A magnet bar coil insulation film fitting jig
Patent Information
- Application Number
- CN202522495203.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-24
- Publication Date
- 2026-10-20
- Estimated Expiration
- 2035-11-24
Smart Images
Figure CN224867864U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of mechanical manufacturing and assembly, and in particular to a jig for bonding insulating film to magnetic rod coils. Background Technology
[0002] In today's era of rapid technological advancement, electronic devices are becoming increasingly intelligent and portable. Styluses, as an important input device, are widely used in various electronic devices such as tablets and digital displays. The performance of a stylus directly affects the user's writing experience and creative effect, and the ferrite coil, as the core component of the stylus, plays a decisive role in its performance and quality. Stable operation and good performance of the ferrite coil ensure accurate positioning and smooth writing, providing users with a more comfortable and efficient experience. The manufacturing process of the ferrite coil includes lead wire cutting, soldering after cutting, and then attaching an insulating film to the ferrite coil product. The quality of the insulating film attachment directly affects the insulation performance, stability, and reliability of the ferrite coil, thus affecting the overall performance and lifespan of the stylus.
[0003] In the industry, the bonding of insulating film to magnetic rod coils primarily relies on manual methods. Operators manually cut the insulating film to the appropriate size and then apply it to each magnetic rod coil individually. This method can meet production needs to a certain extent for small-scale production or when high precision requirements are not critical. Because the magnetic rod coils used in styluses are small, some manufacturers use simple auxiliary tools to improve bonding accuracy. These tools use simple clamps to hold the magnetic rod coil in place, a template to pre-position the insulating film, and then a drive clamp to hold the magnetic rod coil close to the template, ensuring contact between the coil and the adhesive surface of the insulating film. This achieves more precise bonding compared to manual methods.
[0004] However, existing film application methods still have significant drawbacks in practical use. These mainly manifest in low application efficiency and difficulty in ensuring accuracy, leading to instances of misaligned insulation film application. Misaligned film application exposes the magnetic rod coil body, reducing its insulation performance and failing to meet the requirements for consistent processing quality. Consequently, product quality varies, making it unsuitable for large-scale production. Utility Model Content
[0005] To meet the needs of large-scale production and processing, improve the efficiency and accuracy of film application for magnetic rod coils, enhance the insulation performance of magnetic rod coils, and effectively avoid the phenomenon of misaligned insulation film application, this application provides a magnetic rod coil insulation film application fixture.
[0006] This application provides a magnetic rod coil insulating film bonding fixture, including a carrier and a molding assembly that can movably cover the upper surface of the carrier. The carrier includes a material carrier plate and a fixing plate, with a material ejection structure provided between the material carrier plate and the fixing plate. The upper surface of the material carrier plate has a plurality of first material slots for placing magnetic rod coils and cutting slots for separating the insulating film arranged along its length. Two adjacent cutting slots are symmetrically arranged on both sides of a single first material slot, and an abutment block is formed between two adjacent first material slots. Each abutment block... The upper surface of the block is recessed to form a film-carrying groove. The cutting groove passes through the center line of the film-carrying groove, and the film-carrying grooves are interconnected to form a film-penetrating channel. The pressing mold assembly includes a pressing template. The surface of the pressing template is arranged with a plurality of second material-carrying grooves corresponding to the first material-carrying groove. When the pressing template presses the material-carrying plate downward, the material-carrying plate moves toward the fixed plate, and the material ejection structure can extend into the material-carrying groove to push the magnetic rod coil upward and transfer it to the second material-carrying groove, so that each magnetic rod coil is covered with a U-shaped insulating film with its opening facing downward. By adopting the above technical solution, the carrier is provided with a material-carrying plate and a fixed plate, and a material ejection structure is provided between the two. The material-carrying plate is provided with a first material-carrying groove for placing the magnetic rod coil and a cutting groove for separating the insulating film. Adjacent cutting grooves are symmetrically distributed on both sides of the first material-carrying groove. The film-carrying grooves on the abutment block between adjacent first material-carrying grooves are interconnected to form a film-penetrating channel. The pressing template of the pressing mold assembly is provided with a second material-carrying groove corresponding to the first material-carrying groove. When the pressing template presses down on the material carrier plate, the material carrier plate moves towards the fixed plate. The material ejection structure extends into the material carrier groove, pushing the magnetic rod coil upwards and transferring it to the second material carrier groove. Because the cutting groove passes through the centerline of its corresponding film carrier groove, it guides the operator to evenly divide the entire insulating film. During the upward ejection and transfer of the magnetic rod coil, it comes into contact with the insulating film in the film-penetrating channel, causing the insulating film to adhere to the magnetic rod coil. As the magnetic rod coil enters the second material carrier groove, the space constraint of the second material carrier groove causes the insulating film to adhere to the surface of the magnetic rod coil in a U-shape with the opening facing downwards. This adhesion method not only improves the accuracy of the magnetic rod coil insulating film adhesion and avoids the problem of misalignment that is easily caused by manual adhesion, but the U-shaped wrapping method also increases the contact between the insulating film and the magnetic rod coil, further improving the insulation performance of the magnetic rod coil. Using this fixture for film adhesion achieves automatic adhesion of the magnetic rod coil and the insulating film, improving adhesion efficiency, meeting the needs of large-scale production, and ensuring the uniformity of product quality. Preferably, the material ejection structure includes a plurality of ejector pins, the bottom of which is fixedly connected to the fixing plate, and the top of which is located directly below the first material loading groove and in contact with the bottom of the magnetic rod coil.By adopting the above technical solution, since the material ejection structure includes several ejector pins, and the bottom of the ejector pins is fixedly connected to the fixed plate, when there is no initial position of pressing down the loading plate, the top of the ejector pin is located directly below the first loading groove and contacts the bottom of the magnetic rod coil to support the magnetic rod coil. When the pressing plate presses down on the loading plate and the loading plate moves towards the fixed plate, although the position of the ejector pin is not fixed relative to the fixed plate, the ejector pin moves upward relative to the loading plate, thereby ejecting the magnetic rod coil upward and transferring it to the second loading groove, realizing the automatic ejection and transfer of the magnetic rod coil, and improving the efficiency and accuracy of the magnetic rod coil insulation film bonding. Preferably, the surface of the pressing plate is provided with several protrusions corresponding to the loading film groove, and the second loading groove is formed between two adjacent protrusions. By adopting the above technical solution, the surface of the pressing plate is provided with several protrusions corresponding to the loading film groove, and the second loading groove is formed between two adjacent protrusions. When the pressing plate presses down on the loading plate, the protrusions will exert a guiding and squeezing effect on the insulation film located in the loading film groove, guiding the insulation film downward to adhere to the side wall of the magnetic rod coil. Because a second material loading groove is formed between adjacent protrusions, when the material ejection structure pushes the magnetic rod coil upwards into the second material loading groove, the compressed insulating film will form a U-shape with the opening facing downwards around the magnetic rod coil, thus ensuring that each magnetic rod coil can be accurately attached with a U-shaped insulating film with the opening facing downwards, improving the accuracy and efficiency of the insulating film bonding. Preferably, an elastic buffer structure is also provided between the material loading plate and the fixed plate for automatically resetting the material loading plate. By adopting the above technical solution, when the pressure plate presses the material loading plate downwards, the material loading plate moves towards the fixed plate, and the elastic buffer structure is compressed; when the pressure plate no longer applies pressure, due to the elastic restoring force of the elastic buffer structure, it will push the material loading plate to move in the opposite direction of its movement, thereby realizing the automatic reset of the material loading plate. Preferably, the elastic buffer structure includes a guide post and a spring sleeved on the outer wall of the guide post. The guide post passes through the material loading plate and is connected to the fixed plate. The material loading plate moves up and down along the guide post. The bottom of the spring is connected to the fixed plate, and the top of the spring abuts against the bottom of the material loading plate. By adopting the above technical solution, the guide post connects the carrier plate and the fixed plate, allowing the carrier plate to move up and down along the guide post, providing stable guidance for the movement of the carrier plate. When the pressure plate presses down on the carrier plate, the carrier plate moves towards the fixed plate. At this time, the spring is compressed and stores elastic potential energy. When the pressure is removed, the elastic potential energy stored in the spring is released. Since the bottom of the spring is connected to the fixed plate and the top of the spring abuts against the bottom of the carrier plate, the spring will push the carrier plate upward, thereby realizing the automatic reset of the carrier plate. This allows the fixture to quickly return to its initial state, preparing for the next bonding operation and improving the efficiency and continuity of the magnetic rod coil insulation film bonding fixture.Preferably, the molding assembly further includes a cover plate, the molding template is disposed on the cover plate, and at least two pressure rods are symmetrically arranged on the side of the cover plate where the molding template is disposed. One end of each pressure rod is connected to the cover plate, and the other end abuts against the upper surface of the carrier plate. By adopting the above technical solution, the molding assembly is provided with a cover plate, the molding template is disposed on the cover plate, and pressure rods are provided on the side of the cover plate where the molding template is disposed. When the molding assembly is closed on the upper surface of the carrier, one end of the pressure rod is connected to the cover plate, and the other end abuts against the upper surface of the carrier plate. This makes the connection between the molding assembly and the carrier more stable, avoids shaking or displacement during the pressing process, and thus ensures the accuracy of the bonding between the magnetic rod coil and the insulating film, improving product quality. Preferably, the carrier further includes at least two guide rods, and the cover plate is correspondingly provided with guide holes for the guide rods to pass through. The bottom of the guide rod passes through the carrier plate and connects to the fixing plate, and the other end passes through the guide hole of the cover plate. By adopting the above technical solution, the carrier is equipped with at least two guide rods, and the cover plate is correspondingly provided with guide holes for the guide rods to pass through. The bottom of the guide rod passes through the material plate and connects to the fixed plate, while the other end passes through the guide hole of the cover plate. During the process of the pressing mold assembly closing the carrier, the guide rods can provide guidance for the movement of the cover plate, allowing the cover plate to move accurately downwards along the direction of the guide rods, avoiding deviation or shaking of the cover plate during movement, thereby ensuring that the pressing plate can accurately press onto the material plate. The positions of the first material groove and the second material groove correspond one-to-one, ensuring the accuracy of the bonding between the magnetic rod coil and the insulating film, and improving the quality and stability of the bonding between the magnetic rod coil and the insulating film. Preferably, the width of the first material groove is less than or equal to the width of the second material groove. By adopting the above technical solution, during the process of the material ejection structure pushing the magnetic rod coil upwards from the first material groove and transferring it to the second material groove, the magnetic rod coil can smoothly and accurately enter the second material groove, improving the accuracy of the bonding between the magnetic rod coil and the insulating film, and ensuring that each magnetic rod coil can be accurately bonded with a U-shaped insulating film with the opening facing downwards. Preferably, the first material loading slots, the second material loading slots, and the cutting slots are all evenly spaced. By adopting the above technical solution, the evenly spaced arrangement of the first material loading slots, the second material loading slots, and the cutting slots makes the placement of the magnetic rod coils and insulating films on the carrier and molding assembly more regular and orderly. The uniform spacing ensures that the pressure and operating space conditions experienced by each magnetic rod coil and insulating film during processing are basically the same, thereby enabling synchronous and stable completion of the insulating film bonding operation. This improves the accuracy and consistency of the magnetic rod coil insulating film bonding, which is beneficial for ensuring the uniformity of product quality and meeting the quality requirements of large-scale production. Preferably, the film-penetrating channel extends to penetrate both sides of the material loading plate.By adopting the above technical solution, the membrane penetration channel extends to both sides of the carrier plate, allowing the insulating film to smoothly enter the membrane penetration channel from one side of the carrier plate and exit from the other side. This improves the convenience and smoothness of the insulating film laying, which in turn facilitates the subsequent bonding operation between the magnetic rod coil and the insulating film, and improves the efficiency and accuracy of the bonding of the magnetic rod coil and the insulating film.
[0007] In summary, this application includes at least one of the following beneficial technical effects: 1. The carrier and pressing mold assembly work together. When the pressing plate presses down on the material plate, the material plate moves toward the fixed plate. The material ejection structure extends into the material groove to push the magnetic rod coil upward and transfer it to the second material groove, so that each magnetic rod coil is covered with a U-shaped insulating film with the opening facing down. Compared with manual film application or using simple auxiliary tools for film application, this automated bonding process does not require manual film application to each magnetic rod coil, reducing the time and workload of manual operation, thereby improving film application efficiency. 2. The carrier plate has several first carrier slots for placing the magnetic rod coil and cutting slots for separating the insulating film arranged along its length. Two adjacent cutting slots are symmetrically arranged on either side of a single first carrier slot, forming an abutment block between adjacent first carrier slots. The upper surface of each abutment block has a recessed film-carrying groove, and these film-carrying grooves are interconnected to form a film-penetrating channel. The surface of the pressing mold has several second carrier slots arranged corresponding to the first carrier slots, and several protrusions are arranged corresponding to the film-carrying grooves, forming a second carrier slot between adjacent protrusions. Through this structural design, during the pressing process of the pressing mold assembly, the magnetic rod coil, precisely positioned in the first and second carrier slots, accurately adheres to the insulating film at a preset position, avoiding misalignment of the insulating film and ensuring the accuracy of the film application. Attached Figure Description
[0008] Figure 1 This is an exploded view of a magnetic rod coil insulating film bonding fixture according to this application; Figure 2 This is a structural diagram of a magnetic rod coil insulating film bonding fixture according to this application; Figure 3 yes Figure 2 A magnified view of point A; Figure 4 This is a structural diagram of the carrier plate of a magnetic rod coil insulating film bonding fixture according to this application; Figure 5 This is a structural diagram of the pressing template of a magnetic rod coil insulating film bonding fixture according to this application.
[0009] Explanation of reference numerals in the attached drawings: 1. Carrier; 2. Compression molding assembly; 11. Material carrier plate; 12. Fixing plate; 13. Material ejection structure; 14. Elastic buffer structure; 15. Guide rod; 111. First material carrier groove; 112. Cutting groove; 113. Film carrier groove; 114. Film penetration channel; 141. Guide post; 142. Spring; 21. Compression mold plate; 22. Cover plate; 211. Second material carrier groove; 212. Protrusion; 221. Compression rod; 222. Guide hole. Detailed Implementation
[0010] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.
[0011] This application provides a reference for a magnetic rod coil insulating film bonding fixture. Figure 1 and Figure 2 The device includes a carrier 1 and a molding assembly 2 that can be movably covered on the upper surface of the carrier 1. The carrier 1 is used to arrange and place several magnetic rod coils and to attach a whole strip of insulating film directly above each magnetic rod coil. The molding assembly 2 can be movably covered on the upper surface of the carrier 1. Through the cooperation of the two, the magnetic rod coils and the insulating film are bonded together, which improves the efficiency and accuracy of film application.
[0012] Specifically, the carrier 1 in this embodiment includes a material carrier plate 11 and a fixed plate 12, with a material ejection structure 13 and an elastic buffer structure 14 disposed between the material carrier plate 11 and the fixed plate 12. The material carrier plate 11 is used to support the magnetic rod coil and the insulating film, and its structure is a flat plate, which can be made of materials such as metal, and has a certain strength and stability. A cavity structure is formed between the material carrier plate 11 and the fixed plate 12, and this cavity structure is used for the movement of the material carrier plate 11. In particular, the carrier 1 also includes two guide rods 15, the bottom of which passes through the material carrier plate 11 and connects to the fixed plate 12, which can be done by means of threaded connection or other methods. The function of the guide rods 15 is to provide guidance for the movement of the molding assembly 2.
[0013] Reference Figure 3 and Figure 4The upper surface of the carrier plate 11 has several first carrier grooves 111 for placing magnetic rod coils and cutting grooves 112 for uniformly cutting insulating film, evenly spaced along its length. The first carrier grooves 111 are elongated grooves, their dimensions designed according to the size of the magnetic rod coils to ensure stable placement. The cutting grooves 112 are used to uniformly divide the applied insulating film; their shape is generally a narrow, elongated groove, large enough to accommodate the cutting tool. Two adjacent cutting grooves 112 are symmetrically arranged on either side of a single first carrier groove 111, forming an abutment block between them. Each abutment block has a recessed film-carrying groove 113 on its upper surface. The film-carrying grooves 113 are interconnected to form a film-penetrating channel 114, which extends through both sides of the carrier plate 11. The insulating film is pre-bonded along the film-penetrating channel 114, so that the bonding surface of the insulating film first contacts the bottom of the film-carrying groove 113. Since each cutting groove 112 passes through the film-carrying groove 113 along the center line of the film-carrying groove 113, when the tool is used to cut along the cutting groove 112, the insulating film located in the film-carrying groove 113 can be evenly divided.
[0014] The material ejection structure 13 includes two sets of ejector pins, each set having a pin corresponding to the first material loading groove 111. The two sets of ejector pins are symmetrically positioned directly below the first material loading groove 111. The bottom of each ejector pin is fixedly connected to the fixing plate 12, and the connection can be ensured by welding or other methods. Since the first material loading groove 111 penetrates both the upper and lower surfaces of the material loading plate 11, and the ejector pin is located directly below the first material loading groove 111 with at least a portion of its top extending into the first material loading groove 111 and contacting the bottom of the magnetic rod coil, when the material loading plate 11 moves downwards, the top of the ejector pin pushes the magnetic rod coil upwards along the first material loading groove 111. The ejector pin is cylindrical and can be made of stainless steel or similar materials. This structure allows the ejector pin to push the magnetic rod coil upwards when the material loading plate 11 moves towards the fixing plate 12. The ejector pin can also be replaced with other components with ejection functions, such as an ejector block.
[0015] The elastic buffer structure 14 is used for automatically resetting the carrier plate 11. Specifically, the elastic buffer structure 14 includes a guide post 141 and a spring 142 sleeved on the outer wall of the guide post 141. The guide post 141 consists of a nut and a stud. The nut is located at the top of the stud and on the upper surface of the carrier plate 11. The bottom of the stud passes through the carrier plate 11 and connects to the fixed plate 12, allowing the carrier plate 11 to move up and down along the stud. The bottom of the spring 142 is connected to the fixed plate 12, and the top of the spring 142 abuts against the bottom of the carrier plate 11. The guide post 141 provides guidance for the movement of the carrier plate 11. The spring 142 can be a helical spring, which can automatically reset the carrier plate 11 after it is pressed down.
[0016] Specifically, in this embodiment, the molding assembly 2 and the carrier 1 are designed separately. The molding assembly 2 consists of a molding template 21 and a cover plate 22, with the molding template 21 disposed on the cover plate 22. Four pressure rods 221 are symmetrically arranged on the cover plate 22, distributed in a rectangular pattern. The four pressure rods 221 and the molding template 21 are located on the same side of the cover plate 22. One end of each pressure rod 221 is bolted to the cover plate 22, and the other end abuts against the upper surface of the carrier plate 11. The four pressure rods 221 have the same length and are generally cylindrical. Their function is to ensure that the molding template 21 applies pressure evenly to the carrier plate 11 when the molding assembly 2 presses down. The cover plate 22 is correspondingly provided with guide holes 222 through which guide rods 15 pass. The other end of the guide rod 15 passes through the guide holes 222 of the cover plate 22, allowing the molding assembly 2 to move up and down along the guide rods 15.
[0017] Reference Figure 5 The pressing template 21 has several second material loading grooves 211 arranged on the side away from the cover plate 22, corresponding to the first material loading groove 111. The surface of the pressing template 21 has several protrusions 212 arranged corresponding to the film loading groove 113, with a second material loading groove 211 formed between adjacent protrusions 212. The size of the protrusions 212 matches the film loading groove 113. The function of the second material loading grooves 211 is to receive the magnetic rod coils transferred from the first material loading grooves 111 when the pressing template 21 is pressed down.
[0018] Specifically, because the insulating film in this embodiment is relatively thin, the width of the first material loading groove 111 and the width of the second material loading groove 211 are designed to be equal. In other embodiments, if the insulating film is thicker, the width of the second material loading groove 211 can also be greater than the width of the first material loading groove 111. Furthermore, the first material loading grooves 111, the second material loading grooves 211, and the cutting grooves 112 are all evenly spaced, which ensures the bonding accuracy between the magnetic rod coil and the insulating film.
[0019] The operation steps of the bonding fixture are as follows: First, several magnetic rod coils are evenly placed into the first material loading groove 111, ensuring that the magnetic rod coils are stably placed. Next, the insulating film is pre-attached to the film-passing channel 114, so that the adhesive surface of the insulating film contacts the bottom of the film loading groove 113, and it is necessary to ensure that the insulating film is accurately aligned with the magnetic rod coil in the first material loading groove 111. After that, the operator manually uses a knife to cut the insulating film into uniform individual insulating films along the cutting groove 112. Then, the pressing mold assembly 2 is placed on the material loading plate 11 and pressure is applied to press the material loading plate 11 down. At this time, the material loading plate 11 moves towards the fixing plate 12, the spring 142 is compressed, and the ejector pin of the material ejection structure 13 extends into the first material loading groove 111, pushing the magnetic rod coil upward and transferring it to the second material loading groove 211 of the pressing template 21. During the ejection process, since there is a certain gap between the protrusion 212 and the insulating film in the film loading groove 113, the insulating film will not be pressed tightly. As the rectangular bump 212 and the magnetic rod coil move relative to each other, the insulating film in the film carrier groove 113 detaches from the film carrier groove 113, and under the action of the movement of the side wall of the bump 212, the two sides of the single insulating film are attached downward to the side wall of the magnetic rod coil, so that a U-shaped insulating film with the opening facing downward is attached to the surface of the magnetic rod coil.
[0020] The implementation principle of this embodiment is as follows: Through the cooperation of the carrier 1 and the molding assembly 2, the bonding fixture utilizes the material ejection structure 13 and the elastic buffer structure 14 to achieve efficient and precise bonding between the magnetic rod coil and the insulating film. Compared to existing film bonding methods, this significantly improves bonding efficiency, avoids misaligned insulating film application, ensures product quality consistency, and meets the needs of large-scale production. Furthermore, the rational design and coordination between the components ensure a stable and reliable bonding process.
[0021] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A fixture for bonding insulating film to magnetic rod coils, characterized in that, The assembly includes a carrier (1) and a molding assembly (2) that can be movably covered on the upper surface of the carrier (1). The carrier (1) includes a material loading plate (11) and a fixing plate (12). A material ejection structure (13) is provided between the material loading plate (11) and the fixing plate (12). The upper surface of the material loading plate (11) is provided with a plurality of first material loading slots (111) for placing magnetic rod coils and cutting slots (112) for separating insulating films arranged along its length. Two adjacent cutting slots (112) are symmetrically arranged on both sides of a single first material loading slot (111). An abutment block is formed between two adjacent first material loading slots (111). A film loading slot (112) is recessed on the upper surface of each abutment block. 13), the cutting groove (112) passes through the center line of the film carrier groove (113), and each of the film carrier grooves (113) is interconnected to form a film-passing channel (114). The pressing mold assembly (2) includes a pressing template (21). The surface of the pressing template (21) is arranged with a plurality of second material carrier grooves (211) corresponding to the first material carrier groove (111). When the pressing template (21) presses down on the material carrier plate (11), the material carrier plate (11) moves toward the fixing plate (12), and the material ejection structure (13) can extend into the material carrier groove to push the magnetic rod coil upward and transfer it to the second material carrier groove (211), so that each magnetic rod coil is attached with a U-shaped insulating film with the opening facing downward.
2. The magnetic rod coil insulating film bonding fixture according to claim 1, characterized in that, The material ejection structure (13) includes several ejector pins. The bottom of the ejector pins is fixedly connected to the fixing plate (12), and the top of the ejector pins is located directly below the first material loading groove (111) and in contact with the bottom of the magnetic rod coil.
3. The magnetic rod coil insulating film bonding fixture according to claim 1, characterized in that, The surface of the pressing template (21) is provided with a plurality of protrusions (212) arranged in relation to the film carrier groove (113), and the second material carrier groove (211) is formed between two adjacent protrusions (212).
4. The magnetic rod coil insulating film bonding fixture according to claim 1, characterized in that, An elastic buffer structure (14) is also provided between the material carrier plate (11) and the fixing plate (12) for automatically resetting the material carrier plate (11).
5. The magnetic rod coil insulating film bonding fixture according to claim 4, characterized in that, The elastic buffer structure (14) includes a guide post (141) and a spring (142) sleeved on the outer wall of the guide post (141). The guide post (141) passes through the material plate (11) and is connected to the fixing plate (12). The material plate (11) moves up and down along the guide post (141). The bottom of the spring (142) is connected to the fixing plate (12), and the top of the spring (142) abuts against the bottom of the material plate (11).
6. The magnetic rod coil insulating film bonding fixture according to claim 1, characterized in that, The molding assembly (2) also includes a cover plate (22), and the molding template (21) is disposed on the cover plate (22). At least two pressure rods (221) are symmetrically arranged on the side of the cover plate (22) where the molding template (21) is disposed. One end of the pressure rod (221) is connected to the cover plate (22), and the other end can abut against the upper surface of the material carrier plate (11).
7. The magnetic rod coil insulating film bonding fixture according to claim 6, characterized in that, The carrier (1) also includes at least two guide rods (15). The cover plate (22) is provided with guide holes (222) through which the guide rods (15) can pass. The bottom of the guide rod (15) passes through the material plate (11) and is connected to the fixing plate (12), and the other end passes through the guide hole (222) of the cover plate (22).
8. The magnetic rod coil insulating film bonding fixture according to claim 1, characterized in that, The width of the first material loading trough (111) is less than or equal to the width of the second material loading trough (211).
9. The magnetic rod coil insulating film bonding fixture according to claim 1, characterized in that, The first material loading grooves (111), the second material loading grooves (211), and the cutting grooves (112) are all evenly spaced.
10. The magnetic rod coil insulating film bonding fixture according to claim 1, characterized in that, The membrane channel (114) extends to both sides of the material carrier plate (11).