A mold for processing semiconductor parts in the field of vehicle-mounted devices

Abstract

The application relates to the field of vehicle-mounted technology and discloses a vehicle-mounted field semiconductor part machining die. The die comprises an upper die assembly, a lower die assembly and a stripping mechanism, wherein the upper die assembly comprises an upper die base, an upper cover plate, an upper backing plate and a clamping plate and the like, the lower die assembly comprises a lower die base, a lower backing plate and a lower die plate and the like, and the stripping mechanism comprises a stripping back plate and a stripping plate and the like. Specific cavity structures are formed in the interiors of the upper die base, the lower die base and the stripping plate. The cavities are communicated with each other through openings in the side portions of the components, and a complete cavity system is constructed in the die. The heat dissipation performance of the die in continuous high-speed stamping operation is effectively improved, the working temperature of the die is more stable, the size precision and the surface quality of the stamping part are improved, higher production rhythm is supported, and the production efficiency is improved.

Description

Technical Field

[0001] This application belongs to the field of automotive technology, specifically a semiconductor component processing mold for automotive applications. Background Technology

[0002] In the automotive field, electronic devices are rapidly moving towards miniaturization, high performance, and high-density integration. This not only creates an urgent need for domestic substitution of electronic components but also poses stringent challenges to the structural design, performance, and especially thermal management capabilities of these components. Traditional semiconductor components are gradually revealing significant limitations in addressing the increasingly complex thermal management requirements and novel circuit designs of automotive electronic devices.

[0003] The novel semiconductor component UPDFN5*6 single-sided heat dissipation CLIP developed in this project is designed specifically for the automotive field. Its unique feature is that it achieves a multi-bending forming process. While ensuring bending accuracy, it can meet the requirements of automotive electronic devices for high precision, high reliability and excellent thermal management performance of components by combining a double-sided heat dissipation forming process.

[0004] The product uses 0.25mm thin copper strip as raw material and requires more precise dimensions. It needs to rely on high mold precision to achieve the matching of each bend. High precision mold gap matching ensures the flatness of the forming surface, so as to adapt to the space constraints brought about by the miniaturization of automotive electronic devices and the strict requirements of high performance for heat dissipation and structural stability. Utility Model Content

[0005] The purpose of this application is to provide a semiconductor component processing mold for the automotive field in order to solve the problems mentioned above.

[0006] The technical solution adopted in this application is as follows: A semiconductor component processing mold for automotive applications includes an upper mold assembly, a lower mold assembly, and a stripping mechanism. The upper mold assembly includes an upper mold base, from which an upper cover plate, an upper pad plate, and a clamping plate are sequentially connected from top to bottom. A punch is fixed to the clamping plate via clamping plate components. The lower mold assembly includes a lower mold base, from which a lower pad plate and a lower template plate are sequentially connected from bottom to top. A cutting edge is provided on the lower template plate, and a concave die gasket is provided between the cutting edge and the lower template plate. A side baffle is installed on the side of the lower mold base. The stripping mechanism includes a stripping back plate and a stripping plate. Stripping components are provided on the stripping plate, and the stripping back plate and the stripping plate are positioned by pins. The upper mold base, lower mold base, and stripping plate all have hollow cavity structures inside, which form a continuous channel network inside the mold.

[0007] In a preferred embodiment, the cavity inside the upper mold base is located above the mounting surface of the upper pad, and its outline corresponds to the stress area of ​​the upper pad.

[0008] In a preferred embodiment, the cavity inside the lower mold base is arranged around the mounting area of ​​the lower template, and its shape is adapted to the projection area of ​​the lower template and the cutting edge.

[0009] In a preferred embodiment, the cavity inside the stripper plate is composed of multiple interconnected channels.

[0010] In a preferred embodiment, the upper and lower pads are made of a metal material with excellent thermal conductivity.

[0011] In a preferred embodiment, the clamp and the punch are tightly fixed and in contact through the clamp components, ensuring a good heat conduction path.

[0012] In a preferred embodiment, the cavities inside the upper mold base, lower mold base, and stripper plate are interconnected through openings on their sides, forming an integral internal cavity system.

[0013] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are:

[0014] 1. Innovative Product Structure Design

[0015] This project achieved significant innovations in product structure design, successfully developing a multi-bending forming process suitable for the automotive field. Through a unique structural design, the product can be bent multiple times on a 0.25mm thin copper strip, effectively ensuring bending accuracy during these multiple bends and avoiding the accuracy deviations and structural damage issues that easily occur in traditional products during multiple bends. Simultaneously, combined with the aforementioned double-sided heat dissipation forming process, the product structure design fully considers thermal management requirements, optimizing the structure and layout of the heat dissipation surface. This gives the product superior thermal management performance, meeting the heat dissipation requirements of automotive electronic devices under high-temperature and high-load environments. It fills the gaps in thermal management of traditional semiconductor components, providing strong support for the miniaturization and high-performance of automotive electronic devices.

[0016] 2. Mold Innovation

[0017] To address the specific requirements of multiple bending and forming of thin copper strips, innovations were made in mold design and manufacturing. New mold materials and a special mold structure were adopted, improving mold precision and lifespan, and ensuring high-precision fit between each bend. By precisely controlling the mold gap, the flatness of the formed surface was guaranteed, solving the gap control problem that easily occurs with traditional molds when processing thin materials. Attached Figure Description

[0018] Figure 1 This is a cross-sectional view of the stamping die structure in this application;

[0019] Figure 2 This is a side view of the stamping die structure in this application;

[0020] Figure 3 This is a front view of the stamping die structure in this application.

[0021] The markings in the diagram are: 1. Lower mold base; 2. Upper mold base; 3. Upper cover plate; 4. Upper backing plate; 5. Lower backing plate; 6. Clamping plate; 7. Backing plate; 8. Stripper plate; 9. Lower template; 10. Clamping plate parts; 11. Punch; 12. Pin; 13. Stripper parts; 14. Cutting edge; 15. Die gasket; 16. Side baffle. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] Example:

[0024] Reference Figure 1-3 A semiconductor component processing mold for automotive applications includes a lower mold base 1, a lower template 9 at the upper end of the lower mold base 1, a lower pad 5 at the middle position between the lower mold base 1 and the lower template 9, a stripper plate 8 at the upper end of the lower template 9, and a stripper back plate 7 installed at the upper end of the stripper plate 8. The lower mold base 1 serves as the basic support structure of the mold, providing a stable mounting reference for the lower mold assembly and ensuring that the mold maintains overall rigidity during the stamping process. The lower pad 5 is used to disperse and buffer the local stress transmitted to the lower mold base 1 during the stamping process. The stripper plate 8 and the stripper back plate 7 together form the basis of the stripping mechanism, realizing the unloading function after stamping.

[0025] Reference Figure 1-3 A clamping plate 6 is provided at the upper end of the back plate 7, and an upper mold base 2 is provided at the upper end of the clamping plate 6. An upper pad 4 is provided in the middle of the clamping plate 6 and the upper mold base 2. An upper cover plate 3 is provided at the upper end of the upper mold base 2. The clamping plate 6 is used to install and fix the upper mold working parts such as the punch 11. The upper pad 4 is used to evenly distribute and transmit the punching force to prevent the upper mold base 2 from being indented or deformed due to concentrated force. The upper mold base 2 and the lower mold base 1 together constitute the load-bearing frame of the mold.

[0026] Reference Figure 1-3 The clamping plate 6 has multiple clamping parts 10 installed inside. The clamping parts 10 are used to precisely fix and position the punch 11, ensuring its positional stability during continuous stamping, thereby ensuring the dimensional accuracy of the stamped parts.

[0027] Reference Figure 1-3 The clamping plate part 10 has multiple punches 11 inside. The punches 11 pass through the stripper plate 8, the stripper back plate 7 and the clamping plate 6 respectively. The punches 11 are working parts of the mold. During stamping, they move down with the upper mold and cooperate with the cutting edge 14 on the lower mold plate 9 to complete the punching, blanking or forming of the plate.

[0028] Reference Figure 1-3 Inside the lower template 9, a cutting edge 14 is installed at the corresponding position of the punch 11. The cutting edge 14 is precisely matched with the punch 11 to form a blanking or forming cavity. The size and shape of the cutting edge directly determine the contour accuracy of the stamped part. The stripping part 13 is set on the stripping plate 8 and is used to peel off the material or waste that may be wrapped on the punch 11 after stamping.

[0029] Reference Figure 1-3 Inside the stripper plate 8, adjacent to the clamping plate part 10, there is a stripper part 13. Driven by the movement of the stripper plate 8, the stripper part 13 achieves a stable and reliable stripping action, ensuring the continuity of production.

[0030] Reference Figure 1-3 The lower template 9 is also provided with a concave membrane gasket 15. The concave membrane gasket 15 is installed around or below the blade 14 to adjust the effective height of the blade 14 or protect the surface of the lower template 9, so as to facilitate adjustment and replacement after wear.

[0031] Reference Figure 1-3 A side baffle 16 is installed on the side of the lower die holder 1. The side baffle 16 is used to guide and initially position the fed sheet metal. The upper die holder 2, the lower die holder 1, and the stripper plate 8 all have cavity structures inside. These internal cavities are interconnected and together constitute the internal cavity system of the die. By optimizing the internal structure of the die, the overall performance of the die is effectively improved. During the stamping process, each component is precisely guided and positioned by the pins 12 to ensure accurate mold closing between the upper and lower dies.

[0032] The implementation principle of an embodiment of a semiconductor component processing mold for the automotive field in this application is as follows:

[0033] This invention restructures the core components of a traditional mold by creating a continuous cavity system within them. This structure not only preserves the mold's original mechanical properties, but more importantly, these cavities significantly enhance its heat dissipation capacity. When heat generated during mold operation is conducted to these components, the internal cavity structure provides the physical conditions for rapid and uniform heat distribution and efficient dissipation, thereby maintaining the mold's operating temperature within a more stable and ideal range. This optimization approach, starting from the internal structure, fundamentally improves the overall performance of the mold under high-speed continuous operation.

[0034] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A semiconductor component processing mold for automotive applications, comprising an upper mold assembly, a lower mold assembly, and a stripping mechanism, wherein the upper mold assembly comprises an upper mold base (2), the upper mold base (2) being connected to an upper cover plate (3), an upper pad plate (4), and a clamping plate (6), and the clamping plate (6) having a punch (11) fixed thereon via a clamping plate component (10); the lower mold assembly comprises a lower mold base (1), the lower mold base (1) being connected to a lower pad plate (5) and a lower template plate (9), the lower template plate (9) having a cutting edge (14), and the lower mold base (1) having a side baffle plate (16); the stripping mechanism comprises a stripping back plate (7) and a stripping plate (8), the stripping plate (8) having a stripping component (13), and the stripping back plate (7) and the stripping plate (8) being connected via a pin (12); characterized in that: The upper mold base (2), the lower mold base (1), and the stripper plate (8) all have cavity structures inside.

2. The semiconductor component processing mold for the automotive field according to claim 1, characterized in that: The cavity structure of the upper mold base (2) is located above the mounting surface of the upper pad (4).

3. The semiconductor component processing mold for the automotive field according to claim 1, characterized in that: The cavity structure of the lower mold base (1) is arranged around the installation area of ​​the lower template (9).

4. A semiconductor component processing mold for the automotive field according to claim 1, characterized in that: The cavity structure of the stripping plate (8) is composed of multiple interconnected channels.

5. A semiconductor component processing mold for the automotive field according to claim 1, characterized in that: The upper pad (4) and lower pad (5) are made of high thermal conductivity metal material.

6. A semiconductor component processing mold for the automotive field according to claim 1, characterized in that: The clamp (6) is tightly and fixedly connected to the punch (11) through the clamp part (10).

7. A semiconductor component processing mold for the automotive field according to claim 1, characterized in that: A concave membrane gasket (15) is provided between the lower template (9) and the cutting edge (14).

8. A semiconductor component processing mold for the automotive field according to any one of claims 1 to 7, characterized in that: The cavity structures of the upper mold base (2), lower mold base (1) and stripper plate (8) are interconnected through openings on their sides.

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