Brazed spiral wire diamond polishing head

Abstract

The utility model discloses a brazing spiral line type diamond polishing head, including base pole and grinding part, the grinding part is cylinder, its coaxial setting is at the top of base pole, the top surface and side surface of grinding part are working surface, the top surface of grinding part is equipped with the recess of radioactivity spiral line type, and it is first chip groove, the side surface of grinding part is equipped with a plurality of recesses of spiral line type along the axial direction, and it is second chip groove, the spiral line type convex stripe of working surface on grinding part relative to first chip groove and second chip groove and protruding is brazing diamond layer, the utility model effectively solves the problem that diamond grinding head is inconvenient to chip, and the heat dissipation is poor, and the problem such as quick wearing, and the service life of diamond grinding head is improved obviously.

Description

Technical Field

[0001] This utility model relates to the field of diamond tool technology, specifically to a brazed spiral diamond grinding head. Background Technology

[0002] Diamond grinding heads, as core tools for high-precision grinding operations, have a structural design that directly determines their grinding performance. They are primarily composed of three parts: the matrix, the diamond abrasive layer, and the binder. The matrix, serving as the supporting framework of the grinding head, requires material selection suitable for different processing scenarios: metal matrices (such as carbon steel and stainless steel) are suitable for heavy-duty stone grinding due to their high strength and impact resistance; resin matrices are lightweight and have low vibration, making them more suitable for the fine processing of brittle materials such as glass; ceramic matrices possess excellent high-temperature resistance, capable of handling the thermal loads of high-speed grinding. The abrasive layer is the core execution part of the grinding operation, using high-hardness synthetic diamond as the main raw material—this type of diamond undergoes precise screening, resulting in high particle uniformity and stable sharpness, effectively meeting the cutting needs of difficult-to-machine materials such as stone, glass, and cemented carbide. Adhesives act as a "connecting link," firmly fixing the abrasive layer to the substrate surface. Common resin binders have good elasticity and excellent polishing effect, metal binders have high bonding strength and strong wear resistance, while ceramic binders have both high temperature resistance and chemical stability. These three types correspond to different grinding scenarios.

[0003] Most diamond grinding heads currently on the market adopt a cylindrical body design, with a complete grinding working surface on the side, usually covered by diamond. While this structure can ensure the grinding area, it has obvious drawbacks: the full coverage of diamond results in a lack of effective clearance on the working surface, making it difficult for the chips generated during grinding to be discharged. These chips tend to accumulate between the working surface and the workpiece, which not only increases grinding resistance and reduces machining accuracy, but also prevents the timely dissipation of grinding heat. This heat is simultaneously transferred to both the grinding head and the workpiece. The grinding head is exposed to a high-temperature environment for a long time, which accelerates the aging of the adhesive and shortens its service life. The workpiece may crack or deform due to thermal stress, especially affecting heat-sensitive materials such as glass and cemented carbide. Utility Model Content

[0004] To address the technical problems existing in the prior art, the purpose of this utility model is to provide a brazed spiral diamond grinding head, which effectively solves the problems of inconvenient chip removal, poor heat dissipation, and rapid wear of diamond grinding heads, and significantly improves the service life of diamond grinding heads.

[0005] The objective of this utility model is achieved through the following technical solution: a brazed spiral diamond grinding head, comprising a base rod and a grinding part, wherein the grinding part is a cylinder coaxially disposed on the top of the base rod, and the top surface and side surface of the grinding part are working surfaces; the top surface of the grinding part is provided with radial spiral grooves, which are first chip removal grooves; the side surface of the grinding part is provided with multiple spiral grooves along the axial direction, which are second chip removal grooves; the spiral ridges on the working surface of the grinding part that protrude relative to the first and second chip removal grooves are brazed diamond layers.

[0006] Furthermore, the second chip removal groove passes through the top and bottom edges of the side surface. The first and second chip removal grooves correspond one-to-one and are interconnected at the junction of the side surface and the top surface, forming multiple chip removal channels.

[0007] Furthermore, the top surface of the grinding part is recessed in the middle to form a recessed area, the second chip removal groove is a groove that radiates outward from the recessed area, and the first chip removal groove penetrates the recessed area and the outer periphery of the top surface; the spiral-shaped protrusion on the working surface of the grinding part that protrudes relative to the recessed area, the first chip removal groove and the second chip removal groove is a brazed diamond layer.

[0008] Specifically, the brazed diamond layer is formed by selectively brazing solder and diamond powder regions.

[0009] Preferably, the diamond particle size is selected from 30 to 400 mesh, the adhesive is water-based, and the solder is nickel-based, silver-based, or copper-based.

[0010] Specifically, the recessed area is a circular groove with a diameter of 1.8~2.5mm; the area ratio of the recessed area to the top surface is 0.22~0.53:1.

[0011] Specifically, the helix angle θ of the second chip removal groove is 65.8°, and the pitch P is... h =100.

[0012] Specifically, the second chip removal groove has a groove width of 3mm and a groove depth of 1mm.

[0013] Specifically, the starting pitch of the spiral of the first chip removal groove is 0.93 mm, the ending pitch is 3.11 mm, and the spiral angle is 30°.

[0014] Specifically, the depth of the first chip removal groove is 1 mm.

[0015] Compared with the prior art, the present invention has at least the following beneficial effects:

[0016] 1. This utility model changes the complete working surface of the cylindrical grinding section to a spiral distribution, dividing the original single working surface into multiple independent spiral grinding units. Uniform gaps naturally form between these units, i.e., chip removal grooves. This improvement brings dual advantages: firstly, the chip removal grooves provide a smooth discharge channel for chips, preventing chip accumulation from affecting processing; secondly, the chip removal grooves increase the contact area between the working surface and air, while facilitating coolant penetration, significantly improving heat dissipation efficiency, effectively reducing the temperature of the grinding head and workpiece. This extends the service life of the grinding head and prevents workpiece damage due to high temperatures, significantly improving the stability and processing quality of the grinding operation.

[0017] 2. The chip removal channel of this utility model is unobstructed, which facilitates the collection of waste chips generated during grinding. At the same time, the chip removal channel and the recessed area connect the top center of the grinding part with the outer periphery and the two ends of the side, which facilitates the discharge of grinding waste chips and avoids the accumulation of waste chips.

[0018] 3. The design of the double-sided chip removal groove of this utility model is more suitable for grinding straight holes, and can improve the smoothness of the bottom of the hole to a certain extent by reducing the waste chips at the bottom of the hole as the grinding head rotates. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model.

[0020] Figure 2 This is another perspective view of the present invention.

[0021] Figure 3 This is a top view of the present invention.

[0022] Figure 4 This is a side view of the present invention.

[0023] Figure 5 This is a schematic diagram of the structure of the isolation tape of this utility model.

[0024] In the picture:

[0025] 10-Base rod, 20-Grinding part, 21-Top surface, 213-Recessed area, 215-First chip removal groove, 22-Side side, 226-Second chip removal groove, 27-Bracketed diamond layer. Detailed Implementation

[0026] To facilitate understanding of this utility model, the technical solutions and advantages of the utility model will be further described in detail below with reference to the accompanying drawings and embodiments. Any mechanisms or methods not elaborated in this utility model can be referred to in the prior art. The specific structures and features of this utility model are illustrated below by way of example and should not constitute any limitation on this utility model. Furthermore, any technical feature mentioned below (including implicit or disclosed features), as well as any technical feature directly shown or implied in the figures, can be arbitrarily combined or deleted among these technical features to form more other embodiments that may not be directly or indirectly mentioned in this utility model. The accompanying drawings show preferred embodiments of this utility model. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0027] like Figure 1-4 As shown, the brazed spiral diamond grinding head of this embodiment includes a base rod 10 and a grinding part 20. The grinding part 20 is a cylinder and is coaxially disposed on the top of the base rod 10.

[0028] The grinding section 20 includes a circular top surface 21 and an arc-shaped side surface 22. The top edge of the side surface 22 is connected to the outer periphery of the top surface 21. The top surface 21 and the side surface 22 are the working surfaces of the grinding section 20. A recessed area 213 is formed in the middle of the top surface 21 of the grinding section 20. The recessed area 213 is a circular groove, and it is concentric with the circular top surface 21. Multiple spiral grooves radiate outward from the recessed area 213 from the top surface 21 of the grinding section 20. These are first chip removal grooves 215, which penetrate the recessed area 213 and the outer periphery of the top surface 21 to facilitate chip removal. Multiple spiral grooves are provided axially on the side surface 22 of the grinding section 20. These are second chip removal grooves 226, which penetrate the top and bottom edges of the side surface 22 to facilitate chip removal. The first chip removal groove 215 and the second chip removal groove 226 correspond one-to-one and are interconnected at the junction of the side surface 22 and the top surface 21 to form multiple chip removal channels.

[0029] In this preferred embodiment, the diameter of the recessed area 213 is 1.8~2.5mm; the ratio of the area of ​​the recessed area 213 to the area of ​​the top surface 21 is 0.22~0.53:1.

[0030] The spiral of the first chip removal groove 215 has an initial pitch of 0.93 mm, an ending pitch of 3.11 mm, and a spiral angle of 30°. The groove depth of the first chip removal groove 215 is 1 mm.

[0031] In this preferred embodiment, the helix of the second chip removal groove 226 has a helix angle θ = 65.8° and a pitch P.h =100. The width of the second chip removal groove 226 is 3mm and the depth is 1mm.

[0032] The spiral-shaped protrusions on the working surface of the grinding section 20, which are raised relative to the recessed area 213, the first chip removal groove 215 and the second chip removal groove 226, are brazed diamond layers 27. The brazed diamond layers 27 are formed by selective brazing of solder and diamond powder areas.

[0033] The following uses the side of the ground part as an example to illustrate the specific steps for forming the brazed diamond layer, in the following order:

[0034] (1) Apply isolation tape: Use such as Figure 5 The isolation tape with strip-shaped cutouts shown is attached to the working surface of the grinding section. The purpose of the isolation tape is to prevent glue from flowing into the chip removal groove during the application of glue, thus ensuring the integrity of the chip removal groove.

[0035] (2) First application of glue: Use a small brush to apply glue evenly to the surface of the grinding section that is not covered by tape;

[0036] (3) First application of welding powder: Use a feeder to evenly apply welding powder to the areas on the grinding section that have been coated with glue;

[0037] (4) Second application of glue: Repeat step (2);

[0038] (5) Sprinkle diamond powder: Sprinkle diamond powder evenly;

[0039] (6) Third application of glue: Repeat step (2);

[0040] (7) Second welding powder: Repeat step (3), and after completion, let it sit for 10 to 15 minutes to allow the glue to dry completely before proceeding to the next step;

[0041] (8) Brazing: The semi-finished product after step (7) is sent into a vacuum brazing furnace for brazing and then taken out to obtain the finished product.

[0042] The diamond grit size is selected from 30 to 400 mesh. The adhesive is water-based, such as water-based epoxy resin or water-based acrylic resin. The solder is nickel-based, silver-based, or copper-based.

[0043] A brazed diamond layer is formed by region-selective brazing. This brazed diamond layer protrudes upwards relative to the surface, and the spiral lines between the protrusions form a spiral groove, which is the second chip removal groove. The recessed area on the top surface is obtained in the same way as the first chip removal groove.

[0044] Compared to existing technologies, the brazed spiral diamond grinding head of this embodiment changes the complete working surface of the cylindrical body in existing technologies to a spiral distribution, dividing the original single working surface into multiple independent spiral grinding units, with uniform gaps naturally formed between the units. By setting chip removal grooves and recessed areas on the working surface of the grinding section, certain gaps are left between the spiral lines formed by the brazed diamond layers, i.e., each chip removal groove, to facilitate the containment of grinding waste chips. At the same time, the chip removal channels and recessed areas connect the top center of the grinding section with the outer periphery and both ends of the side surfaces, facilitating the discharge of grinding waste chips and preventing chip accumulation.

[0045] In addition, since there are certain gaps between the spiral lines formed by each brazed diamond layer, each chip removal groove can increase the contact area between the working surface of the grinding part and the air, thereby greatly improving the heat dissipation efficiency of the grinding head, effectively reducing the temperature of the grinding head and the workpiece, which can not only extend the service life of the grinding head, but also prevent the workpiece from being damaged by high temperature, significantly improving the stability of grinding operations and processing quality.

[0046] Furthermore, this embodiment not only provides chip removal grooves on the side of the grinding section but also on the top surface. The chip removal grooves on both surfaces serve the same function, effectively removing chips and dissipating heat. The dual-surface chip removal groove design further enhances chip removal during hole grinding. During grinding, waste chips at the bottom of the hole accumulate in the middle of the grinding head, specifically in the recessed area. Then, as the grinding head rotates, they are discharged from the first chip removal groove on the top surface to the second chip removal groove on the side. This dual-surface chip removal groove design is more suitable for grinding straight holes and can improve the surface finish of the hole bottom to a certain extent by reducing the waste chips that rotate with the grinding head. Even designing spiral grooves on a conical grinding head cannot achieve this effect.

[0047] The above embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of protection of the present utility model. For those skilled in the art, it will be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A brazed spiral diamond grinding head, comprising a base rod and a grinding section, wherein the grinding section is a cylinder coaxially disposed on the top of the base rod, and the top surface and side surface of the grinding section are working surfaces; characterized in that, The top surface of the grinding part is provided with a radial spiral groove, which is the first chip removal groove; the side surface of the grinding part is provided with multiple spiral grooves along the axial direction, which are the second chip removal grooves; the spiral ridges on the working surface of the grinding part that are raised relative to the first and second chip removal grooves are brazed diamond layers.

2. The brazed spiral diamond grinding head as described in claim 1, characterized in that, The second chip removal groove passes through the top and bottom edges of the side surface, and the first and second chip removal grooves correspond one-to-one and are interconnected at the junction of the side surface and the top surface to form multiple chip removal channels.

3. The brazed spiral diamond grinding head as described in claim 1, characterized in that, The top surface of the grinding part is recessed in the middle to form a recessed area. The second chip removal groove is a groove that radiates outward from the recessed area. The first chip removal groove passes through the recessed area and the outer periphery of the top surface. The spiral-shaped protrusion on the working surface of the grinding part that protrudes relative to the recessed area, the first chip removal groove and the second chip removal groove is a brazed diamond layer.

4. The brazed spiral diamond grinding head as described in claim 3, characterized in that, The brazed diamond layer is formed by selectively brazing solder and diamond powder regions.

5. The brazed spiral diamond grinding head as described in claim 4, characterized in that, The diamond particle size is selected from 30 to 400 mesh, the adhesive is water-based, and the solder is nickel-based, silver-based, or copper-based.

6. The brazed spiral diamond grinding head as described in claim 3, characterized in that, The recessed area is a circular groove with a diameter of 1.8~2.5mm; the area ratio of the recessed area to the top surface is 0.22~0.53:

1.

7. The brazed spiral diamond grinding head as described in claim 1, characterized in that, The helix angle θ of the second chip removal groove is 65.8°, and the pitch P is... h =100.

8. The brazed spiral diamond grinding head as described in claim 1, characterized in that, The second chip removal groove has a width of 3mm and a depth of 1mm.

9. The brazed spiral diamond grinding head as described in claim 1, characterized in that, The initial pitch of the spiral of the first chip removal groove is 0.93 mm, the final pitch is 3.11 mm, and the spiral angle is 30°.

10. The brazed spiral diamond grinding head as described in claim 1, characterized in that, The depth of the first chip removal groove is 1 mm.

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