A practical jig for CSP product strip cutting

Abstract

The utility model relates to CSP product cutting technical field especially relates to a kind of CSP product row piece cutting practical jig, including stainless steel plate main part, the several cutting lines of extending along X direction and Y direction are formed by CAD drawing mark and are formed by laser processing on the stainless steel plate main part, the middle position of the several cutting lines of X direction and Y direction forms chip arrangement area, first chip positioning point is equipped at the intersection line of the X direction and Y direction of chip arrangement area, cutting machine positioning MARK point is further equipped on the stainless steel plate main body and located cutting line side;The utility model realizes the accurate positioning of chip arrangement, avoids the row piece deviation problem from source, can be cut after mould pressing without reversing film, completely avoids the risk of colloid deformation in film tearing process, significantly reduces the incidence of cutting deviation, colloid breakage and other quality abnormalities, effectively improves product cutting precision and yield.

Description

Technical Field

[0001] This utility model relates to the field of CSP product cutting technology, specifically a practical fixture for CSP product sheet cutting. Background Technology

[0002] CSP (Chip Surface Mount Technology) products, as a simplified packaging structure for conventional LED wire bonding, are widely used in the field of electronic components. After packaging, they need to be cut into individual chips to meet subsequent assembly requirements. Currently, the market demands increasingly stringent cutting precision for CSP products, but existing cutting processes have significant technical shortcomings: In current technology, chip arrangement relies on steel plates without cutting line markings, resulting in opaque products after molding, making it impossible to directly locate the cutting position. A casting process is required, with the chip electrode faces upwards, and positioning and identification are performed through the electrode gaps before manual cutting. This method not only requires additional casting and peeling processes, extending the workflow, but also easily leads to colloid deformation. Furthermore, manual cutting requires frequent manual positioning of PR points, resulting in low cutting efficiency and difficulty in avoiding quality abnormalities such as cutting misalignment. It also cannot achieve automated production, severely impacting product yield and production capacity. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a practical fixture for CSP product sheet cutting, which solves the technical problems of existing CSP product sheet arrangement without fixed position, the need for additional molding and manual positioning of PR points due to the opaque nature of the molded product and the lack of cutting line markings, which leads to cutting deviation, cumbersome operation process, easy deformation of the colloid, and inability to achieve automated cutting.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a practical fixture for CSP product chip arrangement and cutting, comprising a stainless steel plate body, wherein a plurality of cutting lines extending along the X and Y directions are formed on the stainless steel plate body by CAD drawing and laser processing, a chip arrangement area is formed at the middle position of the plurality of cutting lines in the X and Y directions, a first chip positioning point is provided at the intersection of the X and Y directions of the chip arrangement area, and a cutting machine positioning MARK point is also provided on the stainless steel plate body located on one side of the cutting lines.

[0005] Preferably, the stainless steel plate body has a length of 150mm, a width of 80mm, and a thickness of 0.5mm.

[0006] Preferably, the stainless steel plate body is sized to match the molding die.

[0007] Preferably, the positioning point of the first chip is located at the corner of the chip arrangement area, serving as a reference marker for subsequent chip arrangement.

[0008] Preferably, the positioning MARK points of the cutting machine are set on both sides of the stainless steel plate body as PR reference points during cutting.

[0009] Preferably, the number of cutting lines in the X and Y directions is the same as the number of chips arranged in the X and Y directions.

[0010] By employing the above technical solution, this utility model provides a practical fixture for CSP product sheet cutting, which has at least the following beneficial effects: 1. This utility model achieves precise positioning of chip arrangement by pre-setting laser-processed cutting lines and positioning points on the stainless steel plate body, thus avoiding chip misalignment problems from the source. Compared with the existing technology that relies on electrode gap positioning, the cutting machine positioning MARK point is directly set on one side of the cutting line as the PR reference point. After molding, cutting can be performed without demolding, completely avoiding the risk of colloid deformation during the film removal process. This significantly reduces the occurrence rate of quality abnormalities such as cutting misalignment and colloid breakage, and effectively improves the product cutting accuracy and yield.

[0011] 2. This utility model simplifies the cutting process of CSP products, eliminating the necessary molding and manual positioning PR processes in the prior art, and significantly shortens the operation cycle. At the same time, the preset cutting line and the positioning MARK point of the cutting machine are adapted to the recognition requirements of the automated cutting equipment, realizing automated and continuous operation from sheet arrangement to cutting. There is no need for continuous manual intervention in manual cutting, which not only reduces labor costs, but also significantly improves production efficiency and helps to achieve large-scale capacity expansion. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of the present invention, form part of this application: Figure 1 This is a schematic diagram of the overall surface structure of this utility model; Figure 2 This is a schematic diagram of the overall side structure of this utility model.

[0013] Figure label: 1. Stainless steel plate body; 11. Cutting line; 12. Intersection line; 13. First chip positioning point; 14. Cutting machine positioning MARK point. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Due to the limitations of existing technologies, such as cutting deviations, cumbersome procedures, easy deformation of colloids, and the inability to automate cutting, please refer to... Figures 1-2 This embodiment provides a practical fixture for CSP product chip arrangement and cutting, which achieves precise positioning of the chip arrangement, avoiding chip misalignment problems from the source. Furthermore, cutting can be performed without remolding after molding, completely avoiding the risk of adhesive deformation during the film removal process. This significantly reduces the incidence of quality abnormalities such as cutting misalignment and adhesive breakage, effectively improving product cutting accuracy and yield. The fixture includes a stainless steel plate body 1, on which several cutting lines 11 extending along the X and Y directions are formed by CAD drawing and laser processing. The middle position of the cutting line 11 forms a chip arrangement area. The first chip positioning point 13 is set at the intersection line 12 of the X and Y directions of the chip arrangement area. The stainless steel plate body 1 also has a cutting machine positioning MARK point 14 located on one side of the cutting line 11. The precise cutting line 11 and the first chip positioning point 13 are formed by CAD drawing and laser processing, providing a clear position reference for chip arrangement. Combined with the cutting machine positioning MARK point 14, it provides a PR reference for cutting, completely solving the core problems of no fixed position for chip arrangement and no marking for cutting. Precise positioning can be achieved without the need for molding.

[0016] Existing fixtures are prone to size mismatches with the molding die, leading to chip position shifts during molding and instability in the fixture's fit to the die, affecting subsequent cutting accuracy. Therefore, the length of the stainless steel plate body 1 is limited to 150mm, the width to 80mm, and the thickness to 0.5mm. Clearly defining the dimensions of the stainless steel plate body 1 ensures the stability of the fixture structure and lays the foundation for subsequent size matching with the molding die, avoiding molding shifts caused by size incompatibility and improving the compatibility between the fixture and the die.

[0017] The existing fixtures and molding dies are not sized correctly. During the molding process, the chip is prone to positional shift due to misalignment between the fixture and the die, requiring additional adjustments to the die or fixture, increasing the number of steps and the risk of errors. To address this issue, the stainless steel plate body 1 is made to match the dimensions of the molding die. The fixture and molding die are precisely matched, allowing direct connection to the molding process without additional adjustments. This avoids chip positional shifts during molding, reduces process adjustment costs, and ensures the accuracy of the chip position after molding and the subsequent cutting line 11.

[0018] The current chip arrangement lacks a clear reference marker, and the chip arrangement relies on manual estimation of position, resulting in inconsistent chip arrangement positions and uneven chip spacing. This can easily lead to problems such as misaligned cutting and multiple chips being cut consecutively. To address this issue, the first chip positioning point 13 is located at the corner of the chip arrangement area, serving as a reference marker for subsequent chip arrangement. The first chip positioning point 13 at the corner provides a clear chip arrangement reference, ensuring that all subsequent chips are arranged with this point as a reference, guaranteeing the consistency and accuracy of chip arrangement and avoiding cutting defects caused by chip arrangement misalignment from the source.

[0019] Existing cutting methods lack dedicated PR reference points, requiring manual positioning via the electrode gap after molding. Frequent manual adjustments to the PR points result in low cutting efficiency and significant manual positioning errors, easily leading to cutting deviations. To address this issue, the cutting machine positioning MARK points 14 are set on both sides of the stainless steel plate body 1 as PR reference points during cutting. The cutting machine positioning MARK points 14 on both sides provide a stable and accurate PR reference for cutting. The cutting machine can automatically identify these points to complete positioning without manual adjustment, achieving automated cutting while reducing positioning errors and minimizing the risk of cutting deviations.

[0020] The existing dicing method lacks dicing lines 11 corresponding to the number of chips. During dicing, the mismatch between dicing lines 11 and the number of chips can easily lead to missed cuts, overcuts, or damage to individual chips, resulting in low product yield. To address this issue, several dicing lines 11 in the X and Y directions are made, with the same number of chips arranged in the X and Y directions. The precise correspondence between the number of dicing lines 11 and the number of chips ensures that each chip has a unique dicing path, avoiding missed cuts, overcuts, or chip damage, and significantly improving dicing yield and product consistency.

[0021] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0022] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A practical fixture for cutting CSP (Computer-Supported Product) wafers, characterized in that, The stainless steel plate body (1) includes a number of cutting lines (11) extending along the X and Y directions, which are marked by CAD drawing and laser processing. The chip arrangement area is formed at the middle position of the number of cutting lines (11) in the X and Y directions. The first chip positioning point (13) is provided at the intersection line (12) of the X and Y directions of the chip arrangement area. The stainless steel plate body (1) also has a cutting machine positioning MARK point (14) located on one side of the cutting line (11).

2. The practical fixture for CSP product layout and cutting according to claim 1, characterized in that, The stainless steel plate body (1) has a length of 150mm, a width of 80mm, and a thickness of 0.5mm.

3. The practical fixture for CSP product layout and cutting according to claim 1, characterized in that, The stainless steel plate body (1) is matched with the size of the molding die.

4. The practical fixture for CSP product layout and cutting according to claim 1, characterized in that, The first chip positioning point (13) is located at the corner of the chip arrangement area, serving as a reference marker for subsequent chip arrangement.

5. The practical fixture for CSP product layout and cutting according to claim 1, characterized in that, The positioning MARK point (14) of the cutting machine is set on both sides of the stainless steel plate body (1) as the PR reference point during cutting.

6. The practical fixture for CSP product layout and cutting according to claim 1, characterized in that, The number of cutting lines (11) in the X and Y directions is the same as the number of chips arranged in the X and Y directions.

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