Anti-blocking ic packaging tube

Abstract

The utility model discloses an IC packaging tube of preventing material from being stuck relates to IC packaging tube technical field, including pipe body mechanism, the pipe body mechanism includes IC packaging tube body, the inner wall of IC packaging tube body is provided with bottom ball bearing, the lower pressure mechanism, the lower pressure mechanism includes first spring, and the top of first spring is fixedly connected with the top of IC packaging tube body inner chamber, and one end away from IC packaging tube body of first spring is fixedly connected with the pressing plate. The utility model discloses through bottom ball bearing and side ball bearing to be converted to the rolling friction with the sliding friction of chip and pipe wall, cooperate the polytetrafluoroethylene coating of flaring inclined plane surface of pressing plate and, and the friction coefficient is reduced significantly, avoids the jamming of the small size deviation, and simultaneously, first spring drives the pressing plate, and second spring drives the side clamping plate to form the self -adaptation clamping, can automatically adjust the pressure according to chip thickness, prevents the attitude deviation of too loose again, avoids the frictional resistance of too tight aggravation.

Description

Technical Field

[0001] This utility model relates to the field of IC packaging tube technology, specifically to an IC packaging tube that prevents material jamming. Background Technology

[0002] Traditional IC packaging tubes are widely used in the electronics manufacturing industry. They are the core carriers for precision electronic components such as integrated circuit (IC) chips and semiconductor devices in production turnover, warehousing, transportation, and automated surface mount technology (SMT) processing. Their main function is to provide independent space for IC chips, preventing pin deformation or package scratches caused by collisions and friction during transfer. Simultaneously, they ensure that the chips maintain a stable posture to meet the high-speed feeding requirements of automated equipment such as SMT machines, making them a key component connecting IC production and assembly processes.

[0003] However, traditional IC packaging tubes have obvious jamming problems when feeding at high speed on automated production lines: the inner wall of the tube has no drag-reducing structure, resulting in high sliding friction between the chip and the tube wall, which can easily cause jamming due to slight dimensional deviations; the lack of adaptive clamping design makes it poorly adaptable to chips of different thicknesses, with too loose a clamping mechanism causing misalignment and jamming, and too tight a clamping mechanism exacerbating friction; the lack of a guiding structure at the inlet makes it easy for the chip to tilt and jam when entering the tube, requiring frequent shutdowns for processing, which not only reduces production efficiency but may also damage the chip due to jamming and compression. Utility Model Content

[0004] This invention provides an IC packaging tube that prevents material jamming, in order to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0006] An anti-jamming IC packaging tube includes a tube body mechanism, wherein the inner wall of the IC packaging tube body is provided with a bottom ball bearing; a pressing mechanism, wherein the pressing mechanism includes a first spring, the top of the first spring being fixedly connected to the top of the inner cavity of the IC packaging tube body, and a pressure plate being fixedly connected to the end of the first spring away from the IC packaging tube body; and a clamping mechanism, wherein the clamping mechanism includes a second spring, one end of the second spring being fixedly connected to the side of the inner cavity of the IC packaging tube body, and a side clamping plate being fixedly connected to the other end of the second spring.

[0007] A further improvement of this utility model is that the bottom ball bearing is embedded in the bottom of the inner cavity of the IC packaging tube and is rotatably connected to the inside of the IC packaging tube.

[0008] A further improvement of this utility model is that: one end of the pressure plate is provided with a flared inclined plate, and the surfaces of the flared inclined plate and the pressure plate are both coated with polytetrafluoroethylene coating.

[0009] A further improvement of the present invention is that the clamping mechanism further includes side balls, which are embedded inside the side clamping plate and rotatably connected to the inside of the side clamping plate.

[0010] A further improvement of this utility model is that: the end of the side clamp is provided with a side flared plate, and two sets of clamping mechanisms are symmetrically arranged, respectively set on both sides of the inner cavity of the IC packaging tube.

[0011] A further improvement of this utility model is that the bottom ball bearings are made of silicon nitride ceramic material, with a diameter of 1.5-2.5mm, and are evenly distributed along the length of the IC packaging tube. The distance between adjacent bottom ball bearings is 8-12mm, and the top of the ball bearings is 0.2-0.4mm higher than the bottom of the tube.

[0012] A further improvement of this utility model is that: the IC packaging tube is made of modified polypropylene material, with a length of 180-320mm; the side balls and bottom balls are made of the same material, with a diameter of 1-2mm; and 2-4 balls are evenly distributed along the length of each set of side plates.

[0013] Due to the adoption of the above technical solution, the technological progress achieved by this utility model compared to the prior art is as follows:

[0014] This invention provides an IC packaging tube designed to prevent chip jamming. Bottom and side ball bearings convert the sliding friction between the chip and the tube wall into rolling friction. Combined with the PTFE coating on the pressure plate and flared inclined plate, the coefficient of friction is significantly reduced, preventing jamming caused by minute dimensional deviations. Simultaneously, a first spring drives the pressure plate, and a second spring drives the side clamping plate to form an adaptive clamping mechanism. This automatically adjusts the pressure according to the chip thickness, preventing both excessive looseness leading to misalignment and excessive tightness increasing frictional resistance. It is compatible with various IC specifications. The flared inclined plate and side flared plate guide the chip end into the tube upright, eliminating tilting and jamming, significantly improving the continuity of automated production and chip safety. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0016] Figure 2 This is a side view of the present invention.

[0017] Figure 3 This is a schematic diagram of the feed end structure of this utility model;

[0018] Figure 4 This is a cross-sectional structural diagram of the present invention.

[0019] In the diagram: 11. IC packaging tube; 12. Bottom ball bearing; 21. First spring; 22. Pressure plate; 23. Flared slant plate; 31. Second spring; 32. Side clamp plate; 33. Side ball bearing; 34. Side flared plate. Detailed Implementation

[0020] The present invention will be further described in detail below with reference to embodiments:

[0021] Example 1, as Figures 1-4 As shown, this utility model provides an IC packaging tube for preventing jamming, including a tube body mechanism, which includes an IC packaging tube body 11, with a bottom ball bearing 12 provided on the inner wall of the IC packaging tube body 11; a pressing mechanism, which includes a first spring 21, the top of the first spring 21 being fixedly connected to the top of the inner cavity of the IC packaging tube body 11, and a pressure plate 22 being fixedly connected to the end of the first spring 21 away from the IC packaging tube body 11; and a clamping mechanism, which includes a second spring 31, one end of the second spring 31 being fixedly connected to the side of the inner cavity of the IC packaging tube body 11, and a side clamping plate 32 being fixedly connected to the other end of the second spring 31.

[0022] In this embodiment, when the IC chip enters the IC packaging tube 11 from the tray, the flared inclined plate 23 at the tube entrance and the side flared plate 34 form a trumpet-shaped guide channel, guiding the chip to enter the tube in a horizontal and upright posture, avoiding entry jamming caused by tilting or tipping. At the same time, the polytetrafluoroethylene coating on the surface of the flared inclined plate reduces the contact friction between the chip and the plate, ensuring smooth entry into the tube. After the chip enters the tube, the pressure plate 22 at the top applies downward pressure under the elastic force of the first spring 21, and the side clamps 32 on both sides clamp towards the middle under the elastic force of the second spring 31. The two sets of springs can adaptively deform according to the chip thickness.

[0023] Example 2, as Figures 1-4 As shown, based on Embodiment 1, this utility model provides a technical solution: Preferably, the bottom ball bearing 12 is embedded in the bottom of the inner cavity of the IC packaging tube 11 and is rotatably connected to the inside of the IC packaging tube 11. One end of the pressure plate 22 is provided with a flared inclined plate 23. The surfaces of the flared inclined plate 23 and the pressure plate 22 are both coated with polytetrafluoroethylene. The clamping mechanism also includes a side ball bearing 33, which is embedded in the inside of the side clamping plate 32 and is rotatably connected to the inside of the side clamping plate 32.

[0024] In this embodiment, when the chip is thicker, the spring compression increases and the elastic force increases accordingly; when the chip is thinner, the spring extends to maintain appropriate pressure, avoiding the problems of "too loose causing chip displacement" or "too tight aggravating friction" in traditional fixing structures. Furthermore, the side ball bearings 33 embedded in the side clamps convert the sliding friction between the clamps and the chip into rolling friction, further reducing resistance.

[0025] Example 3, as Figures 1-4 As shown, based on Embodiment 1, this utility model provides a technical solution: Preferably, the end of the side clamping plate 32 is provided with a side flared plate 34, and two sets of clamping mechanisms are symmetrically arranged, respectively set on both sides of the inner cavity of the IC packaging tube 11. The bottom ball bearings 12 are made of silicon nitride ceramic material with a diameter of 1.5-2.5mm, and are evenly distributed along the length direction of the IC packaging tube 11. The distance between adjacent bottom ball bearings 12 is 8-12mm, and the top of the ball bearing is 0.2-0.4mm higher than the bottom of the tube. The IC packaging tube 11 is made of modified polypropylene material with a length of 180-320mm. The side ball bearings 33 are made of the same material as the bottom ball bearings 12, with a diameter of 1-2mm. 2-4 balls are evenly distributed along the length direction on each set of side clamping plates 32.

[0026] In this embodiment, as the chip moves along the tube under the pusher of the automated equipment, the silicon nitride ceramic bottom ball 12 at the bottom of the tube contacts the bottom of the chip, converting sliding friction into rolling friction. Combined with the polytetrafluoroethylene coating on the surface of the pressure plate, this significantly reduces the overall conveying resistance. At the same time, the side ball rotates synchronously with the chip, ensuring that the force on both sides of the chip is uniform and avoiding jamming caused by excessive friction on one side. Finally, under the synergistic effect of multiple low-resistance structures and adaptive limiting, the chip is smoothly delivered from the tube outlet in a stable posture, completing the feeding process.

[0027] The working principle of this anti-jamming IC packaging tube will be explained in detail below.

[0028] like Figures 1-4As shown, when the IC chip enters the IC packaging tube 11 from the tray, the flared inclined plate 23 at the tube entrance and the side flared plate 34 form a trumpet-shaped guide channel, guiding the chip into the tube in a horizontal and upright posture, avoiding entry jamming caused by tilting or tipping. At the same time, the polytetrafluoroethylene coating on the surface of the flared inclined plate reduces the contact friction between the chip and the plate, ensuring smooth entry into the tube. After the chip enters the tube, the top pressure plate 22 applies downward pressure under the elastic force of the first spring 21, and the side clamps 32 on both sides clamp towards the middle under the elastic force of the second spring 31. The two sets of springs can adaptively deform according to the chip thickness: when the chip is thicker, the spring compression increases, and the elastic force increases simultaneously; when the chip is thinner, the springs extend to maintain appropriate pressure and avoid transmission. To address the issues of "too loose a fixed structure causing chip misalignment" or "too tight a structure exacerbating friction," the side ball bearings 33 embedded in the side clamps convert the sliding friction between the clamps and the chip into rolling friction, further reducing resistance. As the chip moves along the tube under the pusher of the automated equipment, the silicon nitride ceramic bottom ball bearings 12 at the bottom of the tube contact the bottom of the chip, converting sliding friction into rolling friction. Combined with the polytetrafluoroethylene coating on the surface of the pressure plate, this significantly reduces the overall conveying resistance. Simultaneously, the side ball bearings rotate synchronously with the chip, ensuring uniform force on both sides of the chip and avoiding jamming caused by excessive friction on one side. Finally, under the synergistic effect of multiple low-resistance structures and adaptive limiting, the chip is smoothly delivered from the tube outlet in a stable posture, completing the feeding process.

[0029] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.

Claims

1. An IC packaging tube for preventing jamming, characterized in that: include The tube body mechanism includes an IC packaging tube body (11), and the inner wall of the IC packaging tube body (11) is provided with bottom ball bearings (12); The pressing mechanism includes a first spring (21), the top of the first spring (21) is fixedly connected to the top of the inner cavity of the IC packaging tube (11), and a pressure plate (22) is fixedly connected to the end of the first spring (21) away from the IC packaging tube (11). The clamping mechanism includes a second spring (31), one end of which is fixedly connected to the side of the inner cavity of the IC packaging tube (11), and one end of which is fixedly connected to a side clamping plate (32).

2. The IC packaging tube for preventing jamming according to claim 1, characterized in that: The bottom ball bearing (12) is embedded in the bottom of the inner cavity of the IC packaging tube (11) and is rotatably connected to the inside of the IC packaging tube (11).

3. The IC packaging tube for preventing jamming according to claim 1, characterized in that: One end of the pressure plate (22) is provided with a flared inclined plate (23), and the surfaces of the flared inclined plate (23) and the pressure plate (22) are both coated with polytetrafluoroethylene.

4. The IC packaging tube for preventing jamming according to claim 1, characterized in that: The clamping mechanism also includes side ball bearings (33), which are embedded inside the side clamping plate (32) and rotatably connected to the inside of the side clamping plate (32).

5. The IC packaging tube for preventing jamming according to claim 1, characterized in that: The end of the side clamp (32) is provided with a side flared plate (34), and two sets of clamping mechanisms are symmetrically arranged, respectively located on both sides of the inner cavity of the IC packaging tube (11).

6. The IC packaging tube for preventing jamming according to claim 1, characterized in that: The bottom ball bearings (12) are made of silicon nitride ceramic material with a diameter of 1.5-2.5mm. They are evenly distributed along the length of the IC packaging tube (11). The distance between adjacent bottom ball bearings (12) is 8-12mm. The top of the ball bearing is 0.2-0.4mm higher than the bottom of the tube.

7. The IC packaging tube for preventing jamming according to claim 4, characterized in that: The IC packaging tube (11) is made of modified polypropylene and has a length of 180-320mm. The side ball bearings (33) and the bottom ball bearings (12) are made of the same material and have a diameter of 1-2mm. 2-4 balls are evenly distributed along the length of each set of side plates (32).

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