Double-sided double guide pulley pay-off and take-up system of silicon rod slicing machine

Abstract

The utility model relates to the technical fields of silicon rod slicing machine especially relates to a kind of double-sided double guide pulley pay-off system of silicon rod slicing machine, and pay-off device includes wire roller, first guide pulley and second guide pulley;The axis of wire roller is perpendicular to the axis of cutting roller;The axis of first guide pulley is parallel with the axis of wire roller and can swing along the parallel axis of its own axis;The plane where the axis of second guide pulley is parallel with the axis of wire roller;Wire roller can axially slip, to make the cutting line of wire roller to first guide pulley be in first plane;The cutting line of first guide pulley to second guide pulley is located in first plane and second plane;The cutting line of second guide pulley to cutting roller is located in second plane, and its beneficial effect is to allow thinner cutting line, faster cutting line operating speed and thinner silicon wafer cutting demand, greatly improve the use effect of the silicon rod slicing machine of the system.

Description

Technical Field

[0001] This utility model relates to the technical field of silicon rod slicing machines, and in particular to a double-sided double-guide roller take-up and unload system for silicon rod slicing machines. Background Technology

[0002] As photovoltaic silicon wafers develop towards thinner wafers (0.12mm), larger sizes (silicon rod length ≥900mm), and high-speed cutting (wire speed ≥2400m / min), traditional six-guide wheel diamond wire slicing machines face bottlenecks such as unstable tension control, increased risk of wire breakage, and decreased cutting quality.

[0003] The current slicing machine uses a six-guide roller structure (inlet wire guide roller, inlet wire tension control guide roller, cutting roller inlet guide roller, cutting roller outlet guide roller, outlet wire tension control guide roller, and outlet wire guide roller), which has the following problems under high-speed operation:

[0004] 1. Increased wear on the guide wheel: The diameter of the guide wheel decreased from... Reduce to Then, the speed reaches 7600rpm, matched with 10m / s 2 The acceleration and deceleration of the guide wheel lead to a significant increase in frictional wear between the guide wheel and the diamond wire.

[0005] 2. Significant tension fluctuations: The multi-guide roller structure increases the wire path length, leading to delays and fluctuations in tension transmission. For example, during the cutting process, differences in friction between the guide rollers may cause tension deviations exceeding ±0.5N, affecting the uniformity of silicon wafer thickness.

[0006] 3. Increased risk of wire breakage: The breaking tensile strength of 20μm diamond wire is only 6N, and the processing tensile strength is as low as 3N. The accumulated frictional resistance in the multi-guide roller structure may cause the local tension to exceed the threshold, leading to wire breakage and scrapping of the silicon material.

[0007] In other words, the six-guide wheel structure of the take-up and unwinding system reveals problems such as rapid wear of the guide wheels, high wire breakage rate, and insufficient tension control precision in high-speed, ultra-fine, and ultra-thin machining scenarios.

[0008] With the development of the photovoltaic industry, the demand for more efficient and higher-quality silicon wafers is increasing, which places higher demands on silicon rod slicing machines, including increasing cutting speed, reducing wire breakage rate, and improving silicon wafer surface quality and thickness uniformity. To meet these challenges, the industry has been exploring how to optimize the existing take-up and undocking system structure. Utility Model Content

[0009] (a) Technical problems to be solved

[0010] In view of the above-mentioned shortcomings and deficiencies of the prior art, this utility model provides a double-sided double-guide roller take-up and unload system for a silicon rod slicing machine, which solves the technical problems of rapid guide roller wear, high wire breakage rate and insufficient tension control accuracy exposed by the multi-guide roller structure take-up and unload system in the prior art under high-speed, ultra-fine and ultra-thin processing scenarios.

[0011] (II) Technical Solution

[0012] To achieve the above objectives, the main technical solutions adopted by this utility model include:

[0013] In a first aspect, this utility model provides a double-sided double-guide roller take-up and unwinding system for a silicon rod slicing machine. The silicon rod slicing machine includes a frame and multiple cutting rollers with parallel axes supported on the frame. The system includes two sets of take-up and unwinding devices supported on the frame. Each take-up and unwinding device includes a wire roller, a first guide roller, and a second guide roller. The axis of the wire roller is perpendicular to the axis of the cutting roller, suitable for winding and releasing the cutting wire. The axis of the first guide roller is parallel to the axis of the wire roller and can swing along an axis parallel to its own axis, suitable for tensioning the cutting wire and guiding it to the second guide roller. The plane containing the axis of the second guide roller is parallel to the axis of the wire roller, suitable for guiding the cutting wire to the cutting roller. The planes containing the wire grooves of the first guide roller and the second guide roller are respectively a first plane and a second plane. The wire roller can slide axially so that the cutting wire from the wire roller to the first guide roller is in the first plane; the cutting wire from the first guide roller to the second guide roller is in the first plane and the second plane; the cutting wire from the second guide roller to the cutting roller is in the second plane.

[0014] In one technical solution of this utility model, the take-up and unwinding device further includes a first sliding drive member. The fixed part of the first sliding drive member is supported on the frame, and the second guide wheel is rotatably supported on the moving part of the first sliding drive member, so that the second guide wheel can slide along the axial direction of the cutting roller, thereby making the wire entry and exit position of the second guide wheel correspond to the wire entry and exit position of the cutting roller.

[0015] In one technical solution of this utility model, the take-up and unwinding device further includes a second sliding drive and a first rotating drive. The fixed part of the second sliding drive is supported on the frame, and the first rotating drive is supported on the moving part of the second sliding drive. The wire roller is fixedly connected to the driving end of the first rotating drive, so that the wire roller can rotate clockwise or counterclockwise around its own axis to complete the take-up and unwinding, and can slide along its own axial direction so that the cutting line from the wire roller to the first guide wheel is in the first plane.

[0016] In one technical solution of this utility model, the wire take-up and release device further includes a vision camera, which is supported on the moving part of the second sliding drive member and is suitable for identifying the wire groove position of the first guide wheel and serving as the basis for sliding control of the second sliding drive member.

[0017] In one technical solution of this utility model, the wire take-up and release device further includes a swing arm and a second rotation drive. The second rotation drive is supported on the frame, one end of the swing arm is fixedly connected to the drive end of the second rotation drive, and the first guide wheel is rotatably supported on the other end of the swing arm, so that the second rotation drive can drive the swing arm to swing along the axis parallel to the axis of the first guide wheel, thereby guiding and tensioning the cutting wire released from or wound onto the wire roller.

[0018] In one technical solution of this utility model, the frame has an installation area at one end of the axis corresponding to the cutting roller, and the wire roller is supported in the installation area.

[0019] In one technical solution of this utility model, the wire take-up and unwinding device further includes a third rotation drive component, which can drive the first guide wheel and / or the second guide wheel to rotate actively so that the linear speed of the corresponding wire groove is equal to the linear speed of the cutting wire.

[0020] In one technical solution of this utility model, a first cooling channel is provided in the bearing housing of the first guide wheel and the second guide wheel. The first cooling channel can circulate a first cooling medium so that the bearings of the first guide wheel and the second guide wheel are kept within a predetermined range.

[0021] In one technical solution of this utility model, the cutting roller has a second cooling channel, and a second cooling medium can circulate in the second cooling channel.

[0022] (III) Beneficial Effects

[0023] The beneficial effects of this utility model are as follows: This utility model provides a double-sided, double-guide roller wire feeding and receiving system for a silicon rod slicing machine. The cutting roller carries the high-speed running cutting wire to complete the precision cutting of the silicon rod. The wire roller, as the storage and release unit for the cutting wire, has its axis arranged perpendicularly to the axis of the cutting roller. This orthogonal arrangement facilitates the smooth unfolding of the cutting wire from the wire roller and into the first guide roller, or from the first guide roller into the wire roller, reducing wire wear or jumps caused by angular deviations. The wire roller itself has axial sliding capability, allowing for slight movement along its axis. This ensures that the path of the cutting wire from the wire roller to the first guide roller is always within the first plane where the groove of the first guide roller is located, effectively preventing twisting or lateral force on the cutting wire during the initial guiding stage, thus improving the stability and centering accuracy of the wire feeding process.

[0024] The first guide wheel guides and tensions the cutting wire. When the cutting wire slackens due to thermal expansion, wear, or tension fluctuations during operation, the first guide wheel adjusts its position accordingly to compensate for changes in wire length and maintain a constant tension level. The plane containing the axis of the second guide wheel is parallel to the axis of the wire roller. The second plane formed by its groove receives the cutting wire from the first guide wheel and precisely guides it to the cutting roller area. The cutting wire segment from the second guide wheel to the cutting roller lies entirely within the second plane, while the cutting wire from the first guide wheel to the second guide wheel lies within the first and second planes, i.e., within their intersecting plane. Therefore, the cutting wire will never have any axial offset relative to the grooves of the first and second guide wheels, thus avoiding axial tension on the cutting wire and improving its lifespan.

[0025] In this invention, the total number of guide wheels is reduced from six to four. Combined with the fact that there is no axial tension on the cutting wire during the entire guiding process, it allows for finer cutting wires, faster cutting wire running speeds, and thinner silicon wafer cutting requirements. This greatly improves the performance of silicon rod slicing machines using this system, reduces the wear rate of the guide wheels, and lowers the wire breakage rate. By reducing the number of guide wheels, the tension range is stabilized, thereby significantly improving the cutting capacity and quality of photovoltaic diamond wire slicing machines. Attached Figure Description

[0026] Figure 1 This is one of the structural schematic diagrams of a double-sided double-guide roller take-up and unload system for a silicon rod slicing machine according to this utility model;

[0027] Figure 2 This is the second schematic diagram of the structure of the double-sided double-guide roller take-up and unload system of the silicon rod slicing machine of this utility model;

[0028] Figure 3 This is the third schematic diagram of the structure of the double-sided double-guide roller take-up and unload system of the silicon rod slicing machine of this utility model;

[0029] Figure 4 This utility model Figure 1 A magnified schematic diagram of the local structure at point X;

[0030] Figure 5 This utility model Figure 1 A magnified schematic diagram of the structure at point Y in the middle.

[0031] [Explanation of Labels in the Attached Image]

[0032] 100. Cutting line;

[0033] 1: Rack; A. Installation area;

[0034] 2: Cutting roller;

[0035] 3: Cable take-up and unwinding device;

[0036] 31: Wire roller; 32: First guide wheel; 33: Second guide wheel; 34: First sliding drive; 35: Second sliding drive; 36: First rotation drive; 37: Swing arm; 38: Second rotation drive. Detailed Implementation

[0037] To better explain and facilitate understanding of this utility model, the following description is provided in conjunction with the appendix. Figures 1-5 This invention will be described in detail through specific embodiments. Wherein, directional terms such as "upper" and "lower" are used in this document. Figure 1 The orientation is used as a reference.

[0038] Example 1:

[0039] Reference Figures 1-5 This utility model provides a double-sided double-guide roller take-up and unwinding system for a silicon rod slicing machine. The silicon rod slicing machine includes a frame 1 and multiple cutting rollers 2 supported on the frame 1 with parallel axes. The system includes two sets of take-up and unwinding devices 3 supported on the frame 1. Each take-up and unwinding device 3 includes a wire roller 31, a first guide roller 32, and a second guide roller 33. The axis of the wire roller 31 is perpendicular to the axis of the cutting rollers 2, suitable for winding and unwinding the cutting wire 100. The axis of the first guide roller 32 is parallel to the axis of the wire roller 31 and can swing along an axis parallel to its own axis, suitable for tensioning the cutting wire 100. The cutting line 100 is guided to the second guide roller 33; the plane containing the axis of the second guide roller 33 is parallel to the axis of the wire roller 31, which is suitable for guiding the cutting line 100 to the cutting roller 2; the planes containing the wire grooves of the first guide roller 32 and the second guide roller 33 are the first plane and the second plane, respectively; the wire roller 31 can slide axially so that the cutting line 100 from the wire roller 31 to the first guide roller 32 is in the first plane; the cutting line 100 from the first guide roller 32 to the second guide roller 33 is in the first plane and the second plane; the cutting line 100 from the second guide roller 33 to the cutting roller 2 is in the second plane.

[0040] In this embodiment, the cutting roller 2 carries the high-speed cutting wire 100 to complete the precision cutting of the silicon rod. The wire roller 31 serves as the storage and release unit for the cutting wire 100. Its axis is arranged perpendicular to the axis of the cutting roller 2. This orthogonal arrangement facilitates the smooth unfolding of the cutting wire 100 from the wire roller 31 and into the first guide roller 32, or from the first guide roller 32 into the wire roller 31, reducing wire wear or jump caused by angular deviation. The wire roller 31 itself has axial sliding capability, enabling it to move slightly along its axis. This ensures that the path of the cutting wire 100 from the wire roller 31 to the first guide roller 32 is always within the first plane where the groove of the first guide roller 32 is located. This effectively avoids twisting or lateral force on the cutting wire 100 during the initial guiding stage, improving the stability and centering accuracy of the wire loading process.

[0041] The first guide wheel 32 is used to guide and tension the cutting wire 100. When the cutting wire 100 becomes slack due to thermal elongation, wear, or tension fluctuations during operation, the first guide wheel 32 can adjust its position accordingly to compensate for changes in wire length in real time and maintain a constant tension level. The plane containing the axis of the second guide wheel 33 is parallel to the axis of the wire roller 31. The second plane formed by its groove receives the cutting wire 100 from the first guide wheel 32 and precisely guides it to the area of ​​the cutting roller 2. The section of the cutting wire 100 from the second guide wheel 33 to the cutting roller 2 is entirely located within the second plane, while the section of the cutting wire 100 from the first guide wheel 32 to the second guide wheel 33 is located within the first and second planes, that is, within their intersecting plane. Therefore, the cutting wire 100 will never have any axial offset relative to the grooves of the first guide wheel 32 and the second guide wheel 33, thus avoiding axial tension of the cutting wire 100 and improving its lifespan.

[0042] Specifically, the second guide wheel 33 itself can have the freedom to swing along the parallel axis of the cutting roller 2 axis to adjust the angle of the second guide wheel 33, thereby satisfying the requirement that the cutting line 100 from the first guide wheel 32 to the second guide wheel 33 is located in the first plane and the second plane, and that the cutting line 100 from the second guide wheel 33 to the cutting roller 2 is located in the second plane.

[0043] More specifically, the second guide wheel 33 is hinged to a connecting frame along a parallel axis to the axis of the cutting roller 2, and the hinge connection can be locked, such as by bolts or other locking components. The connecting frame is fixedly connected to the moving part of the first sliding drive 34. During equipment debugging, the angle of the second guide wheel 33 can be changed to meet the above requirements before locking the second guide wheel 33.

[0044] In this invention, the total number of guide wheels is reduced from six to four. Combined with the cutting wire 100, which experiences no axial tension during the entire guiding process, this allows for finer cutting wires 100, faster cutting wire speeds, and thinner silicon wafer cutting requirements. This significantly improves the performance of silicon rod slicing machines using this system, reduces guide wheel wear, lowers the wire breakage rate, and stabilizes the tension range by reducing the number of guide wheels, thereby significantly improving the cutting capacity and quality of photovoltaic diamond wire slicing machines. Experimental data shows that the four-guide-wheel structure can increase the linear speed by 18%, reduce the wire breakage rate by 83%, and increase the yield of A-grade silicon wafers by 6%.

[0045] Specifically, the double-sided double-guide roller system, i.e., a total of four guide rollers, has at least the following advantages:

[0046] Increased linear speed: The cutting efficiency of the four-guide wheel structure at a linear speed of 2800m / min is 18% higher than that of the six-guide wheel structure, and the cutting time of monocrystalline silicon rods is reduced from 80 minutes to 66 minutes.

[0047] Silicon wafer thickness uniformity: When using a four-guide wheel structure, the standard deviation of silicon wafer thickness decreased from 1.2μm to 0.8μm, and the TTV (total thickness variation) compliance rate increased from 92% to 96%.

[0048] Reduced breakage rate: The breakage rate of the four-guide wheel structure is 0.05 times, which is 40% lower than that of the six-guide wheel structure, and the cost of silicon material loss is reduced by about 60%.

[0049] Improved surface quality: The surface roughness Ra of the silicon wafer with the four guide wheel structure decreased from 0.25μm to 0.18μm, the edge chipping length was shortened from 50μm to 20μm, and the A-grade yield increased from 85% to 91%.

[0050] Reduced equipment costs: The manufacturing cost of a four-guide wheel slicer is 12% lower than that of a six-guide wheel slicer, mainly due to the simplification of the guide wheel assembly, servo motor, and transmission system.

[0051] Reduced operating costs: Extended guide wheel life and reduced wire breakage rate reduce the cost of single-blade machining from $1.8 / piece to $1.3 / piece. With an annual production of 2 million pieces, this translates to annual cost savings of approximately $2 million.

[0052] Increased production capacity: Improved cutting efficiency increased the annual production capacity of a single machine from 1.8 million pieces to 2.1 million pieces, shortening the investment payback period to 1.8 years.

[0053] More specifically, the first guide wheel 32 and the second guide wheel 33 can be tungsten carbide coated guide wheels. A 50μm thick tungsten carbide coating is formed on the surface of the guide wheel using supersonic spraying technology, which improves wear resistance by 3 times and extends the life of the guide wheel from 50 hours to 150 hours.

[0054] Alternatively, the first guide wheel 32 and the second guide wheel 33 can be made of ceramic matrix composite material. The hardness of the ceramic guide wheel is HRA 92, and its thermal stability is significantly better than that of the traditional steel guide wheel. At a linear speed of 2400 m / min, the temperature rise of the guide wheel is reduced from 80°C to 40°C, and the wear rate of the diamond wire is reduced by 50%.

[0055] Example 2:

[0056] Reference Figures 1-5 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0057] The take-up and unwinding device 3 also includes a first sliding drive 34. The fixed part of the first sliding drive 34 is supported on the frame 1, and the second guide wheel 33 is rotatably supported on the moving part of the first sliding drive 34 so that the second guide wheel 33 can slide along the axial direction of the cutting roller 2, thereby making the wire entry and exit position of the second guide wheel 33 correspond to the wire entry and exit position of the cutting roller 2.

[0058] In this embodiment, the second guide wheel 33 is mounted on the moving part of the first sliding drive 34 via a rotating support structure, allowing the second guide wheel 33 to slide precisely along the axis of the cutting roller 2 with the moving part. This design means that the position of the second guide wheel 33 is no longer fixed, but can be dynamically adjusted according to the actual cutting process requirements.

[0059] By controlling the movement of the first sliding drive 34, the second guide wheel 33 can be driven to move axially along the cutting roller 2, thereby adjusting the position of the cutting wire 100 from the second guide wheel 33 to the entry point of the cutting roller 2 in real time. Since the cutting wire 100 needs to be arranged in an orderly manner among multiple cutting rollers 2 to form a cutting network during the cutting process, the precise matching of its entry and exit positions directly affects the adhesion and running trajectory of the cutting wire 100 within the groove of the cutting roller 2. This sliding mechanism ensures that the exit end of the second guide wheel 33 always precisely corresponds axially to the entry end of the cutting roller 2, preventing lateral pulling, uneven wear, or skipping of the cutting wire 100 during the guiding process due to positional deviations.

[0060] Especially during multi-wire cutting, the cutting lines 100 need to be densely, uniformly, and stably arranged on the cutting roller 2. Any slight path deviation can accumulate into a significant cutting error. The axial adjustability of the second guide roller 33 allows the system to adapt to the cutting process requirements of silicon rods of different widths or different arrangement pitches. It can achieve rapid changeover and adjustment through program control without changing hardware, thus improving the flexible production capability of the equipment.

[0061] In summary, by adding the first sliding drive component 34 and making the second guide wheel 33 axially adjustable, the geometric path of the cutting line 100 transitioning from the guide wheel system to the cutting roller 2 is optimized, improving the accuracy and stability of the line. It also enhances the system's adaptability to different process parameters, effectively reduces the difficulty of equipment debugging and maintenance costs, and extends the service life of the cutting line 100. Ultimately, it achieves high precision, high efficiency, and high yield in the silicon wafer cutting process, providing a reliable technical guarantee for the large-scale production of high-quality thin silicon wafers.

[0062] Specifically, the first sliding drive 34 can be configured as a lead screw slide, and it is positioned above the cutting roller 2.

[0063] Example 3:

[0064] Reference Figures 1-5 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0065] The take-up and unwinding device 3 also includes a second sliding drive 35 and a first rotation drive 36. The fixed part of the second sliding drive 35 is supported on the frame 1, and the first rotation drive 36 is supported on the moving part of the second sliding drive 35. The wire roller 31 is fixedly connected to the driving end of the first rotation drive 36 so that the wire roller 31 can rotate clockwise or counterclockwise around its own axis to complete the take-up and unwinding, and can slide along its own axis so that the cutting line 100 from the wire roller 31 to the first guide wheel 32 is in the first plane.

[0066] In this embodiment, the fixed part of the second sliding drive 35 is securely connected to the frame 1, ensuring the rigid support of the overall structure. Its moving part carries and supports the first rotation drive 36, enabling the drive unit to make precise axial displacement along the axis of the wire roller 31. The wire roller 31 is rigidly connected to the output end of the first rotation drive 36 through its spindle, thereby realizing forward and reverse rotation around its own axis under the driving action, completing the active winding and unwinding action of the cutting wire 100, and ensuring that the cutting wire 100 maintains a stable and controllable linear speed and initial tension throughout the entire operating cycle.

[0067] Meanwhile, the introduction of the second sliding drive 35 gives the wire roller 31 the ability to slide freely along its axial direction. This axial adjustment function works in conjunction with the rotational motion of the wire roller 31, enabling the cutting wire 100 drawn from the surface of the wire roller 31 to dynamically align with the first plane where the groove of the first guide wheel 32 is located during operation. In actual operation, as the cutting wire 100 is wound layer by layer or gradually released on the wire roller 31, the outer diameter of the wire coil and the exit position of the wire coil constantly change. If the position of the wire roller 31 is fixed, the cutting wire 100 will deviate from the ideal guide plane, generating lateral tension or uneven winding. However, through the real-time compensation control of the second sliding drive 35, the entire wire roller 31 and its drive unit can be driven to move slightly along the axial direction, ensuring that the cutting wire 100 is always drawn from the optimal exit point of the wire roller 31 and accurately falls into the groove plane of the first guide wheel 32, realizing a smooth transition of the cutting wire 100 from its source to the first guide link.

[0068] In addition, the first rotating drive 36 has precise torque and speed control capabilities, and can realize constant or variable wire speed winding and unwinding operations according to the cutting process settings, so as to meet the needs of different cutting stages for the wire's operating status.

[0069] Specifically, the second sliding drive 35 can also be configured as a lead screw slide, and the first rotation drive 36 can be configured as a servo motor.

[0070] Example 4:

[0071] Reference Figures 1-5 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0072] The take-up and take-down device 3 also includes a vision camera, which is supported on the moving part of the second sliding drive 35 and is suitable for identifying the position of the wire groove of the first guide wheel 32 and serving as the basis for sliding control of the second sliding drive 35.

[0073] In this embodiment, the installation position of the vision camera is optimized so that its field of view can clearly cover the groove area of ​​the first guide wheel 32. Especially during the operation of the cutting line 100, it can continuously capture the edge of the groove, the bottom position of the groove, and the actual distribution state of the cutting line 100 within the groove. Through image acquisition and processing algorithms, the system can accurately identify the center position of the groove of the first guide wheel 32 and its relative alignment with the cutting line 100, and then convert this position information into a control signal as the basis for closed-loop control of the axial sliding of the second sliding drive 35.

[0074] This closed-loop control mechanism based on visual feedback significantly improves the intelligence and accuracy of the axial adjustment of the yarn roller 31. In traditional systems, the axial movement of the yarn roller 31 usually relies on a preset program or encoder, calculated based on the winding pattern of the yarn roller 31 itself, which is difficult to respond in real time. Furthermore, some yarn rollers 31 may deviate during the winding process, resulting in non-standard yarn rollers 31. If the axial movement pattern of the yarn roller 31, derived according to the winding pattern of the standard yarn roller 31, is applied to the non-standard yarn roller 31, the problem of axial traction of the cutting wire 100 will occur.

[0075] With the introduction of a vision camera, the system can perceive the actual spatial position of the groove of the first guide wheel 32 in real time, and can dynamically correct the axial position of the wire roller 31 to ensure that the cutting line 100 drawn from the wire roller 31 always falls accurately into the center of the groove of the first guide wheel 32, truly achieving adaptive centering of "what you see is what you adjust".

[0076] More importantly, the coordinated operation of the vision camera and the second sliding drive 35 enables the entire take-up and unwinding path to have online self-calibration capabilities. For example, at the initial stage of threading, the system can automatically confirm through visual recognition whether the cutting wire 100 has correctly entered the guide wheel groove; during continuous operation, if a deviation trend of the cutting wire 100 is detected, the control system can drive the second sliding drive 35 in advance for fine adjustment to prevent the deviation from accumulating and causing the wire to jump out of the groove or break. In addition, after replacing the cutting wire 100 or performing equipment maintenance, there is no need to rely on manual centering or cumbersome calibration procedures. The system can automatically identify and establish a new reference position through vision, which greatly improves the operability and start-up efficiency of the equipment.

[0077] Example 5:

[0078] Reference Figures 1-5 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0079] The take-up and unwinding device 3 also includes a swing arm 37 and a second rotation drive 38. The second rotation drive 38 is supported on the frame 1. One end of the swing arm 37 is fixedly connected to the drive end of the second rotation drive 38. The first guide wheel 32 is rotatably supported on the other end of the swing arm 37 so that the second rotation drive 38 can drive the swing arm 37 to swing along the axis parallel to the axis of the first guide wheel 32, thereby guiding and tensioning the cutting wire 100 released from or wound onto the wire roller 31.

[0080] In this embodiment, a tension sensor is installed on the swing arm 37. Through the active control of the swing arm 37 by the second rotation drive 38, the system achieves precise adjustment of the position of the first guide wheel 32, thereby applying dynamic tension to the cutting wire 100 released from or wound onto the wire roller 31. When the tension of the cutting wire 100 fluctuates during operation due to thermal elongation, wear, or changes in winding and unwinding speed, the second rotation drive 38 can drive the swing arm 37 to rotate slightly around the swing axis according to the feedback from the tension sensor or a preset control strategy, thereby changing the spatial position of the first guide wheel 32, adjusting the wrap angle and path length of the cutting wire 100, compensating for tension changes in real time, and maintaining the stability of the tension of the cutting wire 100 within the system.

[0081] Compared to traditional weighted or spring-type tensioning methods, this active tensioning structure offers significant advantages such as fast response speed, high control precision, and strong reversibility. Especially under conditions where the cutting wire 100 is reciprocating at high speed or switching between forward and reverse directions, the swing arm 37 can complete position adjustment within milliseconds, preventing the cutting wire 100 from becoming too loose or too tight due to tension lag, effectively preventing problems such as wire breakage, skipping, or cutting vibration. Simultaneously, the second rotation drive 38 enables precise forward and reverse control, allowing the swing arm 37 to not only provide tension but also actively retract during wire threading or changing, releasing the cutting wire 100. This facilitates manual or automatic threading operations, improving the operability and automation level of the equipment.

[0082] Specifically, the second rotation drive 38 is also configured as a servo motor.

[0083] Example 6:

[0084] Reference Figures 1-5 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0085] The frame 1 has an installation area A at one end of the axis corresponding to the cutting roller 2, and the wire roller 31 is supported in the installation area A.

[0086] In this embodiment, the wire roller 31 is supported and fixed within the mounting area A, so that it forms a stable and predictable geometric relationship with the cutting roller 2 in spatial position. This layout not only makes full use of the available space at the end of the frame 1 and avoids interference with the main cutting area, but also facilitates the centralized arrangement and maintenance of the take-up and unwinding device 3.

[0087] The mounting area A provides a basic support platform for the multi-degree-of-freedom movement of the wire roller 31. The fixing part of the second sliding drive 35 is directly installed in this area, ensuring the guiding accuracy and rigidity of the axial sliding movement of the wire roller 31. At the same time, the first rotation drive 36 and the second rotation drive 38 are also integrated in this area, realizing efficient driving of the rotation of the wire roller 31 and the swing of the swing arm 37. Since the mounting area A is close to the axial extension direction of the cutting roller 2, the cutting wire 100 led out from the wire roller 31 can enter the first guide wheel 32 with a shorter and more stable path, reducing the suspended span of the wire during the transmission process, effectively suppressing vibration and swaying under high-speed operation, and improving the stability of the cutting wire 100 path.

[0088] Furthermore, the centralized space of installation area A facilitates the integration of components such as the wire roller 31, guide rollers, drive elements, and vision camera into a fully functional take-up and unwind module, enabling modular design and assembly. This module can be fully debugged in the factory before being installed as a whole in the designated installation area A of frame 1, significantly reducing on-site assembly difficulty and debugging time, and improving the manufacturability and maintainability of the equipment. Simultaneously, protective covers, dust removal devices, or lubrication systems can be integrated around installation area A to further improve the working environment of the take-up and unwind area, preventing dust or coolant from contaminating the wire roller 31 and guide rollers, and extending the service life of critical components.

[0089] Example 7:

[0090] Reference Figures 1-5 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0091] The take-up and unwinding device 3 also includes a third rotation drive, which can drive the first guide wheel 32 and / or the second guide wheel 33 to rotate actively so that the linear speed of the corresponding wire groove is equal to the linear speed of the cutting wire 100.

[0092] In this embodiment, a third rotary drive is added to the take-up and unwinding device 3 to give the first guide wheel 32 and / or the second guide wheel 33 active rotation capability, thereby achieving dynamic synchronization between the linear velocity of the guide wheel groove surface and the running speed of the cutting wire 100. This third rotary drive is connected to the shaft of the first guide wheel 32 or the second guide wheel 33 via gears, synchronous belts, or direct shaft drive, and can precisely control the rotational speed of the guide wheel according to the actual running speed of the cutting wire 100, ensuring that the circumferential linear velocity of the groove contact surface is consistent with the axial movement speed of the cutting wire 100.

[0093] In traditional passive guide wheel structures, the guide wheel rotates passively by being dragged by the cutting wire 100, which suffers from problems such as start-up lag, speed fluctuations, and slippage. Especially under conditions of high-speed reciprocating motion or frequent reversals of the cutting wire 100, significant relative sliding friction occurs between the guide wheel and the wire, which not only exacerbates surface wear of the cutting wire 100 but may also cause damage to the wire or increased vibration due to frictional heat or lateral forces, affecting cutting accuracy. However, by introducing a third rotational drive component to achieve active drive of the guide wheel, this relative slippage can be fundamentally eliminated or significantly reduced, allowing the cutting wire 100 to transition smoothly in the guide wheel groove with almost "no slippage," significantly reducing frictional losses between the wire and the guide wheel.

[0094] More importantly, when the linear velocity of the groove surface of the first guide wheel 32 and the second guide wheel 33 is precisely matched with the running speed of the cutting wire 100, the additional tension and disturbance experienced by the cutting wire 100 during the guiding process are effectively suppressed, avoiding instantaneous tension fluctuations or vibration transmission caused by speed differences, thereby improving the dynamic stability of the entire cutting wire 100 path. This speed synchronization control is particularly suitable for silicon wafer cutting processes with high linear speeds and ultra-fine wire diameters, effectively preventing wire breakage, reducing surface microcracks, and improving the surface quality and thickness consistency of the silicon wafer.

[0095] Furthermore, the control of the third rotary drive component can be linked with the linear speed signal of the main cutting system to achieve feedforward or closed-loop collaborative control. For example, during the acceleration or deceleration phase of the cutting wire 100, the rotational speed of the guide wheel can respond to changes in advance to avoid inertial lag; for the first guide wheel 32, its active operation combined with the tensioning function of the swing arm 37 can reduce the winding resistance of the wire on the guide wheel while maintaining stable tension; for the second guide wheel 33, its active rotation helps the cutting wire 100 smoothly enter the cutting roller 2 area, reducing the impact of wire entry.

[0096] This active drive design also extends the service life of the guide wheel and the cutting line 100. Because the friction mode changes from sliding friction to near-pure rolling or low-slip rolling, the wear rate of the guide wheel groove is significantly reduced, and the groove shape retention is better, reducing the jumping or deviation of the cutting line 100 caused by groove wall wear. At the same time, the plating or coating on the surface of the cutting line 100 is less prone to peeling off due to friction, maintaining its strength and lubrication performance.

[0097] In summary, by introducing a third rotating drive component and enabling the active operation of the first guide wheel 32 and / or the second guide wheel 33, the system overcomes the limitations of traditional passive guidance, creating a speed-matched, low-friction, and highly stable transmission environment for the cutting line 100. This design not only improves guiding accuracy and operational stability but also reduces energy consumption and maintenance frequency, providing crucial support for achieving efficient and low-damage cutting of ultra-thin, large-size silicon wafers. It further enhances the technological competitiveness of the double-sided dual-guide wheel take-up and untake-down system of the silicon rod slicing machine in high-end photovoltaic and semiconductor slicing equipment.

[0098] Example 8:

[0099] Reference Figures 1-5 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0100] The double-sided double-guide roller take-up and unload system of the silicon rod slicing machine also includes a controller, which is electrically connected to the first sliding drive 34, the second sliding drive 35, the first rotation drive 36, the second rotation drive 38 and the third rotation drive.

[0101] In this embodiment, the controller serves as the core control hub of the double-sided double-guide roller take-up and unwinding system of the silicon rod slicing machine. It is electrically connected to the first sliding drive 34, the second sliding drive 35, the first rotation drive 36, the second rotation drive 38, and the third rotation drive, forming a highly integrated and collaborative intelligent control system. By collecting real-time operating status parameters of each drive unit and combining them with preset processes, tension feedback signals, visual recognition information, and system operating modes, the controller performs precise timing coordination and dynamic control of each actuator, ensuring the stability, synchronization, and adaptability of the entire take-up and unwinding process.

[0102] During system operation, the controller outputs speed and torque commands to the first rotating drive 36 according to the cutting process requirements, controlling the forward and reverse rotation of the wire roller 31 and the wire feeding and unloading speed to achieve active conveying of the cutting wire 100. Simultaneously, based on the real-time identification of the groove position information of the first guide wheel 32 by the vision camera, the controller dynamically calculates the required axial compensation of the wire roller 31 and drives the second sliding drive 35 to move the wire roller 31 precisely along the axial direction, ensuring that the cutting wire 100 is always drawn out from the optimal position of the wire roller 31 and accurately falls into the center of the groove of the first guide wheel 32, achieving closed-loop centering control of "visual guidance—calculation—execution".

[0103] For tension and guidance control, the controller receives tension feedback from the tension detection device and, combined with the process setpoint, adjusts the output of the second rotation drive 38 in real time. This drives the swing arm 37 to swing the first guide wheel 32, dynamically adjusting the wrap angle and path length of the cutting line 100 to achieve high-response tension closed-loop control. This control strategy is not only suitable for steady-state cutting but also effectively suppresses tension fluctuations during transient processes such as threading, reversing, and starting / stopping, preventing thread breakage or slack.

[0104] For guiding the end of the cutting line 100 path, the controller sends a displacement command to the first sliding drive 34 based on the current arrangement pitch of the cutting rollers 2 and the axial position of the cutting area. This drives the second guide wheel 33 to slide along the axis of the cutting rollers 2, ensuring that its entry and exit positions are always precisely aligned with the entry point of the cutting rollers 2. This guarantees that the cutting line 100 enters the main cutting area smoothly and without deviation. Simultaneously, the controller sends a synchronous speed command to the third rotation drive based on the current running speed of the cutting line 100. This drives the first guide wheel 32 and / or the second guide wheel 33 to rotate actively, ensuring that the linear velocity of the groove surface is consistent with the axial velocity of the cutting line 100, minimizing relative slippage and reducing wear and vibration.

[0105] Example 9:

[0106] Reference Figures 1-5 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0107] The bearing housings of the first guide wheel 32 and the second guide wheel 33 are provided with a first cooling channel, which is able to circulate a first cooling medium so that the bearings of the first guide wheel 32 and the second guide wheel 33 are kept within a predetermined range.

[0108] In this embodiment, a first cooling channel is integrated into the bearing housings of the first guide wheel 32 and the second guide wheel 33, significantly improving the thermal stability and operational accuracy of the guide wheels under high-speed, long-term operating conditions. This cooling channel is arranged along the critical heat-generating areas of the bearing housing and can accommodate the first cooling medium. For example, a gas-liquid two-phase flow cooling method can be used, employing gas-liquid mixing cooling technology. Low-temperature nitrogen gas at -20°C is introduced into the guide wheel bearing housing to control the bearing temperature rise below 15°C. Through heat conduction, the heat generated during bearing operation due to friction, high-speed rotation, and external heat radiation is promptly removed, effectively suppressing the temperature rise of the bearing and surrounding structures, and ensuring stability under high-speed operation.

[0109] During silicon wafer dicing, the dicing wire 100 continuously passes through the guide wheel groove at high speed, causing the guide wheel bearing to endure high-frequency loads and continuous friction, which easily leads to localized temperature rise. If the heat cannot be dissipated in time, it will cause a decrease in the performance of the lubricating grease inside the bearing, changes in clearance, and even thermal expansion and deformation, resulting in reduced rotational accuracy, increased vibration, and in severe cases, bearing seizure or failure. By setting a first cooling channel in the bearing housing, the bearing operating temperature can be stably controlled within the predetermined range allowed by the design, ensuring that it operates under optimal thermal conditions, extending the bearing's service life, and maintaining the dynamic stability of the guide wheel system.

[0110] Furthermore, the temperature stability of the guide wheel body directly affects the geometric accuracy of the cutting line 100 path. Uneven heating of the guide wheel in certain areas may cause slight deformation, leading to drift in the groove position, which in turn affects the guiding accuracy of the cutting line 100, ultimately reflected in the thickness deviation or surface damage of the silicon wafer. The uniform cooling effect of the first cooling channel helps to reduce the overall thermal deformation gradient of the guide wheel, maintain its structural rigidity and geometric accuracy, and provide a reliable physical basis for high-precision cutting.

[0111] This cooling structure can also be linked with the main cooling system, allowing the flow rate and temperature of the primary cooling medium to be intelligently adjusted based on the guide wheel speed, cutting load, or ambient temperature. For example, in high-speed or continuous cutting mode, the controller can instruct an increase in the cooling medium flow rate to enhance heat dissipation; in standby or low-load conditions, the flow rate is reduced to achieve energy-saving operation. Simultaneously, the sealed design of the cooling channel ensures that the cooling medium does not leak onto the guide wheel surface or the cutting line path, preventing contamination of the cutting environment or impact on the cutting fluid performance.

[0112] In summary, by setting up a first cooling channel and introducing a cooling medium within the bearing housings of the first guide wheel 32 and the second guide wheel 33, active temperature control of key rotating components is achieved. This not only effectively ensures the long-term reliable operation of the bearings, reducing maintenance frequency and downtime risks, but also improves the thermal stability and dynamic accuracy of the guide wheel system. This design, in conjunction with the aforementioned tension control, vision alignment, and active drive functions, further enhances the overall performance of the double-sided double-guide wheel take-up and untake-down system of the silicon rod slicing machine under high-temperature and high-load conditions, providing crucial thermal management support for achieving efficient and high-yield cutting of ultra-thin, large-size silicon wafers.

[0113] The cutting roller 2 has a second cooling channel, and a second cooling medium can flow through the second cooling channel.

[0114] In this embodiment, a second cooling channel is provided inside the cutting roller 2, allowing a second cooling medium to circulate through it. This cooling channel can adopt a spiral structure extending axially or circumferentially along the cutting roller 2, increasing the contact area and flow path between the cooling medium and the inside of the roller, thereby improving heat exchange efficiency. The spiral design not only facilitates uniform cooling distribution but also enhances the turbulence effect of the cooling medium, further improving heat dissipation capacity and ensuring a highly consistent temperature distribution across the entire working length of the cutting roller 2.

[0115] The second cooling medium, such as high-purity cutting fluid or a special coolant, continuously flows through the second cooling channel under the drive of a circulating pump, carrying away the large amount of heat generated during the cutting process by the friction between the cutting wire 100 and the silicon rod. This cooling system is linked to a high-precision temperature closed-loop control unit. Temperature sensors located at key positions on the cutting roller 2 provide real-time feedback on the roller temperature. The controller dynamically adjusts the flow rate, temperature, or velocity of the cooling medium according to set target values, achieving precise temperature control of the cutting area. For example, the system can stably control the temperature of the cutting area within an extremely narrow range of 25±1℃, with a temperature fluctuation accuracy of ±0.5℃, significantly better than conventional cooling methods.

[0116] During the cutting process, fluctuations in the temperature of the cutting roller 2 or the surrounding environment can lead to uneven thermal expansion and contraction of the material, resulting in changes in the tension of the cutting line 100, guide deviation, or imbalance in the thermal stress distribution on the cutting surface. These factors can easily induce problems such as warping, bending, or excessive internal residual stress in the silicon wafer after cutting, seriously affecting subsequent grinding, polishing, and cell manufacturing processes. Through the synergistic effect of the second cooling channel and the closed-loop temperature control system, heat accumulation in the cutting area can be effectively suppressed, maintaining the thermal balance of the entire cutting system, thereby significantly reducing the risk of silicon wafer deformation caused by temperature gradients.

[0117] Furthermore, the temperature stability of the cutting roller 2 directly affects its structural accuracy and rotational runout. Under constant temperature conditions, the geometry and surface groove of the cutting roller 2 remain stable, ensuring that the cutting lines 100 are evenly distributed and have consistent tension on the roller surface, avoiding wire mesh distortion or cutting thickness fluctuations caused by thermal deformation of the roller body. At the same time, a stable thermal environment also helps to extend the service life of the cutting roller 2 and reduce material aging or microcrack propagation caused by thermal fatigue.

[0118] This cooling structure can also be integrated with the main cutting fluid system, using the same temperature control unit to provide a constant temperature medium for the cooling channel and the cutting fluid supply system, thereby improving system integration and energy efficiency. Meanwhile, the inlet and outlet interfaces of the cooling channel adopt a rotary joint design to ensure stable inflow and outflow of the cooling medium during the continuous rotation of the cutting roller 2, without affecting its normal operation.

[0119] In summary, by integrating a second cooling channel inside the cutting roller 2 and employing high-precision closed-loop temperature control, active, uniform, and stable thermal management of the core cutting area is achieved. This design not only effectively avoids defects such as silicon wafer warping and uneven thickness caused by temperature fluctuations, but also improves the repeatability and consistency of the cutting process. It provides crucial thermal stability assurance for achieving mass production of ultra-thin, large-size, and high-efficiency silicon wafers, further enhancing the technological leadership of the double-sided double-guide roller take-up and untake-down system of the silicon rod slicing machine in high-end photovoltaic manufacturing equipment.

[0120] It can be understood that, except for conflicting parts, the above embodiments 1-9 can be freely combined to form other embodiments of this utility model.

[0121] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0122] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0123] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "beneath" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0124] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to those processes, articles, or apparatus / devices.

[0125] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A double-sided double-guide roller take-up and unload system for a silicon rod slicing machine, characterized in that: The system includes two sets of take-up and release devices (3) supported on the frame (1), and multiple cutting rollers (2) with parallel axes supported on the frame (1). The two sets of take-up and release devices (3) are used to take up and release the cutting wire (100) respectively. Each take-up and release device (3) includes a wire roller (31), a first guide roller (32), and a second guide roller (33). The axis of the wire roller (31) is perpendicular to the axis of the cutting roller (2), and is suitable for winding and releasing the cutting wire (100); the axis of the first guide wheel (32) is parallel to the axis of the wire roller (31) and can swing along an axis parallel to its own axis, and is suitable for tensioning the cutting wire (100) and guiding the cutting wire (100) to the second guide wheel (33); the plane containing the axis of the second guide wheel (33) is parallel to the axis of the wire roller (31), and is suitable for guiding the cutting wire (100) to the cutting roller (2). The planes on which the grooves of the first guide wheel (32) and the second guide wheel (33) are located are the first plane and the second plane, respectively; the wire roller (31) can slide axially so that the cutting line (100) from the wire roller (31) to the first guide wheel (32) is in the first plane; the cutting line (100) from the first guide wheel (32) to the second guide wheel (33) is in the first plane and the second plane; the cutting line (100) from the second guide wheel (33) to the cutting roller (2) is in the second plane.

2. The double-sided double-guide roller take-up and unload system of the silicon rod slicing machine as described in claim 1, characterized in that: The take-up and unwinding device (3) further includes a first sliding drive (34), the fixed part of the first sliding drive (34) is supported on the frame (1), and the second guide wheel (33) is rotatably supported on the moving part of the first sliding drive (34) so ​​that the second guide wheel (33) can slide along the axial direction of the cutting roller (2), thereby making the wire entry and exit position of the second guide wheel (33) correspond to the wire entry and exit position of the cutting roller (2).

3. The double-sided double-guide roller take-up and unload system of the silicon rod slicing machine as described in claim 1, characterized in that: The take-up and unwinding device (3) further includes a second sliding drive (35) and a first rotating drive (36). The fixed part of the second sliding drive (35) is supported on the frame (1), and the first rotating drive (36) is supported on the moving part of the second sliding drive (35). The wire roller (31) is fixedly connected to the driving end of the first rotating drive (36) so that the wire roller (31) can rotate clockwise or counterclockwise around its own axis to complete the take-up and unwinding, and can slide along its own axis so that the cutting line (100) from the wire roller (31) to the first guide wheel (32) is in the first plane.

4. The double-sided double-guide roller take-up and unload system of the silicon rod slicing machine as described in claim 3, characterized in that: The wire take-up and take-down device (3) also includes a vision camera, which is supported on the moving part of the second sliding drive (35) and is suitable for identifying the wire groove position of the first guide wheel (32) and serving as the basis for sliding control of the second sliding drive (35).

5. The double-sided double-guide roller take-up and unload system of the silicon rod slicing machine as described in claim 1, characterized in that: The take-up and unwinding device (3) further includes a swing arm (37) and a second rotation drive (38). The second rotation drive (38) is supported on the frame (1). One end of the swing arm (37) is fixedly connected to the drive end of the second rotation drive (38). The first guide wheel (32) is rotatably supported on the other end of the swing arm (37) so that the second rotation drive (38) can drive the swing arm (37) to swing along the axis parallel to the axis of the first guide wheel (32), thereby guiding and tensioning the cutting wire (100) released from or wound onto the wire roller (31).

6. The double-sided double-guide roller take-up and unload system of the silicon rod slicing machine as described in claim 1, characterized in that: The frame (1) has an installation area (A) at one end of the axis of the cutting roller (2), and the wire roller (31) is supported in the installation area (A).

7. The double-sided double-guide roller take-up and unload system of the silicon rod slicing machine as described in claim 1, characterized in that: The take-up and undo device (3) further includes a third rotation drive, which can drive the first guide wheel (32) and / or the second guide wheel (33) to operate actively so that the linear speed of the corresponding wire groove is equal to the linear speed of the cutting wire (100).

8. The double-sided double-guide roller take-up and unload system of the silicon rod slicing machine as described in any one of claims 1-7, characterized in that: The bearing housings of the first guide wheel (32) and the second guide wheel (33) are provided with a first cooling channel, which can circulate a first cooling medium so that the bearings of the first guide wheel (32) and the second guide wheel (33) are kept within a predetermined range.

9. The double-sided double-guide roller take-up and unload system of the silicon rod slicing machine as described in any one of claims 1-7, characterized in that: The cutting roller (2) has a second cooling channel, in which a second cooling medium can circulate.

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