Polishing apparatus and polishing device

Abstract

The utility model discloses a polishing device and polishing equipment, polishing device includes: polishing disc, polishing liquid conveying arm, the downside of polishing liquid conveying arm is provided with a plurality of polishing liquid export, sets up a plurality of polishing liquid export on the orthographic projection of polishing disc connection as polishing liquid export projection connection, and the polishing liquid export projection connection is located the radial one side of the center of the polishing disc. Therefore, through setting up a plurality of along the radial interval setting of polishing disc polishing liquid export in the downside of polishing liquid conveying arm, and make the polishing liquid export projection connection be located the radial one side of the center of the polishing disc, and the one end of polishing liquid export projection connection is adjacent the center of the polishing disc, and the other end of polishing liquid export projection connection is adjacent the edge of the polishing disc, can increase the landing point coverage area of polishing liquid, shorten the radial diffusion distance of polishing liquid, make the distribution of polishing liquid on the polishing disc more uniform and comprehensive, thereby improve the uneven distribution problem of polishing liquid in the wafer polishing process, improve the polishing quality of wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a polishing apparatus and polishing equipment. Background Technology

[0002] In the semiconductor chemical mechanical polishing process, the supply status of the polishing slurry directly determines the polishing effect of the wafer. The polishing slurry needs to be sprayed evenly onto the surface of the polishing pad, and the polishing slurry delivery arm, as a slurry delivery device, is mainly used to deliver the polishing slurry to the corresponding area of ​​the polishing pad.

[0003] In related technologies, it is difficult to ensure the uniformity of the polishing slurry distribution on the polishing pad surface. This can easily lead to localized slurry shortages and uneven slurry thickness, resulting in uneven removal rates of material from the wafer surface and poor wafer polishing quality, which makes it difficult to meet the process requirements of high-precision semiconductor manufacturing. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. Therefore, one objective of this invention is to provide a polishing device with a more reliable structure, which allows for a more uniform and comprehensive distribution of polishing slurry on the polishing pad, improving the problem of uneven polishing slurry distribution during wafer polishing and enhancing the polishing quality of the wafer.

[0005] This utility model further proposes a polishing device.

[0006] The polishing device according to this utility model includes: a polishing disc; and a polishing liquid conveying arm. The polishing liquid conveying arm is spaced above the polishing disc. Multiple polishing liquid outlets are radially spaced along the lower side of the polishing liquid conveying arm. A line connecting the orthographic projections of the multiple polishing liquid outlets onto the polishing disc is defined as the polishing liquid outlet projection line. The polishing liquid outlet projection line is located on one radial side of the center of the polishing disc and extends radially along the polishing disc. The polishing device also includes a polishing liquid storage unit and a conveying pipe. The conveying pipe is disposed in the polishing liquid conveying arm. The outlet end of the conveying pipe is connected to the polishing liquid outlet. The inlet end of the conveying pipe extends at least partially from the polishing liquid conveying arm and into the polishing liquid storage unit. The inlet end of the conveying pipe is connected to the polishing liquid storage unit. There are multiple conveying pipes, each connected to one of the multiple polishing liquid outlets.

[0007] Therefore, by opening multiple polishing slurry outlets at radial intervals along the lower side of the polishing slurry delivery arm, and positioning the projection line of the polishing slurry outlets on one radial side of the center of the polishing slurry, with one end of the projection line adjacent to the center of the polishing slurry and the other end adjacent to the edge of the polishing slurry, the coverage area of ​​the polishing slurry landing point can be increased, the radial diffusion distance of the polishing slurry can be shortened, and the distribution of the polishing slurry on the polishing slurry on the polishing slurry can be made more uniform and comprehensive. This improves the problem of uneven distribution of polishing slurry during wafer polishing and enhances the polishing quality of the wafer.

[0008] In some examples of this utility model, one end of the projection line connecting the polishing liquid outlet corresponds to the center of the polishing disk, the other end of the projection line connecting the polishing liquid outlet corresponds to the edge of the polishing disk, and the length of the projection line connecting the polishing liquid outlet is equal to the radius of the polishing disk.

[0009] In some examples of this utility model, the polishing fluid delivery arm includes a first arm segment and a second arm segment. The first arm segment extends in the vertical direction and is spaced apart on the radial outer side of the polishing disk. The second arm segment is spaced apart above the polishing disk and one end is connected to the upper end of the first arm segment. The second arm segment extends radially along the polishing disk. The polishing fluid storage device is spaced apart below the first arm segment.

[0010] In some examples of this utility model, the polishing device further includes a primary three-way valve and an inlet pipe. The primary three-way valve has a first inlet, a first outlet, and a second outlet. The inlet end of the inlet pipe is connected to the polishing liquid storage device, and the outlet end of the inlet pipe is connected to the first inlet. There are multiple delivery pipes, and the inlet ends of two of the multiple delivery pipes are respectively connected to the first outlet and the second outlet.

[0011] In some examples of this utility model, the polishing device further includes a two-stage three-way valve and a diverter pipe. The two-stage three-way valve has a second inlet, a third outlet, and a fourth outlet. The first outlet and the second outlet are respectively connected to the liquid inlet ends of the two diverter pipes. The second inlets of the two two-stage three-way valves are respectively connected to the liquid outlet ends of the two diverter pipes. The third outlet and the fourth outlet are respectively connected to the liquid inlet ends of the two delivery pipes.

[0012] In some examples of this utility model, there are multiple primary three-way valves and multiple secondary three-way valves, with every two secondary three-way valves corresponding to one primary three-way valve.

[0013] In some examples of this utility model, the polishing device further includes a polishing head, which is located above the polishing disk and selectively close to or away from the polishing disk. The orthographic projection of the polishing head on the polishing disk and the orthographic projection of the plurality of polishing liquid outlets on the polishing disk are respectively located on both sides of the center of the polishing disk and are arranged at radial intervals along the polishing disk.

[0014] The polishing apparatus according to an embodiment of the present invention includes: the polishing device described above.

[0015] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the overall structure of the polishing device according to an embodiment of the present utility model; Figure 2 This is a partial structural schematic diagram of the polishing device according to an embodiment of the present utility model.

[0017] Figure label: 100. Polishing equipment; 10. Polishing disc; 20. Polishing fluid delivery arm; 201. Polishing fluid outlet; 202. First arm section; 203. Second arm section; 30. Polishing fluid storage unit; 40. Delivery pipe; 50. First-stage three-way valve; 501. First inlet; 502. First outlet; 503. Second outlet; 60. Liquid inlet pipe; 70. Two-stage three-way valve; 701. Second inlet; 702. Third outlet; 703. Fourth outlet; 80. Diverter tube; 90. Throwing head. Detailed Implementation

[0018] The embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present invention are described in detail below.

[0019] The following is for reference. Figures 1-2 The present invention describes a polishing apparatus 100 according to an embodiment of the present invention, which can be applied to polishing equipment.

[0020] Combination Figures 1-2As shown, the polishing device 100 according to this utility model mainly includes: a polishing disc 10 and a polishing liquid conveying arm 20. The polishing liquid conveying arm 20 is spaced above the polishing disc 10, and a plurality of polishing liquid outlets 201 are radially spaced on the lower side of the polishing liquid conveying arm 20 along the polishing disc 10. The line connecting the orthographic projections of the plurality of polishing liquid outlets 201 onto the polishing disc 10 is defined as the polishing liquid outlet projection line, which is located radially to one side of the center of the polishing disc 10 and extends radially along the polishing disc 10.

[0021] Specifically, multiple polishing slurry outlets 201 are arranged radially at intervals on the underside of the polishing slurry delivery arm 20, so that polishing slurry can fall onto the upper surface of the polishing disk 10 simultaneously from multiple different radial positions.

[0022] Furthermore, by setting the polishing slurry outlet projection line on one radial side of the center of the polishing disk 10, with one end of the polishing slurry outlet projection line adjacent to the center of the polishing disk 10 and the other end adjacent to the edge of the polishing disk 10, rather than having it pass through the center or be symmetrically arranged on both sides of the center, it can be ensured that the supply range of the polishing slurry covers almost the entire radial range of the polishing disk 10 from the center to the edge.

[0023] During the actual operation of the polishing device 100, the polishing liquid in the polishing liquid delivery arm 20 flows downward to the polishing disk 10 through each polishing liquid outlet 201. Since the orthographic projection of multiple polishing liquid outlets 201 on the polishing disk 10 is distributed along the radial direction from the center to the edge, the polishing liquid can simultaneously cover the radial area of ​​the polishing disk 10 from the center to the edge. Combined with the rotational movement of the polishing disk 10, the polishing liquid dripping onto the polishing disk 10 spreads outward in the circumferential direction. At the same time, the polishing liquid at each radial position also diffuses outward in the radial direction under the action of centrifugal force, so that the polishing liquid can cover the entire surface of the polishing disk 10.

[0024] Compared to the single-point outlet method of polishing slurry, this application supplies polishing slurry simultaneously through multiple outlets arranged radially. The polishing slurry does not need to rely entirely on the rotation of the disk to diffuse outward from a single point. This can reduce the radial diffusion distance of the polishing slurry on the polishing disk 10, reduce the concentration decay and uneven liquid film thickness that occur during the outward flow of the polishing slurry, reduce the situation of insufficient polishing slurry supply or polishing slurry accumulation in local areas of the disk, improve the uniformity of polishing slurry distribution on the polishing disk, and at the same time, increase the speed at which the polishing slurry diffuses and covers the polishing disk 10, thereby improving the working efficiency of the polishing device 100.

[0025] In this way, all areas of the wafer in contact with the polishing pad 10 can receive a sufficient and uniform supply of polishing fluid, which can improve the problem of uneven distribution of polishing fluid during wafer polishing, improve the consistency of polishing removal rate in different areas of the wafer, thereby improving the flatness and consistency of the wafer after polishing, and improving the polishing quality of the wafer.

[0026] Furthermore, by reasonably setting the spacing between adjacent polishing slurry outlets 201 and the flow rate of each outlet, the annular liquid supply trajectory formed by adjacent polishing slurry outlets 201 can form a moderate overlap at the junction, avoiding the formation of weak liquid supply areas or blind liquid supply areas due to excessively large liquid supply trajectory spacing, and avoiding the formation of polishing slurry accumulation areas due to excessively small liquid supply trajectory spacing, thus ensuring that the polishing slurry distribution density in the entire radial range of the polishing disk 10 tends to be consistent.

[0027] In some embodiments of this utility model, a plurality of polishing liquid outlets 201 disposed on the lower side of the polishing liquid conveying arm 20 are evenly distributed at equal intervals along the radial direction.

[0028] Therefore, by opening multiple polishing slurry outlets 201 radially spaced along the lower side of the polishing slurry delivery arm 20, and making the projection line of the polishing slurry outlets located on the radial side of the center of the polishing slurry 10, with one end of the projection line of the polishing slurry outlets adjacent to the center of the polishing slurry 10 and the other end adjacent to the edge of the polishing slurry 10, the coverage area of ​​the polishing slurry landing point can be increased, the radial diffusion distance of the polishing slurry can be shortened, and the distribution of the polishing slurry on the polishing slurry 10 can be made more uniform and comprehensive, thereby improving the problem of uneven distribution of polishing slurry during wafer polishing and improving the polishing quality of the wafer.

[0029] Combination Figure 1 and Figure 2 As shown, one end of the projection line connecting the polishing fluid outlet corresponds to the center of the polishing disk 10, and the other end corresponds to the edge of the polishing disk 10. The length of the projection line connecting the polishing fluid outlet is equal to the radius of the polishing disk 10.

[0030] Specifically, the orthographic projections of multiple polishing slurry outlets 201 are arranged along the complete radial radius of the polishing disk 10, and the outlet points cover the entire radial path from the center to the edge of the polishing disk 10. This not only allows the polishing slurry to completely cover the entire surface of the polishing disk 10 by relying on the rotation of the polishing disk 10, but also shortens the radial diffusion path of the polishing slurry, improves the uniformity of the distribution of the polishing slurry on the polishing disk 10, and thus improves the polishing quality of the wafer.

[0031] Combination Figure 1 and Figure 2As shown, the polishing apparatus 100 also includes a polishing liquid storage unit 30 and a delivery pipe 40. The delivery pipe 40 is disposed in the polishing liquid delivery arm 20. The liquid outlet end of the delivery pipe 40 is connected to the polishing liquid outlet 201. The liquid inlet end of the delivery pipe 40 extends at least partially from the polishing liquid delivery arm 20 and into the polishing liquid storage unit 30. The liquid inlet end of the delivery pipe 40 is connected to the polishing liquid storage unit 30.

[0032] Specifically, the polishing fluid storage unit 30 is used to store the polishing fluid, and the delivery pipe 40 is arranged inside the polishing fluid delivery arm 20. The polishing fluid is drawn from the polishing fluid storage unit 30 through the inlet end extending from the arm body, and then delivered to each polishing fluid outlet 201 through the delivery pipe 40. This not only enables the connection between the polishing fluid storage unit 30 and the polishing fluid outlet 201 through the delivery pipe 40, achieving continuous and stable delivery of the polishing fluid, but also effectively utilizes the internal space of the polishing fluid delivery arm 20 to provide physical protection and fixation for the delivery pipe 40, preventing the delivery pipe 40 from being damaged by scratches, bumps, etc., and extending the service life of the delivery pipe 40. At the same time, it also avoids the messy wiring and space occupation caused by the external placement of the delivery pipe 40, making the overall structure of the polishing device 100 more compact and aesthetically pleasing.

[0033] Combination Figure 1 and Figure 2 As shown, there are multiple delivery pipes 40, and each delivery pipe 40 is connected to a corresponding polishing liquid outlet 201.

[0034] Specifically, each delivery pipe 40 is independently connected to a polishing fluid outlet 201. Each delivery pipe 40 is independently arranged to deliver polishing fluid to the corresponding polishing fluid outlet 201. This enables the separate supply of polishing fluid to each outlet 201, avoiding the problems of flow interference and pressure disturbance that occur when multiple outlets share the same pipeline. This allows for individual control of the polishing fluid output flow of each outlet, reducing the phenomenon of insufficient output at distant outlets due to pipeline pressure drop. It also makes the output of polishing fluid from each outlet 201 more balanced, further improving the uniformity of polishing fluid supply at different positions in the radial direction of the polishing disc 10.

[0035] Moreover, even if a single delivery pipe 40 is blocked or leaks, it will not affect the normal liquid supply of the other delivery pipes 40, making it more tolerant of faults. During maintenance, the faulty delivery pipe 40 can be disassembled and installed separately, making maintenance convenient.

[0036] Combination Figure 1 and Figure 2As shown, the polishing slurry delivery arm 20 includes a first arm segment 202 and a second arm segment 203. The first arm segment 202 extends in the vertical direction and is spaced apart on the radial outer side of the polishing disk 10. The second arm segment 203 is spaced apart above the polishing disk 10 and one end is connected to the upper end of the first arm segment 202. The second arm segment 203 extends radially along the polishing disk 10. The polishing slurry storage unit 30 is spaced apart below the first arm segment 202.

[0037] Specifically, the polishing slurry delivery arm 20 has an overall L-shaped structure. The second arm segment 203 extends radially, allowing it to extend above the polishing disk 10 to facilitate the setting of the polishing slurry outlet 201 and ensure that the polishing slurry outlet 201 is aligned with the radial side of the center of the polishing disk 10. The first arm segment 202 extends vertically, providing stable support for the second arm segment 203. The polishing slurry storage unit 30 is arranged below the first arm segment 202, facilitating its placement and maintenance, including replenishment, inspection, and repair. The delivery pipe 40 extends upwards along the first arm segment 202 and connects to the interior of the second arm segment 203, enabling the delivery of polishing slurry from the polishing slurry storage unit 30 to the polishing slurry outlet 201.

[0038] Combination Figure 1 and Figure 2 As shown, the polishing device 100 also includes a primary three-way valve 50 and an inlet pipe 60. The primary three-way valve 50 has a first inlet 501, a first outlet 502 and a second outlet 503. The inlet end of the inlet pipe 60 is connected to the polishing liquid storage device 30, and the outlet end of the inlet pipe 60 is connected to the first inlet 501. There are multiple delivery pipes 40, and the inlet ends of two of the multiple delivery pipes 40 are respectively connected to the first outlet 502 and the second outlet 503.

[0039] Specifically, the polishing fluid inside the polishing fluid storage unit 30 is delivered to the first inlet 501 of the first-stage three-way valve 50 via the inlet pipe 60. After being diverted by the three-way valve, the fluid flows into the corresponding two delivery pipes 40 from the first outlet 502 and the second outlet 503, respectively. In this way, the polishing fluid can be diverted by a single inlet pipe 60 in conjunction with the first-stage three-way valve 50, eliminating the need for two separate inlet pipes 60. This simplifies the overall pipeline layout and reduces the number of pipeline fittings.

[0040] Furthermore, the first-stage three-way valve 50 can distribute the flow rate and pressure of the polishing fluid entering the two delivery pipes 40, reduce the supply disturbance between the two delivery pipes 40, ensure a relatively balanced supply of polishing fluid between the two delivery pipes 40, thereby improving the consistency of the discharge from each polishing fluid outlet 201 and making the distribution of polishing fluid on the polishing disc 10 more uniform. At the same time, the first-stage three-way valve 50 can also realize single-path on / off control. Therefore, according to the specific polishing process requirements, a single-path liquid supply or a two-path liquid supply can be selectively opened, improving the flexibility of use and process adaptability of the polishing device 100.

[0041] Combination Figure 1 and Figure 2 As shown, the polishing device 100 also includes a two-stage three-way valve 70 and a diverter pipe 80. The two-stage three-way valve 70 has a second inlet 701, a third outlet 702 and a fourth outlet 703. The first outlet 502 and the second outlet 503 are respectively connected to the liquid inlet ends of the two diverter pipes 80. The second inlet 701 of the two two-stage three-way valves 70 are respectively connected to the liquid outlet ends of the two diverter pipes 80. The third outlet 702 and the fourth outlet 703 are respectively connected to the liquid inlet ends of the two delivery pipes 40.

[0042] Specifically, after the polishing fluid flows out from the first outlet 502 and the second outlet 503 of the primary three-way valve 50, it enters the corresponding diversion pipe 80 and is then transported to the second inlet 701 of the corresponding secondary three-way valve 70. Each secondary three-way valve 70 then divides the polishing fluid in two and transports it to the corresponding delivery pipe 40 via the third outlet 702 and the fourth outlet 703. This allows for the gradual diversion of the polishing fluid. The primary three-way valve 50 completes the initial diversion, and the two sets of secondary three-way valves 70 achieve the secondary diversion. The supply needs of multiple delivery pipes 40 can be met with fewer main pipelines, which simplifies the overall pipeline layout and makes the overall pipeline layout more regular and reasonable.

[0043] Moreover, the step-by-step diversion method helps to balance the fluid pressure at the front end of each delivery pipe 40, reduce the pressure difference loss caused by long pipelines, reduce the difference in liquid flow rate between each polishing slurry outlet 201, and at the same time, each three-way valve 50 can adjust the on / off state of the corresponding branch, selectively open some delivery pipes 40 according to process requirements, flexibly adjust the number of outlets participating in the liquid supply, adapt to the usage requirements of different wafer sizes and different polishing processes for the range and total flow of polishing slurry supply, and ensure that the polishing slurry supply to the surface of the polishing disk 10 is uniform and stable.

[0044] Combination Figure 1 and Figure 2 As shown, there are multiple primary three-way valves 50 and secondary three-way valves 70, with every two secondary three-way valves 70 corresponding to one primary three-way valve 50.

[0045] Specifically, a single primary three-way valve 50 splits into two fluid streams, each connected to a corresponding secondary three-way valve 70, forming a flow distribution unit. These multiple flow distribution units are independently configured, with no crosstalk between them. This not only allows for control over the fluid supply to the multiple delivery pipes 40 and ensures uniform distribution of the polishing slurry on the polishing disc, but also facilitates group-based on / off control of the fluid supply. Based on the actual wetting requirements or process requirements of the polishing disc 10, the polishing slurry outlets 201 corresponding to certain valve groups can be selectively opened, flexibly adjusting the radial coverage area of ​​the polishing slurry. This allows for both large-area, full-area fluid supply and localized, targeted fluid supply, meeting the polishing slurry supply needs of wafers of different sizes and polishing processes. Furthermore, it facilitates troubleshooting, and an abnormality in one valve group will not directly affect the normal operation of other valve groups, improving the operational reliability of the polishing device 100.

[0046] Combination Figure 1 As shown, the polishing apparatus 100 also includes a polishing head 90, which is located above the polishing disk 10 and selectively close to or away from the polishing disk 10. The orthographic projection of the polishing head 90 on the polishing disk 10 and the orthographic projection of the plurality of polishing liquid outlets 201 on the polishing disk 10 are respectively located on both sides of the center of the polishing disk 10 and are arranged at intervals along the radial direction of the polishing disk 10.

[0047] Specifically, the polishing head 90 and the polishing slurry outlet 201 are respectively arranged on both radial sides of the center of the polishing disk 10. During the operation of the polishing device 100, the polishing slurry outlet 201 sprays polishing slurry downward on one radial side of the center of the polishing disk 10. After the polishing disk 10 rotates and the polishing slurry wets the upper surface of the polishing disk 10, the polishing head 90 drives the wafer to press down on the other radial side of the center of the polishing disk 10, so that the wafer under the polishing head 90 is pressed against the upper surface of the polishing disk 10. In this way, the outlet position of the polishing slurry and the processing position of the wafer are staggered, avoiding the polishing slurry from directly spraying or rinsing the wafer, preventing the high-speed flowing polishing slurry from impacting and disturbing the wafer posture, and reducing the risk of wafer displacement or warping.

[0048] In some embodiments of this utility model, a polishing pad is provided on the polishing disk 10, and the wafer does not directly contact the polishing disk 10, but is pressed on the upper surface of the polishing pad for polishing.

[0049] In some other embodiments of this utility model, the orthographic projection of the polishing head 90 on the polishing disk 10 and the orthographic projection of the plurality of polishing liquid outlets 201 on the polishing disk 10 are arranged at intervals along the circumference of the polishing disk 10.

[0050] The polishing equipment according to this utility model may mainly include: the polishing device 100 mentioned above.

[0051] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0052] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0053] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A polishing apparatus, characterized in that, include: Polishing disc (10); Polishing slurry delivery arm (20) is spaced above the polishing disk (10). The lower side of the polishing slurry delivery arm (20) is provided with a plurality of polishing slurry outlets (201) spaced radially along the polishing disk (10). The line connecting the orthographic projections of the plurality of polishing slurry outlets (201) on the polishing disk (10) is defined as the polishing slurry outlet projection line. The polishing slurry outlet projection line is located on one radial side of the center of the polishing disk (10). The polishing slurry outlet projection line extends radially along the polishing disk (10). The polishing slurry storage unit (30) and the delivery pipe (40) are provided in the polishing slurry delivery arm (20). The outlet end of the delivery pipe (40) is connected to the polishing slurry outlet (201). The inlet end of the delivery pipe (40) extends at least partially from the polishing slurry delivery arm (20) and into the polishing slurry storage unit (30). The inlet end of the delivery pipe (40) is connected to the polishing slurry storage unit (30). There are multiple delivery pipes (40), and each delivery pipe (40) is connected to a corresponding polishing liquid outlet (201).

2. The polishing apparatus according to claim 1, characterized in that, One end of the projection line connecting the polishing liquid outlet corresponds to the center of the polishing disk (10), and the other end of the projection line corresponds to the edge of the polishing disk (10). The length of the projection line connecting the polishing liquid outlet is equal to the radius of the polishing disk (10).

3. The polishing apparatus according to claim 1, characterized in that, The polishing fluid delivery arm (20) includes a first arm segment (202) and a second arm segment (203). The first arm segment (202) extends in the vertical direction and is spaced apart on the radial outer side of the polishing disk (10). The second arm segment (203) is spaced apart above the polishing disk (10) and one end is connected to the upper end of the first arm segment (202). The second arm segment (203) extends radially along the polishing disk (10). The polishing fluid storage device (30) is spaced apart below the first arm segment (202).

4. The polishing apparatus according to claim 1, characterized in that, It also includes a first-stage three-way valve (50) and an inlet pipe (60). The first-stage three-way valve (50) has a first inlet (501), a first outlet (502), and a second outlet (503). The inlet end of the inlet pipe (60) is connected to the polishing liquid storage device (30), and the outlet end of the inlet pipe (60) is connected to the first inlet (501). There are multiple delivery pipes (40), and the inlet ends of two of the multiple delivery pipes (40) are respectively connected to the first outlet (502) and the second outlet (503).

5. The polishing apparatus according to claim 4, characterized in that, It also includes a two-stage three-way valve (70) and a diverter pipe (80). The two-stage three-way valve (70) has a second inlet (701), a third outlet (702) and a fourth outlet (703). The first outlet (502) and the second outlet (503) are respectively connected to the liquid inlet end of the two diverter pipes (80). The second inlet (701) of the two two-stage three-way valves (70) are respectively connected to the liquid outlet end of the two diverter pipes (80). The third outlet (702) and the fourth outlet (703) are respectively connected to the liquid inlet end of the two delivery pipes (40).

6. The polishing apparatus according to claim 5, characterized in that, There are multiple primary three-way valves (50) and secondary three-way valves (70), with each pair of secondary three-way valves (70) corresponding to one primary three-way valve (50).

7. The polishing apparatus according to claim 1, characterized in that, It also includes a polishing head (90), which is located above the polishing disk (10) and selectively close to or away from the polishing disk (10). The orthographic projection of the polishing head (90) on the polishing disk (10) and the orthographic projection of the plurality of polishing liquid outlets (201) on the polishing disk (10) are respectively located on both sides of the center of the polishing disk (10) and are arranged at radial intervals along the polishing disk (10).

8. A polishing device, characterized in that, include: The polishing apparatus according to any one of claims 1-7.

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