate. After releasing, the spring automatically pushes the positioning pin into the positioning hole to complete the limit. It can adapt to silicon carbide wafers of different specifications. During the clamping process, the wafer is fixed by the stabilizing plate and the clamping plate, avoiding displacement and collision during cleaning or lifting, effectively reducing the risk of wafer damage. It is especially suitable for the clamping needs of silicon carbide wafers with high brittleness.

[0021] Second, relying on the cooperation of the rotating mechanism and the cleaning components, the rotating motor drives the clamping disk to rotate the wafer during cleaning. The protrusions on the outer wall of the driving wheel and the driven wheel precisely engage with the grooves on the inner wall of the belt, ensuring stable transmission and uniform speed. This allows all surfaces of the wafer to fully contact the cleaning medium in the inner layer of the cleaning components, avoiding the problem of incomplete cleaning in some areas that exists in traditional fixed cleaning. This significantly improves the surface cleanliness of silicon carbide wafers and meets the stringent requirements of high-precision production for wafer cleanliness.

[0022] Third, the lifting mechanism uses a drive motor to drive a bevel gear set and a rotating rod linked to a screw to achieve smooth lifting of the lifting plate. The guide rods on both sides of the screw can effectively prevent deviation during the lifting process, ensuring that the wafers accurately enter and exit the inner layer of the cleaning component. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the working structure of this utility model;

[0024] Figure 2 This is a schematic diagram of the structure of the present invention when it is to be cleaned;

[0025] Figure 3 This is a schematic diagram of the clamping component structure of this utility model;

[0026] Figure 4 This is a partial exploded view of the clamping component of this utility model;

[0027] Figure 5 This is a cross-sectional view of the lifting mechanism structure of this utility model.

[0028] Legend:

[0029] 1. Frame; 2. Cleaning assembly; 3. Clamping assembly; 4. Rotating mechanism; 5. Lifting mechanism; 201. Outer layer; 202. Inner layer; 301. Clamping plate; 302. Stabilizing plate; 303. Clamping plate; 304. Positioning hole; 305. Positioning pin; 306. Spring; 401. Rotary motor; 402. Drive wheel; 403. Driven wheel; 404. Belt; 405. Support arm; 406. Support plate; 501. Lifting box; 502. Lifting plate; 503. Drive motor; 504. Bevel gear set; 505. Rotating rod; 506. Screw; 507. Guide rod. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0032] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] Example 1:

[0034] like Figures 1 to 5 As shown in the figure, this embodiment provides an ultrasonic cleaning device for silicon carbide wafer production, including a frame 1. The frame 1 is rectangular and internally connected to a cleaning assembly 2 via bolts. The cleaning assembly 2 is used for cleaning the wafer. One side of the cleaning assembly 2 is connected to a lifting mechanism 5, which is used for picking up the wafer. The side of the lifting mechanism 5 near the cleaning assembly 2 is connected to the upper surface of a rotating mechanism 4, which is used for rotating the wafer. The lower end of the rotating mechanism 4 is connected to a clamping assembly 3, which is used for clamping the wafer. The cleaning assembly 2 includes an outer layer 201. The outer wall of the outer layer 201 is connected to the inner wall of the frame 1, and an inner layer 202 is placed inside the outer layer 201.

[0035] In this embodiment, the cleaning component 2, the clamping component 3, the rotating mechanism 4, and the lifting mechanism 5 constitute an ultrasonic cleaning device for silicon carbide wafer production according to this application.

[0036] It should also be noted that the silicon carbide wafer in this application can be an N-type silicon carbide wafer, a P-type silicon carbide wafer, a semi-insulating silicon carbide wafer, etc. Figure 1 In this embodiment, an N-type silicon carbide wafer is used as an example for description. Of course, other types of silicon carbide wafers can also adopt a similar structure, which will not be described in detail below.

[0037] Understandable, Figure 1 The ultrasonic cleaning device is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1 Due to limitations, ultrasonic cleaning devices can also include, compared to... Figure 1 More or fewer parts.

[0038] In addition, in this embodiment, the outer layer 201 is made of stainless steel, and the inner layer 202 is made of polytetrafluoroethylene. A drain valve is provided at the bottom of the outer layer 201. The drain valve passes through the outer layer 201 and the inner layer 202 and a sealing ring is provided at the connection. The frame 1 serves as the overall support frame of the device, supporting the cleaning component 2, the clamping component 3, the rotating mechanism 4, and the lifting mechanism 5. The cleaning component 2 is fixed inside the frame 1 by bolts, so that each component forms an integral structure, ensuring that each component is installed stably and preventing the device from shaking during operation. The outer layer 201 of the cleaning component 2 prevents the cleaning medium from leaking, and the inner layer 202 prevents the cleaning medium from corroding, ensuring the stability of the cleaning process. The drain valve is used for replacing the cleaning fluid.

[0039] Specifically, the clamping assembly 3 includes a clamping disk 301, two clamping disks 301 are provided, and the lower end of the clamping disk 301 facing each other is connected to both ends of the bracket. The upper surface of the bracket is connected to the lower end of the stabilizing plate 302. The upper end of the clamping disk 301 facing each other is slidably connected to both ends of the bracket through a sliding groove, and the lower surface of the bracket is connected to the upper end of the clamping plate 303.

[0040] In this embodiment, the wafer is placed above the stabilizing plate 302, and the position of the bracket with the clamping plate 303 is adjusted by the sliding groove on the clamping plate 301 so that the clamping plate 303 covers the upper end of the wafer, thereby initially fixing the wafer, providing an upper and lower support structure for the wafer, initially restricting the wafer position, and laying the foundation for subsequent precise positioning.

[0041] Specifically, the clamping plate 301 has multiple positioning holes 304 on the side away from the slide groove, and a deep hole is provided at one end of the sliding bracket, with a positioning pin 305 sliding inside the hole. One end of the positioning pin 305 cooperates with the positioning hole 304 and the other end is connected to one end of the spring 306. The other end of the spring 306 is connected to the bottom surface of the deep hole of the sliding bracket.

[0042] As a preferred implementation, pressing the positioning pin 305 compresses the spring 306 and moves it away from the positioning hole 304. After adjusting the position of the sliding bracket, the spring 306 extends and pushes the positioning pin 305 into the positioning hole 304, thereby limiting the sliding bracket and fixing the position of the clamping plate 303. This adapts to wafers of different diameters, prevents wafer displacement during cleaning or lifting, and reduces the risk of damage.

[0043] Example 2:

[0044] A rotating mechanism 4 is provided based on embodiment 1.

[0045] Specifically, the rotating mechanism 4 includes a rotating motor 401, which is disposed on the upper surface of the support plate 406. The upper ends of the support arms 405 are connected around the lower surface of the support plate 406. The lower ends of the support arms 405 wrap around both sides of the clamping disk 301. The clamping disk 301, which is away from the positioning hole 304 and away from the slide groove, is connected to one side of the driven wheel 403.

[0046] In this embodiment, the rotary motor 401 is fixed on the support plate 406. The support plate 406 supports the clamping disk 301 through the support arm 405. When the rotary motor is running, it can drive the driven wheel 403 and the clamping disk 301 to rotate, providing a support structure for wafer rotation, ensuring the stability of the clamping disk 301 during rotation, and preventing the wafer from shaking.

[0047] Specifically, the output shaft of the rotary motor 401 is connected to the drive wheel 402, and the drive wheel 402 and the driven wheel 403 are connected by a belt 404. The outer walls of the drive wheel 402 and the driven wheel 403 are provided with protrusions, and the inner wall of the belt 404 is provided with grooves.

[0048] With this setup, when the rotary motor 401 is started, the output shaft drives the drive wheel 402 to rotate. Through the cooperation of the protrusion and the groove, the drive wheel 402 drives the driven wheel 403 to rotate via the belt 404, which in turn drives the clamping plate 301 and the wafer to rotate, thus achieving stable power transmission, avoiding belt slippage, ensuring uniform wafer rotation speed, and allowing all surfaces of the wafer to fully contact the cleaning medium.

[0049] Example 3:

[0050] A lifting mechanism 5 is provided based on embodiment 2.

[0051] Specifically, the lifting mechanism 5 includes a lifting box 501, which is disposed on one side of the outer wall of the outer layer 201 and a lifting plate 502 is disposed at the upper end of the lifting box 501. The lower surface of one side of the lifting plate 502 is connected to the upper surface of the support plate 406, and the other side of the lifting plate 502 is connected to the upper end of the screw 506. The screw 506 is threadedly connected to the inside of the lifting box 501, and the bottom of the screw 506 is slidably connected to the top of the rotating rod 505.

[0052] When the rotating rod 505 rotates, it drives the screw 506 to rotate through the groove. Since the screw is threadedly connected to the lifting box 501, the rotation of the screw pushes the lifting plate 502 to rise and fall, thereby driving the support plate 406 and the clamping assembly to rise and fall, so as to achieve precise lifting and falling of the wafer, control the entry and exit of the wafer in the cleaning area, and adapt to the needs of different cleaning processes.

[0053] Specifically, the lower end of the rotating rod 505 is connected to one side of the bevel gear set 504, and the other side of the bevel gear set 504 is connected to the output shaft of the drive motor 503. Guide rods 507 are provided on both sides of the screw 506. The upper end of the guide rod 507 is connected to the lower surface of the lifting plate 502, and the other end slides inside the lifting box 501.

[0054] In this embodiment, the drive motor 503 is started, and the output shaft drives the bevel gear set 504 to rotate. The bevel gear set 504 drives the rotating rod 505 to rotate. When the lifting plate 502 is raised and lowered, the guide rod 507 slides along the guide hole to provide power to the screw 506, ensuring that the lifting plate 502 is raised and lowered smoothly, avoiding wafer misalignment, and ensuring accurate entry and exit from the cleaning area.

[0055] In actual use, first place the wafer on top of the stabilizing plate 302, then press the positioning pin 305. The positioning pin 305 compresses the spring 306, causing the positioning pin 305 to move away from the positioning hole 304. Then, pull the clamping plate 303 to slide along the groove on one side of the clamping plate 301 so that the clamping plate 303 covers the upper end of the wafer. After adjusting to the appropriate position, the spring 306 extends and pushes the positioning pin 305 into the positioning hole 304 for limiting. Then, start the drive motor 503. The output shaft of the drive motor 503 drives the bevel gear set 504 to rotate. Due to the meshing relationship of the bevel gear set 504, the bevel gear set 504 drives the rotating rod 505 to rotate. Because the protrusions on both sides of the rotating rod 505 cooperate with the groove inside the screw 506, the rotation of the rotating rod 505 drives the screw 506 to rotate. Because the inside of the lifting box 501 and the screw The screw 506 is threaded, so the rotation of the screw 506 pushes the lifting plate 502 to rise and fall. At this time, the guide rods 507 on both sides of the screw 506 provide guidance. The rise and fall of the lifting plate 502 drives the rotating mechanism 4 to rise and fall. The rise and fall of the rotating mechanism 4 drives the clamping assembly 3 to rise and fall, so that the clamping assembly 3 and the wafer extend into the inner layer 202 for cleaning. During the cleaning process, the rotary motor 401 can be started. The output shaft of the rotary motor 401 drives the drive wheel 402 to rotate. Since the drive wheel 402 and the driven wheel 403 are connected by a belt 404, the drive wheel 402 drives the driven wheel 403 to rotate. The driven wheel 403 drives the clamping disk 301 to rotate inside the support arm 405, thereby cleaning the periphery of the wafer. After cleaning is completed, the lifting mechanism 5 is started to disengage the clamping assembly 3 from the cleaning assembly 2.

[0056] Both the rotary motor 401 and the drive motor 503 are electrically connected to the PLC controller, which is electrically connected to an external power supply. The PLC controller facilitates the power supply control of the electrical equipment, ensuring that the equipment can be powered on when needed, thus avoiding the situation where power cannot be supplied when power is required.

[0057] It should be noted that the controller can be a conventional known device that is controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific embodiments of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0058] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An ultrasonic cleaning device for silicon carbide wafer production, characterized in that: The system includes a frame (1), which is rectangular and internally connected to a cleaning assembly (2) via bolts. The cleaning assembly (2) is used for cleaning wafers. One side of the cleaning assembly (2) is connected to a lifting mechanism (5), which is used for picking up wafers. The side of the lifting mechanism (5) near the cleaning assembly (2) is connected to the upper surface of a rotating mechanism (4), which is used for rotating wafers. The lower end of the rotating mechanism (4) is connected to a clamping assembly (3), which is used for clamping wafers. The cleaning assembly (2) includes an outer layer (201), the outer wall of which is connected to the inner wall of the frame (1), and an inner layer (202) is placed inside the outer layer (201).

2. The ultrasonic cleaning device for silicon carbide wafer production according to claim 1, characterized in that: The clamping assembly (3) includes two clamping disks (301), with the lower end of the clamping disks (301) on one side connected to both ends of the bracket. The upper surface of the bracket is connected to the lower end of the stabilizing plate (302). The upper end of the clamping disks (301) on one side is slidably connected to both ends of the bracket via a sliding groove, and the lower surface of the bracket is connected to the upper end of the clamping plate (303).

3. The ultrasonic cleaning device for silicon carbide wafer production according to claim 2, characterized in that: The clamping plate (301) has multiple positioning holes (304) on the side away from the slide groove. One end of the sliding bracket has a deep hole and a positioning pin (305) slides in the hole. One end of the positioning pin (305) is engaged with the positioning hole (304) and the other end is connected to one end of the spring (306). The other end of the spring (306) is connected to the bottom surface of the deep hole of the sliding bracket.

4. The ultrasonic cleaning device for silicon carbide wafer production according to claim 3, characterized in that: The rotating mechanism (4) includes a rotary motor (401), which is disposed on the upper surface of the support plate (406). The upper ends of the support arms (405) are connected around the lower surface of the support plate (406). The lower ends of the support arms (405) wrap around both sides of the clamping disk (301). The clamping disk (301) away from the positioning hole (304) and away from the slide groove is connected to one side of the driven wheel (403).

5. The ultrasonic cleaning apparatus for silicon carbide wafer production according to claim 4, characterized in that: The output shaft of the rotary motor (401) is connected to the drive wheel (402). The drive wheel (402) and the driven wheel (403) are connected by a belt (404). The outer walls of the drive wheel (402) and the driven wheel (403) are provided with protrusions, and the inner wall of the belt (404) is provided with grooves.

6. The ultrasonic cleaning apparatus for silicon carbide wafer production according to claim 5, characterized in that: The lifting mechanism (5) includes a lifting box (501), which is located on one side of the outer wall of the outer layer (201) and a lifting plate (502) is provided at the upper end of the lifting box (501). The lower surface of one side of the lifting plate (502) is connected to the upper surface of the support plate (406), and the other side of the lifting plate (502) is connected to the upper end of the screw (506). The screw (506) is threaded to the inside of the lifting box (501), and the bottom of the screw (506) is slidably connected to the top of the rotating rod (505).

7. The ultrasonic cleaning apparatus for silicon carbide wafer production according to claim 6, characterized in that: The lower end of the rotating rod (505) is connected to one side of the bevel gear set (504), and the other side of the bevel gear set (504) is connected to the output shaft of the drive motor (503). Guide rods (507) are provided on both sides of the screw (506). The upper end of the guide rod (507) is connected to the lower surface of the lifting plate (502), and the other end slides inside the lifting box (501).

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