Semiconductor lead frame mold

Abstract

The utility model belongs to semiconductor lead frame preparation technical field, concretely relates to semiconductor lead frame mould, including fixed mould and movable mould, the fixed mould top surface four -sided position is set up frame placing groove respectively, the fixed mould four side walls are set up pin groove respectively, pin groove and frame placing groove intercommunication, frame placing groove all is provided with push material subassembly in, movable mould is the hollow structure of bottom opening, movable mould is provided with four and frame placing groove corresponding elastic pressing subassembly. Push material subassembly includes the gas storage cavity set up in the fixed mould inside, the fixed mould side wall is fixedly connected with the air inlet joint, the air inlet joint and gas storage cavity intercommunication, the gas storage cavity side wall evenly is set up four air inlet channels. The utility model can position bending to lead wire frame, be used for improving bending stability and bending accuracy.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor lead frame fabrication technology, specifically relating to semiconductor lead frame molds. Background Technology

[0002] In the manufacturing process of semiconductor devices, the semiconductor lead frame serves as a crucial carrier for connecting the chip to external circuits, and its processing precision directly determines the electrical performance and reliability of the semiconductor device. Lead bending is one of the core processes in semiconductor lead frame processing, requiring the lead frame leads to be precisely bent according to design angles and dimensions to ensure stable connection with external circuits.

[0003] Traditional molds mostly lack precise positioning structures specifically designed for semiconductor leadframes, relying solely on simple slots or stops to limit the leadframe's position. Due to the small size and intricate structure of semiconductor leadframes, traditional positioning methods are prone to errors, causing the force point during lead bending to deviate from the design position. This leads to problems such as lead bending angle deviations and bending position offsets. Such processing errors directly affect the packaging quality of subsequent semiconductor devices, potentially resulting in poor connections between the chip and external circuits, increased contact resistance, unstable signal transmission, and even the scrapping of semiconductor devices. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor lead frame mold that can position and bend the lead frame to increase bending stability and accuracy.

[0005] The specific technical solution adopted by this utility model is as follows:

[0006] A semiconductor lead frame mold includes a fixed mold and a moving mold. The fixed mold has frame placement slots on its four sides and lead slots on its four side walls. The lead slots are connected to the frame placement slots and pusher components are provided in each frame placement slot.

[0007] The moving mold is a hollow structure with an opening at the bottom, and the moving mold is provided with four elastic pressing components corresponding to the frame placement slots.

[0008] Furthermore, the pusher assembly includes an air storage chamber opened inside the fixed mold. An air inlet connector is fixedly connected to the side wall of the fixed mold. The air inlet connector communicates with the air storage chamber. Four air inlet channels are evenly opened on the side wall of the air storage chamber. A telescopic rod is movably connected to the side wall of the air inlet channel. One end of the telescopic rod extends into the frame placement slot and is fixedly connected to the push plate. A piston is fixedly connected to the other end of the telescopic rod. A first spring is sleeved on the side wall of the telescopic rod.

[0009] Furthermore, each of the side walls of the frame placement slot is provided with a storage slot, and the push plate is located in the storage slot, with the push plate flush with the side wall of the frame placement slot.

[0010] Furthermore, a conical guide block is fixedly connected to the top surface of the gas storage chamber.

[0011] Furthermore, the elastic pressing assembly includes a pressing block, and four positioning rods are fixedly connected to the top surface of the pressing block. The positioning rods pass through the moving mold and are movably connected to it. A second spring is sleeved on the side wall of the positioning rod between the pressing block and the moving mold.

[0012] Furthermore, four limiting posts are uniformly fixedly connected to the top surface of the moving mold cavity, and the limiting posts are all located on the upper side of the pressure block.

[0013] Furthermore, multiple rollers are rotatably connected to the inner sidewalls of all four sides of the moving mold, and the rollers correspond to the pin slots.

[0014] The technical effects achieved by this utility model are as follows:

[0015] This novel semiconductor leadframe mold, through the coordinated operation of a fixed mold, a moving mold, a frame placement groove, and an elastic pressing component, can simultaneously bend the leads on the leadframe in four directions. It provides a dedicated positioning space for the semiconductor leadframe, precisely limiting it to a preset processing position and effectively avoiding problems such as bending angle deviation and misalignment caused by positioning errors in traditional molds. Simultaneously, the lead grooves on the four sidewalls of the fixed mold connect with the frame placement groove, allowing the leads to precisely extend into the grooves during leadframe placement. This ensures the leads remain in a preset stress position throughout the bending process, further improving bending accuracy. Attached Figure Description

[0016] Figure 1 This is a perspective view of the present invention;

[0017] Figure 2 This is a cross-sectional structural schematic diagram of the present invention;

[0018] Figure 3 This is a schematic diagram of the disassembled structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the structure of the elastic pressing component of this utility model;

[0020] Figure 5 This is a bottom view structural diagram of the moving mold of this utility model;

[0021] Figure 6 This is a utility model Figure 2 Enlarged view of point A in the image.

[0022] The attached diagram lists the components represented by each number as follows:

[0023] 1. Fixed mold; 2. Moving mold; 3. Frame placement slot; 4. Pin slot; 5. Pressure block; 6. Positioning rod; 7. Second spring; 8. Limiting post; 9. Air storage chamber; 10. Air inlet connector; 11. Air inlet channel; 12. Telescopic rod; 13. Push plate; 14. Piston; 15. First spring; 16. Storage slot; 17. Roller; 18. Conical guide block. Detailed Implementation

[0024] To make the objectives and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the following text is merely used to describe one or more specific embodiments of this utility model and does not strictly limit the scope of protection specifically claimed by this utility model.

[0025] like Figures 1-6 As shown, the semiconductor lead frame mold includes a fixed mold 1 and a moving mold 2. The fixed mold 1 has frame placement slots 3 on the four sides of its top surface, and pin slots 4 on the four side walls of the fixed mold 1. The pin slots 4 are connected to the frame placement slots 3, and each frame placement slot 3 is equipped with a pusher assembly. Specifically, the specifications of the frame placement slots 3 and the pin slots 4 can be customized according to the specifications of the actual product.

[0026] The moving mold 2 is a hollow structure with an opening at the bottom, and the moving mold 2 is equipped with four elastic pressing components corresponding to the frame placement slot 3.

[0027] like Figure 2 and Figure 6 As shown, the pusher assembly includes an air storage chamber 9 opened inside the fixed mold 1. An air inlet connector 10 is fixedly connected to the side wall of the fixed mold 1. The air inlet connector 10 communicates with the air storage chamber 9. Four air inlet channels 11 are evenly opened on the side wall of the air storage chamber 9. A telescopic rod 12 is movably connected to the side wall of the air inlet channel 11. One end of the telescopic rod 12 extends into the frame placement slot 3 and is fixedly connected to a push plate 13. The other end of the telescopic rod 12 is fixedly connected to a piston 14. A first spring 15 is sleeved on the side wall of the telescopic rod 12.

[0028] The frame placement slot 3 has storage slots 16 on each side wall, and the push plate 13 is located in the storage slot 16, with the push plate 13 flush with the side wall of the frame placement slot 3.

[0029] The air intake control in the feeding assembly utilizes a solenoid valve to control the entry of pressurized gas. Pressure changes within the gas storage chamber 9 control the extension and retraction of the piston 14 and pusher plate 13, thus achieving the feeding purpose. This eliminates the need for manual material handling by operators, simplifying the material handling process, significantly improving efficiency, and preventing collisions and damage to bent leads caused by manual handling, further enhancing product qualification rates.

[0030] like Figure 2 As shown, a conical guide block 18 is fixedly connected to the top surface of the air storage chamber 9. The conical guide block 18 facilitates the rapid dispersion of airflow and ensures the consistency of the actions of each pusher plate 13.

[0031] like Figure 2 and Figure 4 As shown, the elastic pressing assembly includes a pressing block 5. Four positioning rods 6 are fixedly connected to the top surface of the pressing block 5. The positioning rods 6 pass through the moving mold 2 and are movably connected to it. A second spring 7 is sleeved on the side wall of the positioning rod 6 between the pressing block 5 and the moving mold 2.

[0032] The elastic pressing component adapts to the thickness of the lead frame, effectively solving the scratches and hard friction problems caused by traditional rigid pressing. When the pressing force is too large, the second spring 7 compresses and buffers, preventing deformation and breakage of the lead frame due to rigid extrusion. When the pressing force is insufficient, the elasticity of the second spring 7 ensures that the pressure block 5 applies sufficient bending force to the pin, achieving effective bending. This not only protects the lead frame from damage but also ensures that each pin is subjected to uniform force during bending, avoiding situations where some pins are bent properly while others are not. This significantly improves the bending consistency of products in the same batch, reduces product losses due to processing defects, and meets the quality standards for large-scale semiconductor device production.

[0033] like Figure 2 As shown, four limiting posts 8 are evenly fixedly connected to the top surface of the inner cavity of the moving mold 2, and the limiting posts 8 are all located on the upper side of the pressure block 5. The limiting posts 8 can accurately limit the downward stroke of the pressure block 5, avoiding excessive descent of the pressure block 5 which could damage the lead frame or the mold itself, and further improving the stability and safety of the bending process.

[0034] like Figure 2 and Figure 5 As shown, multiple rollers 17 are rotatably connected to the inner sidewalls of all four sides of the moving mold 2, and the rollers 17 correspond to the pin slots 4. During the pin bending process, the rollers 17 can rotate synchronously with the bending action of the pin. On the one hand, this can reduce the friction between the pin and the sidewall of the moving mold 2, avoid scratches and damage to the pin surface, and protect the appearance and performance of the pin. On the other hand, the rotation of the rollers 17 can guide the bending process of the pin, further improving the bending accuracy and stability, and making the shape of the pin after bending more regular.

[0035] The working principle of this utility model is as follows: First, the lead frame is placed in the frame placement slot 3 so that the pins on the frame protrude. Then, the air inlet connector 10 is connected to an external air source. The press drives the moving mold 2 to move downward. The pressure block 5 first abuts against the lead frame. At the same time, the moving mold 2 continues to move downward. The force of the second spring 7 keeps the pressure block 5 abutting against the lead frame. As the moving mold 2 descends, the roller 17 abuts against the frame pins and presses down on the pins to bend them. The bent pins can be stored and positioned in the pin slot 4. The roller 17 can avoid rigid contact and squeezing with the pins, which would cause scratches. After bending is completed, the moving mold 2 rises and the force of the second spring 7 drives the pressure block 5 to return to its original position.

[0036] At the same time, pressurized gas is injected into the gas storage chamber 9 using an external air source. The pressurized gas pushes the piston 14 to move rapidly in the air intake channel 11. Simultaneously, the first spring 15 is compressed, and the piston 14 drives the push plate 13 to extend through the telescopic rod 12, quickly pushing out the bent lead frame to achieve convenient material discharge.

[0037] The above description is merely a preferred embodiment of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model. Structures, devices, and operating methods not specifically described or explained in this utility model, unless otherwise specified or limited, shall be implemented using conventional methods in the field.

Claims

1. A semiconductor lead frame mold, characterized in that: It includes a fixed mold (1) and a moving mold (2). The fixed mold (1) has a frame placement groove (3) on each of the four sides of its top surface. The fixed mold (1) has pin grooves (4) on each of its four side walls. The pin grooves (4) are connected to the frame placement grooves (3). Each frame placement groove (3) is equipped with a pusher assembly. The moving mold (2) is a hollow structure with an opening at the bottom, and the moving mold (2) is provided with four elastic pressing components corresponding to the frame placement slot (3).

2. The semiconductor lead frame mold according to claim 1, characterized in that: The pusher assembly includes an air storage chamber (9) opened inside the fixed mold (1). An air inlet connector (10) is fixedly connected to the side wall of the fixed mold (1). The air inlet connector (10) communicates with the air storage chamber (9). Four air inlet channels (11) are evenly opened on the side wall of the air storage chamber (9). A telescopic rod (12) is movably connected to the side wall of the air inlet channel (11). One end of the telescopic rod (12) extends into the frame placement slot (3) and is fixedly connected to the push plate (13). A piston (14) is fixedly connected to the other end of the telescopic rod (12). A first spring (15) is sleeved on the side wall of the telescopic rod (12).

3. The semiconductor lead frame mold according to claim 2, characterized in that: The side walls of the frame placement slot (3) are provided with storage slots (16), and the push plate (13) is located in the storage slot (16). The push plate (13) is flush with the side wall of the frame placement slot (3).

4. The semiconductor lead frame mold according to claim 2, characterized in that: A conical guide block (18) is fixedly connected to the top surface of the gas storage chamber (9).

5. The semiconductor lead frame mold according to claim 1, characterized in that: The elastic pressing assembly includes a pressing block (5), and four positioning rods (6) are fixedly connected to the top surface of the pressing block (5). The positioning rods (6) pass through the moving mold (2) and are movably connected to it. A second spring (7) is sleeved on the side wall of the positioning rod (6) between the pressing block (5) and the moving mold (2).

6. The semiconductor lead frame mold according to claim 5, characterized in that: Four limiting posts (8) are uniformly fixedly connected to the top surface of the inner cavity of the moving mold (2), and the limiting posts (8) are all located on the upper side of the pressure block (5).

7. The semiconductor lead frame mold according to claim 1, characterized in that: The moving mold (2) has multiple rollers (17) rotatably connected to the inner sidewalls on all four sides, and the rollers (17) correspond to the pin slots (4).

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