Composite adhesive layer structure for electronic component package with positioning structure

Abstract

The utility model discloses a kind of composite glue layer structures for electronic component packaging with positioning structure, comprising: carrier structure base layer in upper part, the base surface of carrier structure base layer is spaced apart and is provided with several positioning bosses, the base surface of carrier structure base layer is spaced apart and is several UV fluorescent marker points;Function glue structure layer is arranged in the lower part of carrier structure base layer, and the function glue structure layer includes by upper to lower arrangement core glue layer, buffer glue layer and heat-conducting glue layer;Several glass beads are embedded in the core glue layer or buffer glue layer;Sealing protrusion is arranged on the outside of function glue structure layer, and continuous sealing line is formed after the solidification of sealing protrusion;Release layer is arranged in the lower part of function glue structure layer, and the groove matched with sealing protrusion is arranged around release layer.The utility model realizes accurate positioning by grid boss and fluorescent marker combination, and annular sealing protrusion improves sealing, and layered structure and glass bead realize performance balance and thickness control.

Description

Technical Field

[0001] This utility model relates to the field of composite adhesive manufacturing for electronic component packaging, and specifically to a composite adhesive layer structure for electronic component packaging with a positioning structure. Background Technology

[0002] Electronic adhesives are widely used for the encapsulation, bonding, and protection of electronic components. Most existing electronic adhesives are in liquid or sheet form, which presents the following problems during application: First, poor positioning accuracy: Misalignment is prone to occur during manual or mechanical coating, resulting in uneven coverage of the adhesive layer. This is especially true for micro-electronic components (such as chips and sensors), where a misalignment exceeding 0.1mm may affect the packaging effect. Second, the sealing performance is unstable: the edges of traditional adhesive layers have no special structure, and after curing, micro-cracks are easily generated due to stress shrinkage, leading to the intrusion of moisture; Third, thickness control is difficult: it is difficult to ensure uniform adhesive layer thickness during the coating process. Too thick an adhesive layer will increase volume, while too thin an adhesive layer will not provide effective protection.

[0003] Therefore, an electronic adhesive structure that can achieve precise positioning, ensure sealing performance, and has controllable thickness is needed. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the purpose of this utility model is to provide a composite adhesive layer structure for electronic component packaging with positioning structure.

[0005] To achieve the purpose of this utility model, the technical solution adopted is as follows: A composite adhesive layer structure for encapsulating electronic components with a positioning structure includes: The upper carrier structure base layer has several positioning protrusions spaced apart on its base surface, and several UV fluorescent marking points spaced apart on its base surface. A functional adhesive structure layer is provided at the bottom of the carrier structure base layer. The functional adhesive structure layer includes a core adhesive layer, a buffer adhesive layer and a thermally conductive adhesive layer arranged from top to bottom. The core adhesive layer, buffer adhesive layer, or thermally conductive adhesive layer is embedded with several glass microspheres. The outer side of the functional adhesive structure layer is provided with sealing protrusions, which form a continuous sealing line after curing. A release layer is provided at the bottom of the functional adhesive structure layer, and the release layer has grooves around its perimeter that mate with the sealing protrusions.

[0006] In a preferred embodiment of this invention, the positioning boss is a positioning boss with a trapezoidal cross-section. The height of the positioning boss is 10-30 μm, and the distance between adjacent positioning bosses is 0.5-2 mm.

[0007] In a preferred embodiment of this invention, the carrier structure base layer is a PET film layer. Preferably, the PET film layer has a thickness of 20-50 μm.

[0008] In a preferred embodiment of this utility model, the thickness of the functional adhesive structure layer is 50-150μm, and the thickness ratio of the three layers is 2:1:1.

[0009] In a preferred embodiment of this utility model, the glass microspheres are glass microspheres with a diameter of 5-10 μm, and the glass microspheres are uniformly distributed with a spacing of 50-100 μm.

[0010] In a preferred embodiment of this utility model, the release layer is a silicone oil release film.

[0011] In a preferred embodiment of this invention, the glass microspheres are glass microspheres with a diameter of 7-10 μm.

[0012] In a preferred embodiment of this utility model, the diameter of the UV fluorescent marker dots is 0.1-0.3 mm, and they are printed with UV fluorescent ink.

[0013] In a preferred embodiment of this utility model, the functional adhesive structural layer is a UV adhesive for electronic component encapsulation.

[0014] The significance and effect of this utility model are as follows: Precise positioning is achieved by combining grid protrusions with fluorescent markers, while annular sealing protrusions enhance sealing performance. Layered structures and glass microspheres achieve performance balance and thickness control. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. However, it should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of the invention. Furthermore, in the following descriptions, well-known structures and technologies are omitted to avoid unnecessarily obscuring the concept of the invention.

[0017] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description. They do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention. Furthermore, terms such as "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0018] like Figure 1 The composite adhesive layer structure for electronic component packaging with positioning structure shown includes a carrier structure base layer 1 located at the top, which is a PET film layer with a thickness of 25μm.

[0019] The substrate of the carrier structure 1 has several positioning bosses 2 spaced apart, and several UV fluorescent marking dots 3 spaced apart. The UV fluorescent marking dots 3 have a diameter of 0.2 mm and are printed with UV fluorescent ink.

[0020] Positioning boss 2 is a positioning boss with a trapezoidal cross-section. The height of positioning boss 2 is 20μm, and the distance between adjacent positioning bosses 2 is 1mm. The cross-section is trapezoidal (upper base 0.3mm, lower base 0.5mm).

[0021] A functional adhesive structure layer 4 is provided at the lower part of the carrier structure base layer 1. The functional adhesive structure layer 4 includes a core adhesive layer 6, a buffer adhesive layer 7, and a thermally conductive adhesive layer 8 arranged from top to bottom.

[0022] A number of glass microspheres 9 are embedded in the core adhesive layer 6, the buffer adhesive layer 7, or the thermally conductive layer 8. The glass microspheres 9 are glass microspheres with a diameter of 8μm, and are evenly distributed with a spacing of 80μm.

[0023] Figure 1 Glass microspheres 9 are embedded in the buffer adhesive layer 7 and the thermal conductive layer 8. Alternatively, glass microspheres 9 can be embedded in the core adhesive layer 6 as needed.

[0024] The thickness of the functional adhesive structural layer 4 is 100μm, and the thickness ratio of the three layers is 2:1:1.

[0025] The functional adhesive structural layer 4 has a sealing protrusion 5 on its outer side, which can form a continuous sealing line after curing.

[0026] A release layer 10 is provided at the bottom of the functional adhesive structure layer 4, and grooves 11 that cooperate with the sealing protrusions 5 are provided around the release layer 10.

[0027] Release layer 10 is a silicone oil release film.

[0028] Functional adhesive structural layer 4 is a UV adhesive for encapsulating electronic components.

[0029] In use, the release layer 10 is peeled off, and the positioning boss 2 is aligned with the edge of the electronic component (such as a chip on a PCB board). The positioning accuracy of the UV fluorescent marker 3 can be confirmed by optical inspection equipment. After pressing, it is cured by UV or heat to complete the encapsulation.

[0030] The base carrier surface of this utility model is provided with grid-shaped positioning protrusions, which match the pins or edges of electronic components to achieve pre-positioning with a positioning accuracy of ±0.05mm. The functional adhesive layer of this invention has an annular sealing protrusion at its edge, which forms a tight sealing line with the component surface after curing, thereby improving the moisture-proof performance. The functional adhesive layer of this utility model adopts a three-layer structure (core adhesive layer + buffer adhesive layer + thermally conductive adhesive layer), which respectively realizes the functions of bonding, buffering and shock absorption and auxiliary heat dissipation; The main function of embedding glass microspheres is to control the thickness and ensure that the thickness deviation of the adhesive layer is ≤5μm after curing.

[0031] After the annular sealing protrusion solidifies, it forms a continuous sealing line, reducing the water vapor permeability to below 0.1 g / (m²·24h). Balanced performance: The layered structure balances adhesive strength (≥8MPa), impact cushioning (drop ball impact test ≥50cm), and thermal conductivity (≥0.3W / (m·K)). Easy to install: The groove design of the release layer and sealing protrusions facilitates quick peeling and is suitable for automated production line operations.

[0032] The foregoing has shown and described the basic principles and main features of the invention and the advantages of the invention.

[0033] Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the present invention. Various changes and modifications can be made to the present invention without departing from its spirit and scope. All such changes and modifications fall within the scope of the present invention as claimed, which is defined by the appended claims and their equivalents.

Claims

1. A composite adhesive layer structure for packaging electronic components with a positioning structure, characterized in that, include: The upper carrier structure base layer has several positioning protrusions spaced apart on its base surface, and several UV fluorescent marking points spaced apart on its base surface. A functional adhesive structure layer is provided at the bottom of the carrier structure base layer. The functional adhesive structure layer includes a core adhesive layer, a buffer adhesive layer and a thermally conductive adhesive layer arranged from top to bottom. The core adhesive layer, buffer adhesive layer, or thermally conductive adhesive layer is embedded with several glass microspheres. The outer side of the functional adhesive structure layer is provided with sealing protrusions, which form a continuous sealing line after curing. A release layer is provided at the bottom of the functional adhesive structure layer, and the release layer has grooves around its perimeter that mate with the sealing protrusions.

2. The composite adhesive layer structure for electronic component packaging with positioning structure as described in claim 1, characterized in that, The positioning boss is a positioning boss with a trapezoidal cross-section.

3. The composite adhesive layer structure for electronic component packaging with positioning structure as described in claim 1, characterized in that, The carrier structure base layer is a PET film layer.

4. The composite adhesive layer structure for electronic component packaging with positioning structure as described in claim 1, characterized in that, The thickness of the functional adhesive structure layer is 50-150 μm, and the thickness ratio of the three layers is 2:1:

1.

5. The composite adhesive layer structure for electronic component packaging with positioning structure as described in claim 1, characterized in that, The glass microspheres are glass microspheres with a diameter of 5-10 μm, and the glass microspheres are uniformly distributed with a spacing of 50-100 μm.

6. The composite adhesive layer structure for electronic component packaging with positioning structure as described in claim 1, characterized in that, The release layer is a silicone oil release film.

7. The composite adhesive layer structure for packaging electronic components with a positioning structure as described in claim 1, characterized in that, The glass microspheres are glass microspheres with a diameter of 7-10 μm.

8. The composite adhesive layer structure for packaging electronic components with a positioning structure as described in claim 1, characterized in that, The UV fluorescent markers have a diameter of 0.1-0.3 mm and are printed with UV fluorescent ink.

9. The composite adhesive layer structure for packaging electronic components with a positioning structure as described in claim 1, characterized in that, The functional adhesive structural layer is a UV adhesive used for encapsulating electronic components.

Images