Lead-tin soldering device
Patent Information
- Application Number
- CN202522480218.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-24
- Publication Date
- 2026-10-20
- Estimated Expiration
- 2035-11-24
AI Technical Summary
[0004]但是上述现有技术在使用时还存在不足:贴片电感焊锡后通过移动刮板配合螺旋弹簧来将一排焊锡有的贴片电感逐个推出,由于是横向推动,而且横向推动时弹簧的压缩量会增大,阻力也就增大,由此会增大人工推动出料的强度,具体的说就是较为费力,而且长板不具有拆分的功能,不具有线下上料的功能,对于大量的贴片电感的焊锡处理来说,线上逐一上料的方式会降低焊锡效率
1、在本实用新型中,定位长板相对升降板为可拆卸连接的结构,然后在定位长板背侧设置转轴,转轴的外壁通过支板固定连接有磁铁板,在定位长板的背面开设缺口槽,转轴转动时能带动磁铁板靠近和远离定位长板前侧放置的贴片电容,由此,贴片引脚焊锡后,翻转定位长板,然后转动转轴就能轻易释放定位长板上全部的贴片电容,具有焊锡有下料更加方便快捷的优点。
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Figure CN224866522U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of surface mount inductor processing technology, specifically a lead soldering device. Background Technology
[0002] Soldering is an indispensable part of inductor soldering, and it can also be said to be an indispensable part of electronic component soldering. Before soldering surface mount inductors onto the PCB board, soldering is required on the leads of the surface mount inductors to ensure better soldering with the PCB board. However, in the current technology, when soldering surface mount inductors manually, the surface mount inductors need to be placed on a magnetic jig before soldering. After soldering, an entire row of surface mount inductors needs to be manually removed from the jig, which is quite troublesome.
[0003] Utility model CN223043787U discloses a soldering fixture for surface mount inductors. It includes a long plate, a connecting plate, a magnetic plate, a pull block, a right sliding plate, a left sliding plate, and a fixed shaft. The magnetic plate is slidably connected to the front of the long plate, the connecting plate is fixedly connected to the top of the magnetic plate, the pull block is fixedly connected to the top of the connecting plate, the left sliding plate is slidably connected to the left side of the long plate, the right sliding plate is slidably connected to the right side of the long plate, and the fixed shaft is fixedly connected between the left and right sliding plates. This utility model uses a moving scraper to remove the surface mount inductor from the magnetic plate, eliminating the need for manual removal and improving the processing efficiency of surface mount inductors. The utility model also includes a limiting rod to prevent the coil of the surface mount inductor from getting soldered during soldering, ensuring normal subsequent processing of the surface mount inductor. Furthermore, a shielding cover is provided to prevent the surface mount inductor from falling off the front of the magnetic plate when it moves to the right.
[0004] However, the existing technology has its shortcomings in use: after soldering the surface mount inductors, a moving scraper and a spiral spring are used to push out the surface mount inductors one by one. Since it is a lateral push, and the compression of the spring increases during the lateral push, the resistance also increases. This increases the intensity of manual pushing and pushing out the material, which is more laborious. In addition, the long board does not have the function of splitting or offline feeding. For the soldering of a large number of surface mount inductors, the online feeding method will reduce the soldering efficiency.
[0005] Therefore, this utility model provides a lead wire soldering device. Utility Model Content
[0006] To address the shortcomings of existing technologies, the purpose of this invention is to provide a lead soldering device to solve the problems mentioned in the background. This invention has the function of pre-installing surface mount capacitors offline, without affecting the efficiency of soldering other surface mount capacitor leads. The unloading operation of a row of surface mount capacitors after soldering is more labor-saving, convenient, and fast.
[0007] To achieve the above objectives, this utility model provides the following technical solution: a lead wire soldering device, comprising a lifting plate, a positioning plate detachably connected to the bottom of the lifting plate, a support plate fixedly connected to the front side of the positioning plate, a row of limiting grooves extending through the upper surface of the support plate, a rotating shaft connected to the back of the positioning plate, a magnet plate parallel to the rotating shaft fixedly connected to the outer wall of the rotating shaft via a support plate, a notch groove near the bottom of the positioning plate being provided on the back of the positioning plate, the rotating shaft rotating to drive the magnet plate in and out of the notch groove, and a control mechanism for controlling the rotation of the rotating shaft being provided on the back of the positioning plate.
[0008] Furthermore, coaxial support shafts are welded to both ends of the rotating shaft, and ear plates located at both ends of the notch are welded to the back of the positioning plate. Positioning holes that are rotatably connected to the support shafts are provided on the ear plates.
[0009] Furthermore, the control mechanism includes a gear and a grooved plate. The gear is fixedly sleeved on the support shaft, and the grooved plate is slidably disposed on the back of the positioning plate, with two straight plates on it respectively meshing with the gears at both ends of the rotating shaft.
[0010] Furthermore, the control mechanism includes a spring, and a baffle plate located above the channel plate is welded to the top wall of the positioning plate. One end of the baffle plate is fixedly connected to one side of the positioning plate via an L-shaped plate and located below the horizontal plate on the channel plate. The spring is located inside the L-shaped plate and its top end abuts against the lower end face of the horizontal plate.
[0011] Furthermore, two guide sleeves are welded to the back of the positioning plate, which are respectively fitted onto the outside of two straight plates on the groove plate.
[0012] Furthermore, the bottom of the lifting plate is provided with a groove-shaped notch, and slots are provided on both sides of the groove-shaped notch. The two ends of the positioning plate are provided with sliding tongues, and the sliding tongues are connected to the slots.
[0013] Furthermore, the positioning plate has grooves at both ends, one end of the sliding tongue is fitted into the groove, the front side of the lifting plate has a clearance notch that connects the slot and the groove, and one side of the sliding tongue is fixedly connected to a pivot shaft that matches the clearance notch. The clearance notch is T-shaped.
[0014] The beneficial effects of this utility model are as follows: 1. In this utility model, the positioning plate is detachably connected to the lifting plate. A rotating shaft is set on the back side of the positioning plate. A magnet plate is fixedly connected to the outer wall of the rotating shaft through a support plate. A notch is opened on the back of the positioning plate. When the rotating shaft rotates, it can drive the magnet plate to move closer to and away from the surface-mount capacitors placed on the front side of the positioning plate. Thus, after the surface-mount leads are soldered, the positioning plate is flipped over, and then the rotating shaft can be rotated to easily release all the surface-mount capacitors on the positioning plate. This has the advantages of making soldering and unloading more convenient and faster.
[0015] 2. In this utility model, sliding tongues are provided at both ends of the positioning plate, and a slot-shaped notch is opened at the bottom of the lifting plate. Slots for insertion of the sliding tongues are opened on both sides of the slot-shaped notch. The positioning plate and the lifting plate can be easily connected and separated by sliding the sliding tongues. By setting the clearance notch and the pivot, the sliding operation of the sliding tongues is made more convenient. The above settings allow the positioning plate to install surface-mount capacitors offline without affecting the soldering of surface-mount capacitor pins on other positioning plates, thus improving soldering efficiency. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of a lead wire soldering device according to the present invention; Figure 2 for Figure 1 A schematic diagram of the disassembled positioning plate and lifting plate; Figure 3 for Figure 1 A diagram of the back; Figure 4 This is a schematic diagram of the positioning plate and rotating shaft of the lead wire soldering device of this utility model after being exploded and unfolded.
[0017] In the diagram: 1. Lifting plate; 11. Slot notch; 111. Slot; 12. Clearance notch; 2. Positioning plate; 21. Notch slot; 22. Ear plate; 23. Baffle; 231. L-shaped plate; 24. Guide sleeve; 221. Positioning hole; 25. Sliding tongue; 251. Turning shaft; 26. Slide groove; 12. Clearance notch; 3. Support plate; 31. Limiting support groove; 4. Rotating shaft; 41. Support shaft; 5. Support plate; 6. Magnet plate; 7. Control mechanism; 71. Gear; 72. Spring; 73. Slotted plate; 731. Straight plate; 732. Horizontal plate. Detailed Implementation
[0018] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.
[0019] Please see Figures 1 to 4This utility model provides a technical solution: a lead soldering device, including a lifting plate 1. The lifting of the lifting plate 1 is controlled by an electric push rod on the soldering frame. Specifically, the output shaft of the electric push rod is fixedly connected to the top wall of the lifting plate 1. The electric push rod is electrically connected to an external controller (PLC). A positioning plate 2 is detachably connected to the bottom of the lifting plate 1. A support plate 3 located at the bottom is fixedly connected to the front side of the positioning plate 2. A row of limiting slots 31 is opened through the upper end surface of the support plate 3. The limiting slots 31 are used to place surface mount capacitors. Specifically, the length of the slot in the limiting slot 31 is less than the maximum outer diameter of the surface mount capacitor, and the width of the slot is greater than or equal to the thickness of the surface mount capacitor. The leads on the surface mount capacitor pass through the limiting slots 31 and are located below the positioning plate 2.
[0020] In this embodiment, the bottom of the lifting plate 1 is provided with a groove-shaped notch 11, and slots 111 are provided on both sides of the groove-shaped notch 11. The two ends of the positioning plate 2 are provided with sliding tongues 25, which are inserted into the slots 111. The length of the positioning plate 2 is less than or equal to the length of the groove in the groove-shaped notch 11. After the sliding tongue 25 enters the slot 111, the positioning plate 2 is restricted within the groove-shaped notch 11.
[0021] Furthermore, the positioning plate 2 has grooves 26 at both ends, and one end of the tongue 25 is fitted into the groove 26. The front side of the lifting plate 1 has a clearance notch 12 that connects the slot 111 and the slot notch 11. A pivot 251 that matches the clearance notch 12 is fixedly connected to one side of the tongue 25. The clearance notch 12 is T-shaped, and the length of the larger end of the clearance notch 12 is equal to the width of the tongue 25. That is to say, the tongue 25 can move in and out of the larger end of the clearance notch 12. The pivot 251 is a handheld component. When the pivot 251 is turned, the tongue 25 can be pushed to move relative to the positioning plate 2. This arrangement facilitates the docking and separation of the positioning plate 2 and the slot notch 11.
[0022] The back of the positioning plate 2 is connected to a rotating shaft 4. Specifically, coaxial support shafts 41 are welded to both ends of the rotating shaft 4. Ear plates 22 located at both ends of the notch 21 are welded to the back of the positioning plate 2. The ear plates 22 have positioning holes 221 that are rotatably connected to the support shafts 41. The outer wall of the rotating shaft 4 is fixedly connected to a magnet plate 6 parallel to the rotating shaft 4 by a support plate 5. The back of the positioning plate 2 has a notch 21 near the bottom. The middle of the inner wall of the notch 21 is opposite to the middle of the chip capacitor. The thickness of the positioning plate 2 at the middle of the inner wall of the notch 21 is the smallest (2-3mm). When the magnet plate 6 is opposite to the middle of the notch 21, it can apply a reliable magnetic attraction force to the chip capacitor, so that the row of chip capacitors placed on the tray 3 will not shift.
[0023] When the rotating shaft 4 rotates, it can drive the magnet plate 6 to enter and exit the notch slot 21. When the magnet plate 6 leaves the notch slot 21, the chip capacitor on the tray 3 loses its magnetic attraction and can be easily removed from the limiting tray 31.
[0024] The detachable connection between the lifting plate 1 and the positioning plate 2 mentioned above allows the positioning plate 2, which carries a row of surface mount capacitors, to be loaded and unloaded offline. In other words, during production, multiple positioning plates 2 and components connected to the positioning plates 2 can be prefabricated, and surface mount capacitors can be placed on each positioning plate 2. During soldering, the positioning plates 2 can be connected to the lifting plate 1 in turn to improve the efficiency of soldering. Moreover, after soldering, the surface mount capacitors on the positioning plates 2 can be easily and quickly unloaded by controlling the rotation of the rotating shaft 4.
[0025] Furthermore, a control mechanism 7 for controlling the rotation of the shaft 4 is provided on the back of the positioning plate 2.
[0026] Specifically, the control mechanism 7 includes a gear 71 and a slotted plate 73. The gear 71 is fixedly sleeved on the support shaft 41. The slotted plate 73 is slidably disposed on the back of the positioning plate 2, and two straight plates 731 on it mesh with the gears 71 at both ends of the rotating shaft 4. Specifically, two guide sleeves 24 are welded to the back of the positioning plate 2, which are respectively sleeved on the outside of the two straight plates 731 on the slotted plate 73. The straight plates 731 and the guide sleeves 24 are slidably connected. Among them, a toothed groove is opened on one side of the straight plate 731 to mesh with the gear 71. When the slotted plate 73 slides up and down, the meshing transmission between the toothed groove and the gear 71 drives the support shaft 41 to rotate, which in turn drives the rotating shaft 4 to rotate. When the rotating shaft 4 rotates, it can drive the magnet plate 6 to swing.
[0027] Furthermore, the control mechanism 7 includes a spring 72. A baffle 23 is welded to the top wall of the positioning plate 2, located above the channel plate 73. The baffle 23 is used to limit the top of the channel plate 73. One end of the baffle 23 is fixedly connected to the positioning plate 2 on one side and below the horizontal plate 732 on the channel plate 73 via an L-shaped plate 231. The spring 72 is located inside the L-shaped plate 231 and its top end abuts against the lower end face of the horizontal plate 732. Specifically, the bottom end of the spring 72 is fixedly connected to the bottom wall inside the L-shaped plate 231. The function of the spring 72 is to apply an upward elastic thrust to the horizontal plate 732, so that the upper end face of the horizontal plate 732 abuts against the baffle 23. When abutting, the magnet plate 6 is in the position of effectively magnetically attracting the patch capacitor. That is to say, the spring 72 plays a resetting role.
[0028] Working principle: In use, the solder bath is placed below the soldering rack. A row of surface-mount capacitors is pre-placed on the support plates 3 of multiple positioning plates 2. The surface-mount capacitors are supported and limited by the limiting slots 31, and are simultaneously attracted by the magnet plate 6 on the back of the positioning plates 2. The multiple positioning plates 2 with pre-loaded surface-mount capacitors are arranged on the table. When it is necessary to solder the leads of the surface-mount capacitors, one of the positioning plates 2 is first taken out and placed in the slot notch 11. The sliding tongue 25 is manually pushed into the slot 111 by the pivot 251. At this time, the positioning plate 2 is connected to the lifting plate 1. Then, the lifting plate 1 is controlled to descend, and the leads of the surface-mount capacitors are inserted into the molten solder in the solder bath. The soldering of the leads is then completed. Control the lifting plate 1 to rise, and then manually push the sliding tongue 25 in the opposite direction through the pivot 251. The sliding tongue 25 moves to the large end of the clearance notch 12, and pushes the entire positioning plate 2 forward to separate it from the lifting plate 1. Then, flip the separated positioning plate 2 and place it on top of the turnover box. Manually press the slot plate 73, the spring 72 is compressed, the gear 71 is pushed and rotated, and the rotating shaft 4 drives the magnet plate 6 to contact the chip capacitor. The magnetic attraction force on the chip capacitor will disappear, and at this time, a row of chip capacitors will fall directly into the turnover box. Connect the next positioning plate 2 with chip capacitors to the slot notch 11 in the same way as above, and then solder the pins. This cycle can be repeated to solder a large number of chip capacitors.
[0029] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A lead soldering device, comprising a lifting plate (1), characterized in that, The bottom of the lifting plate (1) is detachably connected to a positioning plate (2). The front side of the positioning plate (2) is fixedly connected to a support plate (3) located at the bottom. A row of limiting slots (31) is opened through the upper end surface of the support plate (3). The back of the positioning plate (2) is connected to a rotating shaft (4). The outer wall of the rotating shaft (4) is fixedly connected to a magnet plate (6) parallel to the rotating shaft (4) through a support plate (5). The back of the positioning plate (2) is provided with a notch (21) near the bottom. When the rotating shaft (4) rotates, it can drive the magnet plate (6) to enter and exit the notch (21). The back of the positioning plate (2) is provided with a control mechanism (7) for controlling the rotation of the rotating shaft (4).
2. The lead soldering device according to claim 1, characterized in that: The two ends of the rotating shaft (4) are welded with coaxial support shafts (41), and the back of the positioning plate (2) is welded with ear plates (22) located at both ends of the notch (21). The ear plates (22) are provided with positioning holes (221) that are rotatably connected to the support shaft (41).
3. The lead soldering device according to claim 2, characterized in that: The control mechanism (7) includes a gear (71) and a slotted plate (73). The gear (71) is fixedly sleeved on the support shaft (41). The slotted plate (73) is slidably disposed on the back of the positioning plate (2) and its two straight plates (731) mesh with the gears (71) at both ends of the rotating shaft (4).
4. The lead soldering device according to claim 3, characterized in that: The control mechanism (7) includes a spring (72). The top wall of the positioning plate (2) is welded with a baffle (23) located above the channel plate (73). One end of the baffle (23) is fixedly connected to the L-shaped plate (231) and the positioning plate (2) on one side and below the horizontal plate (732) on the channel plate (73). The spring (72) is located inside the L-shaped plate (231) and its top end abuts against the lower end face of the horizontal plate (732).
5. A lead soldering device according to claim 3, characterized in that: The back of the positioning plate (2) is welded with two guide sleeves (24) that are respectively fitted onto the outside of two straight plates (731) on the groove plate (73).
6. The lead soldering device according to claim 1, characterized in that: The bottom of the lifting plate (1) is provided with a groove-shaped notch (11), and slots (111) are provided on both sides of the groove-shaped notch (11). The two ends of the positioning plate (2) are provided with sliding tongues (25), and the sliding tongues (25) and slots (111) are connected by insertion.
7. A lead soldering device according to claim 6, characterized in that: The positioning plate (2) has grooves (26) at both ends. One end of the sliding tongue (25) is fitted into the groove (26). The front side of the lifting plate (1) has a connecting slot (111) and a clearance notch (12) of the groove notch (11). One side of the sliding tongue (25) is fixedly connected to a pivot shaft (251) that is compatible with the clearance notch (12). The clearance notch (12) is T-shaped.
Citation Information
Patent Citations
Lead tin brazing jig for chip inductor
CN223043787U