Memory plug-in jig convenient to disassemble

CN224867247UActive Publication Date: 2026-10-20NANNING TEKTRONIX SEMICON CO LTD
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Patent Information

Application Number
CN202522272662.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-27
Publication Date
2026-10-20
Estimated Expiration
2035-10-27

AI Technical Summary

Technical Problem

[0002]现有的内存插拔治具体积过大,无法满足现有测试主板的使用需求,且目前使用人工手动按压内存条,容易导致服务器主板受力不均,经过反复多次的插拔作业,很可能损坏服务器主板,造成极大经济损失

Benefits of technology

[0016]本申请实施例通过优化导向结构和耳槽耳扣的设计,将治具设计为薄型结构,减少治具整体体积,适配高密度的主板布局,治具整体固定在温腔结构件上,将插拔力分散至主板固定螺丝孔,降低对内存插槽及周边元器件的应力集中风险,采用锁扣结构,可实现单手无工具拆卸。

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Abstract

The application relates to a detachable memory plug-in jig, which comprises an auxiliary memory pulling jig and an auxiliary memory inserting jig. The auxiliary memory pulling jig comprises a first pressing block and a first buckle, and the inner surface of the first pressing block is movably connected with the first buckle through a first rotating rod. The rotating rod mainly realizes the rotating fixation of the buckle in the whole jig. The auxiliary memory inserting jig comprises a second pressing block and a second buckle, and the inner surface of the second pressing block is movably connected with the second buckle through the first rotating rod. The utility model is designed as a thin structure through the optimization of a guide structure and the design of an ear slot and an ear buckle, the overall volume of the jig is reduced, the high-density mainboard layout is adapted, the whole jig is fixed on a warm cavity structure member, the plug-in and pull-out force is dispersed to the mainboard fixing screw holes, the stress concentration risk of the memory slot and the surrounding components is reduced, the lock buckle structure is adopted, and one-hand tool-free disassembly can be realized.
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Description

Technical Field

[0001] This application relates to the field of memory insertion and removal fixtures, and more particularly to a memory insertion and removal fixture that is easy to disassemble. Background Technology

[0002] The existing memory insertion and removal fixtures are too large to meet the needs of the current test motherboards. Furthermore, the current method of manually pressing the memory modules can easily lead to uneven stress on the server motherboard. Repeated insertion and removal operations may damage the server motherboard and cause significant economic losses.

[0003] Therefore, existing technologies have shortcomings and need to be improved. Summary of the Invention

[0004] This application provides a memory insertion and removal fixture that is easy to disassemble, in order to solve the above-mentioned problems.

[0005] In a first aspect, this application provides a memory insertion and removal fixture that is easy to disassemble, including an auxiliary memory removal fixture and an auxiliary memory insertion fixture. The auxiliary memory removal fixture includes a first pressing block and a first latch, and the inner surface of the first pressing block is movably connected to the first latch via a first rotating rod. The rotating rod mainly performs the function of rotating and fixing the latch in the entire fixture. The auxiliary memory insertion fixture includes a second pressing block and a second latch, and the inner surface of the second pressing block is movably connected to the second latch via the first rotating rod.

[0006] Preferably, pre-drilled holes are provided at the connection points of the second pressure block and the first rotating rod, and at the connection points of the first pressure block and the first rotating rod. The middle of the first and second handles is hollowed out, and the handle position is rounded to avoid discomfort to the operator caused by sharp edges and optimize the user experience. The hollow size of the first handle is 30mm, and the hollow size of the second handle is 130*1215mm, which can comfortably accommodate two fingers, making it easy to grip and operate. This conforms to ergonomic design and improves the convenience and comfort of operation.

[0007] Preferably, a first slider is inserted into the right side of the first handle to achieve linkage, and a lifting piece is connected to the right side of the first slider by a second screw. A positioning block is fixedly connected to the right side of both the first handle and the right side of the first slider.

[0008] Preferably, the left side of the first slider and the upper end of the inner surface of the lifting piece are provided with positioning grooves that are compatible with the positioning block to reduce assembly deviation. The lifting piece has four slots with a center distance of 7.2mm between adjacent slots, which matches the spacing of the memory slots on the server motherboard, ensuring installation accuracy. Each slot is 5.7mm wide, and the maximum thickness of the memory module is about 3.5mm, leaving enough space to prevent the memory module from being damaged by scratching or bumping against the components on the PCB board during use. The structure is safe and reliable.

[0009] Preferably, the front and rear sides of the outer surface of the first pressure block are connected to the first fixing plate by the first screw, the inner surface of the first fixing plate is snapped with the first snap, the inner side of the first snap is fixedly connected with the first spring, and the end of the first spring is fixedly connected to the surface of the first pressure block.

[0010] Preferably, the front and rear sides of the outer surface of the second pressure block are connected to a second fixing plate by a third screw. The inner surface of the second fixing plate is snapped with a second snap, and the inner side of the second snap is fixedly connected with a second spring, and the end of the second spring is fixedly connected to the surface of the second pressure block.

[0011] Preferably, both the first and second snaps are hollow structures. A protruding rod is fixedly connected to the surface of the first pressure block and the inner side of the first spring, and to the surface of the second pressure block and the inner side of the second spring. This rod can limit the movement of the first and second snaps during pressing, preventing them from detaching from the surfaces of the first and second pressure blocks. Furthermore, both the first and second snaps have locking positions at their bottoms, which can engage with grooves cut into the side walls of the temperature chamber structure to prevent the fixture from shifting left or right during use, achieving precise alignment. This fixing method is more flexible in disassembly and assembly, and easier to maintain and replace compared to the traditional method of using screws to lock the entire fixture to the fixed base plate.

[0012] Preferably, the bottom of the second pressure block is connected to a guide plate by a fourth screw, and both ends of the top of the guide plate are fixedly connected to protruding rods, and the bottom of the second pressure block is provided with a slot that matches the protruding rods.

[0013] Preferably, the guide plate has 4 slots, with a center-to-center distance of 18.13mm between each slot, which is compatible with the spacing of memory slots on the server motherboard. The slot width is 11.16mm, and the design retains a safe distance, which can both meet the guiding function and prevent collisions with electrical components on the memory module.

[0014] Preferably, the inner surface of the second handle is connected to a pressure plate by a third screw. The upper end of the inner surface of the pressure plate has two fixing holes. By adjusting the installation position of the third screw, it can be adapted to memory modules of different heights, increasing the versatility of the fixture. The bottom of the pressure plate is movably connected to a round block by a second rotating rod, which can play a buffering role during the pressing process, absorbing part of the impact force and avoiding damage to the memory module. A reserved groove is provided at the connection between the pressure plate and the round block. There are four round blocks, and the center distance between each round block is aligned with the center distance between the memory modules.

[0015] The technical solutions provided in this application have the following advantages compared with the prior art:

[0016] This application embodiment optimizes the design of the guide structure and ear slot and ear clip, making the fixture a thin structure, reducing the overall size of the fixture, adapting to high-density motherboard layout, and fixing the entire fixture on the temperature cavity structure component, distributing the insertion and extraction force to the motherboard fixing screw holes, reducing the risk of stress concentration on memory slots and surrounding components, and adopting a locking structure, which can achieve one-handed tool-free disassembly. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0020] Figure 1 This is a three-dimensional structural diagram of the auxiliary memory removal fixture of this utility model;

[0021] Figure 2 This is a schematic diagram of the main structure of the auxiliary memory removal fixture of this utility model;

[0022] Figure 3 This is a cross-sectional view of the auxiliary memory removal fixture of this utility model;

[0023] Figure 4 This is a three-dimensional structural diagram of the auxiliary memory insertion fixture of this utility model;

[0024] Figure 5 This is a cross-sectional view of the auxiliary memory insertion fixture of this utility model.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1. First handle 2. First pressure block 3. First fixing plate 4. First screw 5. First snap 6. Lifting plate 7. Second screw 8. First slider 9. First rotating rod 10. First spring 11. Second handle 12. First rotating rod 13. Second pressure block 14. Second fixing plate 15. Third screw 16. Second snap 17. Guide plate 18. Second rotating rod 19. Round block 20. Lower pressure plate 21. Fourth screw 22. Second spring Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0029] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0030] To address the technical problems in the prior art, this application provides a memory insertion and removal fixture that is easy to disassemble. By optimizing the guide structure and the design of the ear slots and ear clips, the fixture is designed to be thin, reducing the overall size of the fixture and adapting to high-density motherboard layouts. The fixture is fixed to the temperature cavity structure, distributing the insertion and removal force to the motherboard fixing screw holes, reducing the risk of stress concentration on the memory slots and surrounding components. The locking structure allows for one-handed, tool-free disassembly.

[0031] Example 1:

[0032] Please see Figure 1 , Figure 3 and Figure 4 The following technical solution is provided, specifically disclosing: an auxiliary memory removal fixture and an auxiliary memory insertion fixture. The auxiliary memory removal fixture includes a first pressing block 2 and a first latch 1, and the inner surface of the first pressing block 2 is movably connected to the first latch 1 via a first rotating rod 9. The rotating rod 9 mainly performs the rotational fixing function of the latch 1 in the entire fixture. The auxiliary memory insertion fixture includes a second pressing block 13 and a second latch 11, and the inner surface of the second pressing block 13 is movably connected to the second latch 11 via a first rotating rod 12. The second pressing block 13 is connected to the first latch 11 via a first rotating rod 12. Pre-drilled holes are provided at the connection points of the rotating rod 12 and the first pressure block 2 and the first rotating rod 9. The middle of the first handle 1 and the second handle 11 are hollowed out, and the handle position is rounded to avoid discomfort to the operator caused by sharp edges and optimize the user experience. The hollow size of the first handle 1 is 30mm, and the hollow size of the second handle 11 is 130*1215mm, which can comfortably accommodate two fingers, making it easy to hold and operate. It conforms to ergonomic design and improves the convenience and comfort of operation.

[0033] Example 2:

[0034] Please see Figure 1 The first latch 1 has a first slider 8 inserted into its right side for linkage. The right side of the first slider 8 is connected to a lifting piece 6 via a second screw 7. Positioning blocks are fixedly connected to the right side of both the first latch 1 and the right side of the first slider 8. Positioning grooves that match the positioning blocks are opened on the left side of the first slider 8 and the upper end of the inner surface of the lifting piece 6 to reduce assembly deviation. The lifting piece 6 has four slots with a center-to-center distance of 7.2mm between adjacent slots, matching the spacing of memory slots on the server motherboard to ensure installation accuracy. Each slot is 5.7mm wide, and the maximum thickness of the memory module is approximately 3.5mm, leaving sufficient space to prevent scratching or bumping the components on the PCB board during use, which could damage the memory module. The structure is safe and reliable.

[0035] Example 3:

[0036] Please see Figure 1 , Figure 2 , Figure 4 and Figure 5The first pressure block 2 has a first fixing plate 3 connected to both the front and rear sides of its outer surface by a first screw 4. A first snap 5 is engaged with the inner surface of the first fixing plate 3. A first spring 10 is fixedly connected to the inner side of the first snap 5, and the end of the first spring 10 is fixedly connected to the surface of the first pressure block 2. The second pressure block 13 has a second fixing plate 14 connected to both the front and rear sides of its outer surface by a third screw 15. A second snap 16 is engaged with the inner surface of the second fixing plate 14. A second spring 22 is fixedly connected to the inner side of the second snap 16, and the end of the second spring 22 is fixedly connected to the surface of the second pressure block 13. Both the first snap 5 and the second snap 16 are... The hollow structure has protruding rods fixedly connected to the surface of the first pressure block 2 and the inner side of the first spring 10, and the surface of the second pressure block 13 and the inner side of the second spring 22. These protruding rods can limit the first snap button 5 and the second snap button 16 when pressed, preventing them from falling off the surfaces of the first pressure block 2 and the second pressure block 13. The bottom of the first snap button 5 and the second snap button 16 are provided with buckle positions, which can be combined with the grooves on the side wall of the temperature cavity structure to prevent the fixture from moving left and right during use and to achieve precise alignment. Compared with the traditional method of using screws to lock the entire fixture to the fixed base plate, this fixing method is more flexible in disassembly and assembly, and is easier to maintain and replace.

[0037] Example 4:

[0038] Please see Figure 4 The bottom of the second pressure block 13 is connected to a guide plate 17 via a fourth screw 21. Both ends of the top of the guide plate 17 are fixedly connected to protruding rods, and the bottom of the second pressure block 13 has slots that match the protruding rods. The guide plate 17 has four slots, each with a center-to-center distance of 18.13mm, adapting to the memory slot spacing on the server motherboard. The slot width is 11.16mm, a design that maintains a safe clearance, satisfying the guiding function while preventing damage to electrical components on the memory module. The inner surface of the second latch 11 is connected to a third screw 15. The lower pressure plate 20 has two fixing holes on the upper end of its inner surface. By adjusting the installation position of the third screw 15, it can be adapted to memory modules of different heights, increasing the versatility of the fixture. The bottom of the lower pressure plate 20 is movably connected to a round block 19 through the second rotating rod 18, which can play a buffering role during the pressing process, absorbing part of the impact force and avoiding damage to the memory module. A reserved groove is provided at the connection between the lower pressure plate 20 and the round block 19. There are four round blocks 19, and the center spacing of each round block 19 is aligned with the center spacing of the memory module.

[0039] The working principle of this application is as follows:

[0040] The auxiliary memory removal fixture is based on the principle of a crank-slider mechanism. It drives the intermediate transmission component (first slider 8) through a rotation input (first latch 1), which is ultimately converted into a linear output (linear displacement of the lifting plate 6). Specifically, when using the fixture, the fixture needs to be aligned and assembled onto the memory module test temperature cavity structure by pressing the first snap buttons 5 on both sides. After assembly, the bottom of the lifting plate 6 will be inserted into the groove on the side of the memory module to ensure correct connection with the memory module. By manually flipping the first latch 1 outward, the first latch 1 drives the first slider 8 to move upward, and the lifting plate 6 moves accordingly to remove the memory module from the motherboard slot. Four memory modules can be removed at a time, which improves the operating efficiency.

[0041] The auxiliary memory insertion fixture is based on the lever principle and torque conversion. Using the first rotating rod 12 as a fixed fulcrum, when the second latch 11 rotates inward, it presses against the upper edge of the memory module, converting the inward rotational force into a downward pressure acting vertically on the memory module. Specifically, when using the fixture, the fixture is aligned and assembled onto the memory module testing chamber structure by pressing the second snaps 16 on both sides. The slots on the guide plate 17 are aligned with the memory slot slots on the motherboard. The memory modules are then placed into the slots one by one, aligned with the grooves on the guide plate 17, and the second latch 11 is flipped inward. This causes the lower pressure plate 20 to rotate downward through the first rotating rod 12. The lower pressure plate 20 applies pressure to the memory module, pressing it into the motherboard slot. The round block 19 on the lower pressure plate 20 acts as a buffer, preventing damage to the memory module or motherboard due to excessive force. This fixture can insert four memory modules at a time, significantly improving efficiency.

[0042] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0043] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0045] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0046] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0047] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0048] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0049] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A memory insertion / removal fixture for easy disassembly, comprising an auxiliary memory removal fixture and an auxiliary memory insertion fixture, characterized in that: The auxiliary memory removal fixture includes a first pressing block and a first latch, and the inner surface of the first pressing block is movably connected to the first latch via a first rotating rod. The rotating rod mainly performs the function of rotating and fixing the latch in the entire fixture. The auxiliary memory insertion fixture includes a second pressing block and a second latch, and the inner surface of the second pressing block is movably connected to the second latch via a first rotating rod.

2. The memory insertion and removal fixture for easy disassembly according to claim 1, characterized in that: Pre-drilled holes are provided at the connection points of the second pressure block and the first rotating rod, as well as at the connection points of the first pressure block and the first rotating rod. The middle of the first and second handles is hollowed out, and the handle position is rounded to avoid discomfort to the operator caused by sharp edges and optimize the user experience. The hollow size of the first handle is 30mm, and the hollow size of the second handle is 130*1215mm, which can comfortably accommodate two fingers, making it easy to grip and operate. This conforms to ergonomic design and improves the convenience and comfort of operation.

3. The memory insertion and removal fixture for easy disassembly according to claim 1, characterized in that: A first slider is inserted into the right side of the first handle to achieve linkage. A lifting piece is connected to the right side of the first slider by a second screw. A positioning block is fixedly connected to the right side of both the first handle and the right side of the first slider.

4. The memory insertion and removal fixture for easy disassembly according to claim 3, characterized in that: The left side of the first slider and the upper end of the inner surface of the lifting piece are provided with positioning grooves that are compatible with the positioning block to reduce assembly deviation. The lifting piece has four slots with a center distance of 7.2mm between adjacent slots, which matches the spacing of the memory slots on the server motherboard to ensure installation accuracy. Each slot is 5.7mm wide, and the maximum thickness of the memory module is about 3.5mm, leaving enough space to prevent the memory module from being damaged by scratching or bumping against the components on the PCB board during use. The structure is safe and reliable.

5. The memory insertion and removal fixture for easy disassembly according to claim 1, characterized in that: The front and rear sides of the outer surface of the first pressure block are connected to the first fixing plate by the first screw. The inner surface of the first fixing plate is snapped with the first snap. The inner side of the first snap is fixedly connected with the first spring, and the end of the first spring is fixedly connected to the surface of the first pressure block.

6. The memory insertion and removal fixture for easy disassembly according to claim 5, characterized in that: The front and rear sides of the outer surface of the second pressure block are connected to the second fixing plate by the third screw. The inner surface of the second fixing plate is snapped with the second snap, and the inner side of the second snap is fixedly connected with the second spring, and the end of the second spring is fixedly connected to the surface of the second pressure block.

7. The memory insertion and removal fixture for easy disassembly according to claim 6, characterized in that: Both the first and second snaps are hollow structures. The surface of the first pressing block and the inner side of the first spring, and the surface of the second pressing block and the inner side of the second spring, are both fixedly connected with protruding rods. These rods can limit the first and second snaps when pressed, preventing them from falling off the surfaces of the first and second pressing blocks. The bottom of both the first and second snaps is provided with a locking position, which can be combined with the groove on the side wall of the temperature cavity structure to prevent the fixture from moving left and right during use and to achieve precise alignment.

8. The memory insertion and removal fixture for easy disassembly according to claim 1, characterized in that: The bottom of the second pressure block is connected to a guide plate by a fourth screw. Both ends of the top of the guide plate are fixedly connected to protruding rods, and the bottom of the second pressure block is provided with a slot that matches the protruding rods.

9. The memory insertion and removal fixture for easy disassembly according to claim 8, characterized in that: The guide plate has four slots, with a center-to-center spacing of 18.13 mm between each slot, which is compatible with the memory slot spacing on the server motherboard. The slot width is 11.16 mm, and the design retains a safe distance, which can both meet the guiding function and prevent damage to the electrical components on the memory module.

10. The memory insertion and removal fixture for easy disassembly according to claim 1, characterized in that: The inner surface of the second handle is connected to a pressure plate by a third screw. The upper end of the inner surface of the pressure plate has two fixing holes. By adjusting the installation position of the third screw, it can be adapted to memory modules of different heights, increasing the versatility of the fixture. The bottom of the pressure plate is movably connected to a round block by a second rotating rod, which can play a buffering role during the pressing process, absorbing part of the impact force and avoiding damage to the memory module. A reserved groove is provided at the connection between the pressure plate and the round block. There are four round blocks, and the center distance between each round block is aligned with the center distance between the memory modules.