Worktable and inkjet printing apparatus including the same

Abstract

Provided is an inkjet printing apparatus including a worktable, the inkjet printing apparatus including: a worktable including a table body including a work area and a plurality of imposition units arranged on the work area, wherein at least one imposition unit of the plurality of imposition units includes a temperature control member; an inkjet assembly arranged on the imposition units and including a nozzle unit configured to drip ink from above the plurality of imposition units; and a controller configured to individually control the temperature of the at least one imposition unit by controlling the current applied to the temperature control member. The heat deformation of the substrate when ink is ejected onto the substrate can be reduced by locally controlling the temperature of the worktable supporting the substrate, thereby achieving a high-precision inkjet process on the substrate.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2024-0136044, filed on October 7, 2024, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to a worktable and an inkjet printing apparatus including the worktable. Background Technology

[0003] As demand for display devices increases, these devices are becoming larger and thinner, leading to a greater need for high-precision inkjet printing processes used in the printed circuitry or pixels of these devices. Utility Model Content

[0004] The purpose of this disclosure is to provide an inkjet printing device capable of performing high-precision inkjet processes.

[0005] According to an aspect of this disclosure, an inkjet printing apparatus includes: a worktable including a worktable body comprising a work area and a plurality of imposition units disposed on the work area, wherein at least one of the plurality of imposition units includes a temperature control member; an inkjet assembly disposed on the imposition units and including nozzle units configured to drip ink from above the plurality of imposition units; and a controller configured to individually control the temperature of at least one imposition unit by controlling the current applied to the temperature control member.

[0006] The table body may include mounting holes formed to extend in one direction, and each of the plurality of panel units may include an engagement portion that is at least partially inserted into the mounting holes.

[0007] Multiple panel units can be arranged in a grid pattern on the work area.

[0008] At least one panel unit may include: a base plate on which temperature control components are disposed; and a top plate disposed opposite to the base plate.

[0009] The base plate may include cable holes, wherein cables connected to the temperature control component are configured to pass through the cable holes.

[0010] Multiple temperature control components, including temperature control elements, are arranged spaced apart from each other on a substrate plate, and include filling material disposed in the space between the multiple temperature control components.

[0011] The base plate can have a higher thermal conductivity than the top plate.

[0012] Temperature control components may include Peltier elements.

[0013] The controller can also be configured to individually control the temperature of at least one imposition unit based on the location where the nozzle unit drops ink.

[0014] According to another aspect of this disclosure, a worktable for an inkjet printing device is provided, and the worktable may include: a table body including a working area and including a plurality of through holes formed extending in one direction; a plurality of imposition units disposed on the working area; and a lifting assembly including a plurality of pin modules disposed in the plurality of through holes.

[0015] The lifting assembly may also include a frame that is movable in a direction parallel to the extension direction of the plurality of through holes and connected to the plurality of pin modules.

[0016] The pin module may include: a riser tube that is linearly movable in the extension direction of a plurality of through holes; and a bushing disposed around the circumference of the riser tube.

[0017] Each of the plurality of through holes may include: a body pin hole extending along a portion of the travel path of the riser tube; and a countersunk hole connecting to the body pin hole and receiving a bushing.

[0018] Each of the plurality of panel units may include a curved portion formed to bend inward from each vertex of the panel unit, wherein panel pin holes may be formed by the curved portions of the respective panel units arranged adjacent to each other, and wherein at least a portion of the pin modules of the plurality of pin modules may be disposed in the panel pin holes.

[0019] Each of the multiple pin modules may include a pin end disposed at an end, which is located on the surface of each of the multiple panel units.

[0020] Each of the multiple pin modules can be formed as a base that can be fixedly supported on the pin end by vacuum pressure.

[0021] According to another aspect of this disclosure, a method for operating a worktable of an inkjet printing device includes the following steps: preparing a worktable, the worktable including a table body, a lifting assembly, and a plurality of panel units forming a surface of the worktable; moving the lifting assembly such that at least a portion of a pin module of the lifting assembly passes through a body pin hole formed in the table body; placing a substrate on the pin end of the pin module; moving the lifting assembly such that the substrate contacts the surface of the worktable; and applying vacuum pressure to the surface of the substrate through the pin end to secure the substrate to the worktable.

[0022] A method of operating a workbench may further include individually controlling the temperature of at least one of a plurality of workbenches by controlling the current applied to a temperature control member of at least one workbench.

[0023] A method of operating a worktable may further include: depositing ink on a substrate; and individually controlling the temperature of each of the plurality of imposition units to match the temperature of the ink deposited on the substrate by controlling a plurality of temperature control components of the plurality of imposition units.

[0024] The step of fixing the substrate to the worktable by applying vacuum pressure may also include applying vacuum pressure to an air layer disposed between multiple panel units through a groove provided in the pin end.

[0025] In this disclosure, the thermal deformation of the substrate when ink is sprayed onto the substrate can be reduced by locally controlling the temperature of the stage supporting the substrate, thereby achieving a high-precision inkjet process on the substrate. Attached Figure Description

[0026] These and / or other features will become apparent and more readily understood through the following description of exemplary embodiments in conjunction with the accompanying drawings, in which: Figure 1 This is a perspective view schematically illustrating some components of an inkjet printing apparatus according to an embodiment of the present disclosure; Figure 2 This is a schematic front view of an inkjet printing apparatus according to an embodiment of the present disclosure; Figure 3 This is a block diagram illustrating the construction of an inkjet printing apparatus according to an embodiment of the present disclosure; Figure 4 This is a block diagram illustrating the construction of an inkjet printing apparatus according to another embodiment of the present disclosure; Figure 5 It is shown Figure 1 An example perspective view of the workbench; Figure 6 It is shown Figure 1 A floor plan of an example workbench; Figure 7 yes Figure 6 A magnified view of part X; Figure 8 It shows from Figure 7 The top panel has been removed. Figure 9 It is along Figure 7 A sectional view of the portion intercepted by line I-I'; Figure 10 It is along Figure 7 A sectional view of the portion intercepted by line II-II'; Figure 11 It is along Figure 7 A sectional view of the portion intercepted by line III-III'; Figure 12 It is shown Figure 5 A perspective view of an example of a panel unit; Figure 13 It is used to describe Figure 12 A view of the internal structure of the panel unit; Figure 14 It is shown Figure 2 A perspective view of an example of the pin module; Figure 15 yes Figure 14 A magnified view of part of the Y region; Figure 16 This is a sectional view used to describe the arrangement of the pin modules; Figure 17 It is a cross-sectional perspective view used to describe the arrangement of the pin modules; Figure 18 This is a flowchart describing a method for manufacturing an inkjet printing apparatus according to embodiments of the present disclosure; Figure 19 It is used to describe preparation Figure 18 The flowchart of the operation of the panel unit; Figure 20 This is a view used to describe the operation of arranging the panel units; and Figure 21 This is a flowchart describing the operation of the worktable of an inkjet printing apparatus according to embodiments of the present disclosure. Detailed Implementation

[0027] In the following description, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings, and in the description with reference to the drawings, the same or corresponding components are given the same reference numerals, and redundant descriptions may be omitted or simplified.

[0028] Various modifications can be made to the aspects of this disclosure. The effects and features of this disclosure, as well as methods of implementing them, will become clear when referred together with the embodiments and accompanying drawings described in detail herein. However, this disclosure is not limited to the embodiments disclosed herein and can be implemented in various forms.

[0029] In the following disclosure, terms such as first and second are used to distinguish one component from other components, rather than to limit it.

[0030] In the following disclosure, unless the context clearly indicates otherwise, the singular form includes the plural form.

[0031] In the following disclosure, the terms “comprising” or “having” are intended to indicate the presence of the features or components described herein, but do not preclude the possibility of adding one or more other features or components.

[0032] In the following disclosure, when a portion such as a membrane, region, component, etc. exists on or above another portion, this situation can include not only the case where the portion is directly on the other portion, but also the case where another membrane, region, component, etc. is arranged between the portion and the other portion.

[0033] In the examples described here, unless the context clearly indicates otherwise, terms such as connection or combination do not necessarily mean a direct and / or fixed connection or combination of two components, nor do they exclude the presence of another component between the two components.

[0034] In the accompanying drawings, the dimensions of components may be exaggerated or reduced for ease of description. In some embodiments, the dimensions and thickness of each component shown in the drawings may be arbitrarily shown for ease of description, and the disclosure is not necessarily limited to the illustrations.

[0035] In traditional inkjet printing processes, temperature variations in the substrate caused by ink temperature can lead to errors during ink deposition, potentially due to substrate movement or warping. According to this disclosure, the substrate can be secured to a stage using multiple pin modules that uniformly apply vacuum pressure across the lower surface of the substrate. According to this disclosure, by locally controlling the temperature of the stage supporting the substrate, thermal deformation of the substrate on which material (e.g., ink) is ejected can be reduced. This disclosure enables high-precision inkjet printing processes on the substrate.

[0036] Figure 1 This is a perspective view schematically illustrating some components of an inkjet printing apparatus according to an embodiment of the present disclosure. Figure 2 This is a schematic front view of an inkjet printing apparatus according to an embodiment of the present disclosure. Figure 3 This is a block diagram illustrating the construction of an inkjet printing apparatus according to an embodiment of the present disclosure.

[0037] Reference Figure 1 , Figure 2 and Figure 3 The inkjet printing apparatus 1 according to embodiments of the present disclosure may include a worktable 100, a lifting assembly 200, and an inkjet assembly 300. Although described below as a separate component, the aspects of the present disclosure are not limited thereto; for example, the worktable 100 may include the lifting assembly 200.

[0038] The workbench 100 can support the base.

[0039] The worktable 100 may include a surface configured to support a substrate on which an inkjet process can be performed.

[0040] The substrate can include any of a variety of materials. For example, the substrate can include a base substrate, a thin-film transistor, or an insulating layer. In some embodiments, the base substrate can be made of, but is not limited to, glass, synthetic resin, or silicone materials.

[0041] The substrate can be a single-element substrate. Alternatively, the substrate can be a parent substrate that can be divided into multiple single-element substrates.

[0042] The substrate can be a single substrate. Alternatively, the substrate can be multiple laminated substrates.

[0043] The lifting assembly 200 can make the base vertical ( Figure 1 The lifting assembly 200 can move in the z-axis direction. Figure 1 The component moves along the z-axis, and through this component, the lifting assembly 200 can move the base in the vertical direction.

[0044] The lifting assembly 200 can support the base on the surface of the worktable 100. The lifting assembly 200 can lift the base in the vertical direction ( Figure 1 The substrate is moved along the z-axis to separate it from the surface of the stage 100.

[0045] In an embodiment, the lifting assembly 200 may include a frame 210 and a pin module 220.

[0046] The frame 210 can be arranged on one side of the worktable 100. For example, the frame 210 can be arranged on the underside of the worktable 100. The frame 210 can be moved in one direction by a lifting drive unit. In some embodiments, the frame 210 can be moved in the vertical direction by a lifting drive unit. Figure 1 It moves along the z-axis.

[0047] Multiple pin modules 220 can be connected to the frame 210. The pin modules 220 can keep the base in the vertical direction ( Figure 1 It moves along the z-axis.

[0048] With multiple pin modules 220 connected to the frame 210, the multiple pin modules 220 can move simultaneously as the frame 210 moves. Therefore, the lifting assembly 200 can stably support the substrate on the worktable 100 without tilting or shifting, or stably separate the substrate from the worktable 100 after the inkjet process is completed.

[0049] The inkjet assembly 300 can perform the function of jetting ink onto a substrate supported by the stage 100.

[0050] The ink can be an inorganic or organic material used to form the display device through the inkjet printing process. Here, the display device can be, but is not limited to, a light-emitting diode (LED) display or an organic LED (OLED) display. However, the embodiments of this disclosure are not limited to the manufacture of display devices, and the stage 100 of the inkjet printing apparatus 1 can be used for other applications.

[0051] In an embodiment, the inkjet assembly 300 may include at least one of a nozzle unit 310, an inkjet controller 320, a power supply unit 330, and an ink supply unit 340.

[0052] The nozzle unit 310 can be positioned above the worktable 100.

[0053] The nozzle unit 310 can perform an inkjet process by dropping ink onto a substrate. The nozzle unit 310 can also perform an inkjet process by dropping ink onto a substrate while moving in at least one direction.

[0054] The inkjet assembly 300 may also include an inkjet drive unit that moves the nozzle unit 310.

[0055] The nozzle unit 310 can perform the inkjet process while moving above the substrate by receiving power from the inkjet drive unit.

[0056] In one embodiment, the nozzle unit 310 can perform the inkjet process while moving back and forth several times over the substrate. In this case, the nozzle unit 310 can perform the inkjet process by dropping ink droplets onto the substrate during multiple passes. In this way, the accuracy of the printed result on the substrate can be improved.

[0057] In one embodiment, the nozzle unit 310 may include a plurality of nozzles. In this case, several nozzles may alternately drop ink droplets at specific locations on the substrate. Therefore, even when the ink ejection volume or detail ejection performance varies from nozzle to nozzle, the ink can be uniformly deposited on the substrate.

[0058] The inkjet controller 320 can control various operations of the inkjet assembly 300. In some embodiments, the inkjet controller 320 can control one or more of the movement direction, number of movements, ink drop volume, and ink drop time of the inkjet assembly 300.

[0059] The power supply unit 330 can supply power to one or more other components of the inkjet assembly 300. For example, the power supply unit 330 can supply power for driving the nozzle unit 310 or the inkjet drive unit.

[0060] The ink supply unit 340 can store ink. In some embodiments, the ink supply unit 340 can be a container or cartridge for storing ink. The ink supply unit 340 can supply the stored ink to the nozzle unit 310 through a pipe or the like.

[0061] In one embodiment, the inkjet assembly 300 may further include an ink temperature controller capable of controlling the temperature of the ink. The ink temperature controller may be connected to the ink supply unit 340 or the nozzle unit 310 to control the temperature of the ink to be sprayed onto the substrate.

[0062] Specifically, the inkjet controller 320 can control the temperature of the ink to be ejected. The inkjet controller 320 can control the ink temperature to control the ink viscosity. Therefore, the spreadability of the ink droplets falling onto the substrate can be controlled.

[0063] The inkjet printing apparatus 1 according to embodiments of the present disclosure may further include a temperature control component 1230, a controller 400, and a memory 500.

[0064] A temperature control component 1230 may be disposed on the worktable 100. The temperature of the temperature control component 1230 may be changed using an externally supplied current. As the temperature of the temperature control component 1230 changes, the temperature of at least one area of ​​the worktable 100 may be controlled.

[0065] The controller 400 can be connected to each component of the inkjet printing device 1 to control the overall operation of the inkjet printing device 1. In some embodiments, the controller 400 may include multiple components, or it may be set as a single component.

[0066] In some embodiments, the controller 400 may include an inkjet controller 320 to control the inkjet operation performed by the inkjet assembly 300. Furthermore, the controller 400 may be connected to the lifting assembly 200 to control the movement of the lifting assembly 200. The controller 400 may also be connected to a temperature control component 1230, and the temperature of at least one area of ​​the worktable 100 can be controlled by controlling the temperature of the temperature control component 1230.

[0067] The memory 500 can store various information for the controller 400 to drive the inkjet printing device 1. In some embodiments, the controller 400 can control the ink temperature, ink ejection volume, movement of the nozzle unit 310, etc., based on the information stored in the memory 500. Optionally, the controller 400 can control the movement of the lifting assembly 200 based on the information stored in the memory 500. Optionally, the controller 400 can control the temperature of the temperature control member 1230 based on the information stored in the memory 500.

[0068] Figure 4This is a block diagram illustrating the construction of an inkjet printing apparatus according to another embodiment of the present disclosure.

[0069] Reference Figure 4 The inkjet printing device 1 may also include a temperature sensor 600.

[0070] The temperature sensor 600 can measure at least one of the temperature of at least one area of ​​the worktable 100 and the temperature of the substrate on which the ink droplets fall.

[0071] In some embodiments, the temperature sensor 600 may be, but is not limited to, a thermal infrared camera, a thermal infrared vision sensor, a thermal infrared monitor, a thermal infrared scanner, etc.

[0072] In one embodiment, the temperature measured by the temperature sensor 600 can be visually displayed to the customer via image processing to the temperature of at least one area of ​​the workbench 100 and the temperature of the substrate on which the ink droplets fall.

[0073] The controller 400 can control the temperature of the temperature control member 1230 based on the temperature of the worktable 100 or the substrate measured by the temperature sensor 600. In some embodiments, when one area of ​​the substrate has a higher temperature than another area, the controller 400 can control the temperature of the temperature control member 1230 to lower the temperature of the area of ​​the worktable 100 corresponding to the area of ​​the substrate with the higher temperature. Optionally, the controller 400 can prevent the temperature of the substrate from rising rapidly due to ink by pre-lowering the temperature of the area of ​​the worktable 100 corresponding to the area of ​​the substrate on which ink will drip.

[0074] Figure 5 It is shown Figure 1 An example perspective view of the workbench, and Figure 6 It is shown Figure 1 A floor plan of an example workbench.

[0075] Reference Figure 5 and Figure 6 The workbench 100 may include a main body 1100 and a tile unit 1200.

[0076] The main body 1100 can be configured such that the substrate can be supported thereon and inkjet printing can be performed on the substrate.

[0077] The main body 1100 may include a work area and a surrounding area.

[0078] The working area can refer to the area on which the substrate is supported and where the inkjet process is performed.

[0079] The base can be supported on the working area. In some embodiments, the base can be supported to overlap at least a portion of the working area.

[0080] Here, when the substrate is supported on the working area, this can mean that the substrate is arranged to contact the working area of ​​the table body 1100, and it can also mean that at least one component or layer can be arranged between the substrate and the table body 1100. In some embodiments, as described below, the panel unit 1200 can be disposed on the table body 1100, and the substrate can be disposed on the panel unit 1200.

[0081] The platform body 1100 may include a rigid material. In some embodiments, the top plate of the working area including the platform body 1100 may include a rigid material.

[0082] In one embodiment, the platform body 1100 may include a material with a large heat capacity. In a particular embodiment, the platform body 1100 may include granite.

[0083] Therefore, although the heat from the temperature control component 1230 in the panel unit 1200 moves to the table body 1100, the temperature change of the table body 1100 can be small, as described here.

[0084] At least one panel unit 1200 may be disposed on the table body 1100. In some embodiments, a plurality of panel units 1200 having dimensions smaller than the dimensions of the top surface of the table body 1100 may be disposed on the table body 1100. The plurality of panel units 1200 may have a rectangular shape. However, aspects of this disclosure are not limited thereto, and the plurality of panel units 1200 may be formed to have other shapes, such as triangular shapes.

[0085] The panel unit 1200 can be arranged on the working area of ​​the main body 1100. However, the panel unit 1200 can not only be arranged on the working area, but also be arranged to cover the entire working area, and can also be arranged on a part of the peripheral area.

[0086] In this embodiment, multiple panel units 1200 can be arranged on the working area of ​​the table body 1100 to form a working plane corresponding to the working area of ​​the table body 1100, and a substrate is supported on the working plane and inkjet process is performed on the working plane.

[0087] In some embodiments, the panel units 1200 may be arranged in a pattern on the work area. In some embodiments, the panel units 1200 may be formed to have a generally quadrilateral shape and may be arranged in a grid pattern on the work area.

[0088] Multiple panel units 1200 can be arranged to be spaced apart from each other, and can be arranged to form spaces between adjacent panel units 1200.

[0089] Figure 7 yes Figure 6 A magnified view of part X. Figure 8 It shows from Figure 7 The top panel has been removed. Figure 9 It is along Figure 7 A sectional view of the portion cut off by line I-I'. Figure 10 It is along Figure 7 A sectional view of the portion cut off by line II-II'. Figure 11 It is along Figure 7 A sectional view of the portion cut off by line III-III'. Figure 12 It is shown Figure 5 A perspective view of an example of a panel unit. Figure 13 It is used to describe Figure 12 A view of the internal structure of the panel unit.

[0090] Reference Figures 7 to 13 The platform body 1100 may include a through hole TH formed extending in one direction.

[0091] Through-hole TH can be in the height direction ( Figure 5 It is formed along the z-axis direction to pass through the main body of the platform 1100.

[0092] Multiple through-holes (TH) can be configured.

[0093] At least a portion of the lifting assembly 200 may be arranged in the through-hole TH as described herein. In some embodiments, pin modules 220 may be arranged in the through-hole TH. At least a portion of the pin modules 220 may be arranged in the through-hole TH in the height direction of the platform body 1100. Figure 5 The base moves along the z-axis to support the base on the worktable 100 or to separate the base from the worktable 100.

[0094] In an embodiment, the frame 210 of the lifting assembly 200 may be formed in the direction of extension of the through hole TH ( Figure 5 The frame 210 is movable in a direction parallel to the z-axis direction (in the extension direction of the through hole TH). Figure 5 When the base moves in a direction parallel to the z-axis, multiple pin modules 220 connected to the frame 210 can move simultaneously to stably support the base on the worktable 100 or stably separate the base from the worktable 100.

[0095] In an embodiment, the through-hole TH may include two regions with different diameters. The through-hole TH may include a body pin hole 1110 and a counter bore 1120.

[0096] As described here, the main pin hole 1110 can guide the movement path of at least some components of the pin module 220. That is, at least some components of the pin module 220 can move linearly along the main pin hole 1110 while keeping the base in the vertical direction ( Figure 5 It moves along the z-axis.

[0097] The countersunk hole 1120 may be formed to have a diameter larger than that of the main pin hole 1110. In some embodiments, the countersunk hole 1120 may be connected to the main pin hole 1110 and may be formed to have a diameter that is larger than that of the main pin hole 1110. The countersunk hole 1120 may accommodate at least some components of the pin module 220, and as described herein, the countersunk hole 1120 may improve the durability of the pin module 220 and the base body 1100.

[0098] The platform body 1100 may also include a mounting hole 1130 formed extending in one direction. The mounting hole 1130 may be in the height direction ( Figure 5 It is formed along the z-axis direction to pass through the main body of the platform 1100.

[0099] The panel unit 1200 may include an engagement portion 1242 that is at least partially inserted into the mounting hole 1130.

[0100] A separately provided connecting member can be disposed in the mounting hole 1130 and can engage with the connecting portion 1242. After the panel unit 1200 is disposed on the table body 1100, the connecting member can be engaged with the connecting portion 1242 to engage the panel unit 1200 with the table body 1100.

[0101] In one embodiment, the connecting member can be inserted from the lower side of the platform body 1100 toward the upper side of the platform body 1100 to pass through the mounting hole 1130, and can be connected to the engagement portion 1242.

[0102] In the embodiments, the connecting component may be, but is not limited to, bolts.

[0103] In some embodiments, the connecting member may further include an elastic member that generates a spring force in the longitudinal direction of the connecting member. In some embodiments, the elastic member may be a spring washer.

[0104] Therefore, the connecting member can stably connect the panel unit 1200 to the table body 1100. For example, after the panel unit 1200 is connected to the table body 1100, the connecting member can stably connect the panel unit 1200 to the table body 1100 without applying excessive pressure to the panel unit 1200.

[0105] In some embodiments, a height control member may be further provided between the panel unit 1200 and the table body 1100. In some embodiments, the height control member may be a shim member.

[0106] The height control component can control the flatness of the working plane formed by multiple panel units 1200.

[0107] Specifically, in the process of attaching the panel units 1200 to the table body 1100 after they are placed on the surface of the table body 1100 using a joining member, a height control member can be positioned below a panel unit 1200 that is lower in height or tilted compared to at least one other adjacent panel unit 1200. Therefore, the height and tilt angle of each panel unit 1200 can be controlled by the height control member, and the flatness of the working plane formed by the multiple panel units 1200 can also be controlled.

[0108] In the process of controlling the flatness of the panel unit 1200 by means of a connecting member including an elastic member, excessive pressure can be avoided on the panel unit 1200.

[0109] In an embodiment, the panel unit 1200 may include a top plate 1220, a temperature control component 1230, and a base plate 1240.

[0110] At least one temperature control member 1230 may be disposed on the base plate 1240. In a particular embodiment, a plurality of temperature control members 1230 may be arranged on the base plate 1240. The temperature control member 1230 may have a rectangular shape. However, the aspects of this disclosure are not limited thereto, and the temperature control member 1230 may be formed to have other shapes, such as triangles.

[0111] The top plate 1220 can be arranged opposite to the base plate 1240. That is, the temperature control component 1230 can be arranged between the top plate 1220 and the base plate 1240, so that the panel unit 1200 can have a sandwich structure.

[0112] The panel pin hole 1210 can be formed in the area of ​​the panel units 1200 arranged adjacent to each other.

[0113] In one embodiment, the panel unit 1200 may be formed in a generally quadrilateral shape. The panel unit 1200 may include curved portions formed to curve inward from each vertex.

[0114] In a particular embodiment, the top plate 1220 may be formed in a generally quadrilateral shape. The top plate 1220 may include a first curved portion 1221 formed to curve inward from each vertex. For example, the first curved portion 1221 may be formed to curve inward from a corner where adjacent edges of the top plate 1220 intersect. In some embodiments, the first curved portion 1221 may have an arcuate cross-section.

[0115] The base plate 1240 may be formed in a shape corresponding to the top plate 1220. In some embodiments, the base plate 1240 may be formed in a quadrilateral shape. The base plate 1240 may include a second curved portion 1241 formed to bend inward from each vertex. For example, the second curved portion 1241 may be formed to bend inward from a corner where adjacent edges of the base plate 1240 intersect. In some embodiments, the second curved portion 1241 may have an arcuate cross-section.

[0116] The first curved portion 1221 and the second curved portion 1241 can be formed to correspond to each other. A plurality of temperature control members 1230 can be disposed on the base plate 1240, but can also be disposed on the inner surface of the base plate 1240 without extending beyond the base plate 1240.

[0117] Therefore, as Figure 12 As shown, the panel unit 1200 may have a shape in which a curved portion is integrally formed at each vertex.

[0118] like Figure 7 and Figure 8 As shown, multiple panel units 1200, each having a curved portion, can be arranged adjacent to each other. Panel pin holes 1210 can be formed by the curved portions formed in each panel unit 1200. In an embodiment, the curved portions formed in the respective panel units 1200 can together form part of a circle.

[0119] The panel pin hole 1210 can be provided at a position corresponding to the through hole TH in the table body 1100. In some embodiments, the panel pin hole 1210 and the through hole TH of the table body 1100 can communicate with each other. For example, the panel pin hole 1210 and the countersunk hole 1120 of the through hole TH can communicate with each other. In this way, the panel pin hole 1210, the countersunk hole 1120, and the body pin hole 1110 can form a continuous hole passing through the table body 1100 and the panel unit 1200.

[0120] Therefore, as described herein, at least some components of the pin module 220 can move along the panel pin hole 1210, the countersunk hole 1120, and the main pin hole 1110 while keeping the base in the vertical direction ( Figure 5 It moves along the z-axis.

[0121] The temperature of the temperature control component 1230 can be changed based on the supplied current.

[0122] In one embodiment, the temperature control component 1230 may include a Peltier element.

[0123] Peltier elements can be thermoelectric elements including n-type and p-type semiconductors, and can perform heat absorption or dissipation depending on the direction of the current when supplied.

[0124] The temperature control component 1230 can be connected to a separately provided cable 1231 to receive current from an external source. However, the aspects of this disclosure are not limited thereto, and for example, the temperature control component 1230 can be connected to a pad (or solder pad, solder pad) provided on the stage body 1100 and receiving current from an external source.

[0125] In one embodiment, the substrate 1240 may include a cable hole 1243 through which a cable 1231 connected to the temperature control component 1230 may pass. The cable hole 1243 may be formed to pass through the substrate 1240.

[0126] like Figure 13 As shown, cable 1231 can extend in one direction from temperature control member 1230 through cable hole 1243. Specifically, when temperature control member 1230 is disposed on base plate 1240, cable 1231 can extend downward through cable hole 1243 formed in base plate 1240.

[0127] In one embodiment, multiple temperature control components 1230 may be arranged spaced apart from each other on the base plate 1240. In this case, cables 1231 may be disposed in the space between the temperature control components 1230.

[0128] In one embodiment, a filling material 1250 may also be provided in the space between the temperature control components 1230. In another embodiment, the filling material 1250 may include a resin filler.

[0129] Specifically, the filler material 1250 can be formed by filling at least a portion of the space between the temperature control members 1230. When the cable 1231 is disposed in the space between the temperature control members 1230, the filler material 1250 can be filled to surround the cable 1231.

[0130] The filler material 1250 can protect the temperature control member 1230 and prevent or stop foreign objects from entering the temperature control member 1230. Furthermore, by selecting various materials for the filler material 1250 as needed, heat can be transferred from the temperature control member 1230 to adjacent directions, or heat movement can be reduced. However, the aspects of this disclosure are not limited to this, and the filler material 1250 can perform various functions.

[0131] In this way, the base plate 1240, temperature control component 1230, top plate 1220, and filler material 1250 can form a single body. Therefore, each panel unit 1200 can be manufactured and individually mounted on the table body 1100. However, this disclosure is not limited to this, and multiple panel units 1200 can be mounted simultaneously on the table body 1100. For example, multiple sets of panel units 1200 can be mounted simultaneously on the table body 1100.

[0132] In an embodiment, the base plate 1240 may be formed of a material having a different thermal conductivity than the top plate 1220. For example, the base plate 1240 may be formed of a material having a higher thermal conductivity than the top plate 1220.

[0133] In this embodiment, the base plate 1240 may be formed of aluminum, or may include aluminum or an aluminum alloy. In this way, heat exchange between the temperature control component 1230 and the stage body 1100 can be performed quickly, and the temperature gradient between the temperature control component 1230 and the stage body 1100 can be reduced.

[0134] Specifically, when the temperature of the temperature control member 1230 rises, heat can move from the temperature control member 1230 to the platform body 1100. In this case, since the platform body 1100 may include a material with a large heat capacity, the heat transferred from the temperature control member 1230 can be absorbed into the platform body 1100, but the temperature of the platform body 1100 will not rise significantly. Furthermore, when the temperature of the temperature control member 1230 decreases, heat from the platform body 1100 can move in the direction towards the temperature control member 1230, and in this case, due to the large heat capacity of the platform body 1100, its temperature will not decrease significantly. For example, a significant change can be determined based on the pressure applied to the substrate. More specifically, a significant temperature change can be greater than about 0.5 degrees Celsius, greater than about 1 degree Celsius, or greater than about 5 degrees Celsius. To explain this feature from another perspective, the platform body 1100 can be used as a heat sink, and the base plate 1240 can rapidly perform heat exchange between the temperature control member 1230 and the platform body 1100.

[0135] In one embodiment, the top plate 1220 may be formed of a material comprising a synthetic resin having a lower thermal conductivity than the substrate plate 1240. In another embodiment, the top plate 1220 may comprise a polyetheretherketone (PEEK) material. In this way, additional heat exchange between adjacent panel units 1200 can be reduced when heat is transferred from the temperature control member 1230 to the panel unit 1200. For example, individual temperature control of the panel unit 1200 can be improved.

[0136] In another example, the top plate 1220 may include aluminum oxide.

[0137] In some embodiments, the platform body 1100 may further include components for dissipating accumulated heat to the outside. In some embodiments, the platform body 1100 may further include a cooling module.

[0138] The temperature function of the console body 1100, performed by the temperature control component 1230, is described below.

[0139] The controller 400 can control the temperature of the assembly unit 1200 individually. In some embodiments, the controller 400 can control the temperature of each assembly unit 1200 by individually controlling the temperature control component 1230 of each assembly unit 1200.

[0140] In one embodiment, the controller 400 can individually control the temperature of the imposition unit 1200 based on the location where the nozzle unit 310 drops (e.g., sprays) ink onto the substrate.

[0141] In one embodiment, when the nozzle unit 310 drops ink onto the substrate, the temperature of the substrate may rise due to the ink, allowing the controller 400 to lower the temperature of the temperature control member 1230 corresponding to the location where the ink droplet landed. In another embodiment, the controller 400 may control the temperature control member 1230 based on the temperature of the substrate or stage 100 measured by the temperature sensor 600.

[0142] In another example, the controller 400 can reduce the temperature of the temperature control member 1230 corresponding to the position where the nozzle unit 310 will drop ink. That is, when ink with a temperature higher than the temperature of the substrate is dropped, the temperature of the substrate can be prevented from rising rapidly due to the ink by reducing the temperature of the temperature control member 1230 located before the ink drops.

[0143] In another example, in order to increase the temperature of the ink that has dripped onto the substrate, the controller 400 may increase the temperature of the temperature control member 1230 corresponding to the location where the ink droplet has fallen or where the ink will drip.

[0144] In some embodiments, the controller 400 can control the amount of current supplied to the temperature control member 1230 based on a target temperature of the temperature control member 1230. In some embodiments, the controller 400 can measure the temperature of a specific temperature control member 1230 or the temperature of a panel unit 1200 in which the temperature control member 1230 is located using a temperature sensor 600, and can calculate the heat required at each location based on the difference from the target temperature. The controller 400 can calculate the amount of current supplied to the temperature control member 1230 located at a specific position based on the calculated heat, and can control the temperature of the temperature control member 1230 based on the calculated current.

[0145] Figure 14 It is shown Figure 2 A perspective view of an example of the pin module. Figure 15 yes Figure 14 A magnified view of part Y. Figure 16 It is a sectional view used to describe the arrangement of the pin modules. Figure 17 It is a cross-sectional perspective view used to describe the arrangement of the pin modules.

[0146] Reference Figures 14 to 17 The lifting assembly 200 may include multiple pin modules 220.

[0147] As described here, multiple pin modules 220 can be connected to frame 210. Therefore, when frame 210 moves, the multiple pin modules 220 connected to frame 210 can move simultaneously.

[0148] The pin module 220 may include a pin end 221, a riser tube 222, and a bushing 223. The pin end 221 may be configured to contact the substrate. The riser tube 222 may be configured in one direction (…). Figure 5 It can move linearly along the z-axis (in the z-axis direction).

[0149] The pin end 221 may be disposed at the end of the pin module 220 to support the base, the end being disposed on the surface of the panel unit 1200. In some embodiments, the pin end 221 may be a component that contacts the base and causes the base to rise and fall.

[0150] In an embodiment, the pin end 221 may include an extension 2211 and a suction hole 2212.

[0151] An extension portion 2211 may be formed on one side of the pin end 221. The extension portion 2211 may be shaped to extend outward from the central axis of the pin end 221. In some embodiments, the extension portion 2211 may be shaped to extend outward from the central axis of the pin end 221 to have an area larger than that of the riser tube 222.

[0152] The surface of the extension portion 2211 can contact the substrate. That is, the extension portion 2211 can support the substrate by contacting the substrate through the movement of the lifting tube 222.

[0153] In this embodiment, the extension 2211 may be generally circular. In this case, the area of ​​the extension 2211 may be less than or equal to the area of ​​the panel pin hole 1210.

[0154] When the lifting tube 222 moves toward the table body 1100, the pin end 221 can move together, and the extension 2211 can be inserted into the panel pin hole 1210. Furthermore, the lifting tube 222, connected to the frame 210, can move linearly relative to the bushing 223, which can be fixed to the table body 1100. For example, the lifting tube 222 can slide through the bushing 223.

[0155] In one embodiment, the lifting tube 222 can move downwards until the extension portion 2211 and the panel pin hole 1210 are aligned on the same plane. In some embodiments, when the substrate is supported on the extension portion 2211, the lifting tube 222 can move in a direction toward the lower side of the table body 1100, such that the extension portion 2211 and the panel unit 1200 can form a coplanar plane. In this case, the substrate can be supported more stably by the extension portion 2211 and the panel unit 1200.

[0156] In some embodiments, the pin tip 221 may comprise a material having relatively low thermal conductivity, being capable of precision machining, and having a relatively low coefficient of friction. In some embodiments, the pin tip 221 may comprise a PEEK material. Therefore, damage to the substrate can be minimized even when the pin tip 221 contacts the substrate.

[0157] The lifting tube 222 can extend in the direction of the through hole TH of the main body 1100 ( Figure 5 It moves linearly in a direction parallel to the z-axis (in the equation).

[0158] In this embodiment, the lifting tube 222 may be formed of a rigid material. Therefore, when the lifting tube 222 is raised or lowered to move the base, the base can be stably supported.

[0159] The lifting tube 222 can be arranged to pass through the main body pin hole 1110 and the panel pin hole 1210. Therefore, the lifting tube 222 can move to pass through the main body pin hole 1110 and the panel pin hole 1210. That is, the main body pin hole 1110 and the panel pin hole 1210 can guide the movement path of the lifting tube 222.

[0160] In an embodiment, the pin module 220 may further include a bushing 223 formed to cover the circumference of the lifting tube 222. For example, the bushing 223 may be disposed around the circumference of the lifting tube 222. In some embodiments, the bushing 223 may be formed in a cylindrical shape including covering the circumference of the lifting tube 222 to overlap with a region of the lifting tube 222. The bushing 223 may seal around the lifting tube 222 to reduce or prevent vacuum pressure leakage through the through-hole TH. The bushing 223 may be disposed in the countersunk hole 1120 and seal around the base of the countersunk hole 1120 to reduce or prevent vacuum pressure leakage through the through-hole TH.

[0161] A bushing 223 may be disposed in the countersunk hole 1120. In some embodiments, the bushing 223 may be formed to extend along at least a portion of the countersunk hole 1120. The bushing 223 may have a height smaller than the height of the countersunk hole 1120. The bushing 223 may be fixed to the countersunk hole 1120, and the riser tube 222 may move linearly through the bushing 223 while it is being inserted.

[0162] Specifically, since the lifting tube 222, as described herein, can move while passing through the space between the table body 1100 and the panel unit 1200, friction will occur between the lifting tube 222 and the table body 1100 or the panel unit 1200 when the direction of movement of the lifting tube 222 is tilted. Therefore, the bushing 223 can precisely guide the movement path of the lifting tube 222. The bushing 223 can also prevent or reduce friction between the lifting tube 222 and the table body 1100 or between the lifting tube 222 and the panel unit 1200 by covering the lifting tube 222.

[0163] In an embodiment, the pin module 220 may be formed as a base fixedly supported on the pin end 221.

[0164] In a specific embodiment, the suction hole 2212 may be formed to pass through the pin end 221 along the longitudinal direction of the pin end 221. A through hole communicating with the suction hole 2212 may be formed in the lifting tube 222 along the longitudinal direction of the lifting tube 222. As described here, the pin end 221 may be provided at a first end of the lifting tube 222, and the connector member 224 may be provided at a second end of the lifting tube 222. The connector member 224 can connect the lifting tube 222 to the suction tube 225. The suction tube 225 may be connected to a separately provided pump, etc.

[0165] When the substrate is supported on the worktable 100 by the pin module 220, the substrate can be fixed to the pin module 220 by a pump or the like that which applies vacuum pressure. In some embodiments, the pump or the like can draw air through the suction pipe 225, the lifting pipe 222 and the suction hole 2212, and the substrate can be fixed to the pin end 221 by vacuum pressure.

[0166] In one embodiment, at least one groove G formed in the radial direction may be formed in the extension 2211 of the pin end 221. In another embodiment, the groove G may be formed in the shape of a cross-shaped groove in the extension 2211 of the pin end 221.

[0167] Therefore, leakage can occur at the pin end 221 during the fixing operation, and the air layer formed between the panel units 1200 can be depressurized to generate vacuum pressure in the air layer. Thus, the pin module 220 can uniformly fix the substrate by applying vacuum pressure throughout the entire lower region of the substrate.

[0168] In the following, a method for manufacturing an inkjet printing apparatus 1 according to another aspect of this disclosure will be described.

[0169] Figure 18 This is a flowchart describing a method for manufacturing an inkjet printing apparatus according to embodiments of the present disclosure. Figure 19 It is used to describe preparation Figure 18 The flowchart of the operation of the panel unit, and Figure 20 This is a view used to describe the operation of arranging the panel units.

[0170] Reference Figure 18 A method for manufacturing an inkjet printing apparatus 1 according to an embodiment of the present disclosure may include the following steps: operation S110 of preparing a table body 1100, a lifting assembly 200 and a mounting unit 1200; operation S120 of installing the lifting assembly 200 such that at least a portion of the pin module 220 of the lifting assembly 200 passes through a main pin hole 1110 formed in the table body 1100; and operation S130 of arranging the mounting unit 1200 on the top surface of the table body 1100 such that mounting pin holes 1210 formed between the mounting units 1200 are located at positions corresponding to the main pin holes 1110.

[0171] The operation S110 of the preparation table main body 1100, lifting assembly 200 and assembly unit 1200 can be used to prepare references. Figures 1 to 17 The operation of each of the table body 1100, lifting assembly 200 and panel unit 1200 is described.

[0172] Regardless of the order, the operations of the preparation table body 1100, the preparation of the lifting assembly 200, and the preparation of the assembly unit 1200 can be performed. In some embodiments, the operations can be performed simultaneously or sequentially.

[0173] The operation S120 for installing the lifting assembly 200 can be the operation of installing the lifting assembly 200 on the platform body 1100.

[0174] In operation S120 of installing the lifting assembly 200, the bushing 223 can be placed in the countersunk hole 1120 of the platform body 1100. The lifting tube 222 can be arranged to pass through the main body pin hole 1110 and the bushing 223. In this case, the bushing 223 can be placed in the countersunk hole 1120 first, and then the lifting tube 222 can be arranged to pass through the main body pin hole 1110 and the bushing 223, or the lifting tube 222 can be inserted into the bushing 223 first, and then the lifting tube 222 and the bushing 223 can be inserted into the platform body 1100 and installed.

[0175] As described here, since multiple main body pin holes 1110 can be formed in the main body 1100, a pin module 220 can be provided in each main body pin hole 1110.

[0176] After the bushing 223 is placed in the countersunk hole 1120, the bushing 223 can be securely attached to the table body 1100 by a separately provided connecting member. In some embodiments, the connecting member may be, but is not limited to, screws, bolts, pins, etc.

[0177] The operation S130 of arranging the panel unit 1200 can be an operation of arranging the panel unit 1200 on the working area of ​​the table body 1100.

[0178] The operation S130 of arranging the panel units 1200 can be an operation in which the panel units 1200 are arranged in the working area on the top surface of the table body 1100 such that the panel pin holes 1210 are positioned at positions corresponding to the main body pin holes 1110. Specifically, the panel units 1200 in which curved portions are formed can be arranged such that the curved portions overlap with a portion of the outer peripheral surface of the main body pin holes 1110. In this way, since multiple panel units 1200 can be arranged adjacent to each other along the outer peripheral surface of the main body pin holes 1110, panel pin holes 1210 can be formed at positions corresponding to the main body pin holes 1110.

[0179] The operation S130 of arranging the panel unit 1200 may include arranging the panel unit 1200 on the top surface of the table body 1100 and then engaging the connecting member and the joint portion 1242 of the panel unit 1200 through the mounting hole 1130 formed in the table body 1100.

[0180] In an embodiment, the assembly unit 1200 can be configured such that the joining portion 1242 is inserted into the mounting hole 1130, and then the joining member can be inserted into the mounting hole 1130 from the lower side of the table body 1100 toward the upper side of the table body 1100, so that the joining member can be joined to the joining portion 1242.

[0181] In an embodiment, the operation S130 of arranging the panel units 1200 may also include the operation of controlling the height of each panel unit 1200.

[0182] The operation of controlling the height of each panel unit 1200 can be an operation of controlling the height of each panel unit 1200 so that the panel unit 1200 forms a horizontal plane.

[0183] The operation of controlling the height of each panel 1200 may include arranging the panel 1200 on the table body 1100 and then arranging the height control member between the panel 1200 and the table body 1100. That is, the height control member may be placed below the panel 1200 that is lower in height or tilted compared to other adjacent panel 1200s.

[0184] In this embodiment, the operation of attaching the connecting member to the joint portion 1242 of the panel unit 1200 and the operation of controlling the height of the panel unit 1200 can be performed simultaneously. That is, the connecting member can be attached to the joint portion 1242 while controlling the height of the panel unit 1200.

[0185] In the embodiments, reference is made to Figure 20 The operation S130 of arranging multiple panel units 1200 can be an operation of arranging panel units 1200 from the inside of the table body 1100 toward the outside.

[0186] Specifically, the panel units 1200 can be arranged from the inside of the working area of ​​the table body 1100 toward its outside. That is, the panel units 1200 can be first set at a position adjacent to the center of the working area of ​​the table body 1100, and then arranged sequentially from the center toward the outside. The flatness of the panel units 1200 can be easily controlled during the process of arranging the panel units 1200, and the arrangement of the panel units 1200 can be easily performed. However, the aspects of this disclosure are not limited to this, and the operation S130 of arranging multiple panel units 1200 can be performed in any of a variety of ways. For example, a scanning method can be used to arrange the panel units 1200 starting from a corner of the table body 1100 and then row by row.

[0187] Reference Figure 19The operation of preparing the panel unit 1200 may include the following steps: operation S111 of arranging at least one temperature control member 1230 on the top surface of the substrate plate 1240 to which a thermally conductive material is applied; operation S112 of arranging filler material 1250 in the area of ​​the top surface of the substrate plate 1240 where the temperature control member 1230 is not arranged; and operation S113 of arranging a top plate 1220 on the temperature control member 1230 to cover the temperature control member 1230 and the filler material 1250.

[0188] The operation S111 of arranging at least one temperature control member 1230 on the top surface of the substrate 1240 may include the operation of applying thermally conductive material to the area of ​​the substrate 1240.

[0189] In this embodiment, the thermally conductive material may be thermally conductive grease.

[0190] At least one temperature control component 1230 may be arranged at the location where the thermally conductive material is applied.

[0191] In this embodiment, thermally conductive material can be applied to multiple areas of the substrate plate 1240, and multiple temperature control components 1230 can be provided at these locations.

[0192] In this way, a thermally conductive material can be placed between the base plate 1240 and the temperature control component 1230.

[0193] Thermally conductive material can transfer heat between the substrate 1240 and the temperature control member 1230. Therefore, heat can be easily moved from a relatively high temperature area (such as the temperature control member 1230 or the substrate 1240) to the top plate 1220 on the opposite side of the panel unit 1200.

[0194] The operation S112 of arranging the filler material 1250 may be an operation of arranging the filler material 1250 in an area of ​​the top surface of the substrate plate 1240 where the temperature control member 1230 is not arranged. In some embodiments, the filler material 1250 may be formed by filling at least a portion of the space between the temperature control members 1230.

[0195] When the cable 1231 is arranged in the space between the temperature control components 1230, the filler material 1250 can be filled to surround the cable 1231.

[0196] The operation S113 of arranging the top plate 1220 can be an operation of arranging the top plate 1220 on the temperature control member 1230 to cover the temperature control member 1230 and the filling material 1250 after the temperature control member 1230 and the filling material 1250 are arranged on the base plate 1240.

[0197] The operation S113 of arranging the top plate 1220 may include applying thermally conductive material to the temperature control component 1230.

[0198] In this embodiment, the thermally conductive material may be thermally conductive grease.

[0199] Therefore, thermally conductive material can be placed between the temperature control component 1230 and the top plate 1220.

[0200] The thermally conductive material can transfer heat between the temperature control component 1230 and the top plate 1220. Therefore, heat can easily move from the higher temperature side of the temperature control component 1230 and the top plate 1220 to the opposite side.

[0201] Figure 21 This is a flowchart describing the operation of the worktable of an inkjet printing apparatus according to embodiments of the present disclosure. The operation of the worktable 100 of the inkjet printing apparatus 1 may include the operation of the lifting assembly 200.

[0202] Reference Figure 21 The operation method of the worktable 100 of the inkjet printing device 1 according to the embodiments of the present disclosure may include the following steps: operation S210 of moving the lifting tube 222 upward; operation S220 of placing the substrate on the pin end 221; operation S230 of moving the lifting tube 222 downward while the substrate is in contact with the pin end 221; operation S240 of fixing the substrate by the suction tube 225 when the lifting tube 222 moves downward to the limit point; and operation S250 of controlling the temperature of the imposition unit 1200.

[0203] The operation S210, which moves the lifting tube 222 upward, can be an operation of placing the base on the worktable 100. The lifting tube 222 can be moved to the upper side of the worktable 100, thereby allowing the base to be placed.

[0204] As described here, the riser tube 222 can move linearly along the main pin hole 1110 and the panel pin hole 1210 while passing through the interior of the bushing 223.

[0205] Multiple lifting tubes 222 can be connected to the frame 210 of the lifting assembly 200. Therefore, when the frame 210 moves to the upper side of the worktable 100, the multiple lifting tubes 222 connected to the frame 210 can move linearly simultaneously. Furthermore, the multiple lifting tubes 222 connected to the frame 210 can move linearly relative to a bushing 223 that can be fixed to the table body 1100. For example, the multiple lifting tubes 222 can slide through the bushing 223.

[0206] The operation S220 of placing the base on the pin end 221 can be the operation of placing the base on the worktable 100.

[0207] Specifically, the operation S220 of placing the substrate on the pin end 221 can be an operation of placing the substrate on the pin ends 221 of a plurality of pin modules 220. The substrate may contact the extension portion 2211 of the pin end 221.

[0208] The operation S230, which moves the lifting tube 222 downward while the base contacts the pin end 221, can be an operation that moves the base set on the pin end 221 downward and places the base on the worktable 100 so that the base can be supported by the worktable 100.

[0209] As described here, the riser tube 222 can move linearly along the main pin hole 1110 and the panel pin hole 1210 while passing through the interior of the bushing 223.

[0210] Multiple lifting tubes 222 can be connected to the frame 210 of the lifting assembly 200. Therefore, when the frame 210 moves to the lower side of the worktable 100, the multiple lifting tubes 222 connected to the frame 210 can move linearly simultaneously.

[0211] The operation S240, which involves fixing the base with the suction tube 225 when the lifting tube 222 moves downward to the limit point, can be an operation that fixes the base and attaches it to the worktable 100 when the lifting tube 222 moves downward to the limit point.

[0212] In one embodiment, the extreme point at which the lifting tube 222 moves downward can be the point where its extension portion 2211 forms a plane with the panel unit 1200. The extreme point can be the point where the extension portion 2211 forms a plane with the panel unit 1200.

[0213] When the riser tube 222 moves to its limit point, the pump or the like can fix the substrate by the suction tube 225 and vacuum pressure. In some embodiments, the pump or the like can draw air through the suction tube 225, the riser tube 222 and the suction hole 2212, thereby allowing the substrate to be fixed to the pin end 221 by vacuum pressure.

[0214] In one embodiment, at least one groove G formed in the radial direction may be formed in the extension 2211 of the pin end 221. In another embodiment, the groove G may be formed in the shape of a cross-shaped groove in the extension 2211 of the pin end 221.

[0215] Therefore, during the operation S240 of fixing the substrate via the pipette 225, leakage can occur at the pin end 221, and the air layer formed between the panel units 1200 can be depressurized to generate vacuum pressure in the air layer. Thus, the substrate can be uniformly fixed by vacuum pressure covering the entire lower region of the substrate.

[0216] In this way, the inkjet printing apparatus 1 according to embodiments of the present disclosure can prevent or reduce partial thermal expansion of the substrate that occurs when ink is applied to the substrate by controlling the temperature of the stage 100 on a piece-by-piece basis.

[0217] In operation S250, the temperature of the at least one layout unit 1200 can be individually controlled by controlling the current applied to the temperature control member 1230 of the at least one layout unit 1200.

[0218] In an embodiment, the temperature control component 1230 of the imposition unit 1200 can be used to control the temperature of each imposition unit 1200 in the imposition unit 1200 to match the temperature of the ink deposited on the substrate. For example, the matched temperature can be within the range of about 5 degrees Celsius, about 1 degree Celsius, or about 0.5 degrees Celsius.

[0219] In this way, even when the temperature of the ink is controlled to control the viscosity of the ink to be ejected, the inkjet printing apparatus 1 according to the embodiments of the present disclosure can prevent or reduce the problem of substrate temperature change due to ink temperature.

[0220] Furthermore, the inkjet printing apparatus 1 according to embodiments of the present disclosure can pre-control the temperature at the location where the ink droplets will fall, thereby controlling the properties of the ink droplets falling onto the substrate.

[0221] Furthermore, the inkjet printing apparatus 1 according to the embodiments of the present disclosure can prevent or reduce the temperature change problem of the substrate that may occur when the nozzle unit 310 repeatedly drops ink onto the substrate, thereby performing a high-precision inkjet process.

[0222] Furthermore, the method of manufacturing inkjet printing apparatus 1 according to embodiments of the present disclosure can provide inkjet printing apparatus 1 having one or more of the technical effects described herein.

[0223] The inkjet printing apparatus and method for manufacturing the inkjet printing apparatus according to embodiments of the present disclosure can provide an inkjet printing apparatus capable of performing high-precision inkjet processes and a method for manufacturing the inkjet printing apparatus.

[0224] This disclosure provides an inkjet printing device capable of performing high-precision inkjet processes and a method for manufacturing the same.

[0225] However, these effects are exemplary, and the effects of this disclosure are not limited thereto.

[0226] The embodiments described herein can be implemented independently, but the structure of each embodiment can be combined with other embodiments.

[0227] Although this disclosure has been described with reference to the examples shown in the accompanying drawings, it will be understood by those skilled in the art that various modifications can be made to the examples shown and other equivalent examples can be obtained. Therefore, the true technical scope of this disclosure should be defined by the technical spirit of the appended claims.

[0228] The specific implementations described in conjunction with the embodiments are examples and do not limit the scope of the embodiments in any way. Furthermore, unless specifically mentioned as "necessary" or "important," it may not be an essential component of the application of this disclosure.

[0229] In the specification of this disclosure (particularly the claims), the use of the term "the (described)" and similar indicators can correspond to both the singular and the plural. Furthermore, when a scope is described in the examples, the utility model includes the application of the various values ​​within that scope (unless otherwise stated) and is identical to the description of each individual value constituting the scope in the detailed description. Finally, when there is no explicit description of the order of operations constituting the method according to the disclosure, or a description contrary to it, the operations may be performed in a suitable order. However, the embodiments are not necessarily limited according to the order in which the operations are described. All examples or exemplary terminology used in this disclosure are for the purpose of simply and thoroughly describing the disclosure, and the scope of the disclosure is not limited by the examples or exemplary terminology except as limited by the claims. Furthermore, it will be understood by those skilled in the art that various modifications, combinations, and changes can be made within the scope of the appended claims or their equivalents, depending on design conditions and factors.

Claims

1. An inkjet printing device, characterized in that, The inkjet printing equipment includes: A workbench includes a main body containing a work area and multiple panel units arranged on the work area, wherein at least one of the multiple panel units includes a temperature control component. An inkjet assembly, disposed on the imposition units and including nozzle units configured to drip ink from above the plurality of imposition units; and The controller is configured to individually control the temperature of the at least one panel unit by controlling the current applied to the temperature control member.

2. The inkjet printing device according to claim 1, characterized in that, The platform body includes a mounting hole formed extending in one direction, and Each of the plurality of panel units includes an engagement portion that is at least partially inserted into the mounting hole.

3. The inkjet printing equipment according to claim 1, characterized in that, The multiple panel units are arranged in a grid pattern on the working area.

4. The inkjet printing device according to claim 1, characterized in that, The at least one panel unit includes: A base plate, wherein the temperature control component is disposed on the base plate; and The top plate is disposed opposite to the base plate.

5. The inkjet printing device according to claim 4, characterized in that, The substrate includes a cable hole, wherein a cable connected to the temperature control component is configured to pass through the cable hole.

6. The inkjet printing device according to claim 4, characterized in that, The multiple temperature control components, including the temperature control components, are arranged spaced apart from each other on the substrate plate in the multiple panel units, and include filling material in the space between the multiple temperature control components.

7. The inkjet printing device according to claim 4, characterized in that, The base plate has a higher thermal conductivity than the top plate.

8. The inkjet printing device according to claim 1, characterized in that, The temperature control component includes a Peltier element.

9. The inkjet printing device according to claim 1, characterized in that, The controller is also configured to individually control the temperature of the at least one imposition unit based on the location where the nozzle unit drops ink.

10. A worktable for an inkjet printer, characterized in that, The workbench includes: The main body of the platform includes a working area and includes multiple through holes formed extending in one direction; Multiple panel units are arranged on the working area; and The lifting assembly includes a plurality of pin modules disposed in the plurality of through holes.

11. The workbench according to claim 10, characterized in that, The lifting assembly also includes a frame that is movable in a direction parallel to the extension direction of the plurality of through holes and connected to the plurality of pin modules.

12. The workbench according to claim 10, characterized in that, The plurality of pin modules include: The rising tube is linearly movable in the extending direction of the plurality of through holes; and A bushing is provided around the circumference of the rising pipe.

13. The workbench according to claim 12, characterized in that, Each of the plurality of through holes includes: The main pin hole extends along a portion of the moving path of the lifting tube; and A countersunk hole connects to the main body pin hole and accommodates the bushing.

14. The workbench according to claim 10, characterized in that, Each of the plurality of panel units includes a curved portion formed to bend inward from each vertex of the panel unit, wherein panel pin holes are formed by the curved portions of corresponding panel units arranged adjacent to each other in the plurality of panel units, and At least a portion of the pin modules among the plurality of pin modules are disposed in the pin holes of the assembly plate.

15. The workbench according to claim 10, characterized in that, Each of the plurality of pin modules includes a pin end disposed at an end, the end being disposed on the surface of each of the plurality of panel units.

16. The workbench according to claim 15, characterized in that, The pin module is formed as a base that can be fixedly supported on the end of the pin by vacuum pressure.

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