A tool for semiconductor esc disassembly

Abstract

The utility model relates to the technical field of semiconductor equipment, concretely relates to a tool for semiconductor ESC dismounting, including support mechanism and dismounting mechanism, and the dismounting mechanism includes multiple connecting rods, multiple rod sleeves, work plate, lifting assembly, clamping assembly, fixed component and cooperation component, the operation unit in the lifting assembly of present setting is convenient for staff to adjust the height of the clamping seat in the clamping assembly, multiple locking columns and positioning columns are arranged below the ESC fixing disc in the fixed component, the recess in the cooperation component can be better and faster to find, the function of automatic position finding is realized, the cooperation top board in the cooperation component is avoided to damage, the design solves the problems, such as difficult to take out from the equipment and accurate installation of ESC, more time is consumed in the process of dismounting and installation, and the use is more inconvenient.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a tooling for disassembling semiconductor ESCs. Background Technology

[0002] In the semiconductor manufacturing field, the electrostatic chuck (ESC) is a core component used to precisely hold wafers in place. It is widely used in etching, thin film deposition (PVD / CVD) and other process equipment. Because the ESC is in direct contact with the wafer and operates in a harsh environment, it needs to be disassembled and maintained regularly. The tooling used for ESC disassembly is a special tool to ensure that this process is efficient, safe and clean. Its design must be strictly matched to the precision structure of the ESC and the high cleanliness and high precision requirements of semiconductor manufacturing.

[0003] The existing tooling makes it difficult to remove the ESC from the equipment and install it accurately. The disassembly and installation process takes a lot of time and is inconvenient to use. Utility Model Content

[0004] The purpose of this invention is to provide a tooling for disassembling semiconductor ESCs, which solves the problems in the prior art where ESCs are difficult to remove from the equipment and install accurately, the disassembly and installation process is time-consuming, and the use is inconvenient.

[0005] To achieve the above objectives, this utility model provides a tooling for disassembling semiconductor ESCs, including a support mechanism and a disassembly mechanism. The disassembly mechanism includes multiple connecting rods, multiple rod sleeves, a work plate, a lifting assembly, a clamping assembly, a fixing assembly, and a mating assembly. The mating assembly is detachably connected to the fixing assembly and is located below the fixing assembly. The fixing assembly is detachably connected to the clamping assembly and is located below the clamping assembly. The clamping assembly is movably connected to the lifting assembly and is located below the lifting assembly. The lifting assembly is fixedly connected to the work plate and is located above the work plate. Each rod sleeve is fixedly connected to a corresponding connecting rod and is located around the corresponding connecting rod. The upper end of each connecting rod is fixedly connected to the work plate and is located below the work plate. The lower end of each connecting rod is fixedly connected to the support mechanism and is located above the support mechanism.

[0006] The lifting assembly includes a lifting seat, a lifting column, and an operating unit. The operating unit is rotatably connected to the lifting seat and is located on the front side of the lifting seat. The lifting column is fixedly connected to the lifting seat and is located above the lifting seat. The lifting seat is fixedly connected to the work plate and is located above the work plate.

[0007] The operating unit includes a handwheel and a grip lever. The grip lever is rotatably connected to the handwheel and is located on one side of the handwheel. The other side of the handwheel is rotatably connected to the lifting seat and is located on the front side of the lifting seat.

[0008] The clamping assembly includes a connecting seat and a clamping seat. The clamping seat is fixedly connected to the connecting seat and located below the connecting seat. The connecting seat is movably connected to the lifting seat and located below the lifting seat.

[0009] The fixing assembly includes a clamping seat, an ESC fixing plate, two locking pins and multiple positioning pins. Each positioning pin and the two locking pins are fixedly connected to the ESC fixing plate and are located below the ESC fixing plate. The ESC fixing plate is fixedly connected to the clamping seat and is located below the clamping seat. The clamping seat is detachably connected to the clamping seat and is located below the clamping seat.

[0010] The mating assembly includes a mating top plate and a mating bottom plate. The mating bottom plate is fixedly connected to the mating top plate and is located below the mating top plate. The mating top plate is detachably connected to each of the positioning posts and is located below each of the positioning posts.

[0011] The mating top plate has two locking holes and multiple positioning holes, which are respectively adapted to the corresponding locking pins and positioning pins.

[0012] The support mechanism includes a bottom ring and a support ring. The bottom ring is fixedly connected to the support ring and is located below the support ring. The support ring is fixedly connected to each of the connecting rods and is located at the lower end of each connecting rod.

[0013] This utility model discloses a tooling for disassembling semiconductor ESCs. The operating unit within the lifting assembly facilitates the adjustment of the height of the clamping seat within the clamping assembly by the operator. Multiple locking posts and positioning posts are provided below the ESC fixing plate within the fixing assembly, which can better and faster locate the groove within the mating assembly, realizing the function of automatic position finding and avoiding damage to the mating top plate within the mating assembly. This design solves the problems of ESCs being difficult to remove from the equipment and accurately installed, the time-consuming disassembly and installation process, and the inconvenience of use. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0015] Figure 1This is a schematic diagram of the overall structure of a tooling for disassembling semiconductor ESCs according to this utility model.

[0016] Figure 2 This is a top view of a tooling for disassembling semiconductor ESCs according to this utility model.

[0017] Figure 3 This is a rear view of a tooling for disassembling a semiconductor ESC according to this utility model.

[0018] Figure 4 This is the utility model Figure 3 A sectional view along line AA.

[0019] Figure 5 This is the utility model Figure 4 Enlarged view of the local structure at point B.

[0020] 101-Supporting mechanism, 102-Disassembly mechanism, 103-Connecting rod, 104-Rod sleeve, 105-Working plate, 106-Lifting assembly, 107-Clamping assembly, 108-Fixing assembly, 109-Matching assembly, 110-Lifting seat, 111-Lifting column, 112-Operating unit, 113-Handwheel, 114-Grip rod, 115-Connecting seat, 116-Clamping seat, 117-Clamped seat, 118-ESC fixing plate, 119-Locking column, 120-Positioning column, 121-Matching top plate, 122-Matching bottom plate, 123-Locking hole, 124-Positioning hole, 125-Bottom ring, 126-Supporting ring. Detailed Implementation

[0021] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0022] Please see Figures 1-5 ,in Figure 1 This is a schematic diagram of the overall structure of a tooling for disassembling semiconductor ESCs according to this utility model. Figure 2 This is a top view of a tooling for disassembling semiconductor ESCs according to this utility model. Figure 3 This is a rear view of a tooling for disassembling semiconductor ESCs according to this utility model. Figure 4 This is the utility model Figure 3 AA-line sectional view, Figure 5 This is the utility model Figure 4 Enlarged view of the local structure at point B.

[0023] This utility model provides a tooling for disassembling semiconductor ESCs, including a support mechanism 101 and a disassembly mechanism 102. The disassembly mechanism 102 includes multiple connecting rods 103, multiple rod sleeves 104, a working plate 105, a lifting assembly 106, a clamping assembly 107, a fixing assembly 108, and a mating assembly 109. The lifting assembly 106 includes a lifting seat 110, a lifting column 111, and an operating unit 112. The operating unit 112 includes a handwheel 113 and a gripping rod 114. The clamping assembly 107 includes a connecting seat 115 and a clamping seat 116. The fixing assembly 108 includes a clamping seat 117, an ESC fixing plate 118, two locking columns 119, and multiple positioning columns 120. The mating assembly 109 includes a mating top plate 121 and a mating bottom plate 122. The mating top plate 121 has two locking holes 123 and multiple positioning holes 124. The support mechanism 101 includes a bottom ring 125 and a support ring 126.

[0024] In this specific embodiment, the mating component 109 is detachably connected to the fixing component 108, the fixing component 108 is detachably connected to the clamping component 107, the clamping component 107 is movably connected to the lifting component 106, the lifting component 106 is fixedly connected to the working plate 105, each of the rod sleeves 104 is fixedly connected to the corresponding connecting rod 103, the upper end of each connecting rod 103 is fixedly connected to the working plate 105, and the lower end of each connecting rod 103 is fixedly connected to the support mechanism 1. 01. Fixed connection: The operating unit 112 is rotatably connected to the lifting seat 110; the lifting column 111 is fixedly connected to the lifting seat 110; the lifting seat 110 is fixedly connected to the working plate 105; the gripping rod 114 is rotatably connected to the handwheel 113; the other side of the handwheel 113 is rotatably connected to the lifting seat 110; the clamping seat 116 is fixedly connected to the connecting seat 115; the connecting seat 115 is movably connected to the lifting seat 110; each positioning column 120 and two locking columns 11... All 9 are fixedly connected to the ESC fixing plate 118, the ESC fixing plate 118 is fixedly connected to the clamping seat 117, the clamping seat 117 is detachably connected to the clamping seat 116, the mating base plate 122 is fixedly connected to the mating top plate 121, the mating top plate 121 is detachably connected to each of the positioning pins 120, the bottom ring 125 is fixedly connected to the support ring 126, the support ring 126 is fixedly connected to each of the connecting rods 103, and the operating unit 11 is located within the lifting assembly 106. 2. This design facilitates the adjustment of the height of the clamping seat 116 within the clamping assembly 107 by the staff. Multiple locking posts 119 and positioning posts 120 are provided below the ESC fixing plate 118 within the fixing assembly 108, enabling better and faster location of the groove within the mating assembly 109 and achieving automatic position finding. This avoids damage to the mating top plate 121 within the mating assembly 109. This design solves the problems of ESC being difficult to remove from the device and accurately installed, the time-consuming disassembly and installation process, and the inconvenience of use.

[0025] The mating component 109 is located below the fixing component 108, the fixing component 108 is located below the clamping component 107, the clamping component 107 is located below the lifting component 106, the lifting component 106 is located above the working plate 105, each of the rod sleeves 104 is located around the corresponding connecting rod 103, the upper end of each connecting rod 103 is located below the working plate 105, and the lower end of each connecting rod 103 is located above the support mechanism 101. The clamping seat 117 can be directly removed from the clamping seat 116, and the mating top plate 121 can also be directly removed from below the ESC fixing plate. This tooling structure is simple, easy to disassemble and install, and convenient to use.

[0026] Secondly, the operating unit 112 is located on the side of the lifting seat 110, the lifting column 111 is located above the lifting seat 110, the lifting seat 110 is located above the working plate 105, the gripping rod 114 is located on one side of the handwheel 113, and the other side of the handwheel 113 is located on the side of the lifting seat 110. The working plate 105 is fixed above the support ring 126 by multiple connecting rods 103, and provides installation support for the lifting seat 110. The multiple rod sleeves 104 protect the connecting rods 103 and also abut against the connecting surfaces of the support ring 126 and the working plate 105, ensuring that the two are on the same vertical line after connection, thus improving the accuracy of the tooling structure.

[0027] Meanwhile, the clamping seat 116 is located below the connecting seat 115, which is located below the lifting seat 110. Each positioning post 120 and the two locking posts 119 are located below the ESC fixing plate 118, which is located below the clamping seat 117, which is located below the clamping seat 116. The operator manually holds the gripping rod 114 or directly turns the handwheel 113 to adjust the height of the connecting seat 115 and the clamping seat 116 below the lifting seat 110. The diameter of the mating top plate 121 and the ESC fixing plate 118 is slightly smaller than that of the support ring 126. The operator can manually adjust the height of the ESC fixing plate 118 to disassemble and replace the semiconductor board.

[0028] In addition, the mating base plate 122 is located below the mating top plate 121, the mating top plate 121 is located below each of the positioning posts 120, the bottom ring 125 is located below the support ring 126, and the support ring 126 is located at the lower end of each of the connecting rods 103. The mating base plate 122 and the mating top plate 121 mainly adsorb or directly support the semiconductor substrate. Two sets of locking posts 119 and positioning posts 120 are provided below the fixing plate. The mating top plate 121 has corresponding locking holes 123 and positioning holes 124 above it, ensuring that the ESC fixing plate 118 automatically finds the correct position after it abuts against the mating top plate 121, avoiding damage to the mating top plate 121. This process is precise, labor-saving, and convenient to use.

[0029] In this embodiment, the clamping seat 117 can be directly removed from the clamping seat 116, and the mating top plate 121 can also be directly removed from below the ESC fixing plate. This fixture structure is simple, easy to disassemble and install, and convenient to use. The working plate 105 is fixed directly above the support ring 126 by multiple connecting rods 103, and provides installation support for the lifting seat 110. Multiple rod sleeves 104 protect the connecting rods 103 while also abutting the connecting surfaces of the support ring 126 and the working plate 105, ensuring that they are on the same vertical line after connection, thus improving the accuracy of the fixture structure. The operator manually holds the holding rod 114 or directly turns the handwheel 113 to adjust the connecting seat 115 and the clamping seat 116 in the correct position. The height below the lifting seat 110 is such that the diameter of the mating top plate 121 and the ESC fixing plate 118 is slightly smaller than that of the support ring 126. The height of the ESC fixing plate 118 can be manually adjusted by the operator to disassemble and replace the semiconductor board. The mating bottom plate 122 and the mating top plate 121 mainly adsorb or directly support the semiconductor board. Two sets of locking and positioning pins 119 and 120 are provided below the fixing plate. The mating top plate 121 has corresponding locking holes 123 and positioning holes 124 above it to ensure that the ESC fixing plate 118 automatically finds the correct position after it abuts against the mating top plate 121, avoiding damage to the mating top plate 121. This process is precise, labor-saving, and convenient to use.

[0030] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A tooling for disassembling semiconductor ESCs, comprising a support mechanism, characterized in that, It also includes a disassembly mechanism, which comprises multiple connecting rods, multiple rod sleeves, a work plate, a lifting assembly, a clamping assembly, a fixing assembly, and a mating assembly. The mating assembly is detachably connected to the fixing assembly and is located below the fixing assembly. The fixing assembly is detachably connected to the clamping assembly and is located below the clamping assembly. The clamping assembly is movably connected to the lifting assembly and is located below the lifting assembly. The lifting assembly is fixedly connected to the work plate and is located above the work plate. Each rod sleeve is fixedly connected to a corresponding connecting rod and is located around the corresponding connecting rod. The upper end of each connecting rod is fixedly connected to the work plate and is located below the work plate. The lower end of each connecting rod is fixedly connected to the support mechanism and is located above the support mechanism.

2. The tooling for semiconductor ESC removal as described in claim 1, characterized in that, The lifting assembly includes a lifting base, a lifting column, and an operating unit. The operating unit is rotatably connected to the lifting base and is located on the front side of the lifting base. The lifting column is fixedly connected to the lifting base and is located above the lifting base. The lifting base is fixedly connected to the work plate and is located above the work plate.

3. The tooling for semiconductor ESC removal as described in claim 2, characterized in that, The operating unit includes a handwheel and a grip lever. The grip lever is rotatably connected to the handwheel and is located on one side of the handwheel. The other side of the handwheel is rotatably connected to the lifting seat and is located on the front side of the lifting seat.

4. The tooling for semiconductor ESC removal as described in claim 3, characterized in that, The clamping assembly includes a connecting seat and a clamping seat. The clamping seat is fixedly connected to the connecting seat and located below the connecting seat. The connecting seat is movably connected to the lifting seat and located below the lifting seat.

5. The tooling for semiconductor ESC removal as described in claim 4, characterized in that, The fixing assembly includes a clamping seat, an ESC fixing plate, two locking pins and multiple positioning pins. Each positioning pin and the two locking pins are fixedly connected to the ESC fixing plate and are located below the ESC fixing plate. The ESC fixing plate is fixedly connected to the clamping seat and is located below the clamping seat. The clamping seat is detachably connected to the clamping seat and is located below the clamping seat.

6. The tooling for semiconductor ESC removal as described in claim 5, characterized in that, The mating assembly includes a mating top plate and a mating bottom plate. The mating bottom plate is fixedly connected to the mating top plate and is located below the mating top plate. The mating top plate is detachably connected to each of the positioning posts and is located below each of the positioning posts.

7. The tooling for semiconductor ESC removal as described in claim 6, characterized in that, The mating top plate has two locking holes and multiple positioning holes, which are respectively adapted to the corresponding locking pins and positioning pins.

8. The tooling for semiconductor ESC removal as described in claim 7, characterized in that, The support mechanism includes a bottom ring and a support ring. The bottom ring is fixedly connected to the support ring and is located below the support ring. The support ring is fixedly connected to each of the connecting rods and is located at the lower end of each of the connecting rods.

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